JP2008537637A - Ｉｃソケットにおける温度検知および予測 - Google Patents

Ｉｃソケットにおける温度検知および予測 Download PDF

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Publication number
JP2008537637A
JP2008537637A JP2008500780A JP2008500780A JP2008537637A JP 2008537637 A JP2008537637 A JP 2008537637A JP 2008500780 A JP2008500780 A JP 2008500780A JP 2008500780 A JP2008500780 A JP 2008500780A JP 2008537637 A JP2008537637 A JP 2008537637A
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JP
Japan
Prior art keywords
temperature
package
surface temperature
amount
measured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008500780A
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English (en)
Japanese (ja)
Inventor
クリストファー， エイ． ロペス，
ブライアン，ジェー． デンヘヤー，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wells CTI LLC
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Wells CTI LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wells CTI LLC filed Critical Wells CTI LLC
Publication of JP2008537637A publication Critical patent/JP2008537637A/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
    • G01K7/425—Thermal management of integrated systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Power Sources (AREA)
JP2008500780A 2005-03-08 2006-03-03 Ｉｃソケットにおける温度検知および予測 Pending JP2008537637A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65980805P 2005-03-08 2005-03-08
PCT/US2006/007687 WO2006096543A2 (fr) 2005-03-08 2006-03-03 Detection et prevision de temperature dans des prises a circuits integres

Publications (1)

Publication Number Publication Date
JP2008537637A true JP2008537637A (ja) 2008-09-18

Family

ID=36953894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008500780A Pending JP2008537637A (ja) 2005-03-08 2006-03-03 Ｉｃソケットにおける温度検知および予測

Country Status (5)

Country Link
EP (1) EP1866656A2 (fr)
JP (1) JP2008537637A (fr)
KR (1) KR20070114310A (fr)
CN (1) CN101495821A (fr)
WO (1) WO2006096543A2 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013084666A (ja) * 2011-10-06 2013-05-09 Mitsubishi Electric Corp 半導体素子の接合温度の推定方法、推定システムおよび推定プログラム
JP2015207735A (ja) * 2014-04-23 2015-11-19 富士通株式会社 半導体部品および電子機器
KR20190100380A (ko) * 2017-01-09 2019-08-28 델타 디자인, 인코포레이티드 소켓 측(側) 열 시스템
KR20230022684A (ko) * 2021-08-09 2023-02-16 리노공업주식회사 검사소켓
US11774486B2 (en) 2021-06-30 2023-10-03 Delta Design Inc. Temperature control system including contactor assembly

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110106476A1 (en) * 2009-11-04 2011-05-05 Gm Global Technology Operations, Inc. Methods and systems for thermistor temperature processing
US8384395B2 (en) 2010-05-06 2013-02-26 Texas Instrument Incorporated Circuit for controlling temperature and enabling testing of a semiconductor chip
JP4891423B2 (ja) * 2010-06-01 2012-03-07 ファナック株式会社 電子回路の冷却部の異常検査システム
CN102636291B (zh) * 2011-02-15 2013-12-25 三一电气有限责任公司 一种igbt结温检测装置及其方法
US8547122B2 (en) * 2011-07-11 2013-10-01 Microchip Technology Incorporated Temperature measurement of active device under test on strip tester
GB2509649B (en) * 2011-10-31 2019-10-30 Hewlett Packard Development Co Airflow block response in a system
KR101942027B1 (ko) * 2012-03-28 2019-04-11 삼성전자 주식회사 디바이스의 온도 예측 방법
CN103364739B (zh) * 2012-03-29 2016-04-20 北京动力源科技股份有限公司 一种开关电源中开关管的结点温升测试方法
KR101600176B1 (ko) * 2014-04-11 2016-03-07 영남대학교 산학협력단 열저항을 이용한 led모듈체의 방열판 결합상태 검사시스템 및 열저항을 이용한 led모듈체의 방열판 결합상태 검사방법
CN106546357B (zh) * 2015-09-23 2020-06-02 中兴通讯股份有限公司 一种检测环境温度的方法、装置和电子设备
CN110928340B (zh) * 2018-09-19 2021-12-24 中车株洲电力机车研究所有限公司 一种功率器件主动结温控制系统及方法
TWI701447B (zh) * 2019-03-15 2020-08-11 鴻勁精密股份有限公司 具溫控單元之測試裝置及其應用之測試分類設備
CN113182198B (zh) * 2020-01-14 2023-08-29 鸿劲精密股份有限公司 具温控单元的测试装置及其应用的测试分类设备
CN111310362B (zh) * 2020-04-01 2023-11-10 纬湃科技投资(中国)有限公司 直流母线接插件的温度估算方法和计算机可读存储介质
CN111443278B (zh) * 2020-04-21 2022-10-18 普源精电科技股份有限公司 一种芯片、芯片温度检测模块及方法
CN111883516A (zh) * 2020-07-24 2020-11-03 青岛歌尔智能传感器有限公司 集成模组的封装结构及其封装方法、以及电子设备
US11573262B2 (en) * 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
WO2023051927A1 (fr) * 2021-09-30 2023-04-06 Advantest Corporation Dispositifs de commande pour commander un équipement de test automatisé (ate), ate, procédés de commande d'un ate, procédés de fonctionnement d'un ate et programmes informatiques pour mettre en œuvre de tels procédés, comprenant une estimation ou une détermination de température

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000304804A (ja) * 1999-04-26 2000-11-02 Denken Eng Kk バーンイン装置及びバーンイン方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6668570B2 (en) * 2001-05-31 2003-12-30 Kryotech, Inc. Apparatus and method for controlling the temperature of an electronic device under test
JP4148677B2 (ja) * 2001-12-19 2008-09-10 富士通株式会社 ダイナミック・バーンイン装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000304804A (ja) * 1999-04-26 2000-11-02 Denken Eng Kk バーンイン装置及びバーンイン方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013084666A (ja) * 2011-10-06 2013-05-09 Mitsubishi Electric Corp 半導体素子の接合温度の推定方法、推定システムおよび推定プログラム
JP2015207735A (ja) * 2014-04-23 2015-11-19 富士通株式会社 半導体部品および電子機器
US9627291B2 (en) 2014-04-23 2017-04-18 Fujitsu Limited Semiconductor device and electronic device
KR20190100380A (ko) * 2017-01-09 2019-08-28 델타 디자인, 인코포레이티드 소켓 측(側) 열 시스템
JP2020505584A (ja) * 2017-01-09 2020-02-20 デルタ・デザイン・インコーポレイテッドＤｅｌｔａ Ｄｅｓｉｇｎ， Ｉｎｃ． ソケット側表面熱システム
KR102473364B1 (ko) * 2017-01-09 2022-12-01 델타 디자인, 인코포레이티드 소켓 측(側) 열 시스템
JP2022188088A (ja) * 2017-01-09 2022-12-20 デルタ・デザイン・インコーポレイテッド ソケット側表面熱システム
US11879910B2 (en) 2017-01-09 2024-01-23 Delta Design, Inc. Socket side thermal system
US11774486B2 (en) 2021-06-30 2023-10-03 Delta Design Inc. Temperature control system including contactor assembly
KR20230022684A (ko) * 2021-08-09 2023-02-16 리노공업주식회사 검사소켓
KR102670897B1 (ko) 2021-08-09 2024-05-31 리노공업주식회사 검사소켓

Also Published As

Publication number Publication date
WO2006096543A2 (fr) 2006-09-14
CN101495821A (zh) 2009-07-29
KR20070114310A (ko) 2007-11-30
WO2006096543A3 (fr) 2009-04-16
EP1866656A2 (fr) 2007-12-19

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