JP2010208902A - Apparatus for dividing substrate and method for controlling the same - Google Patents

Abstract

A substrate dividing apparatus and a substrate dividing apparatus control method capable of appropriately feeding and dividing a substrate with a simple configuration.
A feed table that intermittently feeds a substrate W, a positioning mechanism that positions a scribe line of the substrate W on a break line B on the feed table, and a dividing operation device that divides the positioned substrate W. The feed table 23 includes: a substrate feed path that causes the substrate W to air levitate and is inclined downward in the feed direction; and an air supply device 29 that supplies air for air levitation to the substrate feed path. It is what you have.
[Selection] Figure 1

Description

  The present invention relates to a substrate dividing apparatus that divides a substrate along a scribe line while intermittently feeding the substrate, and a method for controlling the substrate dividing apparatus.

Conventionally, as this type of substrate dividing apparatus, a plurality of round belts stretched in the substrate feed direction at intervals narrower than the width of the substrate, and a drive unit that rotationally drives the plurality of round belts to feed the substrate in the substrate feed direction Positioning means for positioning the sent substrate at a division position; and division means for bending and dividing the substrate by sandwiching a division side portion of the substrate and rotating about a division line (scribe line) Have been known (see Patent Document 1).
In this case, the substrate is placed on a plurality of rotationally driven round belts, sent in the substrate feed direction, positioned at the dividing position by the positioning means, and then divided by the dividing means by bending at the dividing line. The

Japanese Patent Laid-Open No. 2004-9208

  However, such a substrate dividing apparatus has a problem in that the substrate is damaged when the substrate is fed because the lower surface of the substrate comes into contact with the round belt (particularly, the substrate and the belt rub against each other when feeding is started and stopped). It was. Further, since a plurality of round belts and a drive unit for driving the belts are necessary, there is a problem that the apparatus is complicated as a whole.

  An object of the present invention is to provide a substrate dividing apparatus and a substrate dividing apparatus control method capable of appropriately feeding and dividing a substrate with a simple configuration.

  The substrate dividing apparatus of the present invention includes a feed table that intermittently feeds a substrate, a positioning unit that positions a scribe line of the substrate at a break point on the feed table, and a dividing unit that divides the positioned substrate, The feed table includes a substrate feed path that floats the substrate in air and is inclined downward in the feed direction, and an air supply means that supplies air for air floating to the substrate feed path. .

  According to this configuration, since the substrate feed path is inclined downward in the feed direction and air floating air is supplied to the substrate feed path, the substrate set on the substrate feed path is simply air. By floating, it is sent in the feed direction by its own weight. That is, the substrate can be appropriately fed in the feeding direction without damaging the substrate, and then positioned and divided. In addition, since it is sufficient to float the air in order to send the substrate and no special mechanism or actuator is required, the apparatus can be configured easily and inexpensively.

  In this case, it is preferable that the substrate feed path is configured by one of the perforated plate and the porous plate.

  According to this configuration, since the flying air can be uniformly supplied to the substrate, the substrate can be efficiently levitated on the substrate feeding path.

  In this case, the feed table has a first table on the upstream side in the feed direction and a second table on the downstream side in the feed direction across the break point, and the dividing means faces the first table from above, and the substrate A first holding mechanism that holds the substrate between the first table, a second holding mechanism that faces the second table from above and holds the substrate between the second table, a second table, and a second holding mechanism. It is preferable to have a rotation mechanism that rotates around the break point.

  According to this configuration, the division can be performed with higher accuracy than when the substrate is divided by pressing the scribe line. In addition, if the substrate is divided by shifting the center of rotation up and down the center of thickness of the substrate (downward in the case of mountain folds and up in the case of valley folds), the substrate can be divided by tensile force, It can be prevented from being damaged.

  In this case, it is preferable that the rotation mechanism rotates the second table and the second holding mechanism so that the substrate is folded in a mountain.

  According to this configuration, since the rotated second table is inclined downward, it is possible to remove the material from the second table by sliding the divided substrate forward.

  In this case, it is preferable that the positioning means has a stopper provided on the second table and against which the front end of the substrate in the transport direction is abutted.

  According to this configuration, positioning in the substrate feeding direction can be performed reliably.

  In this case, it is preferable that the positioning means further includes a retracting mechanism that causes the stopper to protrude from the second table.

  According to this configuration, if the stopper is immersed during the dividing operation, the divided substrate does not collide with the stopper, so that the substrate can be prevented from being damaged.

  In this case, it is preferable that the positioning means further includes a position adjusting mechanism for moving the stopper minutely back and forth in the feed direction.

  According to this configuration, by appropriately changing the position of the stopper, it is possible to freely correspond to a plurality of types of substrates having different scribe line positions.

  The substrate splitting device control method of the present invention is the above-described substrate splitting device control method, wherein the air supply means is driven in a state where the substrate is set on the first table, and the substrate is sent and abutted against the stopper. After the step and the substrate positioning step, the first holding mechanism and the second holding mechanism are driven to hold the substrate, the substrate holding step for immersing the stopper, and after the substrate holding step, the rotation mechanism is driven. The substrate dividing step for dividing the substrate, and the material removal step for sliding the divided substrate off the second table after the substrate dividing step are provided.

  According to this configuration, when the substrate is floated on the air, the substrate is fed in the substrate feeding direction by its own weight and positioned by hitting the stopper. Then, after the substrate is held by the first holding mechanism and the second holding mechanism, the stopper is immersed and the rotation mechanism is driven to divide the substrate and remove the material. Thereby, it is possible to continuously feed and divide the substrate continuously without damaging it.

  In this case, it is preferable to continue driving the air supply means in the substrate holding step, the substrate dividing step, and the material removal step.

  According to this configuration, it is not necessary to frequently control driving and stopping of the air supply means, and when the substrate holding state is released, the divided substrate can be smoothly removed by air levitation. It is possible to prevent the substrate from being damaged when removing the material.

(A) is a perspective view of an ODF mother substrate, (b) is a perspective view of a TFT liquid crystal panel. It is the perspective view seen from the front side of the substrate dividing device. It is the perspective view seen from the back side of a substrate dividing device. It is the perspective view seen from the side surface side of a substrate dividing device. (A) It is a schematic diagram of a board | substrate division | segmentation apparatus, (b) is AA sectional drawing. It is an enlarged view around the second holding mechanism. It is explanatory drawing (1) for demonstrating the division | segmentation operation | movement of a board | substrate. It is explanatory drawing (2) for demonstrating the division | segmentation operation | movement of a board | substrate.

  Hereinafter, a substrate dividing apparatus and a method for controlling the substrate dividing apparatus according to the present invention will be described with reference to the accompanying drawings. In this substrate dividing apparatus, a disk-shaped ODF (One Drop Filling) mother substrate is divided into strips along a scribe line, and subsequently divided along a scribe line formed on a TFT substrate. A strip-shaped ODF substrate (substrate) is further divided at the scribe line to form a pre-TFT liquid crystal panel in which unnecessary chips remain. The pre-TFT liquid crystal panel becomes a small TFT liquid crystal panel by dividing unnecessary chips in a later process. Therefore, first, an ODF mother substrate that is a base of a strip-shaped ODF substrate to be divided will be described.

  As shown in FIG. 1, an ODF mother substrate 1 includes a TFT mother substrate 2 which is a circular glass substrate in which a plurality of TFTs 4 are formed in a matrix, and a sealing material 5 onto which liquid crystal is dropped. The counter mother board | substrate 3 which is a glass substrate is bonded together, and is comprised (refer Fig.1 (a)). On the other hand, a plurality of TFT liquid crystal panels 6 taken from the ODF mother substrate 1 have a configuration in which a counter substrate 8 is bonded to a TFT substrate 7 through a sealing material 5 and is formed in a square as a whole. In this case, the TFT substrate 7 and the counter substrate 8 are aligned on two sides in the vertical direction and one side in the horizontal direction, and the counter substrate 8 is set back to the TFT substrate 7 on the remaining one side in the horizontal direction. ing. A terminal area 9 for connecting an FPC or the like is formed on the TFT substrate 7 in the set back portion (see FIG. 1B).

  Therefore, as shown in FIG. 1A, the ODF mother substrate 1 that takes a plurality of TFT liquid crystal panels 6 is scribed to move (reciprocate) a diamond cutter (not shown) relative to the ODF mother substrate 1. The scribe lines 11 are formed in a lattice shape by an apparatus or the like. A TFT vertical scribe line 12 (corresponding to two sides in the vertical direction) that matches the width of the TFT liquid crystal panel 6 is formed on the outer surface of the TFT mother substrate 2. The opposing vertical scribe lines 13 that match the width of the TFT liquid crystal panel 6 are formed. Further, a TFT horizontal scribe line 14 (see FIG. 2) that matches the length of the TFT liquid crystal panel 6 (corresponding to two sides in the horizontal direction) is formed on the outer surface of the TFT mother substrate 2, and similarly, the opposite mother substrate. 3 is formed with an opposing lateral scribe line 15 that matches the length of the TFT liquid crystal panel 6. Further, on the outer surface of the counter substrate 8, a counter half scribe line 16 constituting an uneven portion is formed.

  First, the opposing mother substrate 3 is broken along the opposing vertical scribe line 13, and after dicing along the opposing vertical scribe line 13 after being divided, the TFT mother substrate 2 is subsequently turned into the TFT vertical scribe line 12. Along the break, the ODF mother substrate 1 is divided into strip-shaped ODF substrates 17. Next, after the opposing mother substrate 3 is broken along the opposing half scribe line 16 in each strip-shaped ODF substrate 17 and is divided along the opposing half scribe line 16 after the division, the TFT mother is subsequently processed. The substrate 2 is broken along the TFT horizontal scribe line 14. By this break, the pre-TFT liquid crystal panel 19 in which the terminal area 9 is exposed and the opposite lateral scribe line 15 is left and the unnecessary chip 18 remains is divided. Then, finally, the unnecessary chip 18 is divided and removed by the break along the opposing horizontal scribe line 15, and the TFT liquid crystal panel 6 is formed.

  That is, the substrate W to be divided in the embodiment is a strip-shaped ODF substrate 17 immediately before being divided into the pre-TFT liquid crystal panel 19. Specifically, it is a strip-shaped ODF substrate 17 in which the opposing mother substrate 3 is broken along the opposing half scribe line 16 and is subjected to dicer processing. In the division of the substrate dividing apparatus 21 according to the embodiment, the TFT horizontal scribe line 14 and the counter half scribe line 16 adjust the number of reciprocations of the diamond cutter and the pressing force of the diamond cutter so that the unnecessary chip 18 is not accidentally divided. Thus, the ODF mother substrate 1 may be scribed strongly, and the opposing horizontal scribe line 15 may be scribed weakly.

  Next, the substrate dividing apparatus 21 will be described with reference to FIGS. The substrate dividing device 21 as a whole is slightly inclined downward (lower right in the figure), and includes a base plate 22, a material table (first table) 33 and a rotary table (in front of the base plate 22). A second table 34, a dividing table 24 that divides the substrate W while being held on the feeding table 23 from the back side of the base plate 22, and the base plate 22. An alignment camera 25 that faces the feed table 23 from the back side and images the positioned substrate W from above (Z-axis direction), and a collection tray disposed on the base plate 22 at the end of the rotation table 34 (X-axis direction). 26, and a control device 27 (see FIG. 5) that controls these components in an integrated manner. The rotating table 34 incorporates a positioning mechanism (positioning means) 28 for abutting and positioning the substrate W sent by the material supply table 33.

  The feed table 23 is configured to send the substrate W by air levitation. The substrate W (the strip-shaped ODF substrate 17) sent by the feed table 33 is moved by the positioning mechanism 28 to the scribe line (TFT side). The scribe line 14) is stopped so as to coincide with the break line B (break point). In this state, after confirming the position of the scribe line by the alignment camera 25, the division operation device 24 is driven to divide (break) the substrate W. The divided substrate (pre-TFT liquid crystal panel 19) W slides forward from the rotary table 34 and is collected in the collection tray 26.

  The base plate 22 is formed in a thick plate shape, and adjustment bolts (not shown) are respectively disposed in the through holes 31 at the four corners. The base plate 22 is mounted on a horizontal machine base (not shown), and is configured such that the height and inclination can be adjusted by the four adjusting bolts. Thereby, the board | substrate division | segmentation apparatus 21 inclines slightly in the board | feeding direction as a whole, and is inclined slightly, and is installed.

  The feed table 23 includes the above-described feed table 33 disposed on the upstream side in the substrate feed direction, and the above-described rotation table 34 disposed on the downstream side of the feed table 33. The base plate 22 is inclined so as to be parallel to the base plate 22. Further, an air supply device (air supply means) 29 for supplying pressurized air for air levitation is connected to the supply table 33 and the rotation table 34, respectively. That is, the feed table 23 is slightly tilted forward and downward in the substrate feed direction because the entire substrate dividing apparatus 21 is tilted, and the feed table 33 and the rotary table 34 are supplied with compressed air for air levitation. Can be supplied. As a result, the substrate W is floated by the compressed air supplied to the supply table 33, and the feed table 23 is inclined, so that the substrate W is sent to the downstream side in the substrate feed direction by its own weight.

  The feed table 33 is mounted on a table plate 35 on the base plate 22, and a feed table main body 41 supported by a plurality of support columns 36 and a feed plate disposed on the upper surface of the feed table main body 41. (Substrate feed path) 42 and a pair of substrate guides 43 disposed on both sides of the feed plate 42 and restricting the position of the width direction of the substrate W to be fed. The substrate W is fed along the feed plate 42 (the tip in the X-axis direction) while being guided by the feed plate 42 and the substrate guide 43 with the TFT mother substrate 2 on which the scribe lines to be divided are formed as the upper surface. Go.

  The feed table main body 41 is formed longer than the substrate W, and a plate groove 44 in which the feed plate 42 is disposed extends in the center in the width direction so as to extend in the X-axis direction. Yes. In addition, a narrow compressed air groove 45 is formed in the central portion of the plate groove 44 so as to form a floating pressurized air chamber (air chamber) between the plate plate 44 (see FIG. 5). Although not shown in the drawing, a compressed air flow path connected to the air supply device 29 in the extending direction is connected to a plurality of locations of the air chamber. Further, an edge 46 constituting a break line (brain point B), which is a reference for dividing the substrate W, is flush with the surface of the supply table main body 41 at the upper end on the downstream side of the supply table main body 41. It is attached as follows. The edge 46 is made of a material such as cemented carbide and is formed longer (wider) than the width dimension of the substrate W.

  The feed plate 42 is composed of a perforated plate in which a plurality of feed blow-out holes 51 for pressurized air for levitation are formed at equal intervals in the center in the X-axis direction, and a plurality of feed plates are provided via an air chamber. By blowing air from the material blowing holes 51, the substrate W is slightly lifted with respect to the feed plate 42. The feed plate 42 may be a porous plate.

  The substrate guide 43 is composed of a pair of guide plates 52 disposed on both edges of the supply table body 41 and a plurality (four in the illustrated example) of fixing screws 53 for fixing the guide plates 52. Has been. Each guide plate 52 is formed with a long hole for the fixing screw 53 extending in the width direction, and the gap between the pair of guide plates 52 can be appropriately adjusted according to the width of the substrate W to be divided. ing. Each guide plate 52 is configured to be sufficiently lower than the dicer groove 10 diced in the scribe line (opposite vertical scribe line 13), and is screwed so as to have a slight gap with the side surface of the dicer groove 10. Has been. In an actual product, the guide plate 52 is formed so that the gap between each guide plate 52 and the upper surface of the dicer groove 10 is about 0.3 mm in a state where the substrate W is in contact with the supply plate 42. The guide plates 52 and the side surfaces of the dicer grooves 10 are respectively screwed with fixing screws 53 so as to be about 0.1 mm. The pair of guide plates 52 guides the feeding of the substrate W (see FIG. 5).

  The rotary table 34 includes a rotary plate (substrate feed path) 55 formed of a wide perforated plate in which a plurality of rotary blowout holes 54 for floating air pressure are formed on the peripheral edge of the upper surface, and the rotary plate 55 from both sides. A pair of side frames 56 to be held, and the portions of both side frames 56 are rotatably supported by a U-shaped frame 57 erected on the table plate 35. The rotating plate 55 is disposed on the extension of the feed plate 42 with a gap, and is arranged so that the upper surface of the rotating plate 55 and the upper surface of the feed plate 42 are flush with each other. In other words, the rotation table 34 (rotation plate 55) is also inclined slightly in the downward direction in the substrate feed direction, like the supply table 33 (supply plate 42), and the substrate W floating on the air is smooth forward. To be sent to. An air chamber (not shown) is also formed inside the rotating plate 55, and a compressed air flow path connected to the air supply device 29 is connected to the air chamber in a separate system from the material table 33. Has been. Note that the rotating plate 55 may also be formed of a porous plate like the material supply plate 42.

  At the upper end of the U-shaped frame 57, a rotation shaft 58 for dividing the substrate W into mountain folds is provided, and the rotation shaft 58 is disposed at a position slightly lower than the upper surface of the feed table 23. ing. Then, the rotation table 34 rotates downward about the rotation shaft 58 to divide the substrate W (details will be described later). Then, the collection tray 26 faces the front end of the turntable 34 that is turned downward. Further, the auxiliary member 59 is disposed between the side frame so that the substrate W slid down from the turntable 34 does not enter between the turntable 34 and the collection tray 26 rotated downward. 56. An input plate 38 that engages with a rotation mechanism 93 described later is provided below the side frame 56 so as to extend in parallel with the rotation table 34 and directly below the collection tray 26. Yes.

  The recovery tray 26 is a box-shaped recovery tray main body 61 from which the front plate on the rotating table 34 side is removed, a recovery plate 62 constituting the bottom plate of the recovery tray main body 61, and these are supported on the base plate 22 in a cantilever manner. And a pair of hexagonal struts 63. The recovery plate 62 is composed of a wide perforated plate in which a plurality of recovery blowout holes 64 for flying pressure air are formed at the peripheral edge of the upper surface, and the divided substrate W sliding down from the rotary table 34 is used for floating. It is designed to receive air while blowing. An air chamber (not shown) is also formed inside the recovery plate 62, and a compressed air flow path connected to the air supply device 29 is connected to the air chamber in a separate system from the feed table 23. ing. Further, the recovery plate 62 may also be formed of a porous plate like the supply plate 42 and the rotating plate 55.

  The positioning mechanism 28 is incorporated in the rotating table 34, and includes a stopper 71 that abuts the front end of the substrate W in the feed direction, a retracting mechanism 72 that causes the stopper 71 to protrude from the rotating plate 55 of the rotating table 34, and a stopper. 71 and a position adjusting mechanism 73 that moves the retracting mechanism 72 as a unit in the X-axis direction (forward and backward in the feed direction).

  The stopper 71 is formed in a round bar shape with a circular cross section, and is disposed so as to face a U-shaped notch groove 74 formed on the center line of the rotating plate 55. With the stopper 71 protruding from the rotating plate 55, the tip of the substrate W sent (the tip of the dicer groove 10 formed on the counter mother substrate 3) abuts, so that the breaker line of the feed table 33 is directly above. The feeding of the substrate W is stopped so that the scribe line (opposed half scribe line 16) is positioned.

  The in / out mechanism 72 is configured by a so-called air cylinder connected to the stopper 71, and makes the stopper 71 in and out of the upper surface of the rotating plate 55 in synchronization with the dividing operation of the substrate W described later. Although not shown in the drawing, the retracting mechanism 72 on which the stopper 71 is mounted is supported so as to be slidable in the X-axis direction with respect to the pair of side frames 56.

  The position adjusting mechanism 73 includes a stopper micrometer head fixed to the outer surface of one side frame 56, and is connected to a rod 75 extending from the retracting mechanism 72. By rotating the stopper micrometer head forward and backward, the stopper 71 can be slightly moved in the X-axis direction via the retracting mechanism 72 so that the position of the stopper 71 can be finely adjusted.

  The alignment camera 25 is disposed on a fixed base 81 disposed in parallel with the table plate 35, and includes a lens barrel 82 facing the substrate W from above, a camera body 83 connected to the upper side of the lens barrel 82, a mirror A camera arm 84 that supports the tube 82 and the camera body 83, and a camera fixing member 85 that supports the camera arm 84 on the fixing base 81 on the base side thereof. The alignment camera 25 is fixed so as to face the upper portion of the edge 46, and a portion serving as a positioning reference such as a TFT 4 of the substrate W or a scribe line formed on the upper surface of the substrate W is sent from the TFT mother substrate 2 side. Take an image. Then, based on the imaging result projected on the monitor (not shown), the substrate W is scribe line (opposite half scribe line 16) directly above the break line B of the edge 46 by an alignment device (not shown) or human work. Align so that is located. The alignment of the substrate W is performed at least when the substrate W is introduced into the apparatus.

  The dividing operation device 24 faces the supply table 33 from above, holds the substrate W between the supply table 33 and the rotation table 34 from above, and the substrate W faces the rotation table. 34, and a rotating mechanism 93 that rotates the rotating table 34 and the second holding mechanism 92 around the break line B to perform the dividing operation of the substrate W. is doing. The first holding mechanism 91 is mounted on the fixed base 81 together with the alignment camera 25, and the second holding mechanism 92 is mounted on the pair of side frames 56 on the downstream side in the substrate feeding direction with the alignment camera 25 interposed therebetween. It has been. Further, the rotation mechanism 93 is mounted on the base plate 22 on the downstream side of the second holding mechanism 92 and adjacent to the fixed base 81.

  The first holding mechanism 91 includes a surface holding mechanism 101 provided immediately above the feed table 33, a point fixing mechanism 102 attached to the downstream side of the surface holding mechanism 101, and the surface holding mechanism 101 and the point fixing mechanism 102. Elevating cylinder 103 for elevating and lowering in the Z-axis direction, linear guide 104 for guiding elevating and lowering of the surface holding mechanism 101 and point fixing mechanism 102 by the elevating cylinder 103, and a thick plate-like vertical supporting the elevating cylinder 103 and the linear guide 104 A frame 105, a bracket 106 that slidably supports the vertical frame 105 in the X-axis direction, and a surface X-axis micro that moves the surface holding mechanism 101 and the point fixing mechanism 102 minutely in the X-axis direction via the vertical frame 105. The meter head 107 and the fixed base 81 are slidably supported in the Y-axis direction. Via the socket 106, the surface holding mechanism 101 and the point securing mechanism 102 and adjustment screw 108 for fine movement in the Y-axis direction, and a.

  After the position of the bracket 106 is adjusted in the Y-axis direction by the adjusting screw 108, the bracket 106 is bolted to the fixing base, and the surface holding mechanism 101 and the point fixing mechanism 102 rotate the surface X-axis micrometer head 107 forward and backward. By doing so, the position is adjusted in the X-axis direction via the vertical frame 105. A surface Z-axis micrometer head 109 for adjusting the degree of contact is disposed below the elevating cylinder 103. The surface holding mechanism 101 and the point fixing mechanism 102 are moved up and down by the elevating cylinder 103. The lower end position, that is, the position in contact with or approaching the substrate W is adjusted by the surface Z-axis micrometer head 109.

  The surface holding mechanism 101 includes a surface supporting member 111 that is a main body, and a pad-shaped surface holding member 112 that is attached to the lower surface of the surface supporting member 111. A weight is mounted on the surface support member 111 so that the surface holding member 112 is not displaced when the substrate W is divided. The surface holding member 112 covers the substrate W so as to cross the substrate W (see FIG. 5), and an elastic member 115 made of a silicon rubber material is disposed on a flat bottom surface. Thereby, the substrate W is not damaged.

  The point fixing mechanism 102 includes a pin-like pusher 113 that presses the center of the substrate W, and a pusher fixing member 114 that supports the pusher 113 on the downstream side surface of the surface support member 111. The position of the front end (lower end) of the pusher 113 is adjusted so that it is slightly below the lower surface of the surface holding member 112.

  That is, the surface holding mechanism 101 and the point fixing mechanism 102 move together in the X-axis, Y-axis, and Z-axis directions. When the substrate W is fed, the surface holding mechanism 101 and the point fixing mechanism 102 are moved to the substrate. Move to a standby position above W. Further, when the substrate W is positioned by the stopper 71, the surface holding mechanism 101 and the point fixing mechanism 102 are lowered, the center of the substrate W in the width direction is fixed by the point fixing mechanism 102, and the substrate W The surface of the substrate W is held by the surface holding mechanism 101 so as to have a slight gap. As a result, the substrate W is fixed to the supply table 33 with almost no load, and is prevented from being lifted excessively when the substrate is divided. The stopper 71 described above is controlled so as to be immersed in the rotary plate 55 immediately after the substrate W is fixed at the dividing position by the surface holding mechanism 101 and the point fixing mechanism 102. The position adjustment of the surface holding member 112 and the point fixing mechanism 102 is performed every time the scribe line or the substrate W having a different thickness is divided.

  The second holding mechanism 92 includes a dividing micrometer head 121 having a plunger that directly applies a pressing force from the upper side of the substrate W and can be moved slightly in the Z-axis direction, and a support block that supports the dividing micrometer head 121. 122, a support block 122 that is slidably supported in the Y-axis direction, and supported by a pair of side frames 56 that are slidable (X-axis direction), and a pair of upright portions of the support base 123. A pair of head Y-axis micrometer heads 124 are fixed to the outer surface of one side frame 56, and the split micrometer head 121 is slightly moved in the X-axis direction with respect to the pair of side frames 56 via a support base 123. An X-axis micrometer head 125 for the head to be operated.

  The splitting micrometer head 121 adjusts the discharge dimension (Z-axis direction) of the plunger that directly contacts the substrate W during the splitting. The pair of Y-axis micrometer heads 124 for the pair of heads has the splitting micrometer head 121 mounted on the substrate W. The position in the Y-axis direction is adjusted so as to face the center in the width direction. The head X-axis micrometer head 125 adjusts the position of the dividing micrometer head 121 in the X-axis direction. That is, the dividing micrometer head 121 is positioned so that the distance from the break line B is the same as the distance from the break line B to the point fixing mechanism 102 and at the center in the width direction of the substrate W to be divided. Adjusted to Further, the adjustment is performed by slightly moving so as to have a gap that is small enough to allow the substrate W to pass therethrough. Further, the position of the point fixing mechanism 102 and the dividing micrometer head 121 is adjusted so as to be arranged in a line-symmetrical position around the scribe line (break line B).

  The rotation mechanism 93 is located on the back side of the collection tray 26 and is fixed to the base plate 22. A table rotation cylinder 131, an L-shaped arm 132 attached to the output side of the table rotation cylinder 131, and an L-shape. A roller follower 133 attached to the tip of the arm 132 and disposed below the collection tray 26 and a return spring (not shown) provided corresponding to the roller follower 133 are provided. An input plate 38 of the rotation table 34 is sandwiched between the roller follower 133 and the return spring. When the table rotation cylinder 131 is driven, the input plate 38 is pressed downward by the roller follower 133, and the rotation table 34 is greatly rotated downward. On the other hand, when the table rotation cylinder 131 stops driving, the rotation table 34 returns to its original position by the spring force of the return spring.

  The turning operation of the turning table 34 simultaneously turns the second holding mechanism 92 attached to the turning table 34. That is, the rotation table 34 and the dividing micrometer head 121 are rotated forward and backward about the rotation shaft 58 by the cooperation of the table rotation cylinder 131 and the return spring. As a result, the dividing micrometer head 121 presses and divides the tip of the substrate W that is fixed and held on the surface while sliding. As described above, since the dividing micrometer head 121 moves circularly around the break line B and presses the substrate W at a point to fold it in a mountain, the dividing operation can be performed by applying only the pressing force to the substrate W. In addition, the substrate W can be prevented from being damaged by rubbing between the substrates W.

  Next, a control method of the substrate dividing apparatus 21 will be described with reference to FIGS. In this control method, after the substrate W is set on the supply table 33, the air supply device 29 is driven, the substrate positioning step of feeding the substrate W and abutting against the stopper 71, and the substrate holding step, the first holding mechanism 91 and the second holding mechanism 92 are driven to hold the substrate W, and a substrate holding step for immersing the stopper 71, and after the substrate holding step, the rotating mechanism 93 is driven to divide the substrate W. A dividing step and a material removal step of sliding the divided substrate W off the rotary table 34 after the substrate dividing step are provided. Note that the substrate holding step, the substrate dividing step, and the material removal step are performed in a state where the compressed air from the air supply device 29 is supplied. That is, the air supply device 29 continues to supply compressed air to the feed table 23 and the collection tray 26 while the substrate W is being divided.

  In the substrate positioning step, the air supply device 29 is driven in a state where the substrate W is set at the upstream end of the material supply table 33. Thereby, the substrate W floats on the air, and the substrate feed path is inclined downstream in the substrate feed direction, so that the substrate W is fed downstream by its own weight (see FIG. 7A). That is, the substrate W can be sent to the downstream side of the substrate feeding only by floating the substrate W. When the substrate W is sent, the tip of the substrate W (the dicer groove 10 of the opposing lateral scribe line 15) comes into contact with the stopper 71, so that the scribe line (opposed half scribe line 16) is positioned on the break line B. (See FIG. 7B). Then, the scribe line, the specific TFT 4 and the like are imaged by the alignment camera 25, and it is confirmed whether or not the position is shifted.

  In the substrate holding step, the point fixing mechanism 102 fixes the center in the width direction of the substrate W, and the surface support member 111 lowers the surface holding member 112 until it has a slight gap between the substrate W and the surface. By holding (see FIG. 7C), the substrate W is fixed at the division position. Further, immediately after the substrate W is fixed by the surface holding mechanism 101 and the point fixing mechanism 102, the stopper 72 is immersed in the rotary table 34.

  In the substrate dividing step, the dividing micrometer head 121 and the rotating table 34 are rotated by driving the rotating mechanism 93. At this time, since the dividing micrometer head 121 starts to rotate together with the rotation table 34 from a state having a slight gap with the substrate W, the dividing micrometer head 121 rotates immediately before the dividing micrometer head 121 contacts the substrate W. The table 34 is separated from the substrate W (see FIG. 7D). When the leading end of the substrate W is pressed by the dividing micrometer head 121, the substrate W is bent into a convex shape. When the pressing is further continued, the scribe line formed on the outer surface of the TFT mother substrate 2 of the substrate W is cracked to be divided into the pre-TFT liquid crystal panel 19 (see FIG. 8A).

  In the material removal process, the divided pre-TFT liquid crystal panel 19 slides down from the rotating table 34 from which the compressed air is ejected (see FIG. 8B) and falls to the collection tray 26 from which the compressed air is ejected ( Soft landing) and recovery (see FIG. 8C).

  The rotation table 34 and the dividing micrometer head 121 are returned to their original positions, and the pusher 113 and the surface holding member 112 are slightly raised after the stopper 71 protrudes from the upper surface of the rotation table 34 ( As shown in FIG. 9D, the substrate W is sent and the next division is performed.

  According to the above configuration, since the air floating air is supplied to the feed plate 42 and the rotating plate 55 (substrate feed path) that are inclined downward in the feed direction, the substrate W is fed in the feed direction by its own weight. It will be sent towards. Then, after the substrate W is positioned and held by hitting the stopper 71, the substrate W is divided and removed by driving the rotation mechanism 93. By repeating this operation, the substrate W can be appropriately fed and divided without being damaged continuously.

  In the present embodiment, the feed table 23 is composed of two parts, which are a material table 33 and a rotation table 34. However, the present invention divides the break head by pressing it against the substrate W. For example, the present invention can also be applied to the substrate dividing apparatus 21 configured by the single feed table 23 without the rotation table 34. Further, while the substrate W is being divided, the air floating air is continuously supplied to the feed table 23 and the collection tray 26. In the substrate positioning step, air is supplied only to the feed table 23. The substrate W is transported and positioned in the state, and the air is stopped immediately after the substrate holding process 101 and the point fixing mechanism 102 fix the substrate W in the substrate holding process. The air may be supplied only to 34 and the collection tray 26.

  DESCRIPTION OF SYMBOLS 14 ... TFT horizontal scribe line 21 ... Substrate dividing device 23 ... Feeding table 24 ... Dividing operation device 28 ... Positioning mechanism 29 ... Air supply device 33 ... Feeding table 34 ... Turning table 71 ... Stopper 72 ... Extruding mechanism 73 ... Position adjustment Mechanism 91 ... First holding mechanism 92 ... Second holding mechanism 93 ... Rotating mechanism B ... Break line W ... Substrate

Claims (9)

A feed table that intermittently feeds the substrate;
Positioning means for positioning a scribe line of the substrate at a break point on the feed table;
Dividing means for dividing the positioned substrate, and
The feed table is a substrate feed path that floats the substrate in air and is inclined downward in the feed direction;
An apparatus for dividing a substrate, comprising: air supply means for supplying air for air levitation to the substrate feed path.   The substrate dividing apparatus according to claim 1, wherein the substrate feeding path is configured by one of a perforated plate and a porous plate. The feed table has a first table on the upstream side in the feed direction and a second table on the downstream side in the feed direction across the break point,
The dividing means faces the first table from the upper side, holds the substrate between the first table and the first table, and faces the second table from the upper side, and brings the substrate to the second table. 2. A second holding mechanism that is held between the first table and the second table, and a turning mechanism that turns the second table and the second holding mechanism around the break point. 3. The substrate dividing apparatus according to 2.   The substrate dividing apparatus according to claim 3, wherein the rotating mechanism rotates the second table and the second holding mechanism so that the substrate is folded in a mountain.   5. The substrate dividing apparatus according to claim 4, wherein the positioning unit includes a stopper provided on the second table and against which a front end of the substrate in the transport direction is abutted. 6.   The substrate dividing apparatus according to claim 5, wherein the positioning unit further includes a retracting mechanism for retracting the stopper from the second table.   7. The substrate dividing apparatus according to claim 5, wherein the positioning unit further includes a position adjusting mechanism that minutely moves the stopper back and forth in the feed direction. A control method for a substrate dividing apparatus according to claim 6,
A substrate positioning step of driving the air supply means in a state where the substrate is set on the first table, and feeding the substrate against the stopper;
After the substrate positioning step, the substrate holding step of driving the first holding mechanism and the second holding mechanism to hold the substrate and immerse the stopper;
After the substrate holding step, the substrate dividing step of driving the rotating mechanism to divide the substrate;
A substrate splitting apparatus control method comprising: a material removal step of sliding the divided substrate off the second table after the substrate splitting step.   9. The method of controlling a substrate dividing apparatus according to claim 8, wherein the driving of the air supply means is continued in the substrate holding step, the substrate dividing step, and the material removal step.

Images