JP2010141278A - Polysaccharide wiring board and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To develop a simple and low-cost technique for manufacturing a wiring board using an earth-friendly material by solving a problem wherein, up to now, a resin is mainly used as a board material so that a circuit is stably operated in a wiring board with electric components and electronic components mounted thereon as integrated circuits, but the whole wiring board is handled as a waste when any of the components comes to the end of its life, and a problem wherein an environmental load such as resource consumption or environmental pollution is large in manufacturing the wiring board. <P>SOLUTION: In this polysaccharide wiring board, since the wiring board formed of polysaccharide derived from a living substance is formed into a structure having surface wiring and/or embedded wiring, the polysaccharide wiring board must be subjected only to an aqueous solution treatment for this treatment; thereby a waste problem does not occur; and reusable components are easily recovered; whereby a useful component regeneration technique is composed and this simple and low-cost technique for manufacturing a wiring board using an earth-friendly material and small in environmental load is composed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a polysaccharide wiring board technology that has surface wiring arranged on the surface of the substrate and / or embedded wiring arranged inside the substrate, and these wirings are wiring that can be connected to an electrical component or an electronic component. Further, the present invention relates to a technique for manufacturing the polysaccharide wiring board, and more particularly, to a technique for the polysaccharide wiring board in which the substrate and the components are sealed with an insulator.

  The present invention also relates to a technique for a polysaccharide-wiring board that can be attached to the skin, having surface electrodes and fine needle electrodes exposed on the surface of the board, and has a magnetic coil wiring and a magnetic body on the board surface. Further, the present invention relates to a polysaccharide wiring board technology equipped with a speaker that can be worn on the skin, and further includes a light-emitting diode arranged on the surface of the board and / or a light-emitting diode embedded inside the board, and can be worn on the skin. The present invention relates to a polysaccharide wiring board technology equipped with a simple light emitting diode.

On the other hand, in wiring boards on which electrical components and electronic components are mounted as integrated circuits, resins (bakelite, epoxies, etc.) are mainly used as substrate materials in consideration of the various characteristics described above in order to ensure stable operation of integrated circuits. Ceramics have been used when heat dissipation is particularly important. For example, Patent Document 1 provides a substrate for an electric wiring board, and here, an invention using a resin or ceramic as a board material is disclosed in order to solve the problem of unnecessary electromagnetic radiation.
JP 2005-32969 A

In addition, in the technical field related to the electrical measurement of living bodies, it is necessary to wear measurement electrodes that form an electrical circuit on the body. Particularly in electrocardiogram measurement and electroencephalogram measurement, the electrodes should be attached to the skin stably and connected to the skin. In order to stabilize electrical contact, skin attachment has been performed by using a suction cup or conductive silver paste. However, in general, when an electrode, which is a printed circuit board, is worn on the body, since the substrate material is mainly resin or ceramics, an adhesive having appropriate tackiness is required to attach the material to the skin. . For example, Patent Document 2 provides a health promotion tool to be applied to the skin, and here, an invention using a skin adhesive layer as an adhesive used when an electrode is attached to the skin is disclosed.
JP-A-7-108065

  Resin, which is the main component of a wiring board on which electrical and electronic components are mounted as an integrated circuit, will inevitably become waste when one of its components has reached the end of its life. The problem of waste of resources still existed here. Although general disposal and incineration have been carried out for the processing of these wiring boards, scattering of harmful substances from harmful wastes and generation of harmful exhaust gases have become major environmental problems as described above. Furthermore, ceramic substrates with good heat dissipation used for high integration of electronic components have been treated as waste when any component has reached the end of their life. General disposal to the ground etc. has been carried out, and this entails the possibility of becoming an environmental pollution problem in future generations. In the processing site of such wiring boards, it is impossible to remove the parts attached by solder from the wiring boards made of resin or ceramics on which electric parts and electronic parts are mounted without destroying them. It is also impossible to recycle and use, and in fact, only those precious metals used for wiring on those parts or boards can be recycled, or some parts that are easily removed can be inserted into connectors. This is a big problem in that the recycling ratio is low when viewed from the whole parts used in the wiring board.

  Considering the above problems, it is impossible to remove and recycle reusable electrical and electronic components mounted on resin substrates by solder. Furthermore, macroscopically, the development of a permanent technology (Eternal Technology) whose main purpose is resource continuity on a global scale has become an important issue.

  On the other hand, in the process of manufacturing the multilayer wiring board having the surface wiring and the embedded wiring, first, after manufacturing the substrate on which the normal surface wiring is provided, a new substrate is provided to cover the surface wiring so as to be embedded. If a surface wiring is further provided on the substrate, a two-layer wiring can be manufactured. By repeating this process, it is possible to make the wiring multi-layered. However, in the production of the conventional multilayer wiring board as described above, it is necessary to repeat the production of each layer and the wiring process, which is a factor of high cost. It has become a major issue in manufacturing technology. Accordingly, there has been a demand for development of a simple and low-cost manufacturing technique in the manufacture of a wiring board having surface wiring and embedded wiring.

  In addition, measurement electrodes are attached to the body for electrical measurement of living organisms, but when attaching electrodes that are printed circuit boards, adhesives are mainly used to attach resin substrates and ceramic substrates to the body. Since it is necessary, there has been a problem that it is impossible to use the substrate for a long time, that is, the electrode mounting due to the rash on the skin surface due to the adhesive or the performance degradation of the adhesive due to perspiration. Therefore, the above-mentioned problems have been associated with the attachment of electrocardiographs and electroencephalograph electrodes that are measured over a long period of time, more than one day. Furthermore, in electrocardiogram measurement and electroencephalogram measurement, in order to stably attach the electrode to the skin and stabilize the electrical contact with the skin, the electrode diameter is enlarged, the use of a suction cup or conductive silver paste as an adhesive function, etc. However, there are problems in that the subject feels uncomfortable because of the skin feel and the coldness, and the adhesion function due to the above-mentioned skin irritation and perspiration is reduced. In order to solve these problems, there has been a problem of developing a body-mounted technique for measuring electrodes that is less uncomfortable and simple.

  Furthermore, in hearing aids that are generally used as hearing aids, there are problems such as the hearing aid being detached each time the body is moved, inconveniences such as hurting the ear canal due to long-term use, and extreme hearing ability. There were problems such as extremely low effectiveness for those who declined. Therefore, although bone conduction type hearing aids have been developed, smaller size and lower cost are required, and how to apply wiring board technology to such needs is a problem. It was.

  Moreover, in light emitting diodes that have been used as light-generating devices with energy saving and long life, the use of light has been expanded due to technological advancement. When irradiating the skin with light, the material of the optical path is glass that has been used in the past, so when connecting between optical paths like an optical fiber, if the optical axis alignment is not accurate, the transmission efficiency will be due to scattering Will be reduced. Therefore, it has become a problem here to stably attach light emitting diodes to the skin and to irradiate the skin with light efficiently. That is, how to apply the wiring board technology to this problem is important. It was an issue.

In order to solve the above problems, the inventors have conducted intensive research and development, and as means and methods for solving these problems in the present invention,
(1) A wiring board made of a polysaccharide has a structure having a surface wiring arranged on the surface of the substrate or a buried wiring arranged inside the substrate, and the wiring can be connected to an electrical component and / or an electronic component. A polysaccharide wiring board having surface wiring or embedded wiring, characterized by
(2) The surface wiring or embedded wiring according to (1) above, wherein the polysaccharide in the polysaccharide wiring board is one polysaccharide selected from pullulan, carboxymethylcellulose, starch, and hyaluronic acid. A polysaccharide wiring board, and
(3) In the production of the polysaccharide wiring board having the structure having the surface wiring, after filling the hydrophobic mold with 10% by weight to 70% by weight of the polysaccharide aqueous solution, the humidity of the mold is 10% or less. The polysaccharide aqueous solution filled in the mold is dried and solidified and molded by standing in a dry atmosphere of the above or by heating the mold to 50 ° C. to 90 ° C. A wiring that can be connected to an electrical component and / or an electronic component is provided on the surface, or in the manufacture of a polysaccharide wiring board having a structure having the embedded wiring, the wiring can be connected to an electrical component and / or an electronic component. The wiring is placed in a hydrophobic mold and filled with 10% to 70% by weight polysaccharide aqueous solution, and then the mold is left in a dry atmosphere with a humidity of 10% or less. 3. The polysaccharide aqueous solution filled in the mold is dried and solidified and molded by heating the mold to 50 ° C. to 90 ° C. Manufacturing method of polysaccharide wiring board having surface wiring or embedded wiring, and
(4) A polysaccharide wiring board having a structure having surface wiring arranged on the substrate surface and embedded wiring arranged inside the board, and the wiring can be connected to an electrical component and / or an electronic component. A polysaccharide wiring board having a surface wiring and an embedded wiring, and
(5) The surface wiring and embedded wiring according to (4) above, wherein the polysaccharide in the polysaccharide wiring board is one polysaccharide selected from pullulan, carboxymethylcellulose, starch, and hyaluronic acid. A polysaccharide wiring board, and
(6) A wiring that can be connected to an electrical component and / or an electronic component is disposed in a hydrophobic mold, and 10% by weight to 70% by weight polysaccharide aqueous solution is filled in the mold, and then the mold is used. By standing in a dry atmosphere with a humidity of 10% or less, or by heating the mold to 50 ° C. to 90 ° C. to dry and solidify the polysaccharide aqueous solution filled in the mold. Furthermore, the manufacturing method of the polysaccharide wiring board having the surface wiring and the embedded wiring according to the above (4) or (5), characterized in that a wiring that can be connected to an electrical component and / or an electronic component is provided on the surface of the molded product. Method, and
(7) The surface wiring or embedded wiring or the surface wiring and embedded according to any one of (1) or (4), wherein the substrate and the component are sealed with an insulator made of pullulan or hyaluronic acid. A polysaccharide wiring board having wiring, and
(8) The polysaccharide wiring board has a structure in which a terminal portion of the embedded wiring disposed inside the substrate has a surface electrode exposed on the surface of the board, and the wiring is an electrical component and / or an electronic device. A skin mounting characterized in that it is a wiring that can be connected to a component, and the substrate is adhered to the skin by wetting the substrate surface on which the surface electrode is exposed, so that the surface electrode contacts the skin surface. Polysaccharide wiring board with possible surface electrodes, and
(9) A wiring board made of a polysaccharide, wherein the wiring board has a structure having a fine needle electrode that is connected to a terminal portion of an embedded wiring disposed inside the substrate and exposed on the surface of the board, and the wiring is an electrical component And / or a wiring that can be connected to an electronic component, and the substrate surface on the side where the fine needle electrode is exposed is wetted so that the substrate adheres to the skin and the fine needle electrode is inserted into the skin surface. A polysaccharide wiring board having fine needle electrodes that can be worn on the skin, and
(10) A wiring board made of a polysaccharide having a structure having a magnetic coil wiring disposed on the surface of the substrate and a magnetic body disposed in the magnetic coil wiring, wherein the magnetic coil wiring is an electrical component and / or Alternatively, the wiring can be connected to an electronic component, and the substrate adheres to the skin by wetting the substrate surface opposite to the substrate surface on which the magnetic body is disposed, and the magnetic coil wiring is energized to pass the magnetic A polysaccharide wiring board equipped with a skin-worn speaker, characterized by conducting an audio signal in the skin as a speaker by vibrating the body, and
(11) In the wiring substrate made of a polysaccharide, the light-emitting diode connected to the surface wiring disposed on the surface of the substrate and / or the embedded wiring disposed inside the substrate, and disposed on the surface of the substrate, and / or It has a structure having a light emitting diode embedded in a substrate, and the wiring is a wiring that can be connected to an electrical component and / or an electronic component, and the substrate adheres to the skin by wetting the surface of the substrate. A polysaccharide wiring board having a light-emitting diode mounted on the surface of the substrate and / or a light-emitting diode embedded in the substrate to illuminate the skin surface, ,
(12) The polysaccharide according to any one of (8) to (11), wherein the polysaccharide in the polysaccharide wiring board is one polysaccharide selected from pullulan, carboxymethylcellulose, starch, and hyaluronic acid. Polysaccharide wiring board,
This invention is made.

  In the polysaccharide wiring board of the present invention, the polysaccharide wiring board has a structure having a surface wiring disposed on the surface of the substrate and / or a buried wiring disposed inside the substrate, and the wiring is electrically connected. By disposing wiring that can be connected to a component and / or electronic component, the disposal process at the time when the life of any of the components has expired or the wiring that can be connected is hindered is not possible. Taking advantage of the water-solubility, which is a characteristic, it can be handled by dissolving the polysaccharide wiring board in an appropriate amount of water. This eliminates the need for disposal in landfills or incineration using a high-temperature furnace, and does not cause environmental problems such as scattering of harmful substances from waste and generation of harmful exhaust gases. Furthermore, it is possible to easily and inexpensively collect reusable electrical components and electronic components from the water containing the water-soluble polysaccharide wiring board, and by subjecting the polysaccharide wiring board of the present invention to water treatment, It can be developed into useful parts recycling technology. In addition, if electrical components or electronic components are connected with connectors, and the substrate material to be attached and the protective insulator material to be manufactured are made of polysaccharides, they can be easily dissolved in water and the components and circuit parts can be removed. Since each component can be removed from the connector without breaking, all electrical and electronic components can be used permanently. That is, the present invention can be developed into a component recycling technology, and further into a permanent technology. It can develop. Moreover, since the polysaccharide raw material which is a biological material is used in the manufacture of the polysaccharide wiring board of the present invention, petroleum-based raw materials, various chemical intermediates and their chemical reactions, and solvents are used in the manufacturing process. Simple and low-cost wiring board manufacturing technology using polysaccharides, which are environmentally friendly raw materials, with less environmental impacts such as resource consumption and environmental pollution compared to resin and ceramics as raw materials. It will be.

  In the polysaccharide wiring board having the surface-mountable surface electrode or fine needle electrode of the present invention, in the wiring board made of polysaccharide, the end portion of the embedded wiring disposed inside the substrate is exposed on the surface of the substrate. A surface electrode or a fine needle electrode that is connected to a terminal portion of an embedded wiring disposed inside the substrate and exposed on the surface of the substrate, and the wiring is an electrical component and / or an electronic component. The surface electrode or the fine needle electrode is attached to the skin by wetting the surface of the substrate on the side where the surface electrode or the fine needle electrode is exposed, so that the surface electrode or the fine needle electrode is attached to the skin surface. By touching or inserting, it is impossible to wear the substrate for a long time due to rash on the skin surface due to adhesive or deterioration of the performance of the adhesive due to sweating, that is, electrode mounting use It was to overcome the problem that. Furthermore, when capturing electrical signals from inside the body, such as electrocardiogram measurement and electroencephalogram measurement, the wiring board and surface electrode with electrical or electronic components mounted to measure the potential of the skin surface or to introduce current from the skin surface Although it is necessary to provide it on the skin surface, the wiring board material is made of polysaccharides so that the back surface is moistened and adhered to the skin, so there is no inflammation such as rash on the skin surface and long-term measurement is possible. It becomes possible. Also, if a fine needle electrode is used, the tip of the fine needle electrode can be inserted into the skin, the electric contact resistance can be reduced as much as possible, a suction cup is provided to push the electric contact resistance, and the electrode There is no need to increase the diameter of the electrode or to attach it to the skin with a conductive silver paste, and an extremely small electrode can be used. As described above, the polysaccharide wiring board having the surface electrode or the fine needle electrode that can be attached to the skin according to the present invention may reduce the adhesion function due to skin irritation or sweating, which has been a problem in the above-described conventional technology. Furthermore, it is possible to develop a measurement electrode body mounting technique that is less discomfort and simple.

  In the polysaccharide wiring board on which the skin-worn speaker of the present invention is mounted, the magnetic coil wiring disposed on the substrate surface in the polysaccharide wiring board, and the magnetic body disposed in the magnetic coil wiring are provided. The magnetic coil wiring is a wiring that can be connected to an electrical component and / or an electronic component, and the substrate surface is wetted on the substrate surface opposite to the substrate surface on which the magnetic body is disposed. Adhering to the skin, energizing the magnetic coil wiring to vibrate the magnetic body, thereby conducting an audio signal in the skin as a speaker and moistening the back surface of the polysaccharide wiring board (the back side of the speaker arrangement surface). This makes it possible to easily attach the polysaccharide wiring board to the skin, and even when an audio signal is transmitted directly into the body, it is necessary to limit it to the ear like an earphone. Without, Using bone conduction, it becomes possible to propagate an audio signal to the hearing even from the body. When using the polysaccharide wiring board equipped with such a speaker as a hearing aid, if it is attached to the bone near the base of the neck, it can be placed in clothes without being particularly noticeable. It can be used stably, and the polysaccharide wiring board on which this speaker is mounted can be used as a small-size and low-cost hearing aid.

  In the polysaccharide wiring board having the skin-mountable light emitting diode of the present invention mounted thereon, in the wiring board made of polysaccharide, the wiring is connected to the surface wiring arranged on the substrate surface and / or the embedded wiring arranged inside the substrate. A light emitting diode disposed on a surface of the substrate and / or a light emitting diode embedded in the substrate, and the wiring is a wiring that can be connected to an electrical component and / or an electronic component, Furthermore, the substrate adheres to the skin by wetting the substrate surface, and the surface of the skin is illuminated by the light emitting diodes arranged on the surface of the substrate and / or the light emitting diodes embedded in the substrate. Can be formed into an optical path of any shape, that is, a light emitting diode It will be able to fully utilize the expansion of the optical applications by development, optimal if required a free shape as the light ornaments, may be expected to artistic expression. In addition, if the optical path material is made of polysaccharides, when connecting between optical paths as in an optical fiber, the fibers can be fused together, and no optical axis alignment is required, so there is no scattering and transmission efficiency is improved. Furthermore, the surface of the polysaccharide wiring board on which the light emitting diode of the present invention is mounted (in the case of a light emitting diode arranged inside the board) or the back surface (in the case of a light emitting diode arranged on the substrate surface) Skin attachment can be simplified by moistening the back side of the arrangement surface.

  In the polysaccharide wiring board of the present invention, the polysaccharide wiring board has a structure having a surface wiring disposed on the surface of the substrate and / or a buried wiring disposed inside the substrate, and the wiring is electrically connected. It is assumed that the wiring can be connected to parts and / or electronic parts, and the disposal of the polysaccharide wiring board is made water-soluble in an appropriate amount of water, thereby scattering harmful substances from waste and generating harmful emissions. The effect that no environmental problems occur. In addition, there is also an effect that electric parts and electronic parts that can be reused from the water including the water-soluble polysaccharide wiring board can be easily and at low cost. Furthermore, since the polysaccharide is used as a raw material in the production of the polysaccharide wiring board of the present invention, petroleum-based raw materials, various chemical intermediates and their chemical reactions, and solvents are also involved in the production process. Compared with the case where resin is used as a raw material, the environmental load such as resource consumption and environmental pollution is extremely small, and the effect is that it is a simple and low-cost method for producing a wiring board using polysaccharides, which are earth-friendly raw materials. Will get.

  In the polysaccharide wiring board having the surface-mountable surface electrode or fine needle electrode of the present invention, in the wiring board made of polysaccharide, the end portion of the embedded wiring disposed inside the substrate is exposed on the surface of the substrate. A surface electrode or a fine needle electrode that is connected to a terminal portion of an embedded wiring disposed inside the substrate and exposed on the surface of the substrate, and the wiring is an electrical component and / or an electronic component. The surface electrode or the fine needle electrode is attached to the skin by wetting the surface of the substrate on the side where the surface electrode or the fine needle electrode is exposed, so that the surface electrode or the fine needle electrode is attached to the skin surface. When the electrode is attached to the skin for a long time due to contact or insertion, the skin surface is rashed by the adhesive or the adhesive performance is reduced due to sweating. Use effect is obtained that it becomes possible. In addition, there is also an effect that it is possible to easily attach the measurement electrode to the body with less discomfort.

  In the polysaccharide wiring board on which the skin-worn speaker of the present invention is mounted, the magnetic coil wiring disposed on the substrate surface in the polysaccharide wiring board, and the magnetic body disposed in the magnetic coil wiring are provided. The magnetic coil wiring is a wiring that can be connected to an electrical component and / or an electronic component, and the substrate surface is wetted on the substrate surface opposite to the substrate surface on which the magnetic body is disposed. The back surface of the polysaccharide wiring board (the back side of the speaker placement surface) is wetted by conducting an audio signal in the skin as a speaker by adhering to the skin and energizing the magnetic coil wiring to vibrate the magnetic material. By doing so, the polysaccharide wiring board can be easily attached to the skin, and an audio signal can be transmitted to the hearing from anywhere in the body according to the principle of bone conduction. Effect that capable of. In addition, the polysaccharide wiring board on which the speaker is mounted can be used as a small-size and low-cost hearing aid.

  In the polysaccharide wiring board having the skin-mountable light emitting diode of the present invention mounted thereon, in the wiring board made of polysaccharide, the wiring is connected to the surface wiring arranged on the substrate surface and / or the embedded wiring arranged inside the substrate. A light emitting diode disposed on a surface of the substrate and / or a light emitting diode embedded in the substrate, and the wiring is a wiring that can be connected to an electrical component and / or an electronic component, Furthermore, the substrate adheres to the skin by wetting the substrate surface, and the surface of the skin is illuminated by the light emitting diodes arranged on the surface of the substrate and / or the light emitting diodes embedded in the substrate. Because it is made of polysaccharides, it is possible to form an optical path of any shape, and is ideal when it is required to have a free shape such as a light ornament Yes, the effect is obtained that artistic expression can be expected. In addition, if the optical path material is made of polysaccharides, when connecting between optical paths as in an optical fiber, the fibers can be fused together, and no optical axis alignment is required, so there is no scattering and transmission efficiency is improved. The effect that it can be maintained is also acquired. Furthermore, it is possible to obtain an effect that the skin can be easily attached by wetting the front surface or the back surface of the polysaccharide wiring board on which the light emitting diode according to the present invention is mounted.

  Embodiments of the polysaccharide wiring board and the method for producing the same according to the present invention will be described in detail below, but the present invention is not limited to these embodiments.

  In the present invention, the wiring board means an electric wiring circuit board. Therefore, the surface wiring and the embedded wiring all mean the form of the electric wiring. Furthermore, the electric parts include a light bulb, a vacuum tube, and an outlet. There are general electrical parts such as connectors, transformers, relays, induction coils, stabilized power supplies, dry batteries, etc., and electronic parts include diodes, capacitors, transistors, light emitting diodes, integrated circuits, coils, micromachines, microswitches, solar cells There are general electronic parts. FIG. 1 is a schematic perspective view showing a main part of a surface wiring in a conventional wiring board. Here, a structure in which the surface wiring 1 is arranged on the surface of the wiring board 2 is shown. In general, resin, ceramics, glass, or the like is used as the base material. Further, FIG. 2 is a schematic perspective view showing main portions of the surface wiring and embedded wiring in the conventional wiring board. Here, a structure in which the surface wiring 1 is arranged on the surface of the upper wiring board 4 and the embedded wiring 3 is arranged on the surface of the lower wiring board 5 is shown. It is embedded inside. As shown in FIG. 2, when a conventional wiring board having surface wiring and embedded wiring is manufactured, the embedded wiring 3 is first disposed on the surface of the lower wiring board 5 and then the upper wiring board 4 is covered with the embedded wiring 3. After that, the surface wiring 1 is provided on the surface of the upper wiring board 4. In this conventional manufacturing process, when manufacturing a multilayer wiring board, it is required to repeat the production of each layer and the wiring process, which is a factor of high cost.

In the present invention, it is easy to obtain a commercially available polysaccharide as a raw material for a polysaccharide wiring board using a biologically safe and low-cost material, and it is easy to solidify by drying a polysaccharide aqueous solution. It is preferable that the polysaccharide is one polysaccharide selected from pullulan, carboxymethylcellulose, starch, and hyaluronic acid because it can retain insulation and strength when used as a wiring board. In addition to the above reasons, other polysaccharides are selected from cellulose, glycogen, chitin, heparin, carrageenan, agarose, pectin, and xyloglucan because they are novel molding materials that have an affinity for the living body. It is preferable to use one polysaccharide. Further, regarding the method for producing a polysaccharide wiring board of the present invention, in the production of the polysaccharide wiring board having the structure having the surface wiring, 10% by weight to 70% by weight of the polysaccharide aqueous solution is contained in a hydrophobic mold. After the filling, the polysaccharide aqueous solution filled in the mold is left by leaving the mold in a dry atmosphere with a humidity of 10% or less, or by heating the mold to 50 ° C. to 90 ° C. A manufacturing method of forming by drying and solidifying and providing a wiring that can be connected to an electrical component and / or an electronic component on the surface of the molded product is preferable, and manufacturing a polysaccharide wiring board having a structure having the embedded wiring , Wiring that can be connected to electrical components and / or electronic components is placed in a hydrophobic mold, and 10% to 70% by weight of a polysaccharide aqueous solution is filled in the mold. Then, the polysaccharide aqueous solution filled in the mold is dried by allowing the mold to stand in a dry atmosphere having a humidity of 10% or less, or by heating the mold to 50 ° C. to 90 ° C. A production method of solidifying and molding is preferred. Next, in the manufacturing method of the polysaccharide wiring board having the surface wiring and the embedded wiring according to the present invention, the wiring that can be connected to the electrical component and / or the electronic component is disposed in the hydrophobic mold, After filling 10% to 70% by weight polysaccharide aqueous solution, the mold is left in a dry atmosphere with a humidity of 10% or less, or the mold is heated to 50 ° C. to 90 ° C. A manufacturing method is preferable in which the polysaccharide aqueous solution filled in the mold is dried and solidified and molded, and an electric component and / or wiring that can be connected to the electronic component is provided on the surface of the molded product. That is, in the present invention, the concentration of the polysaccharide water solution is preferably 10% by weight to 70% by weight, but if it is less than 10% by weight, it takes too much time to dry and solidify the polysaccharide water solution. If it is more than 70% by weight, it is not preferable because the viscosity of the polysaccharide aqueous solution is too high and molding becomes extremely difficult. In the present invention, the humidity of the dry atmosphere is preferably 10% or less. However, if it is more than 10%, it takes too much time to dry the polysaccharide water solution, which is not suitable for production. Furthermore, in the present invention, the heating temperature is preferably 50 ° C. to 90 ° C., but if it is less than 50 ° C., the heating temperature of the polysaccharide aqueous solution is too low, and it takes a long time to dry, resulting in poor production efficiency. For this reason, when the temperature is higher than 90 ° C., the heating temperature of the polysaccharide aqueous solution is too high, resulting in a large difference between the surface drying speed of the polysaccharide and the internal drying speed, and distortion of the polysaccharide after drying. It is not preferable because it becomes easy. In addition, the mold used in the present invention is preferably hydrophobic, because it is very easy to release the molded product from the inner wall of the mold after dry molding of the polysaccharide aqueous solution. For example, stainless steel, iron, titanium, silicon and the like are preferably used as the material, and in the case of drying in a dry atmosphere without heating, for example, a resin is preferably used, and further, the shape and division are related. The structure is not particularly limited. Further, the standing time and the heating time in drying and solidifying the polysaccharide aqueous solution in the mold are not particularly limited as long as the strength is suitable for use as a wiring board. Further, it is a method of providing a wiring that can be connected to an electrical component and / or an electronic component on the surface of the molding, but a method of simply arranging the wiring on the surface, a method of printed wiring based on a printing technique, There are various methods such as a method of providing aluminum electrical wiring on the surface through a stencil mask by a vacuum deposition method, but it is not particularly limited.
FIG. 3 is a schematic perspective view showing the main part of the surface wiring in the polysaccharide wiring board of the present invention. Here, the structure in which the surface wiring 1 is arranged on the surface of the polysaccharide wiring board 6 is shown. FIG. 4 is a schematic perspective view showing the main part of the embedded wiring in the polysaccharide wiring board according to the present invention. FIG. 4 shows a structure in which the embedded wiring 3 is arranged inside the polysaccharide wiring board 6. ing. FIG. 5 is a schematic perspective view showing the main parts of the surface wiring and embedded wiring in the polysaccharide wiring board of the present invention. Here, the surface wiring 1 is arranged on the surface of the polysaccharide wiring board 6, and the polysaccharide wiring is shown. A structure in which the embedded wiring 3 is arranged inside the substrate 6 is shown, and a single layer (single layer) structure is used instead of a multilayer (two layers) structure as compared with FIG. 2 showing the conventional wiring substrate. Should be noted. Due to this single-layer structure, the manufacturing cost can be reduced as compared with the conventional wiring board. Further, FIG. 6 is a schematic cross-sectional view of the main part of the surface wiring and embedded wiring when the polysaccharide wiring board of the present invention is attached to the skin. Here, the polysaccharide wiring board 6 is an adhesive surface with respect to the surface of the skin 8. 7 is attached to the skin. The adhesive surface 7 is obtained by making the surface of the polysaccharide wiring board 6 to be attached to the skin wetted with water before mounting, and the above-mentioned method of wetting with water is a brush, a sprayer, etc. There is no particular limitation. Incidentally, the adhesive surface 7 is caused by the fact that the water-soluble polysaccharide is melted and sticky by wetting the polysaccharide with water. The same is true in either case.

  In the present invention, as an application example of the polysaccharide wiring board, FIG. 7 shows a schematic perspective view showing a main part of the polysaccharide wiring board on which the diode and the capacitor according to the present invention are mounted, and FIG. 8 shows the present invention. FIG. 1 is a schematic cross-sectional view of a main part of a polysaccharide wiring board on which a diode and a capacitor are mounted. In FIG. 1, a surface wiring 1 and a diode 9 and a capacitor 10 connected thereto are arranged on the surface of the polysaccharide wiring board 6. The structure is shown. Further, FIG. 9 shows a schematic cross-sectional view of the main part of the polysaccharide wiring board encapsulated by the polysaccharide insulator in the present invention. Here, the polysaccharide wiring board shown in FIG. The surface wiring 1 arranged, and the diode 9 and capacitor 10 connected to the surface wiring 1 are enclosed by an insulator 11 made of a polysaccharide. The surface wiring 1 and the diode 9 connected to the surface wiring 1 are shown. And the capacitor | condenser 10 is protected by the insulator 11 which consists of polysaccharides, and will operate | move stably also as a wired circuit board. Here, as the insulator 11 made of polysaccharide, it is easy to obtain a commercial product with a safe and low-cost material derived from living organisms, and it can be easily solidified by drying the polysaccharide aqueous solution and used as a wiring board. Pullulan or hyaluronic acid is preferably used for the reason that the insulation and strength can be maintained.

  In the present invention, a polysaccharide wiring board having a skin-mountable surface electrode includes a polysaccharide-based wiring board, and a surface electrode in which a terminal portion of an embedded wiring disposed inside the board is exposed on the surface of the board And the wiring is a wiring that can be connected to an electrical component and / or an electronic component, and further, the substrate adheres to the skin by wetting the substrate surface on the side where the surface electrode is exposed. The surface electrode is preferably used in contact with the skin surface. FIG. 10 is a schematic perspective view showing a wiring main part of the polysaccharide wiring board having the surface electrode in the present invention, and FIG. 11 is a wiring when the polysaccharide wiring board having the surface electrode of the present invention is attached to the skin. It is a schematic sectional drawing of the principal part. 10 and 11 show a structure in which the end portion of the embedded wiring 3 disposed inside the polysaccharide wiring substrate 6 is exposed to the surface of the substrate 6 to become the surface electrode 12. The polysaccharide wiring substrate 6 is attached to the surface of the skin 8 via the adhesive surface 7, and the surface electrode 12 is in contact with the surface of the skin 8. The adhesive surface 7 is obtained by making the surface of the polysaccharide wiring substrate 6 to be attached to the skin wet with water before mounting, and the above-described wet method or wet method is a brush. A sprayer may be used and is not particularly limited. The shape of the surface electrode 12 is not particularly limited as long as it is in contact with the skin surface, and the material of the surface electrode is mainly metal, but it functions as an electrode. If there are, for example, aluminum, titanium, iron, stainless steel, gold, platinum, silver and the like are suitably used, and there is no particular limitation.

  In the present invention, in the polysaccharide wiring board having fine needle electrodes that can be attached to the skin, the polysaccharide wiring board is connected to the end of the embedded wiring disposed inside the substrate and exposed to the surface of the board. And the wiring is a wiring that can be connected to an electrical component and / or an electronic component, and further, the substrate surface on the side where the fine needle electrode is exposed is wetted to form the substrate. It is preferable that the electrode adheres to the skin and the fine needle electrode is inserted into the skin surface. FIG. 12 is a schematic perspective view showing a wiring main part of the polysaccharide wiring board having fine needle electrodes in the present invention, and FIG. 13 is a case where the polysaccharide wiring board having fine needle electrodes of the present invention is attached to the skin. It is a schematic sectional drawing of the wiring principal part. 12 and 13 show a structure in which the terminal portion of the embedded wiring 3 disposed inside the polysaccharide wiring substrate 6 is exposed to the surface of the substrate 6 to form the fine needle electrode 13. In addition, the polysaccharide wiring substrate 6 is attached to the surface of the skin 8 via the adhesive surface 7, and the fine needle electrode 13 is inserted into the surface of the skin 8. The adhesive surface 7 is obtained by making the surface of the polysaccharide wiring substrate 6 to be attached to the skin wet with water before mounting, and the above-described wet method or wet method is a brush. A sprayer may be used and is not particularly limited. The shape of the fine needle electrode 13 is not particularly limited as long as it can be easily inserted into the skin surface, and the material of the fine needle electrode is mainly metal, but acts as an electrode. For example, aluminum, titanium, iron, stainless steel, gold, platinum, silver and the like are preferably used and are not particularly limited.

  In the present invention, in the polysaccharide wiring board on which the skin-worn speaker is mounted, in the wiring board made of polysaccharide, the magnetic coil wiring disposed on the substrate surface, and the magnetic body disposed in the magnetic coil wiring The magnetic coil wiring is a wiring that can be connected to an electrical component and / or an electronic component, and the substrate surface on the side opposite to the substrate surface on which the magnetic body is disposed is moistened. That adheres to the skin and conducts an audio signal in the skin can be suitably used as a speaker by vibrating the magnetic material by energizing the magnetic coil wiring. FIG. 14 is a schematic diagram showing the main wiring part of the polysaccharide wiring board on which the skin-mountable speaker according to the present invention is mounted, and FIG. 15 shows the polysaccharide wiring board on which the skin-mountable speaker of the present invention is mounted. It is a schematic sectional drawing of the wiring main part at the time of mounting | wearing with skin. 14 and 15 show a structure having a magnetic coil wiring 14 and a magnetic body 15 disposed in the magnetic coil wiring 14 on the surface of the polysaccharide wiring board 6, and the polysaccharide wiring board 6. Is attached to the surface of the skin 8 through the adhesive surface 7, and conducts an audio signal into the skin as a speaker by energizing the magnetic coil wiring 14 to vibrate the magnetic body 15. The adhesive surface 7 is obtained by making the surface of the polysaccharide wiring board 6 to be attached to the skin wetted with water before mounting, and the above-mentioned method of wetting with water is a brush, a sprayer, etc. There is no particular limitation. The shape and structure of the magnetic coil wiring 14 and the magnetic body 15 are not particularly limited as long as the functions as a speaker are suitably exhibited. Further, when the polysaccharide wiring substrate 6 is attached to the surface of the skin 8 via the adhesive surface 7, the polysaccharide wiring substrate 6 may be attached to the skin without any gap in order to efficiently transmit the audio signal to the skin and bone. preferable.

  In the present invention, the polysaccharide wiring board on which the skin-mountable light emitting diode is mounted includes a surface wiring arranged on the substrate surface and / or an embedded wiring arranged inside the board in the polysaccharide wiring board. A light-emitting diode that is connected and arranged on the surface of the substrate and / or a light-emitting diode that is embedded in the substrate, and the wiring is a wiring that can be connected to an electrical component and / or an electronic component. Further, it is preferable that the substrate adheres to the skin by moistening the substrate surface, and the surface of the skin is illuminated by the light-emitting diode disposed on the surface of the substrate and / or the light-emitting diode embedded in the substrate. Used for. FIG. 16 is a schematic perspective view showing the main part of the polysaccharide wiring board on which the skin-mounted light-emitting diode according to the present invention is mounted, and FIG. 17 is a polysaccharide on which the skin-mounted light-emitting diode of the present invention is mounted. It is a schematic sectional drawing of the principal part of wiring at the time of mounting a wiring board on skin. 16 and 17 show a structure having a light emitting diode 16 disposed on the surface of the polysaccharide wiring substrate 6 and a light emitting diode 17 embedded in the substrate, and the polysaccharide wiring. The substrate 6 is attached to the surface of the skin 8 via the adhesive surface 7, and the light irradiation from the light emitting diodes 16 and 17 is indicated by an arrow 18 indicating the traveling direction of the light irradiated from the light emitting diode. As shown, the surface of the skin 8 is irradiated with light, and further, the light reaches the inside of the skin 8. The adhesive surface 7 is obtained by making the surface of the polysaccharide wiring board 6 to be attached to the skin wetted with water before mounting. Etc. may be used and is not particularly limited. The shape, structure, etc. of the light emitting diodes 16 and 17 are not particularly limited as long as they are efficiently arranged on the substrate surface and efficiently irradiate light. Incidentally, it should be noted that in FIG. 16 and FIG. 17, the wiring lines of the light emitting diodes 16 and 17 are omitted in order to avoid complication of the drawing.

  The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples.

Fabrication of pullulan wiring board having surface wiring and insulation test thereof Hydrophobic stainless steel mold (inner recess is in a rectangular parallelepiped shape with a longitudinal length of 0.3 cm, a lateral length of 1 cm, and a width of 3 cm, and the upper surface is open. Casting mold) is filled with 60% by weight pullulan aqueous solution, which is the raw material, and then heated to 60 ° C (about 30 minutes) to dry and solidify the pullulan aqueous solution filled in the mold. A rectangular parallelepiped pullulan substrate as shown in FIG. 3 was produced. Next, in order to provide an electrical wiring that can be connected to an electrical component and / or an electronic component on the upper surface of the pullulan substrate, one aluminum electrical wiring (thickness 0) is passed through a stencil mask having a wiring-shaped gap by vacuum deposition. .005 mm, width 0.1 mm, and length 3 cm) were provided at predetermined positions as shown in FIG. 3 to produce a pullulan wiring board. Incidentally, regarding the removal of the molded product from the mold, the molded product is slightly reduced by drying in the mold, and the concave wall inside the mold is hydrophobic, so that the molded product is naturally released from the mold. In addition, this molded product has a strength suitable for use as a wiring board, and these are the same in the following examples. Further, in the present example, the molded product has a rectangular parallelepiped shape, but the three sides, which are constituent elements thereof, are referred to as a longitudinal length, a lateral length, and a width. Therefore, the longitudinal length and the lateral length of the molded product are shown in FIG. Means the vertical length and the horizontal length of the foremost rectangle, and the width of the molded product means the side representing the distance between the rectangle and the rectangle facing the rectangle. Therefore, the shape of the molded product is the same as the shape of the concave portion inside the mold as it is, and the size of the concave portion inside the mold is expressed by using the three sides of the vertical length, the horizontal length, and the width. It should be noted that also in the examples, the three sides representing the shape of the molded product and the shape of the recess inside the mold are referred to as described above. Next, in order to conduct an insulation test on the pull-run wiring board, except that two independent aluminum electric wirings (thickness 0.005 mm, width 0.1 mm, length 3 cm) are provided in the above manufacturing method. In the same manner as in the manufacturing method described above, a pull-run wiring board for insulation test was produced, and the electrical resistance between the two electrical wirings was measured. As a result, it was confirmed that the resistance was 2 MΩ or more.

Production of carboxymethylcellulose wiring board having surface wiring and insulation test thereof In Example 1, 50% by weight carboxymethylcellulose aqueous solution was used as a raw material, and the mold content after filling the raw material was dried and solidified at a humidity of 5%. A rectangular parallelepiped carboxymethyl cellulose substrate as shown in FIG. 3 was produced in the same manner as in Example 1 except that the substrate was left in a dry atmosphere (about 60 minutes). Next, in order to conduct an insulation test on the carboxymethylcellulose wiring board, except that two independent aluminum electrical wirings (thickness 0.005 mm, width 0.1 mm, length 3 cm) were provided in the above manufacturing method. Produced a carboxymethylcellulose wiring board for insulation test in the same manner as in the above manufacturing method and measured the electric resistance between the two electric wirings, and confirmed that the resistance had an insulating property of 2 MΩ or more.

Preparation of hyaluronic acid wiring board with embedded wiring and its insulation test Copper wiring (thickness 0.05mm, width 0.3mm, length 3cm) that can be connected to electrical and / or electronic components is hydrophobic. As shown in FIG. 7, a predetermined space arrangement is performed in a stainless steel mold (a casting mold in which an inner concave portion is a rectangular parallelepiped shape having a longitudinal length of 0.3 cm, a lateral length of 1 cm, a width of 3 cm, and an upper surface being opened). It was. Next, after filling the mold with 50% by weight hyaluronic acid aqueous solution as a raw material, the mold is heated to 50 ° C. (about 50 minutes) to dry the hyaluronic acid aqueous solution filled in the mold. Solidified and molded, a rectangular parallelepiped hyaluronic acid wiring board as shown in FIG. 4 was produced. Next, in order to conduct an insulation test on the hyaluronic acid wiring board, two independent copper electric wirings (thickness 0.05 mm, width 0.3 mm, length 3 cm) are provided in the above-described manufacturing method. Produced a hyaluronic acid wiring substrate for insulation test in the same manner as described above, and when the electrical resistance between the two electrical wirings was measured, it was confirmed that the resistance had an insulating property of 2 MΩ or more.

Preparation of starch wiring board having embedded wiring and insulation test thereof In Example 3, 40% by weight of starch aqueous solution was used as a raw material, and drying and solidification of the mold contents after filling the raw material was performed at a humidity of 5%. A rectangular parallelepiped-shaped starch wiring board as shown in FIG. 4 was produced in the same manner as in Example 3 except that it was left in the atmosphere (about 70 minutes). Next, in order to conduct an insulation test on the starch wiring board, two independent copper electric wirings (thickness 0.05 mm, width 0.3 mm, length 3 cm) were provided in the above-described manufacturing method. A starch wiring board for insulation test was produced in the same manner as in the above production method, and when the electric resistance between the two electric wirings was measured, it was confirmed that the resistance had an insulating property of 2 MΩ or more.

Preparation of pull-run wiring board having surface wiring and embedded wiring and skin mounting test First, copper wiring (thickness 0. 0) that can be connected to an electrical component and / or an electronic component in order to manufacture a wiring substrate having embedded wiring. 05mm, width 0.3mm, length 3cm) in a hydrophobic stainless steel mold (a casting mold in which the inner recess has a rectangular parallelepiped shape with a longitudinal length of 1cm, a lateral length of 2cm, a width of 3cm, and an open top surface) As shown in FIG. 5, a predetermined spatial arrangement was performed. Next, after filling the mold with 60% by weight pullulan aqueous solution as a raw material, the mold is heated to 60 ° C. (about 30 minutes) to dry and solidify the pullulan aqueous solution filled in the mold. A rectangular parallelepiped pullulan wiring board having embedded wiring as shown in FIG. 5 was produced. Next, in order to provide an electrical wiring that can be connected to an electrical component and / or an electronic component on the upper surface of the pullulan substrate, one aluminum electrical wiring (thickness 0) is passed through a stencil mask having a wiring-shaped gap by vacuum deposition. .005 mm, width 0.3 mm, and length 3 cm) were provided at predetermined positions as shown in FIG. 5 to produce a pullulan wiring board having surface wiring and embedded wiring. Next, in this pullulan wiring board, the back side surface of the surface wiring arrangement surface was wetted with water using a brush, and the skin mounting test was performed using the back side surface as an adhesive surface. It was confirmed that the pullulan wiring board was in close contact with the skin as shown in FIG.

Fabrication of pullulan wiring board with capacitors and diodes and their function confirmation test Hydrophobic stainless steel mold (inner recess is 1 cm in length, 2 cm in width, 3 cm in width, and the top surface is open casting After filling 40% by weight pullulan aqueous solution as a raw material in the mold), this mold is heated to 70 ° C. (about 30 minutes) to dry and solidify the pullulan aqueous solution filled in the mold. A rectangular parallelepiped pullulan substrate as shown in FIGS. 7 and 8 was produced. Next, on the upper surface of the pullulan substrate, an aluminum electrical wiring (thickness 0.005 mm, width 0.3 mm, long length) is formed through a stencil mask by vacuum deposition in order to provide electrical wiring that can be connected to electrical components and / or electronic components. 7 cm) was provided at a predetermined position as shown in FIGS. 7 and 8, and a 1 μF capacitor and a small diode were connected to the predetermined position to produce a pullulan wiring board having the capacitor and the diode. Next, when electricity was passed through the wiring, it was confirmed that the capacitor and the diode normally functioned.

Fabrication of Pullulan Wiring Board Having Capacitor and Diode Encapsulated by an Insulator Made of Pullulan For the pullulan wiring board having the capacitor and diode fabricated in Example 6, the wiring board surface is as shown in FIG. In order to enclose with an insulator made of pullulan, the surface of the wiring board is encapsulated by dipping method using 50% by weight pullulan aqueous solution having low fluidity, and the solidification of the pullulan aqueous solution is dried at a humidity of 5%. A pullulan wiring substrate having a capacitor and a diode encapsulated by an insulator made of pullulan as shown in FIG. 9 was produced by standing in the atmosphere (about 60 minutes). In addition, about this pull run wiring board, the part enclosed with the insulator which consists of pull runs also kept the protection strength of the grade suitable for use.

Fabrication of pullulan wiring board with surface electrode and skin mounting test Titanium wiring (thickness 0.5 mm, width 3 mm, length 1 cm) that can be connected to electrical and / or electronic components is made of stainless steel with hydrophobicity A predetermined space arrangement was performed as shown in FIG. 10 in a mold (a casting mold in which the inner concave portion is a rectangular parallelepiped shape having a longitudinal length of 0.3 cm, a lateral length of 1 cm, and a width of 1.5 cm). . At this time, it is important to arrange the embedded wiring (titanium wire) in a space so as to be appropriately exposed on the surface of the pullulan wiring substrate which is a molded product. Next, after filling the mold with 60% by weight pullulan aqueous solution as a raw material, the mold is heated to 60 ° C. (about 30 minutes) to dry and solidify the pullulan aqueous solution filled in the mold. Then, a rectangular parallelepiped pullulan wiring board having a surface electrode as shown in FIG. 10 was produced. Next, in this pullulan wiring board, the surface of the substrate on which the surface electrode is exposed is moistened with water using a brush (excluding the surface of the surface electrode) so that the wet surface becomes an adhesive surface. As a result, it was confirmed that the pullulan wiring board and the surface electrode were in close contact with the skin as shown in FIG.

Fabrication of hyaluronic acid wiring board with fine needle electrode and skin mounting test Titanium wiring (thickness 0.5 mm, width 3 mm, length 1 cm) that can be connected to electrical parts and / or electronic parts and the wiring For fine needles (bottom pyramidal titanium fine needles with a bottom length of 1 mm and a horizontal length of 1 mm, and a height of 2 mm), a stainless steel mold with hydrophobicity (inner recess is 0.3 cm long, 1 cm wide, thickness) A predetermined space arrangement was performed as shown in FIG. 12 in a casting mold having a rectangular parallelepiped shape with a length of 1.5 cm and an open upper surface. At this time, it is important to arrange the fine needles in a space so as to be appropriately exposed on the surface of the pullulan wiring board as a molded product. Next, after filling the mold with 50% by weight of hyaluronic acid aqueous solution as a raw material, the mold was filled in the mold by standing in a dry atmosphere of 5% humidity (about 60 minutes). A hyaluronic acid aqueous solution was dried and solidified to form a rectangular parallelepiped pullulan wiring board having fine needle electrodes as shown in FIG. Next, in the present hyaluronic acid wiring substrate, the surface of the substrate on which the fine needle electrode is exposed is moistened with water using a brush (excluding the surface of the fine needle electrode), so that the wet surface becomes an adhesive surface. When a skin wearing test was performed, it was confirmed that the hyaluronic acid wiring board was in close contact with the skin due to the adhesive action of the adhesive surface, and that the fine needle electrode was inserted into the skin surface, as shown in FIG.

Fabrication of pullulan wiring board with speaker and skin mounting test Hydrophobic stainless steel mold (inner recess is 0.3mm in length, 1cm in width, 1cm in width, cuboid shape, upper surface is open casting After filling 60% by weight pullulan aqueous solution as a raw material in the mold), this mold is heated to 60 ° C. (about 30 minutes) to dry and solidify the pullulan aqueous solution filled in the mold. Then, a rectangular parallelepiped pullulan substrate as shown in FIG. 14 was produced. Thereafter, in order to provide electrical wiring that can be connected to electrical components and / or electronic components on the upper surface of the pull-run substrate, a circular coil-shaped aluminum electrical wiring (circular portion) is formed through a stencil mask having a wiring-shaped gap by vacuum deposition. Were provided at predetermined positions as shown in FIG. 14 to produce a pullulan wiring board. Further, on the upper surface of the pullulan substrate, a magnetic body (diameter 0.2 cm, thickness 0.1 cm) is disposed in a predetermined position in the magnetic coil wiring as shown in FIG. A pullulan wiring board was prepared. Next, in this pullulan wiring board, the surface of the substrate opposite to the surface of the substrate on which the magnetic material is disposed is wetted with water using a brush, and the wet surface is used as an adhesive surface against the back of the hand. When a mounting test was performed, it was confirmed that the pullulan wiring board and the surface electrode were in close contact with the skin as shown in FIG. Furthermore, when electricity as an audio signal was passed through the magnetic coil wiring in the close contact state, it was confirmed that the audio signal was conducted into the skin on the back of the hand when the magnetic body vibrated.

Fabrication of pullulan wiring board mounted with light emitting diode and skin mounting test thereof Light emitting diode and copper wiring (thickness 0.5 mm, width 1 mm, length 1 cm) connected to it is made of a stainless steel mold (inner recess) Is a rectangular parallelepiped shape having a vertical length of 0.5 cm, a horizontal length of 1 cm, and a width of 1 cm, and a predetermined space arrangement is performed as shown in FIGS. However, in FIGS. 16 and 17, all wirings connected to the light emitting diodes are omitted in order to avoid complication of the drawings. Next, after filling the mold with 50% by weight pullulan aqueous solution as a raw material, the mold is heated to 60 ° C. (about 30 minutes) to dry and solidify the pullulan aqueous solution filled in the mold. A rectangular parallelepiped pullulan wiring board having light emitting diodes embedded and arranged as shown in FIG. 16 was produced. Next, in order to provide electrical wiring that can be connected to electrical components and / or electronic components on the top surface of the wiring board, aluminum electrical wiring (thickness 0.005 mm, width) is formed through a stencil mask having a wiring-shaped gap by vacuum deposition. A 0.1 mm long, 1 cm long) light emitting diode connected to the light emitting diode was provided at a predetermined position, and a rectangular parallelepiped pullulan wiring board having light emitting diodes embedded and surfaced as shown in FIG. 16 was produced. Next, in this pullulan wiring board, the lower surface of the substrate was wetted with water using a brush, and when the skin mounting test was performed using the wetted surface as an adhesive surface, the pullulan wiring substrate was bonded by the adhesive action of the adhesive surface. As shown in FIG. 17, it was confirmed that it was in close contact with the skin. Furthermore, when electricity was passed through the copper and aluminum connection wirings in the close contact state, it was confirmed that the skin surface was illuminated by irradiating light from the embedded and surface-mounted light emitting diodes.

  The polysaccharide wiring board of the present invention and the method for producing the same have various characteristic effects as described above. Utilizing these effects, the wiring board technical field, the electrode skin mounting technical field, the bone conduction speaker technical field, It can be practically used in the field of application technology of light emitting diodes. Moreover, the polysaccharide wiring board and the manufacturing method thereof of the present invention can be mass-produced and can be used industrially.

  It is a schematic perspective view which shows the surface wiring principal part in the conventional wiring board.   It is a schematic perspective view which shows the surface wiring and the embedded wiring principal part in the conventional wiring board.   It is a schematic perspective view which shows the surface wiring principal part in the polysaccharide wiring board of this invention.   It is a schematic perspective view which shows the embedded wiring principal part in the polysaccharide wiring board of this invention.   It is a schematic perspective view which shows the surface wiring and embedded wiring principal part in the polysaccharide wiring board of this invention.   It is a schematic sectional drawing of the surface wiring and embedded wiring principal part at the time of carrying out skin mounting | wearing of the polysaccharide wiring board of this invention.   It is a schematic perspective view which shows the wiring principal part of the polysaccharide wiring board carrying the diode and capacitor | condenser in this invention.   It is a schematic sectional drawing of the wiring principal part of the polysaccharide wiring board carrying the diode and capacitor | condenser in this invention.   It is a schematic sectional drawing of the wiring principal part of the polysaccharide wiring board enclosed with the insulator which consists of polysaccharides in this invention.   It is a schematic perspective view which shows the wiring principal part of the polysaccharide wiring board which has a surface electrode in this invention.   It is a schematic sectional drawing of the principal part of wiring at the time of carrying on the skin mounting | wearing with the polysaccharide wiring board which has the surface electrode of this invention.   It is a schematic perspective view which shows the wiring principal part of the polysaccharide wiring board which has a fine needle electrode in this invention.   It is a schematic sectional drawing of the wiring principal part at the time of carrying on the skin mounting | wearing with the polysaccharide wiring board which has the fine needle electrode of this invention.   It is the schematic which shows the wiring principal part of the polysaccharide wiring board carrying the speaker which can be mounted | worn with skin in this invention.   It is a schematic sectional drawing of the wiring principal part at the time of carrying out skin mounting | wearing with the polysaccharide wiring board carrying the speaker which can be mounted | worn with skin of this invention.   It is a schematic perspective view which shows the board | substrate principal part of the polysaccharide wiring board carrying the light-emitting diode which can be mounted | worn with skin in this invention.   It is a schematic sectional drawing of the principal part of wiring at the time of carrying on the skin mounting | wearing with the polysaccharide wiring board carrying the light-emitting diode which can be mounted | worn with skin of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Surface wiring 2 Wiring board 3 Embedded wiring 4 Upper layer wiring board 5 Lower layer wiring board 6 Polysaccharide wiring board 7 Adhesive surface 8 Skin 9 Diode 10 Capacitor 11 Insulator made of polysaccharide 12 Surface electrode 13 Fine needle electrode 14 Magnetic coil wiring 15 Magnetic body 16 Light emitting diode 17 disposed on the substrate surface Light emitting diode 18 embedded in the substrate Arrow indicating the traveling direction of the irradiation light from the light emitting diode

Claims (12)

  The wiring board made of a polysaccharide has a structure having a surface wiring disposed on the surface of the substrate or an embedded wiring disposed inside the substrate, and the wiring is a wiring that can be connected to an electrical component and / or an electronic component. A polysaccharide wiring board having a surface wiring or an embedded wiring, which is characterized in that it exists.   2. The polysaccharide wiring having surface wiring or embedded wiring according to claim 1, wherein the polysaccharide in the polysaccharide wiring board is one polysaccharide selected from pullulan, carboxymethylcellulose, starch, and hyaluronic acid. substrate.   In the production of the polysaccharide wiring board having the structure having the surface wiring, after the hydrophobic mold is filled with 10% by weight to 70% by weight of the polysaccharide aqueous solution, the mold is dried in a dry atmosphere with a humidity of 10% or less. The polysaccharide aqueous solution filled in the mold is dried and solidified by being left standing inside or by heating the mold to 50 ° C. to 90 ° C., and the surface of the molded product is electrically Wiring that can be connected to components and / or electronic components is provided, or, in the manufacture of a polysaccharide wiring board having a structure having the embedded wiring, wiring that can be connected to electric components and / or electronic components, After being placed in a hydrophobic mold and filled with 10% to 70% by weight polysaccharide aqueous solution in the mold, the mold is allowed to stand in a dry atmosphere with a humidity of 10% or less. The surface wiring according to claim 1 or 2, wherein the polysaccharide aqueous solution filled in the mold is dried and solidified by heating or heating the mold to 50 ° C to 90 ° C. Or the manufacturing method of the polysaccharide wiring board which has an embedded wiring.   The wiring board made of a polysaccharide has a structure having a surface wiring arranged on the substrate surface and a buried wiring arranged inside the substrate, and the wiring is a wiring that can be connected to an electrical component and / or an electronic component. A polysaccharide wiring board having surface wiring and embedded wiring, which is characterized in that   5. The polysaccharide wiring having a surface wiring and an embedded wiring according to claim 4, wherein the polysaccharide in the polysaccharide wiring substrate is one polysaccharide selected from pullulan, carboxymethylcellulose, starch, and hyaluronic acid. substrate.   Wiring that can be connected to an electrical component and / or an electronic component is placed in a hydrophobic mold, and 10% by weight to 70% by weight polysaccharide aqueous solution is filled in the mold. % By drying in a dry atmosphere or by heating the mold to 50 ° C. to 90 ° C. to dry-solidify the polysaccharide aqueous solution filled in the mold, 6. The method for producing a polysaccharide wiring board having surface wiring and embedded wiring according to claim 4, wherein wiring that can be connected to an electrical component and / or an electronic component is provided on the surface of the molded product.   5. The surface wiring or embedded wiring according to claim 1 or 4, or the polysaccharide having surface wiring and embedded wiring, wherein the substrate and the component are encapsulated by an insulator made of pullulan or hyaluronic acid. Quality wiring board.   In the wiring board made of a polysaccharide, the embedded wiring disposed inside the board has a structure having a surface electrode exposed on the surface of the board, and the wiring is connected to an electrical component and / or an electronic component. A skin-worn surface, characterized in that the surface of the surface electrode is exposed to moisture by moistening the surface of the substrate on which the surface electrode is exposed so that the substrate adheres to the skin and the surface electrode contacts the skin surface. A polysaccharide wiring board having electrodes.   In the wiring board made of a polysaccharide, the wiring board has a structure having a fine needle electrode that is connected to a terminal portion of an embedded wiring arranged inside the board and exposed on the surface of the board, and the wiring is an electrical component and / or Wiring that can be connected to an electronic component, and the substrate surface on the side where the fine needle electrode is exposed is wetted so that the substrate adheres to the skin and the fine needle electrode is inserted into the skin surface. A polysaccharide wiring board having fine needle electrodes that can be attached to the skin.   A wiring board made of a polysaccharide has a structure having a magnetic coil wiring disposed on the substrate surface and a magnetic body disposed in the magnetic coil wiring, and the magnetic coil wiring is an electric component and / or an electronic component. Further, the substrate adheres to the skin by wetting the substrate surface opposite to the substrate surface on which the magnetic body is arranged, and the magnetic body is vibrated by energizing the magnetic coil wiring. A polysaccharide wiring board having a speaker that can be worn on the skin, characterized in that a sound signal is conducted into the skin as a speaker.   In a wiring board made of a polysaccharide, it is connected to a surface wiring arranged on the substrate surface and / or a buried wiring arranged inside the substrate, and a light emitting diode arranged on the surface of the substrate and / or inside the substrate. The substrate has a structure having a light emitting diode embedded therein, and the wiring is a wiring that can be connected to an electrical component and / or an electronic component, and the substrate adheres to the skin by wetting the surface of the substrate, and the substrate A polysaccharide wiring board equipped with a light-emitting diode that can be worn on the skin, wherein the skin surface is illuminated with a light-emitting diode disposed on the surface of the substrate and / or a light-emitting diode embedded in the substrate.   The polysaccharide wiring board according to any one of claims 8 to 11, wherein the polysaccharide in the polysaccharide wiring board is one polysaccharide selected from pullulan, carboxymethylcellulose, starch, and hyaluronic acid. .

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