JP2004281161A - Adhesive connector and manufacturing method thereof - Google Patents

Abstract

An adhesive capable of easily connecting printed wiring boards having complicated signal lines to achieve high-quality, high-speed transmission, and realizing a sufficiently narrow pitch while maintaining a low profile. To provide a type connector.
The adhesive connector (1) secures a base (2) and a ground metal plate layer (4) serving as a ground plate with a first adhesive layer (3), and one of a second adhesive layer (5). The ground metal plate layer 4 is fixed to the surface, and a plurality of terminal portions are fixedly arranged on the other surface. The plurality of terminal portions are formed at the periphery of the other surface of the second adhesive layer 5. A ground metal thin film 6 formed of a metal thin film so as to straddle both sides of the layer between the edges of the formed through hole 7 and at least one of which is connected to the ground metal plate layer 4; A signal metal thin film 8 arranged in parallel with each other at a position separated from the ground metal thin film 6 on the other surface of the second adhesive layer 5.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an adhesive connector having a structure capable of directly connecting a plurality of terminal portions provided on an adhesive layer directly to wiring portions on two separated printed wiring board surfaces by an adhesive action. More specifically, the present invention relates to an adhesive connector having a microstrip line structure and suitable for high-speed transmission, and a method of manufacturing the same.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, when a flexible printed circuit board (FPC) is connected to a wiring portion on a surface of a general printed circuit board, a connector having a metal spring contact capable of contacting the end of the FPC cable by the number of wires is used. After the connector is soldered to the wiring portion on the surface of the printed wiring board, the connector and the FPC cable are attached / detached (for example, see Patent Document 1), or an integrated circuit element mounted on the printed wiring board is used. One in which a connector to which an FPC cable is connected is inserted into an engagement recess of a connection block fixedly connected to the back surface so that the contact of the connector comes into contact with the back electrode of the integrated circuit element (see Patent Document 2). Can be
[0003]
However, since all of these connectors are formed separately from the FPC main body, the number of components is increased, so that it is inconvenient that the connection cannot be easily performed, and the connector is suitable for reducing the overall height of the connected components. There is a disadvantage that there is no.
[0004]
Therefore, it is possible to solve these problems, and as a technically separate attempt, devising the basic structure of the FPC itself, forming a conductor pattern on the adhesive or adhesive, and then using it as a mechanical coupling means for various applications A configuration in which a plurality of conductor patterns are arranged at a predetermined pitch in parallel with each other on an adhesive disposed on one surface of a base material, particularly when an adhesive connector is used (see Patent Document 3). ) Has been proposed by the present applicant.
[0005]
Furthermore, the present applicant has also proposed an electrical connection member capable of improving the transfer yield and reducing the variation in the resistance value at the time of contact, but this electrical connection member uses a metal thin film as an adhesive on one surface of a substrate. An example in which a wiring pattern is formed by transferring and forming a wiring pattern on an adhesive (see Patent Literature 4), and as an example of enabling connection to a place where connection by adhesion is not suitable, a wiring pattern of an electrical connection member is applied to an FPC by using an adhesive. An adhesive connector having a configuration in which the connectors are directly connected by an adhesive action is disclosed.
[0006]
[Patent Document 1]
JP-A-9-82427 (abstract)
[0007]
[Patent Document 2]
JP 2001-313109 A (abstract, page 3)
[0008]
[Patent Document 3]
JP-A-2001-210933 (abstract, page 5, FIG. 4)
[0009]
[Patent Document 4]
JP-A-2002-184546 (Abstract, page 4, FIG. 6)
[0010]
[Problems to be solved by the invention]
In the case of the adhesive connector disclosed in Patent Document 3 or Patent Document 4 described above, the number of parts is small and the FPC connector (which requires a separate connector to be connected to the FPC cable) is simpler than the earlier connector for FPC. Connections can be made, and the overall height of the connecting parts can be sufficiently reduced, and high-speed transmission by narrowing the pitch can be realized to some extent.However, a plurality of wiring patterns are formed on the adhesive. Because it has a structure of only parallel lines, it connects the printed wiring boards with complicated signal lines on which a number of recent complicated central processing units (CPUs) and large-scale integrated circuits (LSI) are mounted. In addition to the above, there is a problem that it is difficult to apply to high-speed transmission, and it is difficult to realize a sufficiently narrow pitch while maintaining a low profile.
[0011]
The present invention has been made to solve such problems, and the technical problem is that printed wiring boards having complicated signal lines can be easily connected to each other and high-quality high-speed transmission is possible. An object of the present invention is to provide an adhesive connector capable of realizing a sufficiently narrow pitch while maintaining a low profile and a method of manufacturing the same.
[0012]
[Means for Solving the Problems]
According to the present invention, a ground plate made of a thin metal conductive plate and an adhesive layer are laminated on an insulating base material, and the adhesive layer has at least one terminal portion in the ground plate. In the pressure-sensitive adhesive connector fixedly disposed so as to be connected to the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer includes a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer, and the first pressure-sensitive adhesive layer allows the pressure-sensitive adhesive layer to be connected to the base material. A second adhesive layer fixed to the ground plate, and a plurality of terminal portions fixedly arranged on the other surface; The portion is formed of a metal thin film so as to straddle both sides of the layer between the edges of the through hole formed in the peripheral portion of the other surface of the second pressure-sensitive adhesive layer, and at least one of the portions is grounded. Ground metal sheet connected to plate When the adhesive-type connector comprising a signal metal thin film which is arrayed so as to be parallel to each other at a place separated from the ground metal thin film on the other surface of the second adhesive layer.
[0013]
According to the present invention, in the adhesive connector, the signal metal thin film has a microstrip line structure with respect to the ground metal thin film and the ground plate, and the impedance thereof is matched. The adhesive metal connector has a structure in which the ground metal thin film is directly connected to a wiring portion at a predetermined position on the two separated printed wiring board surfaces by the adhesive action of the second adhesive layer. Is obtained.
[0014]
Further, according to the present invention, an adhesive depositing step of depositing a second adhesive layer with an adhesive on a ground plate made of a thin metal conductive plate, and piercing a predetermined portion of a peripheral portion from the surface side of the ground plate. And forming a ground metal thin film as a terminal portion by a metal thin film so as to extend from the surface side of the second pressure-sensitive adhesive layer to both sides of the layer from the surface side of the second adhesive layer to the edge of the through hole. A first metal thin film transfer step of transferring and forming by bending, and a signal as a terminal portion by a metal thin film so as to be parallel to each other at a position separated from the ground metal thin film with respect to the surface of the second adhesive layer. A second metal thin film transfer step of transferring the metal thin film to the ground metal thin film and the ground plate so as to form a microstrip line structure to form a row, and applying an adhesive sheet to the surface of the ground plate Forming a first pressure-sensitive adhesive layer on the surface of the first pressure-sensitive adhesive layer, and then bonding a pressure-sensitive adhesive sheet and a substrate sheet to form a substrate by pasting an insulating substrate sheet on the surface of the first pressure-sensitive adhesive layer. Thus, a method for manufacturing an adhesive connector having the same is obtained.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a basic structure and an adhesive function of an adhesive connector 1 according to one embodiment of the present invention. FIG. 1A shows an adhesive connector 1 with two separated printed wiring boards 11. , 12 relating to an external perspective view showing a state of being connected to a wiring portion at a predetermined position on the surface by adhesive action, and FIG. 12 (b) shows A1 of the adhesive connector 1 shown in FIG. FIG. 1 (c) relates to a side cross-sectional view of a main part of the adhesive connector 1 shown in FIG. 2 (a) along the line A2-A2, and FIG. (D) relates to a side cross-sectional view of an essential part of the adhesive connector 1 shown in FIG. (A) with a part cut in the BB line direction, and (e) shown in FIG. Part of the adhesive surface (back surface) of the adhesive connector 1 It relates plan view of the main part.
[0016]
This adhesive connector 1 has a ground metal plate layer 4 serving as a ground plate made of a thin metal conductive plate and an adhesive layer 3 and 5 laminated on an insulating base material 2. Are fixedly arranged so that at least one of them is connected to the ground metal plate layer 4. As shown in FIG. 1 (a), the two printed wiring boards 11, The structure is such that each terminal portion can be directly connected to the wiring portion at a predetermined position on the surface 12 by the adhesive action of the adhesive layer 5.
[0017]
Specifically, referring to FIGS. 1B to 1E, the pressure-sensitive adhesive layers 3 and 5 are distinguished into a first pressure-sensitive adhesive layer 3 and a second pressure-sensitive adhesive layer 5, The base material 2 and the ground metal plate layer 4 serving as a ground plate are fixed by the adhesive layer 3, the ground metal plate layer 4 is fixed to one surface of the second adhesive layer 5, and the other is fixed. A plurality of terminal portions are fixedly arranged on the surface. Further, the plurality of terminal portions are formed between the edges of the through-hole 7 formed in the peripheral portion of the other surface of the second adhesive layer 5. The ground metal thin film 6 is formed of a metal thin film so as to straddle both surface portions of the layer, and at least one is connected to the ground metal plate layer 4 and the other of the second adhesive layer 5. And a signal metal thin film 8 arranged in parallel with each other at a location separated from the ground metal thin film 6 on the surface.
[0018]
That is, the signal metal thin film 8 here forms a substantially coaxial microstrip line structure with the ground metal thin film 6 and the ground metal plate layer 4 (ground portion), and the impedance is matched. Further, the signal metal thin film 8 and the ground metal thin film 6 have an adhesive effect of the second adhesive layer 5 on a wiring portion at a predetermined position on the surfaces of the two printed wiring boards 11 and 12. Are connected directly.
[0019]
In the case of the adhesive connector 1 having such a structure, the ground metal thin film 6 is always held in close contact with the ground metal plate layer 4 by the adhesive layers 3 and 5. Since the impedance is matched by forming a microstrip line structure with respect to the ground metal thin film 6 and the ground metal plate layer 4, the connection to each of the printed wiring boards 11 and 12 is made directly by the adhesive action. Even when each of the printed wiring boards 11 and 12 has a complicated signal line, the printed wiring boards 11 and 12 can be easily connected to each other, and high-quality high-speed transmission can be performed. Thus, the pitch can be sufficiently narrowed. In particular, when each of the printed wiring boards 11 and 12 is an FPC, even if the printed wiring boards 11 and 12 are slightly bent in the plate surface direction after the adhesive connector 1 is connected, the electrical connection state is sufficient. It is kept stable.
[0020]
By the way, as a material of each part in the adhesive connector 1, a case where a film sheet of polyester, polyimide or the like is used for the base material 2 and a Si-based or acrylic-based material is used for the adhesive of the adhesive layers 3 and 5 can be exemplified. The metal thin film 6 for grounding and the metal thin film 8 for signal may be formed by depositing a metal thin film on a Si wafer by sputtering or the like and then attaching the adhesive sheet to transfer the metal thin film. It is formed in a shape that is bent so as to straddle both sides of the layer between the edges of the through hole 7. In any case, these metal thin films are very smooth and thin.
[0021]
Next, a method for manufacturing such an adhesive connector 1 will be described. 2A and 2B are side cross-sectional views of a main part showing a manufacturing process of the adhesive connector 1 for each step, in which FIG. 2A is related to an adhesive depositing step, and FIG. FIG. 3 (c) relates to the first metal thin film transfer step, FIG. 6 (d) relates to the second metal thin film transfer step, FIG. 5 (e) relates to the adhesive sheet and base sheet bonding step, FIG. 3D relates to an enlarged view of a local area after the pressure-sensitive adhesive sheet and base sheet bonding step of FIG.
[0022]
That is, when the adhesive connector 1 is manufactured, first, as an adhesive depositing step as shown in FIG. 2A, a second adhesive is formed on the ground metal plate layer 4 made of a thin metal conductive plate serving as a ground plate. After the pressure-sensitive adhesive layer 5 is deposited, as a drilling step as shown in FIG. 2B, the surface side of the ground metal plate layer 4 with the separator 9 adhered to the surface of the second pressure-sensitive adhesive layer 5 Then, a through hole 7 is formed in a predetermined portion of the peripheral portion by machining or laser processing.
[0023]
Next, as a first metal thin film transfer step as shown in FIG. 2C, the separator 9 is peeled off from the surface of the second pressure-sensitive adhesive layer 5 from the surface side of the second pressure-sensitive adhesive layer 5 in a state where the separator 9 is peeled off. The ground metal thin film 6 as a terminal portion is transferred and bent by a metal thin film so as to straddle both sides of the layer between the edges of the through hole 7. Thereafter, as a second metal thin film transfer step as shown in FIG. 2D, the surface of the second pressure-sensitive adhesive layer 5 is separated from the ground metal thin film 6 so as to be parallel to each other. Then, the signal metal thin film 8 as a terminal portion is transferred to the ground metal thin film 6 and the ground metal plate layer 4 by a metal thin film so as to form a microstrip line structure so as to form a row.
[0024]
Further, as a step of sticking the pressure-sensitive adhesive sheet and the base material sheet as shown in FIG. 2 (e), the separator 10 is stuck on the surface of the second pressure-sensitive adhesive layer 5, After the pressure-sensitive adhesive sheet is pasted to form the first pressure-sensitive adhesive layer 3, an insulating base sheet is pasted on the surface of the first pressure-sensitive adhesive layer 3 to form the substrate 2. In addition, although the case where the first pressure-sensitive adhesive layer 3 and the base material 2 are separately applied has been described, the base material sheet with the pressure-sensitive adhesive layer (the first pressure-sensitive adhesive layer 3 and the base material 2 May be used. In this state, as shown in FIG. 2 (f), a part of the ground metal thin film 6 is in a state where it is sufficiently adhered and held to the ground metal plate layer 4.
[0025]
FIG. 3 is a partial cutaway view of a main part of a detailed structure of a connection state of the adhesive connector 1 obtained as described above, which is adhered to a wiring portion at a predetermined position on the surface of the printed wiring board 13 by an adhesive action. It is the side sectional view shown.
[0026]
Here, the separator 10 is peeled off from the surface of the second pressure-sensitive adhesive layer 5 of the pressure-sensitive adhesive connector 1 obtained through the above-described manufacturing process, and the ground, which is a wiring portion at a predetermined position on the surface of the printed wiring board 13, is removed. This shows a state in which the ground metal thin film 6 and the signal metal thin film 8 on the surface of the second adhesive layer 5 are connected to the land and the signal land, respectively, by the adhesive action of the surrounding adhesive. This indicates that electrical contact is achieved, and that the signal metal thin film 8 has a microstrip line structure with respect to the ground metal thin film 6 and the ground metal plate layer 4, so that conduction by tunnel current can be obtained. .
[0027]
【The invention's effect】
As described above, according to the adhesive connector of the present invention, the first adhesive is improved by improving the wiring pattern structure of only a plurality of parallel lines formed on the adhesive in the conventional adhesive connector. In a configuration in which the base and the ground plate are fixed by a layer, the ground plate is fixed to one surface of the second adhesive layer, and a plurality of terminals are fixedly arranged on the other surface. The terminal portion of the second pressure-sensitive adhesive layer is formed of a metal thin film so as to straddle both side portions of the layer between the edges of the through hole formed in the peripheral portion of the other surface of the second adhesive layer, and at least one of the A ground metal thin film connected to the ground plate, and a signal metal thin film arranged in parallel with each other at a position separated from the ground metal thin film on the other surface of the second adhesive layer. Has a structure that has Therefore, the ground metal thin film and the signal metal thin film on the surface of the second adhesive layer can be directly and easily applied to the wiring portion at a predetermined position on the printed wiring board surface by the adhesive action of the surrounding adhesive. The connection can be made, and a sufficiently stable electrical contact can be obtained. As a result, unlike conventional products, even when the printed wiring board has complicated signal lines, it is possible to easily connect the printed wiring boards to each other, to achieve high-quality high-speed transmission, and to maintain a low profile. Thus, the pitch can be sufficiently reduced.
[Brief description of the drawings]
FIG. 1 shows a basic structure and an adhesive function of an adhesive connector according to one embodiment of the present invention. FIG. 1 (a) shows an adhesive connector at a predetermined position on a surface of a printed circuit board separated from two parts. (B) relates to a side sectional view of a main part of the adhesive connector shown in (a) in the direction of the line A1-A1. (C) relates to a side sectional view of a main part of the adhesive connector shown in (a) in the direction of line A2-A2, and (d) shows the adhesive connector shown in (a) in line BB. (E) relates to a partially cutaway plan view of the main part of the adhesive connector (back surface) shown in (a) of FIG. It is.
FIGS. 2A and 2B are cross-sectional side views of a main part showing a manufacturing process of the adhesive connector shown in FIG. 1 for each step, wherein FIG. 2A is related to an adhesive depositing step, FIG. ) Relates to the first metal thin film transfer step, (d) relates to the second metal thin film transfer step, (e) relates to the adhesive sheet and substrate sheet bonding step, and (f) relates to (e). 3 is an enlarged view of a local portion after the pressure-sensitive adhesive sheet and the base material sheet pasting step.
FIG. 3 is a side cross-sectional view showing a part of a detailed structure of a detailed connection state of the adhesive connector shown in FIG. 1 in a connection state at a predetermined position on the surface of a printed wiring board by an adhesive action on a wiring portion; It is.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Adhesive connector 2 Base material 3, 5 Adhesive layer 4 Ground metal plate layer 6 Ground metal thin film 7 Through hole 8 Signal metal thin film 9, 10 Separator 11, 12, 13 Printed wiring board

Claims (3)

A ground plate made of a thin metal conductive plate and an adhesive layer are laminated on an insulating base material, and the adhesive layer has a plurality of terminals so that at least one terminal is connected to the ground plate. In the pressure-sensitive adhesive connector fixedly disposed, the pressure-sensitive adhesive layer includes a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer. And the ground plate is fixed to one surface of the second pressure-sensitive adhesive layer, and the plurality of terminals are fixedly arranged on the other surface. The terminal portion is formed of a metal thin film so as to straddle both side portions of the layer between the edges of the through-hole formed in the peripheral portion of the other surface of the second pressure-sensitive adhesive layer, and at least one terminal portion. Is connected to the ground plate. A ground metal thin film, and a signal metal thin film arranged in parallel with each other at a position on the other surface of the second adhesive layer separated from the ground metal thin film. Adhesive connector. The adhesive connector according to claim 1, wherein the signal metal thin film has a microstrip line structure with respect to the ground metal thin film and the ground plate, and has an impedance matching, and the signal metal thin film and The ground metal thin film has a structure in which the ground metal thin film is directly connected to a wiring portion at a predetermined position on the surface of the two printed wiring boards by the adhesive action of the second adhesive layer. Adhesive connector characterized by the following. A pressure-sensitive adhesive deposition step of depositing a second pressure-sensitive adhesive layer on a ground plate made of a thin metal conductive plate with a pressure-sensitive adhesive; And a step of transferring and bending a metal thin film for grounding as a terminal portion using a metal thin film so as to extend from the surface side of the second pressure-sensitive adhesive layer to the edge between the through holes and to both surface portions of the layer. A first metal thin film transferring step, and a signal metal thin film as a terminal portion by a metal thin film so as to be parallel to each other at a position separated from the ground metal thin film with respect to the surface of the second adhesive layer. A second metal thin film transfer step of transferring the metal thin film for grounding and the ground plate to form a microstrip line structure to form a row, and an adhesive sheet on the surface of the ground plate A pressure-sensitive adhesive sheet and a substrate sheet-paste, which form a substrate by pasting to form a first pressure-sensitive adhesive layer and then pasting an insulating substrate sheet on the surface of the first pressure-sensitive adhesive layer And a process for producing an adhesive connector.

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