JP2009182327A - Ｌｅｄ照明装置、ｌｅｄ光源モジュール及びｌｅｄ支持体 - Google Patents

Ｌｅｄ照明装置、ｌｅｄ光源モジュール及びｌｅｄ支持体 Download PDF

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Publication number
JP2009182327A
JP2009182327A JP2009012664A JP2009012664A JP2009182327A JP 2009182327 A JP2009182327 A JP 2009182327A JP 2009012664 A JP2009012664 A JP 2009012664A JP 2009012664 A JP2009012664 A JP 2009012664A JP 2009182327 A JP2009182327 A JP 2009182327A
Authority
JP
Japan
Prior art keywords
metal
foam
layer
led
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009012664A
Other languages
English (en)
Japanese (ja)
Inventor
Xue-Yong Liu
学勇 劉
Hong-Xian Lou
洪献 楼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Andy Optoelectronic Co Ltd
Original Assignee
Ningbo Andy Optoelectronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Andy Optoelectronic Co Ltd filed Critical Ningbo Andy Optoelectronic Co Ltd
Publication of JP2009182327A publication Critical patent/JP2009182327A/ja
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP2009012664A 2008-01-31 2009-01-23 Ｌｅｄ照明装置、ｌｅｄ光源モジュール及びｌｅｄ支持体 Pending JP2009182327A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2008100333273A CN101220934A (zh) 2008-01-31 2008-01-31 Led照明装置

Publications (1)

Publication Number Publication Date
JP2009182327A true JP2009182327A (ja) 2009-08-13

Family

ID=39630932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009012664A Pending JP2009182327A (ja) 2008-01-31 2009-01-23 Ｌｅｄ照明装置、ｌｅｄ光源モジュール及びｌｅｄ支持体

Country Status (4)

Country Link
EP (1) EP2085681A2 (fr)
JP (1) JP2009182327A (fr)
KR (1) KR20090084689A (fr)
CN (1) CN101220934A (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100285A (ja) * 2009-11-05 2011-05-19 Canon Inc Ｕｓｂホスト装置、制御方法、及びプログラム
CN103727506A (zh) * 2013-12-13 2014-04-16 青岛威力电子科技有限公司 Led光源承载体的高效散热方法
CN104315486A (zh) * 2013-04-20 2015-01-28 大连三维传热技术有限公司 SiO2纳米液体工质的泡沫金属吸液芯热板散热器
CN105177339A (zh) * 2015-10-26 2015-12-23 三峡大学 一种三维空间有序孔结构泡沫铝及其制备方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2961894B1 (fr) * 2010-06-24 2013-09-13 Valeo Vision Dispositif a echange de chaleur, notamment pour vehicule automobile
FR2965042B1 (fr) * 2010-09-22 2014-11-21 Valeo Vision Dispositif a echange de chaleur, notamment pour vehicule automobile
CN102661504A (zh) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 一种设有金属散热装置的大功率led筒灯
CN102661505A (zh) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 一种设有金属散热装置的大功率led平板灯具
FR3031569B1 (fr) * 2015-01-12 2018-11-16 Xyzed Module d'eclairage a diodes a refroidissement ameliore

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006135502A1 (fr) * 2005-06-10 2006-12-21 Cree, Inc. Lampe à l’état solide à haute puissance
JP2007527619A (ja) * 2003-07-17 2007-09-27 エンフィス リミテッド 冷却方法並びに装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007527619A (ja) * 2003-07-17 2007-09-27 エンフィス リミテッド 冷却方法並びに装置
WO2006135502A1 (fr) * 2005-06-10 2006-12-21 Cree, Inc. Lampe à l’état solide à haute puissance

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100285A (ja) * 2009-11-05 2011-05-19 Canon Inc Ｕｓｂホスト装置、制御方法、及びプログラム
CN104315486A (zh) * 2013-04-20 2015-01-28 大连三维传热技术有限公司 SiO2纳米液体工质的泡沫金属吸液芯热板散热器
CN103727506A (zh) * 2013-12-13 2014-04-16 青岛威力电子科技有限公司 Led光源承载体的高效散热方法
CN105177339A (zh) * 2015-10-26 2015-12-23 三峡大学 一种三维空间有序孔结构泡沫铝及其制备方法

Also Published As

Publication number Publication date
KR20090084689A (ko) 2009-08-05
CN101220934A (zh) 2008-07-16
EP2085681A2 (fr) 2009-08-05

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