JP2008166830A5 - - Google Patents

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Publication number
JP2008166830A5
JP2008166830A5 JP2008011466A JP2008011466A JP2008166830A5 JP 2008166830 A5 JP2008166830 A5 JP 2008166830A5 JP 2008011466 A JP2008011466 A JP 2008011466A JP 2008011466 A JP2008011466 A JP 2008011466A JP 2008166830 A5 JP2008166830 A5 JP 2008166830A5
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JP
Japan
Prior art keywords
cassette
wafer
process processing
processing apparatus
transfer means
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Pending
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JP2008011466A
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Japanese (ja)
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JP2008166830A (en
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Priority to JP2008011466A priority Critical patent/JP2008166830A/en
Priority claimed from JP2008011466A external-priority patent/JP2008166830A/en
Publication of JP2008166830A publication Critical patent/JP2008166830A/en
Publication of JP2008166830A5 publication Critical patent/JP2008166830A5/ja
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Claims (4)

ウェハを真空処理する複数のプロセス処理装置と、ウェハを収納できる複数のカセットを載置し得るカセット載置手段と、前記複数のプロセス処理装置と前記カセット載置手段との間に設けた搬送手段と、該搬送手段を用いて前記カセット載置手段上に載置される任意のカセット内からウェハを前記各プロセス処理装置に搬入し、前記各プロセス処理装置で真空処理された処理済ウェハを搬出する搬送制御を行う制御手段とで構成された真空処理装置において、
前記カセット内に収納された複数のウェハを前記搬送手段を介して共通の処理を施す複数のプロセス処理装置へ順次搬送し、搬送したウェハに共通のレシピを適用して共通の処理を施す処理、及び前記複数のカセット内に収納された複数のウェハを前記搬送手段を介してカセット毎にそれぞれ異なるプロセス処理装置へ搬送し、搬送したウェハにプロセス処理装置毎に異なるレシピを適用して異なる処理を施す処理の何れかを選択的に施すとともに処理を施した後のウェハを前記搬送手段を介してもとのカセットに戻すことを特徴とする真空処理装置。
A plurality of process processing apparatuses for vacuum processing a wafer, a cassette mounting means for mounting a plurality of cassettes capable of storing wafers, and a transfer means provided between the plurality of process processing apparatuses and the cassette mounting means And a wafer is carried into each of the process processing apparatuses from an arbitrary cassette mounted on the cassette mounting means using the transfer means, and a processed wafer that has been vacuum-processed by each of the process processing apparatuses is unloaded. In a vacuum processing apparatus configured with a control means for performing transport control,
A process of sequentially transferring a plurality of wafers stored in the cassette to a plurality of process processing apparatuses that perform a common process via the transfer means, and applying a common recipe to the transferred wafer, And transferring a plurality of wafers stored in the plurality of cassettes to different process processing apparatuses for each cassette via the transfer means, and applying different recipes to the transferred wafers for each process processing apparatus. A vacuum processing apparatus characterized by selectively performing any of the processing to be performed and returning the processed wafer to the original cassette via the transfer means.
請求項1記載の真空処理装置において、
前記いずれかのプロセス処理装置に装置停止の必要が生じたとき、装置停止の必要が生じたプロセス処理装置に対するカセットからのウェハの搬出を中断し、前記装置停止の必要が生じたプロセス処理装置内のウェハをもとのカセットに戻したのち装置停止の必要がないプロセス処理装置に対するカセットからのウェハの搬出を継続し処埋を再開することを特徴とする真空処理装置。
The vacuum processing apparatus according to claim 1, wherein
When any one of the process processing apparatuses needs to be stopped, the carrying out of the wafer from the cassette to the process processing apparatus where the apparatus needs to be stopped is interrupted, and the inside of the process processing apparatus where the need to stop the apparatus occurs. A vacuum processing apparatus characterized in that after the wafer is returned to the original cassette, the wafer is unloaded from the cassette to the process processing apparatus which does not need to be stopped, and the processing is resumed.
カセット載置手段に載置される任意のカセット内から搬送手段を介してウェハを複数のプロセス処理装置に搬送し、該ウェハの真空処理を行う真空処理方法において、
前記カセット内に収納された複数のウェハを前記搬送手段を介して共通の処理を施す複数のプロセス処理装置へ順次搬送し、搬送したウェハに共通のレシピを適用して共通の処理を施す処理、及び前記複数のカセット内に収納された複数のウェハを前記搬送手段を介して各カセット毎にそれぞれ異なるプロセス処理装置へ搬送し、搬送したウェハにプロセス処理装置毎に異なるレシピを適用して異なる処理を施す処理の何れかを選択的に施すとともに処理を施した後のウェハを前記搬送手段を介してもとのカセットに戻すことを特徴とする真空処理方法。
In a vacuum processing method in which a wafer is transferred from a cassette placed on a cassette mounting means to a plurality of process processing apparatuses via a transfer means, and vacuum processing of the wafer is performed.
A process of sequentially transferring a plurality of wafers stored in the cassette to a plurality of process processing apparatuses that perform a common process via the transfer means, and applying a common recipe to the transferred wafer, And a plurality of wafers stored in the plurality of cassettes are transferred to different process processing apparatuses for each cassette via the transfer means, and different processes are applied to the transferred wafers by applying different recipes for each process processing apparatus. A vacuum processing method characterized by selectively performing any one of the processes for performing the process and returning the wafer after the process to the original cassette via the transfer means.
請求項3記載の真空処理方法において、
前記いずれかのプロセス処理装置に装置停止の必要が生じたとき、装置停止の必要が生じたプロセス処理装置に対するカセットからのウェハの搬出を中断し、前記装置停止の必要が生じたプロセス処理装置内のウェハをもとのカセットに戻したのち装置停止の必要がないプロセス処理装置に対するカセットからのウェハの搬出を継続し処埋を再開することを特徴とする真空処埋方法。
In the vacuum processing method of Claim 3,
When any one of the process processing apparatuses needs to be stopped, the carrying out of the wafer from the cassette to the process processing apparatus where the apparatus needs to be stopped is interrupted, and the inside of the process processing apparatus where the need to stop the apparatus occurs. A vacuum processing method characterized in that after the wafer is returned to the original cassette, the wafer is unloaded from the cassette to the process processing apparatus which does not need to be stopped, and processing is resumed.
JP2008011466A 2008-01-22 2008-01-22 Vacuum processing method and vacuum processing apparatus Pending JP2008166830A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008011466A JP2008166830A (en) 2008-01-22 2008-01-22 Vacuum processing method and vacuum processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008011466A JP2008166830A (en) 2008-01-22 2008-01-22 Vacuum processing method and vacuum processing apparatus

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004153482A Division JP4121480B2 (en) 2004-05-24 2004-05-24 Vacuum processing method and vacuum processing apparatus

Publications (2)

Publication Number Publication Date
JP2008166830A JP2008166830A (en) 2008-07-17
JP2008166830A5 true JP2008166830A5 (en) 2009-04-30

Family

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Family Applications (1)

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JP2008011466A Pending JP2008166830A (en) 2008-01-22 2008-01-22 Vacuum processing method and vacuum processing apparatus

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JP (1) JP2008166830A (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3238432B2 (en) * 1991-08-27 2001-12-17 東芝機械株式会社 Multi-chamber type single wafer processing equipment
JPH07106215A (en) * 1993-10-08 1995-04-21 Kokusai Electric Co Ltd Failure processing method in semiconductor manufacturing equipment
JP3328869B2 (en) * 1995-06-27 2002-09-30 東京エレクトロン株式会社 Processing method and processing apparatus
JPH0950948A (en) * 1995-08-08 1997-02-18 Kokusai Electric Co Ltd Failure coping system for semiconductor manufacturing equipment

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