JP2007287939A - 研磨方法、及び研磨装置 - Google Patents

研磨方法、及び研磨装置 Download PDF

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Publication number
JP2007287939A
JP2007287939A JP2006113813A JP2006113813A JP2007287939A JP 2007287939 A JP2007287939 A JP 2007287939A JP 2006113813 A JP2006113813 A JP 2006113813A JP 2006113813 A JP2006113813 A JP 2006113813A JP 2007287939 A JP2007287939 A JP 2007287939A
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JP
Japan
Prior art keywords
polishing
gas
polished
substrate
gas suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006113813A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007287939A5 (2
Inventor
Akira Fukunaga
明 福永
Nobu Shimizu
展 清水
Shintaro Kamioka
真太郎 上岡
Manabu Tsujimura
学 辻村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2006113813A priority Critical patent/JP2007287939A/ja
Priority to US11/785,190 priority patent/US20070243797A1/en
Publication of JP2007287939A publication Critical patent/JP2007287939A/ja
Publication of JP2007287939A5 publication Critical patent/JP2007287939A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B24B49/045—Specially adapted gauging instruments
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2006113813A 2006-04-17 2006-04-17 研磨方法、及び研磨装置 Withdrawn JP2007287939A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006113813A JP2007287939A (ja) 2006-04-17 2006-04-17 研磨方法、及び研磨装置
US11/785,190 US20070243797A1 (en) 2006-04-17 2007-04-16 Polishing method and polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006113813A JP2007287939A (ja) 2006-04-17 2006-04-17 研磨方法、及び研磨装置

Publications (2)

Publication Number Publication Date
JP2007287939A true JP2007287939A (ja) 2007-11-01
JP2007287939A5 JP2007287939A5 (2) 2009-03-19

Family

ID=38605383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006113813A Withdrawn JP2007287939A (ja) 2006-04-17 2006-04-17 研磨方法、及び研磨装置

Country Status (2)

Country Link
US (1) US20070243797A1 (2)
JP (1) JP2007287939A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105643464A (zh) * 2015-12-25 2016-06-08 深圳市财富之舟科技有限公司 一种移动终端壳体的加工方法及壳体模具

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5006883B2 (ja) * 2006-10-06 2012-08-22 株式会社荏原製作所 加工終点検知方法および加工装置
CN117817135B (zh) * 2024-03-05 2024-05-31 鑫业诚智能装备(无锡)有限公司 一种激光自动标刻装置及标刻方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6096267A (en) * 1997-02-28 2000-08-01 Extraction Systems, Inc. System for detecting base contaminants in air
US6077350A (en) * 1998-03-10 2000-06-20 Sony Corporation System and method for curing polymeric/photoresist coatings
US6180422B1 (en) * 1998-05-06 2001-01-30 International Business Machines Corporation Endpoint detection by chemical reaction
US6066564A (en) * 1998-05-06 2000-05-23 International Business Machines Corporation Indirect endpoint detection by chemical reaction
US6021679A (en) * 1998-08-04 2000-02-08 International Business Machines Corporation Probe for slurry gas sampling
US6254453B1 (en) * 1999-09-30 2001-07-03 International Business Machines Corporation Optimization of chemical mechanical process by detection of oxide/nitride interface using CLD system
US6291351B1 (en) * 2000-06-28 2001-09-18 International Business Machines Corporation Endpoint detection in chemical-mechanical polishing of cloisonne structures
JP2003338499A (ja) * 2002-05-20 2003-11-28 Tokyo Electron Ltd 膜形成方法及び膜形成装置
US6899784B1 (en) * 2002-06-27 2005-05-31 International Business Machines Corporation Apparatus for detecting CMP endpoint in acidic slurries
US6878629B1 (en) * 2002-06-27 2005-04-12 International Business Machines Corporation Method for detecting CMP endpoint in acidic slurries
US7189146B2 (en) * 2003-03-27 2007-03-13 Asm Nutool, Inc. Method for reduction of defects in wet processed layers
KR100583105B1 (ko) * 2003-12-24 2006-05-23 주식회사 하이닉스반도체 반도체 소자의 화학적 기계적 연마 공정의 종말점 검출 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105643464A (zh) * 2015-12-25 2016-06-08 深圳市财富之舟科技有限公司 一种移动终端壳体的加工方法及壳体模具
CN105643464B (zh) * 2015-12-25 2019-06-07 深圳市沃特沃德股份有限公司 一种移动终端壳体的加工方法及壳体模具

Also Published As

Publication number Publication date
US20070243797A1 (en) 2007-10-18

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