JP2012144678A5 - - Google Patents
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- JP2012144678A5 JP2012144678A5 JP2011006116A JP2011006116A JP2012144678A5 JP 2012144678 A5 JP2012144678 A5 JP 2012144678A5 JP 2011006116 A JP2011006116 A JP 2011006116A JP 2011006116 A JP2011006116 A JP 2011006116A JP 2012144678 A5 JP2012144678 A5 JP 2012144678A5
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- less
- room temperature
- fluidity
- regarding
- silicon
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Description
一般式（１）において、ａは２０〜１００００の数を表わす。ａが２０よりも小さい場合には得られる硬化物の耐熱性が不充分となり、１００００より大きい場合には粘度が大きくなり、ハンドリングに支障をきたす。ａは、１００〜５０００が好ましく、２００〜２０００がより好ましい。
In the general formula (1), a represents a number of 20 to 10,000. When a is less than 20, the resulting cured product has insufficient heat resistance, and when it is greater than 10,000 , the viscosity increases, which hinders handling. a is preferably from 100 to 5,000, more preferably from 200 to 2,000.
本発明のケイ素含有硬化性樹脂組成物は、室温（２５℃）で良好な流動性があり、ハンドリング性に優れる。流動性に関しては、金属酸化物微粉末を含まない状態で、室温（２５℃）においてＥ型粘度計で測定した粘度が５０Ｐａ・ｓ以下であるのが好ましく、１０Ｐａ・ｓ以下であるのがより好ましい。 The silicon-containing curable resin composition of the present invention has good fluidity at room temperature (25 ° C.) and excellent handling properties. Regarding the fluidity, the viscosity measured with an E-type viscometer at room temperature (25 ° C.) without containing the metal oxide fine powder is preferably 50 Pa · s or less, more preferably 10 Pa · s or less. preferable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011006116A JP5647012B2 (en) | 2011-01-14 | 2011-01-14 | Silicon-containing curable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011006116A JP5647012B2 (en) | 2011-01-14 | 2011-01-14 | Silicon-containing curable resin composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012144678A JP2012144678A (en) | 2012-08-02 |
| JP2012144678A5 true JP2012144678A5 (en) | 2013-12-26 |
| JP5647012B2 JP5647012B2 (en) | 2014-12-24 |
Family
ID=46788578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011006116A Expired - Fee Related JP5647012B2 (en) | 2011-01-14 | 2011-01-14 | Silicon-containing curable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5647012B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6143359B2 (en) * | 2013-11-19 | 2017-06-07 | 日本化薬株式会社 | Silicone-modified epoxy resin and composition thereof |
| JP6404110B2 (en) * | 2014-12-18 | 2018-10-10 | 信越化学工業株式会社 | Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound and cured product thereof |
| JP7771933B2 (en) | 2022-11-24 | 2025-11-18 | 信越化学工業株式会社 | Epoxy group-containing cyclic organopolysiloxane, curable composition containing same, and cured product thereof |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001040066A (en) * | 1999-07-30 | 2001-02-13 | Dow Corning Toray Silicone Co Ltd | Ultraviolet-curable composition |
| JP2006249400A (en) * | 2005-02-10 | 2006-09-21 | Sanyo Chem Ind Ltd | Epoxy resin composition |
| JP5248034B2 (en) * | 2007-04-23 | 2013-07-31 | 株式会社Ａｄｅｋａ | Silicon-containing compound, curable composition, and cured product |
| JP4707729B2 (en) * | 2008-03-31 | 2011-06-22 | 信越化学工業株式会社 | Low viscosity UV curable silicone composition for release paper |
| JP5251668B2 (en) * | 2009-03-27 | 2013-07-31 | 日油株式会社 | Thermosetting resin composition |
| WO2011065365A1 (en) * | 2009-11-30 | 2011-06-03 | ナミックス株式会社 | Epoxy resin composition for sealing semiconductors, and semiconductor devices |
| JP5734629B2 (en) * | 2010-11-25 | 2015-06-17 | 株式会社Adeka | Positive photosensitive resin composition and permanent resist |
| KR101858638B1 (en) * | 2012-03-23 | 2018-05-16 | 가부시키가이샤 아데카 | Silicon-containing curable resin composition |
-
2011
- 2011-01-14 JP JP2011006116A patent/JP5647012B2/en not_active Expired - Fee Related
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