JP2010237672A - 層状中間転写部材 - Google Patents
層状中間転写部材 Download PDFInfo
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- JP2010237672A JP2010237672A JP2010073657A JP2010073657A JP2010237672A JP 2010237672 A JP2010237672 A JP 2010237672A JP 2010073657 A JP2010073657 A JP 2010073657A JP 2010073657 A JP2010073657 A JP 2010073657A JP 2010237672 A JP2010237672 A JP 2010237672A
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- layer
- intermediate transfer
- polyetherimide
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- polysiloxane
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- 238000012546 transfer Methods 0.000 title claims abstract description 78
- 239000004642 Polyimide Substances 0.000 claims abstract description 46
- 229920001721 polyimide Polymers 0.000 claims abstract description 46
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 229920001601 polyetherimide Polymers 0.000 claims abstract description 20
- 239000004697 Polyetherimide Substances 0.000 claims abstract description 18
- 229920000642 polymer Polymers 0.000 claims abstract description 13
- -1 polysiloxane Polymers 0.000 claims description 35
- 239000000203 mixture Substances 0.000 claims description 12
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 claims description 7
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 claims description 5
- 239000004812 Fluorinated ethylene propylene Substances 0.000 claims description 4
- 229920009441 perflouroethylene propylene Polymers 0.000 claims description 4
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 4
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 2
- 239000004962 Polyamide-imide Substances 0.000 claims 2
- 229920002312 polyamide-imide Polymers 0.000 claims 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims 2
- 239000004800 polyvinyl chloride Substances 0.000 claims 2
- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 claims 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- 239000002033 PVDF binder Substances 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 claims 1
- 239000004734 Polyphenylene sulfide Substances 0.000 claims 1
- 229920002492 poly(sulfone) Polymers 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 229920000069 polyphenylene sulfide Polymers 0.000 claims 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 65
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 26
- 239000006229 carbon black Substances 0.000 description 21
- 235000019241 carbon black Nutrition 0.000 description 21
- 229920000767 polyaniline Polymers 0.000 description 17
- 239000010408 film Substances 0.000 description 16
- 239000011521 glass Substances 0.000 description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 13
- 238000010521 absorption reaction Methods 0.000 description 12
- 229920001400 block copolymer Polymers 0.000 description 12
- 229920001577 copolymer Polymers 0.000 description 11
- 239000012790 adhesive layer Substances 0.000 description 10
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- 238000000034 method Methods 0.000 description 10
- 238000000576 coating method Methods 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 8
- 229920004738 ULTEM® Polymers 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000004205 dimethyl polysiloxane Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000002209 hydrophobic effect Effects 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 6
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
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- 238000005507 spraying Methods 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000011164 primary particle Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 238000007611 bar coating method Methods 0.000 description 3
- 210000004556 brain Anatomy 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229920001897 terpolymer Polymers 0.000 description 3
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 241000220010 Rhode Species 0.000 description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 229920000775 emeraldine polymer Polymers 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229920001973 fluoroelastomer Polymers 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 2
- 108091008695 photoreceptors Proteins 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920006259 thermoplastic polyimide Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- JUKXKQJJQVSGJW-UHFFFAOYSA-N CCC.C(=O)(O)C1=C(OC2=C(C=CC=C2)O)C=CC=C1C(=O)O Chemical compound CCC.C(=O)(O)C1=C(OC2=C(C=CC=C2)O)C=CC=C1C(=O)O JUKXKQJJQVSGJW-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920002449 FKM Polymers 0.000 description 1
- 102220560985 Flotillin-2_E60C_mutation Human genes 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000001825 Polyoxyethene (8) stearate Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 101100280469 Salmonella typhimurium (strain LT2 / SGSC1412 / ATCC 700720) fabI gene Proteins 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920005610 lignin Polymers 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- QLOAVXSYZAJECW-UHFFFAOYSA-N methane;molecular fluorine Chemical compound C.FF QLOAVXSYZAJECW-UHFFFAOYSA-N 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000006053 organic reaction Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000005325 percolation Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000000527 sonication Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/14—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base
- G03G15/16—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer
- G03G15/1605—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer using at least one intermediate support
- G03G15/161—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer using at least one intermediate support with means for handling the intermediate support, e.g. heating, cleaning, coating with a transfer agent
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/14—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base
- G03G15/16—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer
- G03G15/1605—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer using at least one intermediate support
- G03G15/162—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer using at least one intermediate support details of the the intermediate support, e.g. chemical composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G2215/00—Apparatus for electrophotographic processes
- G03G2215/16—Transferring device, details
- G03G2215/1604—Main transfer electrode
- G03G2215/1623—Transfer belt
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electrostatic Charge, Transfer And Separation In Electrography (AREA)
- Laminated Bodies (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
Abstract
【解決手段】第1のポリイミド基材層と、ポリエーテルイミド/ポリシロキサンポリマの第2の層と、を含む、ベルトなどの中間転写媒体。
【選択図】なし
Description
1層ポリイミド中間転写ベルト(ITB)部材を下記のように調製した。
ポリイミドベース層と、ポリエーテルイミド−b−ポリシロキサン最上層とを有する2層中間転写ベルト(ITB)部材を下記のように調製した。
ポリイミドベース層と、無溶媒接着層と、ポリエーテルイミド−b−ポリシロキサン最上層とを有する3層中間転写ベルト(ITB)部材を、無溶媒接着層をポリイミドベース層とポリエーテルイミド−b−ポリシロキサン最上層との間に組み入れることを除き実施例Iのプロセスを繰り返すことにより調製した。
比較例1および実施例Iの上記ITB膜または装置に対し、高抵抗率計測器(三菱化学(株)(Mitsubishi Chemical Corp.)からのヒレスタ−アップ(Hiresta−Up)MCP−HT450を用いて表面抵抗率(様々なスポット、72°F/65%の部屋湿度での4から6の測定を平均する)を測定し、表面抵抗率の結果を下記表1に示す。
比較例1および実施例IのITB装置の水の前進接触角(脱イオン水中)を、周囲温度(約23℃)で、コンタクトアングルシステム(Contact Angle System)OCA(データフィジクスインスツルメンツ(Dataphysics Instruments)GmbH、モデルOCA15を用いて測定した。少なくとも10の測定を実施し、それらの平均もまた表1において報告する。
Claims (4)
- ポリイミド基材と、その上のポリエーテルイミド/ポリシロキサンと、を備える中間転写部材。
- 前記ポリイミドはポリイミド、ポリエーテルイミド、ポリアミドイミド、ポリエーテルイミド/ポリシロキサン、またはそれらの混合物のうちの少なくとも1つであり、
前記層形態のポリエーテルイミド/ポリシロキサンにおいて、総固体の重量に基づき約70から約90重量%の量で存在する、ポリイミド、ポリカーボネート、ポリアミドイミド、ポリフェニレンスルフィド、ポリアミド、ポリスルホン、ポリエーテルイミド、ポリエステル、ポリフッ化ビニリデン、ポリエチレン−コ−ポリテトラフルオロエチレン、およびそれらの混合物からなる群より選択される第2のポリマと、
その上の、ポリ(塩化ビニル)、フッ素化エチレンプロピレンコポリマ、ポリテトラフルオロエチレン、ポリフルオロアルコキシポリテトラフルオロエチレン、フルオロシリコーン、フッ化ビニリデン、ヘキサフルオロプロピレン、およびテトラフルオロエチレンのポリマ、またはそれらの混合物を備える外側離型層と、
をさらに含む、請求項1記載の中間転写部材。 - 前記ポリイミドは、第1の支持基材層として機能し、その上には、ポリエーテルイミド−ブロック−ポリシロキサンコポリマを含む第2の層、前記第1の層と前記第2の層との間に配置された接着層を備え、前記第1の層および前記第2の層の少なくとも1つはさらに導電成分を含み、
前記第2の層と接触した必要に応じて用いられる離型層をさらに備え、前記離型層は、ポリ(塩化ビニル)、フッ素化エチレンプロピレンコポリマ、ポリテトラフルオロエチレン、ポリフルオロアルコキシポリテトラフルオロエチレン、フルオロシリコーン、フッ化ビニリデン、およびヘキサフルオロプロピレンテトラフルオロエチレンポリマからなる群より選択される、請求項1記載の中間転写部材。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/413,645 | 2009-03-30 | ||
| US12/413,645 US7910183B2 (en) | 2009-03-30 | 2009-03-30 | Layered intermediate transfer members |
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| Publication Number | Publication Date |
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| JP2010237672A true JP2010237672A (ja) | 2010-10-21 |
| JP5693868B2 JP5693868B2 (ja) | 2015-04-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2010073657A Expired - Fee Related JP5693868B2 (ja) | 2009-03-30 | 2010-03-26 | 層状中間転写部材 |
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| Country | Link |
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| US (1) | US7910183B2 (ja) |
| EP (1) | EP2237113A1 (ja) |
| JP (1) | JP5693868B2 (ja) |
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2237113A1 (en) | 2010-10-06 |
| US7910183B2 (en) | 2011-03-22 |
| JP5693868B2 (ja) | 2015-04-01 |
| US20100247818A1 (en) | 2010-09-30 |
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