JP2011114031A - Ceramic package for storing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ceramic package for storing an electronic component high in reliability in joining at a junction between an external connection terminal pad of a ceramic base body and a soldering pad of a mounting wiring board. <P>SOLUTION: In the ceramic package 10 for storing an electronic component that can be mounted by bringing one side face 15 of a ceramic base body 11 formed in a rectangular shape capable of storing an electronic component 12 into contact with a mounting wiring board 16 to be vertically erected, and jointing external connection terminal pads 17 formed on the ceramic base body 11 for bringing the electronic component 12 and the outside into an electrically conducting state to soldering pads 18 of the mounting wiring board 16 through solder pieces 19, the external connection terminal pads 17 include: end terminal pads 20 formed at both the respective ends in the longitudinal direction of the one side face 15 and both principal surfaces of the ceramic base body 11 in the vicinities thereof; and intermediate-part terminal pads 21 formed in intermediate parts in the longitudinal direction of the one side face 15 and both the principal surfaces of the ceramic base body 11 in the vicinities thereof. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a ceramic package for storing an electronic component for storing an electronic component such as a semiconductor element, a light emitting element, or a crystal resonator. More specifically, the electronic component is stored in a ceramic substrate. The present invention relates to a ceramic package for storing electronic components that is erected and mounted on a wiring board for mounting.

  Conventionally, a plurality of large ceramic green sheets have been used for ceramic packages for storing electronic components. Each ceramic green sheet is subjected to a hole forming process for a plurality of ceramic substrates, and then a wiring made of a conductive metal paste for forming electrical continuity in the package is formed by screen printing. Furthermore, each ceramic green sheet is formed into a laminated body by overlapping and heating and pressing and adhering. The laminated body is formed in a ceramic base aggregate in which a plurality of ceramic bases of a fired body in which a ceramic green sheet and a conductor metal are simultaneously fired in a reducing atmosphere and a metallized film is provided on the surface and the inner layer are arranged. . This ceramic substrate aggregate is formed by forming a plating film on the metallized film exposed to the outside, and then dividing it by dividing grooves provided in advance before firing or cutting after firing. A ceramic substrate is used, and this is a ceramic package for storing an electronic component in which the electronic component is mounted and stored on the ceramic substrate. The ceramic package for storing electronic components is obtained by storing an electronic component in a ceramic substrate, and then using a metallized film provided on the ceramic substrate and an external connection terminal pad made of a plating film as a soldering pad on a mounting wiring board. It is mounted by soldering and is electrically connected to the outside.

  In the ceramic package for storing electronic parts, one side of the ceramic substrate is vertically erected so as to contact the wiring board for mounting, and both one side of the ceramic substrate and the ceramic substrate near the one side are both Some external connection terminal pads, which are solder joints provided on the main surface, are soldered and joined to solder pads on a mounting wiring board via solder to form an electrically conductive state with the outside. A plurality of external connection terminal pads are provided so as to provide a gap between one side of the ceramic base and both ends in the length direction of both main surfaces of the ceramic base in the vicinity of the one side and between adjacent sides. It is provided in the middle part in the length direction.

  In order to form this external connection terminal pad, a plurality of ceramic green sheets are formed on a plurality of ceramic green sheets, after forming through holes such as a circle, an ellipse, and an oval in a plurality of ceramic green sheets. A conductive metal for the metallized film is formed on the wall surface of the through hole of the upper and lower ceramic green sheets excluding the green sheet. At the same time, the upper surface of the uppermost layer and the lower surface of the lowermost layer of the ceramic substrate are connected to a conductive metal formed on the wall surface of the through hole in the vicinity of the through hole. After forming the conductor metal, these ceramic green sheets are laminated to form a laminate. Then, a dividing groove crossing the through hole is formed on the surface of the laminate, and after baking, a plating film is formed on the surface of the metallized film exposed to the outside, and divided by the dividing groove. A plurality of external connection terminal pads are provided in the middle portion of the side surface in the length direction. Alternatively, the laminate is fired to form a plating film, and then cut so as to cross the through-hole, thereby providing a plurality of external connection terminal pads in the middle portion in the length direction of one side surface.

  The above-mentioned ceramic package for storing electronic components is a module that is mounted on a mounting wiring board by being soldered and bonded to improve the mounting density, and is incorporated into a device such as an automobile or a robot. It is used to enable high performance. Such a device generates a temperature cycle in the ceramic package for electronic component storage that generates a high temperature from the electronic component when it operates and returns to normal temperature when it stops, and intense vibrations occur in the ceramic package for electronic component storage. Therefore, high bonding reliability is required for the soldered joint between the electronic component housing ceramic package and the mounting wiring board. In addition, an apparatus in which a ceramic package for storing electronic components is erected on a wiring board for mounting has a configuration in which the portions most affected by the stress on the temperature cycle are concentrated at both end portions in the length direction of one side surface of the ceramic substrate. ing.

  In the conventional ceramic package for storing electronic components, an external connection terminal provided in a vertically mounted semiconductor device, in which a semiconductor element is stored in a base body and is vertically erected with one side as a bottom surface There has been proposed a soldering joint that is a pad, and a stand portion that is supported so as not to fall down until the soldering joining is performed on the base (for example, Patent Document 1). reference).

  In addition, in a conventional ceramic package for storing electronic components, one side end of a substrate to be mounted on a wiring board for mounting is divided in half by a through-hole portion under the name of the mounting method of the substrate. , Brazed at half-thru through-holes with the substrate upright on the connection part, which is a soldering pad of the mounting wiring board, or connected with conductive adhesive and both ends of the half-thru through-holes A board mounting method is proposed in which a leg portion is formed by cutting off a hole, a hole is formed through a connection portion of a wiring board for mounting, and the leg portion is inserted into the hole and temporarily fixed. (For example, refer to Patent Document 2).

JP-A-6-85163 JP-A-8-23163

However, the conventional ceramic package for storing electronic components as described above has the following problems.
(1) In a conventional ceramic package for storing electronic components, external connection terminal pads are provided on one side surface of a ceramic substrate and in the middle portion in the length direction of both main surfaces of the ceramic substrate in the vicinity of the one side surface. It is not provided at both ends in the length direction of one side surface, which is the place most affected by the stress, and is not configured to reinforce both ends. Further, in the conventional ceramic package for storing electronic components, the external connection terminal pads are provided only on one side surface of the ceramic substrate and the middle portion in the length direction of both main surfaces of the ceramic substrate in the vicinity of the one side surface. The supporting strength when mounted upright on a mounting wiring board is insufficient, and it cannot withstand severe vibration. Therefore, the conventional ceramic package for storing electronic components is a joint between the external connection terminal pad of the ceramic substrate and the soldering pad of the mounting wiring board, particularly, the ceramic substrate or the like due to the vibration caused by the operation of the device or the temperature cycle. In addition, the bonding reliability is low such that a crack or breakage occurs in the metallized film or the like.
(2) A ceramic package for storing electronic components as disclosed in Japanese Patent Application Laid-Open Nos. 6-85163 and 8-23163 is provided with a stand part and leg parts at both ends for mounting a ceramic substrate. Although it can be made to stand upright easily on a wiring board, since both ends are not soldered and joined to the mounting wiring board, both ends are not reinforced. Therefore, as in the case of the above-described ceramic package for storing electronic components, such a ceramic package for storing electronic components is provided with one side surface of the ceramic substrate and the ceramic in the vicinity of the one side surface due to vibration caused by the operation of the apparatus and a temperature cycle. Joints between the external connection terminal pads provided only in the lengthwise intermediate portions of both main surfaces of the substrate and the soldering pads of the mounting wiring board, particularly cracks in the ceramic substrate, metallized film, etc. The bonding reliability is such that breakage occurs.

  The present invention has been made in view of such circumstances, and a ceramic package for storing an electronic component having high bonding reliability at a bonding portion between an external connection terminal pad of a ceramic substrate and a soldering pad of a wiring board for mounting. The purpose is to provide.

  The ceramic package for storing an electronic component according to the present invention that meets the above-described object is characterized in that one side surface of a ceramic substrate having a rectangular shape that can store an electronic component is brought into contact with the wiring board for mounting and is erected vertically. In the ceramic package for storing electronic components, the external connection terminal pad provided on the ceramic base can be mounted by being joined to the soldering pad of the mounting wiring board via solder. An end terminal pad provided on each side of the ceramic substrate near one side surface and both main surfaces of the ceramic base near the one side surface, and one side surface and both main surfaces of the ceramic base near the one side surface. An intermediate terminal pad is provided in the middle in the length direction.

  Here, the above-described ceramic package for electronic component storage includes a first notch portion in which the end terminal pads communicate with one side surface and the thickness of the ceramic base on each other side surface adjacent to the one side surface at right angles; In the vicinity of the first metallized film that communicates the thickness of the ceramic substrate with the surface of one notch portion or breaks at the middle portion of the thickness of the ceramic substrate, and the first notch portions on both main surfaces of the ceramic substrate. A second notch portion having a second metallization film electrically connected to the first metallization film, wherein the intermediate terminal pad communicates the thickness of the ceramic substrate on one side surface; and a second notch The first metallized film that communicates the thickness of the ceramic base with the surface of the part, or breaks at the intermediate part of the thickness of the ceramic base, and the first metallized film in the vicinity of the second notch on both main surfaces of the ceramic base. It may have a second metallized film comprising a film and electrically conductive.

  The above-mentioned ceramic package for storing electronic components includes an end terminal pad provided on each side of the main surface of the ceramic base in the vicinity of one side surface of the ceramic base and both sides of the ceramic base near the one side, and one side face And an intermediate terminal pad provided at the intermediate portion in the longitudinal direction of both main surfaces of the ceramic base in the vicinity of the one side surface, so that one side surface of the ceramic base that is most affected by the stress of the temperature cycle by the end terminal pad Both end portions in the length direction and both end portions in the length direction of both main surfaces of the ceramic base in the vicinity of one side surface can be reinforced, and the bonding reliability against the temperature cycle can be improved. In addition to the end terminal pads, the ceramic package for electronic component storage has sufficient support strength when mounted upright on the mounting wiring board by the intermediate terminal pads, and can withstand severe vibration. As a result, the bonding reliability against vibration can be improved.

  In particular, in the above-described ceramic package for electronic component storage, the first terminal portion has a first notch portion that communicates the thickness of the ceramic substrate on one side surface and each other side surface adjacent to the one side surface at a right angle. The first metallized film that communicates the thickness of the ceramic substrate with the surface of the notch portion, or is disconnected at the middle portion of the thickness of the ceramic substrate, and the first notch portion in the vicinity of the first notch portions on both main surfaces of the ceramic substrate. A second notched portion having a second metallized film electrically connected to the first metallized film, the intermediate terminal pad communicating the thickness of the ceramic base on one side, and a second notched portion A first metallized film that communicates with the surface of the ceramic substrate or is broken at an intermediate portion of the thickness of the ceramic substrate; and a first metallized film in the vicinity of the second notch portions on both main surfaces of the ceramic substrate. Since a second metallized film that is electrically conductive with each other is formed, a good solder meniscus can be formed between the end terminal pad and the intermediate terminal pad and the soldering pad of the mounting wiring board. In addition, it is possible to provide a ceramic package for storing electronic components that improves the bonding reliability against temperature cycling and vibration.

It is a perspective view of the ceramic package for electronic component accommodation which concerns on one embodiment of this invention. (A), (B) is explanatory drawing which mounts the ceramic package for electronic component accommodation on a mounting wiring board, respectively.

Next, with reference to the accompanying drawings, embodiments for embodying the present invention will be described for understanding of the present invention.
As shown in FIG. 1, an electronic component housing ceramic package 10 according to an embodiment of the present invention includes a semiconductor substrate 11 made of ceramic such as alumina (Al ₂ O ₃ ) or aluminum nitride (AlN), and a semiconductor. An electronic component 12 such as an element, a light emitting element, or a crystal resonator is mounted and stored. The electronic component storage ceramic package 10 has a quadrangular shape in which a ceramic substrate 11 is laminated with a plurality of plate-shaped ceramic plates. Usually, a cavity portion 13 that can store an electronic component 12 is provided on one main surface side. Is provided. The electronic component storage ceramic package 10 has the electronic component 12 mounted in the cavity portion 13 of the ceramic base 11 so that the electronic component 12 and the outside are in an electrically conductive state. The electronic component 12 in the cavity portion 13 is hermetically sealed by bonding a lid 14 made of a metal plate, a ceramic plate, or the like. Although not shown, the ceramic package 10 for storing electronic components has tungsten (in the cavity portion 13 of the ceramic substrate 11 or a laminated inner layer in order to electrically connect the electronic component 12 and the outside. W), a conductor wiring pattern using a refractory metal such as molybdenum (Mo), a wire bond pad, and the like are provided.

  As shown in FIGS. 2A and 2B, the above-described ceramic package 10 for storing electronic components is vertically erected by bringing one rectangular side surface 15 of the ceramic base 11 into contact with the mounting wiring board 16. It can be made to. At the same time, the ceramic package 10 for storing electronic components is provided with an external connection terminal pad 17 provided in the length direction of one main surface 15 of the ceramic substrate 11 and both main surfaces of the ceramic substrate 11 in the vicinity of the one side surface 15. 16 solder pads 18 are joined via solder 19 so that a good meniscus shape can be formed on the solder 19 for mounting.

  In the electronic component storing ceramic package 10, the external connection terminal pads 17 are provided at one end 15 of the ceramic base 11 and at both ends in the longitudinal direction of both main surfaces of the ceramic base 11 near the side 15. A terminal pad 20 is provided. Further, in the electronic component storing ceramic package 10, the external connection terminal pads 17 together with the end terminal pads 20 are provided on one side surface 15 of the ceramic substrate 11 and both main surfaces of the ceramic substrate 11 in the vicinity of the one side surface 15. An intermediate terminal pad 21 is provided in the middle in the length direction. The electronic component storage ceramic package 10 can be mounted by mounting the electronic component 12 in the cavity portion 13 and then bringing the side surface 15 of the ceramic substrate 11 into contact with the mounting wiring substrate 16 so as to stand upright. The electronic component housing ceramic package 10 includes an end terminal pad 20 provided at one end 15 in the length direction of one main surface 15 of the ceramic base 11 and both main surfaces of the ceramic base 11 in the vicinity of the one side 15; The intermediate part terminal pad 21 provided in the intermediate part can be firmly joined by the good meniscus shape of the solder 19 formed between the wiring board 16 for mounting.

  In the electronic component housing ceramic package 10 described above, the end terminal pad 20 communicates the thickness of the ceramic base 11 on one side 15 of the ceramic base 11 and the other side 15a and 15b adjacent to the side 15 at right angles. It is preferable to have a first cutout portion 22 that does. The end terminal pad 20 has a first metallized film 23 that communicates the thickness of the ceramic base 11 with the surface of the first notch 22 or is disconnected at the middle of the thickness of the ceramic base 11. It is good to be. Further, the end terminal pad 20 is connected to the first metallized film 23 in the vicinity of the first cutouts 22 on both main surfaces of the ceramic base 11 and is electrically connected to the second metallized film 24. It is good to have. In the electronic package housing ceramic package 10 described above, the end terminal pad 20 is in the vicinity of the first cutout portion 22 on each of the other side surfaces 15a and 15b adjacent to the one side surface 15 of the ceramic substrate 11 at right angles. It may have a third metallized film (not shown) that is electrically connected to the first and second metallized films 23 and 24.

  In the electronic component housing ceramic package 10, the intermediate terminal pad 21 may have a second notch 25 that communicates the thickness of the ceramic base 11 on one side surface 15 of the ceramic base 11. . The intermediate terminal pad 21 has a first metallized film 23 a that communicates the thickness of the ceramic base 11 with the surface of the second notch 25 or is disconnected at the intermediate part of the thickness of the ceramic base 11. It is good to be. Further, the intermediate terminal pad 21 is connected to the first metallized film 23a in the vicinity of the second cutouts 25 on both main surfaces of the ceramic substrate 11, and is electrically connected to the second metallized film 24a. It is good to have.

  In the electronic package housing ceramic package 10 described above, the first metallized film 23 in which the end terminal pads 20 are disconnected at the intermediate portion of the thickness of the ceramic base 11 and the intermediate terminal pads 21 are the intermediate portion of the thickness of the ceramic base 11. By providing the first metallized film 23a that is disconnected at a large number, the external connection terminal pads 17 can be formed on the one side surface 15 side of the ceramic substrate 11. Although the above-described ceramic package 10 for storing electronic components is not shown, normally, Ni is formed on the upper surfaces of the first metallized films 23 and 23a and the second metallized films 24 and 24a. A plating film and an Au plating film are formed on the upper surface.

Here, a method for manufacturing the above-described ceramic package 10 for storing electronic components will be briefly described.
A plurality of ceramic green sheets are used in the ceramic package 10 for storing electronic components as described above. For the production of this ceramic green sheet, for example, when the ceramic is made of alumina, a powder is prepared by adding an appropriate amount of a sintering aid such as magnesia, silica, calcia to alumina powder. To this powder, a plasticizer such as dioctyl phthalate, a binder such as acrylic resin, and a solvent such as toluene, xylene, and alcohols are added and kneaded sufficiently, and then defoamed to obtain a slurry having a viscosity of 2000 to 40000 cps. Yes. Then, the slurry is formed into a plurality of ceramic green sheets formed into a sheet having a thickness of, for example, 0.25 mm by a doctor blade method or the like and further cut into an appropriate size. This ceramic green sheet has a size that can be formed as an aggregate in which a large number of individual ceramic substrates 11 are arranged in a matrix.

  Next, in each of the plurality of ceramic green sheets, via conductor through-holes for forming upper and lower layers of electrical continuity for the plurality of individual ceramic base bodies 11 and electronic A through hole for the cavity portion 13 for mounting a part and a through hole for the first and second cutout portions 22 and 25 are formed by punching using a punching die or a punching machine. Yes. Furthermore, each ceramic green sheet is screen-printed with a conductive paste made of a refractory metal such as tungsten (W) or molybdenum (Mo) and filled with through-holes for via conductors, or has a conductor on the surface. Conductor print patterns for wiring routing, second metallized films 24, 24a, etc. are printed, or the first metallized film 23 is formed on the wall surfaces of the through holes for the first and second cutouts 22, 25. , 23a for through-hole printing.

  Next, a plurality of these ceramic green sheets are overlaid and laminated by applying temperature and pressure to form a laminated body. Then, the laminated body is pressed with a cutting blade attached to a press or the like at each of the positions where the quadrangular ceramic base 11 is formed, so that divided grooves are formed on the surface of the laminated body. Since the ceramic package 10 for storing electronic parts after firing has the side surface 15 of the ceramic substrate 11 brought into contact with the mounting wiring board 16 and is erected, for example, the size is 6 × 7 mm and the thickness is 2. About 5 mm, the thickness of the ceramic substrate 11 is relatively thick. Therefore, the dividing grooves formed in such a thick laminate can be divided so that the ends of the dividing grooves are connected to each other at the time of division after firing, and the divided sections are divided into two substantially equal to each other. In order to do so, it is preferable to form on both main surfaces of the laminate. Further, the dividing groove provided at the position of the one side surface 15 is provided so as to pass through the centers of the through holes for the first and second cutout portions 22 and 25. The ceramic package 10 for storing electronic parts is not provided with a dividing groove in the portion that becomes the one side surface 15 of the ceramic substrate 11 at the stage of the laminated body, and is first and second by a cutting machine such as a dicing saw after firing. In some cases, the flat one side surface 15 having the first and second cutout portions 22 and 25 is formed by cutting the cutout portions 22 and 25 through the center of the through holes. .

  Next, the laminate is formed by simultaneously firing the ceramic green sheet and the refractory metal at a temperature of about 1550 ° C. in a reducing atmosphere. This fired body is an aggregate of the ceramic substrate 11 that is shrunk by about 30% from the laminate of the ceramic green sheets by firing, and the surface of the ceramic green sheet and the through holes for the first and second cutout portions 22 and 25 are used. The first and second metallized films 23, 23 a, 24, 24 a, etc., are formed by baking the conductor print pattern formed on the wall surface of the hole on each ceramic substrate 11. The fired body is formed by forming a Ni plating film and an Au plating film on a metal portion exposed to the outside, and then dividing the fired body by dividing grooves or cutting a position that is a desired side surface of the ceramic substrate 11. A ceramic package 10 for storing individual electronic components is formed.

  The ceramic package for electronic component storage according to the present invention includes a semiconductor element, a light emitting element, a crystal resonator, and other electronic components mounted thereon, and then a side surface of the ceramic substrate is brought into contact with a mounting wiring board such as a board. It can be mounted upright and can be used by being incorporated in various electronic devices that need to improve the mounting density.

  10: Ceramic package for storing electronic components, 11: Ceramic substrate, 12: Electronic components, 13: Cavity, 14: Lid, 15: One side, 15a, 15b: Other side, 16: Wiring board for mounting, 17: external connection terminal pad, 18: soldering pad, 19: solder, 20: end terminal pad, 21: intermediate terminal pad, 22: first notch, 23, 23a: first metallized film 24, 24a: second metallized film, 25: second notch

Claims (2)

One side surface of a ceramic substrate having a quadrangular shape capable of storing electronic components is brought into contact with the mounting wiring board so as to stand vertically, and in order to electrically connect the electronic components with the outside, In the ceramic package for storing electronic components that can be mounted by bonding the external connection terminal pads to be provided to the soldering pads of the mounting wiring board via solder,
The external connection terminal pads are provided on the one side surface of the ceramic base and on both end portions in the length direction of both main surfaces of the ceramic base in the vicinity of the one side surface, the one side surface, and the one side surface. A ceramic package for storing electronic components, comprising intermediate terminal pads provided at intermediate portions in the longitudinal direction of both main surfaces of the ceramic base in the vicinity of the side surface.   2. The ceramic package for storing electronic parts according to claim 1, wherein the end terminal pad communicates the thickness of the ceramic substrate on the one side surface and each other side surface adjacent to the one side surface at a right angle. A first metallized film that communicates the thickness of the ceramic base to the surface of the first notch, or is disconnected at an intermediate portion of the thickness of the ceramic base, and the main surfaces of the two main surfaces of the ceramic base. A second metallized film electrically connected to the first metallized film is provided in the vicinity of the first notch, and the intermediate terminal pad communicates the thickness of the ceramic substrate on the one side surface. The first metallization in which the thickness of the ceramic base is communicated with the second notch and the surface of the second notch, or the middle of the thickness of the ceramic base is disconnected And the second metallized film electrically connected to the first metallized film in the vicinity of the second notch on both main surfaces of the ceramic substrate. Ceramic package.

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