JP2007242548A - フィルム外装電気デバイスの製造方法、ヒータおよびフィルム外装電気デバイス - Google Patents
フィルム外装電気デバイスの製造方法、ヒータおよびフィルム外装電気デバイス Download PDFInfo
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Abstract
【解決手段】本発明のフィルム外装電気デバイスの製造方法は、シーラント11どうしが接合され、加圧されることにより熱融着性樹脂層を押し延ばす面を有する延出部11cを有するシーラント11をリード端子4に被覆する工程と、電池要素2の周辺部のラミネートフィルム5、6を熱融着させる周辺加熱部52と、リード端子4に対応し、周辺加熱部52に対して凹形状となる、シーラント11とラミネートフィルム5、6とを熱融着させるリード加熱部51と、周辺加熱部52とリード加熱部51とを階段状に繋ぐ、シーラント11の延出部11cとラミネートフィルム5、6とを熱融着させる中間加熱部53を有するヒータ50a、50bを用いて熱融着を行う工程とを含む。
【選択図】図3
Description
本発明のフィルム外装電気デバイスの製造方法は、延出部を有する被覆部材によって電極端子を被覆しておき、この延出部を中間過熱部を有するヒータによりヒートプレスすることで延出部に対応する部分の熱融着性樹脂層を押し出すようにして熱融着する。これにより、延出部における熱融着された領域の幅を電気デバイス要素の周辺部における熱融着された領域の幅よりも広く形成することができる。すなわち、本発明は、従来、幅が狭くなり、くびれとなっていた被覆部材の側端面近傍を幅広に熱融着することができ、もしくは製造ばらつきによる最悪の場合でもくびれ発生を防止することができるので、外部から水分の浸入を防止することができる。
2 電池要素
3 集電部
4 リード端子
4c 側端部
5 ラミネートフィルム
7 熱融着部
11 シーラント
11a 耐熱性樹脂層
11b 金属接着性樹脂層
11c 延出部
11d 押出し面
50a ヒータ
51 リード加熱部
51h リード部
52 周辺加熱部
52h 周辺部
53 中間加熱部
53a リード側端面
53b 周辺側端面
53h 中間平坦部
Claims (5)
- 電気デバイス要素と、前記電気デバイス要素に接続された電極端子を被覆する被覆部材と、熱融着性樹脂層を備えた外装体フィルムとを有し、前記電気デバイス要素の周辺部の前記外装体フィルムどうし、および前記外装体フィルムと前記被覆部材とを熱融着させることで電気デバイス要素が前記外装体フィルムにより封止されたフィルム外装電気デバイスの製造方法において、
平坦面を有する延出部を備えた前記被覆部材が形成された前記電極端子を用意する工程と、
前記電気デバイス要素の周辺部の前記外装体フィルムどうしを熱融着させる周辺加熱部と、前記電極端子に対応し、前記周辺加熱部に対して凹形状となる、前記被覆部材と前記外装体フィルムとを熱融着させる端子加熱部と、前記周辺加熱部と前記端子加熱部とを階段状に繋ぐ、前記被覆部材の前記延出部と前記外装体フィルムとを熱融着させる中間加熱部を有するヒータを用意する工程と、
前記ヒータの前記中間加熱部により、前記外装体フィルムを介して前記平坦面を加圧することで前記平坦面と重なる領域の前記熱融着性樹脂層を押し延ばしながら熱融着する工程と、を含むことを特徴とするフィルム外装電気デバイスの製造方法。 - 前記ヒータは金属製である、請求項1に記載のフィルム外装電気デバイスの製造方法。
- 電気デバイス要素と、前記電気デバイス要素に接続された電極端子を被覆する被覆部材と、前記電気デバイス要素の周辺部および前記被覆部材を熱融着して電気デバイス要素を封止する、熱融着性樹脂層を備えた外装体フィルムとを有するフィルム外装電気デバイスにおいて、
前記被覆部材は、平坦面を有する延出部を備えており、
前記電極端子と前記被覆部材と前記外装体フィルムとが接合された領域を含む第1の厚さの第1の接合領域と、
前記外装体フィルムどうしが接合された、前記第1の厚さよりも薄い第2の厚さの第2の接合領域と、
前記延出部と前記外装体フィルムとが接合された領域を含み、前記第1の厚さよりも薄くかつ前記第2の厚さよりも厚く、前記第1の接合領域と前記第2の接合領域とを繋ぐようにして形成された平坦な第3の接合領域とを有しており、
前記第3の接合領域において前記延出部の前記平坦面と重なる領域の熱融着製樹脂が押し延ばされていることを特徴とするフィルム外装電気デバイス。 - 前記延出部における熱融着された領域の幅が前記電気デバイス要素の周辺部における熱融着された領域の幅よりも広い、請求項3に記載のフィルム外装電気デバイス。
- 前記延出部の、前記電極端子から延出している方向への長さは1.5mm以上かつ、前記第2の接合領域の熱融着の幅以下である、請求項3または4に記載のフィルム外装電気デバイス。
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