JP2012242184A - Probe pin materiel, probe pin and manufacturing method thereof - Google Patents
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Abstract
【課題】完成前の加工段階では良好な加工性を備え、完成品状態で十分な硬度を有するプローブピンを提供する。
【解決手段】Inまたは/およびSn：0.2〜1.2mass%、Pd：35〜50mass%、Cu：25〜40mass%、Ag：15〜40mass%および不可避不純物からなる合金を、55〜99.6%の加工率[加工率(%)=((加工前の断面積−加工後の断面積)/加工前の断面積)×100とする]でプローブピン用材料に加工する。280〜440のビッカース硬さを有し上記加工率のプローブピン用材料を、所望の形状に加工した後、300〜500℃で加熱、析出処理する。
【選択図】なしProvided is a probe pin that has good workability at a processing stage before completion and has sufficient hardness in a finished product state.
An alloy composed of In or / and Sn: 0.2 to 1.2 mass%, Pd: 35 to 50 mass%, Cu: 25 to 40 mass%, Ag: 15 to 40 mass% and inevitable impurities is processed to 55 to 99.6%. The probe pin material is processed at a rate [processing rate (%) = ((cross-sectional area before processing−cross-sectional area after processing) / cross-sectional area before processing) × 100]]. A probe pin material having a Vickers hardness of 280 to 440 and having the above processing rate is processed into a desired shape, and then heated and precipitated at 300 to 500 ° C.
[Selection figure] None
Description
本発明は、半導体ウェハ上の集積回路や液晶表示装置等の電気的特性を検査するためのプローブカードに組み込まれたプローブピン(以下、「プローブピン」と略称する)に関する。 The present invention relates to a probe pin (hereinafter abbreviated as “probe pin”) incorporated in a probe card for inspecting electrical characteristics of an integrated circuit, a liquid crystal display device and the like on a semiconductor wafer.
半導体ウェハ上に形成された集積回路や液晶表示装置等の電気的特性の検査には、複数のプローブピンが組み込まれたプローブカードが用いられている。この検査は、プローブカードに組み込まれたプローブピンを、集積回路や液晶表示装置等の電極や端子、導電部にプローブピンを接触させることにより行われている。 A probe card in which a plurality of probe pins are incorporated is used for inspection of electrical characteristics of an integrated circuit, a liquid crystal display device, and the like formed on a semiconductor wafer. This inspection is performed by bringing a probe pin incorporated in a probe card into contact with an electrode, a terminal, or a conductive part of an integrated circuit or a liquid crystal display device.
このようなプローブピンは、高導電性はもちろん、安定した検査結果を得るため、耐食性、耐酸化性が求められ、且つ検査対象物に繰り返し接触させるため、十分な強度が必要となる。強度が必要なのは、何万回と検査体にプローブピンを接触することによる摩耗を低減させる必要があるためである。 Such a probe pin is not only highly conductive, but also requires corrosion resistance and oxidation resistance in order to obtain a stable inspection result, and is required to have sufficient strength because it is repeatedly brought into contact with an inspection object. The strength is required because it is necessary to reduce wear caused by contacting the probe pin with the test object tens of thousands of times.
一方、半導体集積回路等の電極や端子等の間隔がますます狭くなっているため、プローブピンのピッチを狭くすることが要求され、プローブピンは、十分な硬さを有し、良好な加工性が求められている。最近は、複雑形状に対応するため、加工しやすい硬さの段階で、所定形状のプローブピンに加工した後、析出処理により硬さを上げる方法が取られており、そのためプローブピンには、良好な加工性と高い析出硬化能が求められている。また析出硬化後の硬さは、硬いほど望ましい。 On the other hand, since the distance between electrodes and terminals of semiconductor integrated circuits and the like is becoming narrower, it is required to reduce the pitch of the probe pins, and the probe pins have sufficient hardness and good workability. Is required. Recently, in order to cope with complex shapes, a method of increasing the hardness by precipitation treatment after processing into a probe pin of a predetermined shape at the stage of hardness that is easy to process has been adopted. Workability and high precipitation hardening ability are required. Moreover, the hardness after precipitation hardening is so preferable that it is hard.
従来用いられるプローブピンには、特許文献1や特許文献2に示すようにリン青銅やタングステンが使用されている。
これらのプローブピンは、耐酸化性に劣り、使用の際、表面に酸化膜が生成され、繰り返し検査を続けていくうちに酸化物が検査対象物に付着し、導通不良が発生するといった問題がある。
As shown in Patent Document 1 and Patent Document 2, phosphor bronze or tungsten is used for probe pins used conventionally.
These probe pins are inferior in oxidation resistance, and when used, an oxide film is formed on the surface, and the oxide adheres to the object to be inspected as the inspection is repeated. is there.
このようなプローブピンの酸化膜形成による不良を防ぐために、特許文献3、特許文献4、特許文献5のようにパラジウム合金、白金合金を使用する場合がある。
このなかでパラジウム合金を使用しているプローブピンは、加工硬化で硬さを向上させる場合と、析出硬化により硬さを向上させる場合、あるいはその両方により硬さを向上させる場合がある。また、白金合金は、固溶硬化および加工硬化により硬さを向上させる。
パラジウム合金で要求される硬さを得るためには、強加工を施し、且つ時効処理を行う必要があるが、所定の硬さを得るため強加工を行うと90°に曲げるだけで破折するため、良好な加工性を得るためには加工率を下げ、硬さを犠牲にする必要がある。
一方、白金合金は合金にもよるが、析出硬化しない組成が多いため、固溶硬化と加工硬化で硬さを上げるが、こちらも、所定の硬さを得るため強加工を行うと90°に曲げるだけで破折するため、良好な加工性を得るためには加工率を下げ、硬さを犠牲にする必要がある。
In order to prevent such defects due to the formation of the oxide film of the probe pin, a palladium alloy or a platinum alloy may be used as in Patent Document 3, Patent Document 4, and Patent Document 5.
Among these, a probe pin using a palladium alloy may be improved in hardness by work hardening, in case of improving hardness by precipitation hardening, or in both cases. Moreover, platinum alloy improves hardness by solid solution hardening and work hardening.
In order to obtain the required hardness of the palladium alloy, it is necessary to perform strong processing and aging treatment, but if strong processing is performed in order to obtain a predetermined hardness, it will break only by bending to 90 °. Therefore, in order to obtain good processability, it is necessary to reduce the processing rate and sacrifice the hardness.
On the other hand, although platinum alloys depend on the alloy, there are many compositions that do not precipitate and harden, so the hardness is increased by solid solution hardening and work hardening, but this is also 90 ° when strong processing is performed to obtain the prescribed hardness. Since it breaks only by bending, in order to obtain good workability, it is necessary to reduce the processing rate and sacrifice the hardness.
そこで本発明の目的は、完成前の加工段階では良好な加工性を備え、完成品状態では十分な硬度を有するプローブピンを提供することにある。 SUMMARY OF THE INVENTION An object of the present invention is to provide a probe pin that has good workability at the processing stage before completion and has sufficient hardness in the finished product state.
本発明者らは、上記の目的を達成すべく鋭意検討した結果、Pdに所定量のCuとAgを含有させ、さらに特定少量のInまたは/およびSnを添加させた合金を、加工率にして55〜99.6%の範囲で加工し、ビッカース硬さ（以下、HVとする）を280〜420とした材料にすることにより、90°の折り曲げにも耐えられる加工性を有しつつ、300〜500℃で加熱、析出処理を行うことによりHV450以上の硬さとなるプローブピンが得られることを見出し、本発明を完成するに至った。 As a result of intensive investigations to achieve the above-mentioned object, the inventors have made an alloy containing a predetermined amount of Cu and Ag in Pd, and further added a specific small amount of In or / and Sn. By processing in the range of 55-99.6% and making it a material with Vickers hardness (hereinafter referred to as HV) of 280-420, it has a workability that can withstand bending at 90 °, and 300-500 It has been found that a probe pin having a hardness of HV450 or more can be obtained by heating and precipitating at ℃, and the present invention has been completed.
すなわち上記目的は、半導体ウェハ上の集積回路や液晶表示装置等の電気的特性を検査するために用いられ、半導体集積回路や液晶表示装置等の電極や導電部に接触させるプローブピンであって、Inまたは/およびSnが0.2〜1.2mass%、35〜50mass%のPd、25〜40mass%のCu、15〜40mass%のAgおよび不可避不純物からなる合金からなり、加工率[加工率(%)=((加工前の断面積−加工後の断面積)/加工前の断面積)×100とする]が、55〜99.6%の範囲で加工を行い、加工時のビッカース硬さが280〜440の材料からなるプローブピンによって達成される。 That is, the above object is a probe pin used for inspecting the electrical characteristics of an integrated circuit, a liquid crystal display device, etc. on a semiconductor wafer, and brought into contact with an electrode or a conductive part of the semiconductor integrated circuit, the liquid crystal display device, In or / and Sn is composed of 0.2 to 1.2 mass%, 35 to 50 mass% Pd, 25 to 40 mass% Cu, 15 to 40 mass% Ag and inevitable impurities, and the processing rate [processing rate (%) = ((Cross sectional area before processing-Cross sectional area after processing) / Cross sectional area before processing) × 100] is within the range of 55-99.6%, and the Vickers hardness during processing is 280-440 This is achieved by a probe pin made of material.
上記の材料を300〜500℃で加熱、析出処理を行うことにより、ビッカース硬さが450以上の材料からなるプローブピンが得られる。 A probe pin made of a material having a Vickers hardness of 450 or more can be obtained by heating and precipitating the above material at 300 to 500 ° C.
本発明は、析出処理前の加工性が良好で、且つ析出処理により十分な硬度を有し、さらに貴金属を60mass%以上含有することから、耐酸化性にも優れるため検査対象物を汚染することなく、長期間安定して使用可能なプローブピンを得ることができる。 The present invention has good workability before the precipitation treatment and has sufficient hardness by the precipitation treatment, and further contains no less than 60 mass% of precious metal, so that the object to be inspected is contaminated due to excellent oxidation resistance. Thus, a probe pin that can be used stably for a long time can be obtained.
また本発明において、プローブピンの製造に用いられるプローブピン用材料は、280〜440のビッカース硬さを有し、55〜99.6%の加工率で加工が施されている。この特徴により、良好な加工性が得られるとともに、後に加熱、析出処理を行うことで十分な析出硬化が得られる。 In the present invention, the probe pin material used for manufacturing the probe pin has a Vickers hardness of 280 to 440 and is processed at a processing rate of 55 to 99.6%. Due to this feature, good workability can be obtained, and sufficient precipitation hardening can be obtained by performing heating and precipitation treatment later.
また本発明では、上記特徴のプローブピン用材料を所望の形状に加工した後、300〜500℃で加熱、析出処理する。これにより、繰り返し検査に耐えうる十分な強度のプローブピンが得られる。 Moreover, in this invention, after processing the material for probe pins of the said characteristic into a desired shape, it heats and precipitates at 300-500 degreeC. As a result, a probe pin having sufficient strength to withstand repeated inspection can be obtained.
プローブピンは、プローブカードに組み込むため所定の形状に加工する必要があることから、最低でも加熱、析出処理前は90°の折り曲げに耐える必要がある。
そのため、加工率は55〜99.6%の範囲とし、HVが280〜420の範囲とする。加工率が55%未満の場合、加工性は良好だが、その後の加熱、析出処理を行っても十分な析出硬化が得られず、HVで450未満になる場合があるため、加工率を55%以上にする必要がある。一方、加工率が99.6%を上回ると90°の折り曲げにも耐えられず破折するため、加工率は99.6%以下とする必要がある。
Since the probe pin needs to be processed into a predetermined shape in order to be incorporated into the probe card, it is necessary to withstand at least 90 ° bending before heating and precipitation treatment.
Therefore, the processing rate is in the range of 55-99.6%, and the HV is in the range of 280-420. If the processing rate is less than 55%, the workability is good, but even if the subsequent heating and precipitation treatment is performed, sufficient precipitation hardening cannot be obtained, and the HV may be less than 450, so the processing rate is 55%. It is necessary to do more. On the other hand, if the processing rate exceeds 99.6%, it will not be able to withstand 90 ° bending and will break, so the processing rate needs to be 99.6% or less.
また本発明のプローブピンの材料は、Inまたは/およびSnが0.2〜1.2mass%、30〜50mass%のPd、25〜40mass%のCu、15〜40mass%のAgおよび不可避不純物からなる合金からなるものである。またより好ましい組成は、Inまたは/およびSnが0.3〜1.0mass%、Pdが35〜48mass%、Cuが26〜38mass%、Agが18〜38mass%である。またPdとAgの合計を50mass%以上にすることにより、大気中での酸化を抑えることができ、検査対象物への酸化物の付着が起こりにくくなる。 The material of the probe pin of the present invention is made of an alloy consisting of In or / and Sn of 0.2 to 1.2 mass%, 30 to 50 mass% Pd, 25 to 40 mass% Cu, 15 to 40 mass% Ag, and inevitable impurities. Is. Further, a more preferable composition is 0.3 to 1.0 mass% for In or / and Sn, 35 to 48 mass% for Pd, 26 to 38 mass% for Cu, and 18 to 38 mass% for Ag. In addition, when the total of Pd and Ag is 50 mass% or more, oxidation in the air can be suppressed, and the adhesion of oxide to the inspection object is less likely to occur.
本発明のプローブピンの材料は、300〜500℃の範囲で熱処理し、析出硬化によりより硬くすることができる。熱処理温度は、300℃未満では、十分な硬さの上昇がみられず、500℃を超えると熱処理により軟化することから、上記の温度範囲とする。熱処理を行うことにより、HV450以上の硬さに上昇する。 The material of the probe pin of the present invention can be hardened by heat treatment in the range of 300 to 500 ° C. and precipitation hardening. When the heat treatment temperature is less than 300 ° C., a sufficient increase in hardness is not observed, and when the heat treatment temperature exceeds 500 ° C., the heat treatment is softened. By performing heat treatment, the hardness increases to HV450 or higher.
熱処理の時間は、析出硬化が十分生じる時間が好ましいが、例えば線径がφ0.05〜0.5mmの場合、1分程度でも十分な析出硬化が得られる。また熱処理による析出硬化後の硬さは、HV450以上、さらに好ましくはHV460以上が好ましい。HVが450未満の場合、プローブピンとしての強度が十分ではなく、繰り返し検査に耐えられず、検査回数が低下するためである。 The heat treatment time is preferably a time at which precipitation hardening is sufficiently caused. However, for example, when the wire diameter is 0.05 to 0.5 mm, sufficient precipitation hardening can be obtained even for about 1 minute. The hardness after precipitation hardening by heat treatment is preferably HV450 or more, more preferably HV460 or more. This is because when the HV is less than 450, the strength as a probe pin is not sufficient, the test cannot be repeated, and the number of inspections decreases.
本発明に従うプローブピンに使用する合金は、それ自体既知の方法に従い、例えばPdにAgとCuとInおよび/またはSnを上記の量で添加、原料配合物を調整し、それをガス炉、高周波溶解炉など適当な金属溶解炉で溶解することにより製造することができる。溶解時の炉雰囲気としては、通常大気が用いられるが、必要に応じて不活性ガスまたは真空を使用することができる。また溶融状態の上記の合金を適当な型に鋳造し、インゴットを作製する。必要に応じて、インゴットを鍛造やスェージング加工を施し、溝ロールにより角形または多角形の棒材または線材に加工する。さらにダイスを用い伸線加工することにより、プローブピン用材料を作製することができる。 The alloy used for the probe pin according to the present invention is prepared in accordance with a method known per se, for example, Ag, Cu, In and / or Sn are added to Pd in the above amounts, the raw material composition is adjusted, It can be produced by melting in a suitable metal melting furnace such as a melting furnace. As the furnace atmosphere at the time of melting, air is usually used, but an inert gas or a vacuum can be used as necessary. Further, the above alloy in a molten state is cast into an appropriate mold to produce an ingot. If necessary, the ingot is subjected to forging or swaging, and processed into a square or polygonal bar or wire by a groove roll. Furthermore, a probe pin material can be produced by wire drawing using a die.
以下、本発明を実施例によりさらに具体的に説明する。 Hereinafter, the present invention will be described more specifically with reference to examples.
Pd、Agに、Cu、In、Snを所定量に配合し、ガス炉にて溶解、鋳造、鍛造またはスェージング加工し、さらに溝ロール加工にて□4.9mmの棒材を作製した。
その後、□4.9mmの棒材を800℃×1hr熱処理後、水冷により焼鈍した試料に伸線加工を施し、加工率を変え調査した。作製したプローブピン用材料の組成を表1に示す。
Cu, In and Sn were mixed in a predetermined amount to Pd and Ag, melted, casted, forged or swaged in a gas furnace, and further a □ 4.9 mm bar was produced by groove roll processing.
After that, a 4.9 mm rod was heat-treated at 800 ° C. for 1 hour and then annealed by water cooling. Table 1 shows the composition of the produced probe pin material.
（加工率調査用試料）
作製した表1の各サンプルについて、加工率の異なる複数の試料を作製した。
□4.9mm(断面積：24mm2)を起点とし、加工により所定の加工率になった段階で試料を採取し、以後の調査用試料とした。
(Sample for processing rate investigation)
A plurality of samples having different processing rates were prepared for each sample of the prepared Table 1.
□ Starting from 4.9 mm (cross-sectional area: 24 mm 2 ), a sample was taken when the processing rate reached a predetermined processing rate, and used as a sample for subsequent investigation.
（折曲げ試験）
表1の組成の各サンプルを加工率96%以上まで加工、棒材にした試料（プローブピン用材料）を、折曲げ試験機を用い90°になるまで曲げ、破折もしくは表面に割れが発生するかを確認した。
(Bending test)
Each sample with the composition shown in Table 1 was processed to a processing rate of 96% or more, and the specimen (probe pin material) was bent to 90 ° using a bending tester, causing breakage or cracks on the surface. I confirmed what to do.
曲げ試験の条件は、φ20mmのロールを25mm離し、ロール間距離を5mmとしたロール上にL30mmの長さの棒材を置き、厚さ2mm、棒材との接触部の曲率半径が1mmの押し板を押し当て、棒材が90°まで曲がるよう押込み、押し込んだ後の状態を調査した。 The condition of the bending test is that a 20 mm roll is placed 25 mm apart, a 30 mm long bar is placed on the roll with a distance between rolls of 5 mm, the thickness is 2 mm, and the radius of curvature of the contact part with the bar is 1 mm. The board was pressed, the bar was pushed to 90 °, and the state after the push was investigated.
評価基準として、○を破折および割れ無、△を割れ有り、×を破折と表記する。(各試料数：n＝3) As evaluation criteria, ◯ is described as broken and unbroken, Δ is cracked, and x is broken. (Number of samples: n = 3)
表3のように各サンプルとも、96.7%までは割れずに90°まで曲げることができた。加工率が上がると、実施例は99.2%まで破折、割れ無に曲げることができたが、比較例1〜4および比較例6は、99.2%で破折または割れが発生しており、実施例において加工性が向上していることがわかる。ただし加工率が99.9%になると実施例も破折や割れが生じており、加工率は99.9%未満にする必要がある。また比較例6は、伸線時に割れが発生し加工率96.7%以上の加工ができなかった。 As shown in Table 3, each sample could be bent up to 90 ° without breaking up to 96.7%. When the processing rate increased, the example could be bent to 99.2% and could be bent without cracking, but Comparative Examples 1 to 4 and Comparative Example 6 were broken or cracked at 99.2%. It can be seen that the workability is improved in the example. However, when the processing rate reaches 99.9%, breakage and cracks also occur in the examples, and the processing rate needs to be less than 99.9%. In Comparative Example 6, cracking occurred during wire drawing, and processing with a processing rate of 96.7% or more could not be performed.
（硬さ試験）
表1の組成のサンプルの各加工率に対する硬さを測定、その後300〜500℃の範囲で1hr熱処理し、再度硬さを測定した。測定結果を表4に示す。
(Hardness test)
The hardness with respect to each processing rate of the sample of the composition of Table 1 was measured, and then heat treated for 1 hour in the range of 300 to 500 ° C., and the hardness was measured again. Table 4 shows the measurement results.
表4のように実施例の場合、加工率が50%以下だと熱処理による析出硬化を行ってもHVが450に満たない。加工率が62.5%以上だとHVが450以上となることが分かる。このため、加工率は50%を超える必要がある。 In the case of Examples as shown in Table 4, when the processing rate is 50% or less, the HV is less than 450 even if precipitation hardening is performed by heat treatment. It can be seen that the HV is 450 or more when the processing rate is 62.5% or more. For this reason, the processing rate needs to exceed 50%.
比較例1〜5は、加工率が96.7%でもHVが450未満であり、実施例よりも析出硬化が低い。また、比較例6は、加工率が62.5%の場合でもHVが450未満であり、Inの添加量が多いと逆に析出硬化しにくくなる。 In Comparative Examples 1 to 5, even when the processing rate is 96.7%, the HV is less than 450, and the precipitation hardening is lower than that of the Examples. Further, in Comparative Example 6, even when the processing rate is 62.5%, the HV is less than 450, and when the amount of In added is large, the precipitation hardening is difficult.
（比抵抗調査）
300〜500℃の範囲で1hr熱処理した析出硬化処理後の比抵抗を測定した。測定時の温度は、25℃とし、各試料の抵抗を測定し、式1に従い比抵抗を算出した。
(Resistivity survey)
The specific resistance after precipitation hardening after heat treatment for 1 hour in the range of 300 to 500 ° C. was measured. The measurement temperature was 25 ° C., the resistance of each sample was measured, and the specific resistance was calculated according to Equation 1.
式1：比抵抗=(抵抗×断面積)／測定長 Formula 1: Specific resistance = (resistance x cross-sectional area) / measurement length
比抵抗測定結果を表5に示す。 Table 5 shows the specific resistance measurement results.
実施例は、熱処理後の比抵抗が20μΩ・cm以下であり、低い比抵抗となっており、良好な結果が得られた。 In the examples, the specific resistance after heat treatment was 20 μΩ · cm or less, and the specific resistance was low, and good results were obtained.
本発明は、半導体ウェハ上の集積回路や液晶表示装置等の電気的特性を検査するためのプローブカードに組み込まれたプローブピン(以下、「プローブピン」と略称する)に関する。 The present invention relates to a probe pin (hereinafter abbreviated as “probe pin”) incorporated in a probe card for inspecting electrical characteristics of an integrated circuit, a liquid crystal display device and the like on a semiconductor wafer.
半導体ウェハ上に形成された集積回路や液晶表示装置等の電気的特性の検査には、複数のプローブピンが組み込まれたプローブカードが用いられている。この検査は、プローブカードに組み込まれたプローブピンを、集積回路や液晶表示装置等の電極や端子、導電部にプローブピンを接触させることにより行われている。 A probe card in which a plurality of probe pins are incorporated is used for inspection of electrical characteristics of an integrated circuit, a liquid crystal display device, and the like formed on a semiconductor wafer. This inspection is performed by bringing a probe pin incorporated in a probe card into contact with an electrode, a terminal, or a conductive part of an integrated circuit or a liquid crystal display device.
このようなプローブピンは、高導電性はもちろん、安定した検査結果を得るため、耐食性、耐酸化性が求められ、且つ検査対象物に繰り返し接触させるため、十分な強度が必要となる。強度が必要なのは、何万回と検査体にプローブピンを接触することによる摩耗を低減させる必要があるためである。 Such a probe pin is not only highly conductive, but also requires corrosion resistance and oxidation resistance in order to obtain a stable inspection result, and is required to have sufficient strength because it is repeatedly brought into contact with an inspection object. The strength is required because it is necessary to reduce wear caused by contacting the probe pin with the test object tens of thousands of times.
一方、半導体集積回路等の電極や端子等の間隔がますます狭くなっているため、プローブピンのピッチを狭くすることが要求され、プローブピンは、十分な硬さを有し、良好な加工性が求められている。最近は、複雑形状に対応するため、加工しやすい硬さの段階で、所定形状のプローブピンに加工した後、析出処理により硬さを上げる方法が取られており、そのためプローブピンには、良好な加工性と高い析出硬化能が求められている。また析出硬化後の硬さは、硬いほど望ましい。 On the other hand, since the distance between electrodes and terminals of semiconductor integrated circuits and the like is becoming narrower, it is required to reduce the pitch of the probe pins, and the probe pins have sufficient hardness and good workability. Is required. Recently, in order to cope with complex shapes, a method of increasing the hardness by precipitation treatment after processing into a probe pin of a predetermined shape at the stage of hardness that is easy to process has been adopted. Workability and high precipitation hardening ability are required. Moreover, the hardness after precipitation hardening is so preferable that it is hard.
従来用いられるプローブピンには、特許文献1や特許文献2に示すようにリン青銅やタングステンが使用されている。
これらのプローブピンは、耐酸化性に劣り、使用の際、表面に酸化膜が生成され、繰り返し検査を続けていくうちに酸化物が検査対象物に付着し、導通不良が発生するといった問題がある。
As shown in Patent Document 1 and Patent Document 2, phosphor bronze or tungsten is used for probe pins used conventionally.
These probe pins are inferior in oxidation resistance, and when used, an oxide film is formed on the surface, and the oxide adheres to the object to be inspected as the inspection is repeated. is there.
このようなプローブピンの酸化膜形成による不良を防ぐために、特許文献3、特許文献4、特許文献5のようにパラジウム合金、白金合金を使用する場合がある。
このなかでパラジウム合金を使用しているプローブピンは、加工硬化で硬さを向上させる場合と、析出硬化により硬さを向上させる場合、あるいはその両方により硬さを向上させる場合がある。また、白金合金は、固溶硬化および加工硬化により硬さを向上させる。
パラジウム合金で要求される硬さを得るためには、強加工を施し、且つ時効処理を行う必要があるが、所定の硬さを得るため強加工を行うと90°に曲げるだけで破折するため、良好な加工性を得るためには加工率を下げ、硬さを犠牲にする必要がある。
一方、白金合金は合金にもよるが、析出硬化しない組成が多いため、固溶硬化と加工硬化で硬さを上げるが、こちらも、所定の硬さを得るため強加工を行うと90°に曲げるだけで破折するため、良好な加工性を得るためには加工率を下げ、硬さを犠牲にする必要がある。
In order to prevent such defects due to the formation of the oxide film of the probe pin, a palladium alloy or a platinum alloy may be used as in Patent Document 3, Patent Document 4, and Patent Document 5.
Among these, a probe pin using a palladium alloy may be improved in hardness by work hardening, in case of improving hardness by precipitation hardening, or in both cases. Moreover, platinum alloy improves hardness by solid solution hardening and work hardening.
In order to obtain the required hardness of the palladium alloy, it is necessary to perform strong processing and aging treatment, but if strong processing is performed in order to obtain a predetermined hardness, it will break only by bending to 90 °. Therefore, in order to obtain good processability, it is necessary to reduce the processing rate and sacrifice the hardness.
On the other hand, although platinum alloys depend on the alloy, there are many compositions that do not precipitate and harden, so the hardness is increased by solid solution hardening and work hardening, but this is also 90 ° when strong processing is performed to obtain the prescribed hardness. Since it breaks only by bending, in order to obtain good workability, it is necessary to reduce the processing rate and sacrifice the hardness.
そこで本発明の目的は、完成前の加工段階では良好な加工性を備え、完成品状態では十分な硬度を有するプローブピンを提供することにある。 SUMMARY OF THE INVENTION An object of the present invention is to provide a probe pin that has good workability at the processing stage before completion and has sufficient hardness in the finished product state.
本発明者らは、上記の目的を達成すべく鋭意検討した結果、Pdに所定量のCuとAgを含有させ、さらに特定少量のInまたは/およびSnを添加させた合金を、加工率にして55〜99.6%の範囲で加工し、ビッカース硬さ（以下、HVとする）を280〜440とした材料にすることにより、90°の折り曲げにも耐えられる加工性を有しつつ、300〜500℃で加熱、析出処理を行うことによりHV450以上の硬さとなるプローブピンが得られることを見出し、本発明を完成するに至った。 As a result of intensive investigations to achieve the above-mentioned object, the inventors have made an alloy containing a predetermined amount of Cu and Ag in Pd, and further added a specific small amount of In or / and Sn. By processing it in the range of 55-99.6% and making it a material with Vickers hardness (hereinafter referred to as HV) of 280-440, it has a workability that can withstand bending at 90 °, and 300-500 It has been found that a probe pin having a hardness of HV450 or more can be obtained by heating and precipitating at ℃, and the present invention has been completed.
すなわち上記目的は、半導体ウェハ上の集積回路や液晶表示装置等の電気的特性を検査するために用いられ、半導体集積回路や液晶表示装置等の電極や導電部に接触させるプローブピンであって、Inまたは/およびSnが0.2〜1.2mass%、35〜50mass%のPd、26〜40mass%のCu、15〜40mass%のAgおよび不可避不純物からなる合金からなり、加工率[加工率(%)=((加工前の断面積−加工後の断面積)/加工前の断面積)×100とする]が、55〜99.6%の範囲で加工を行い、加工時のビッカース硬さが280〜440の材料からなるプローブピンによって達成される。 That is, the above object is a probe pin used for inspecting the electrical characteristics of an integrated circuit, a liquid crystal display device, etc. on a semiconductor wafer, and brought into contact with an electrode or a conductive part of the semiconductor integrated circuit, the liquid crystal display device, etc. In or / and Sn is composed of 0.2 to 1.2 mass%, 35 to 50 mass% Pd, 26 to 40 mass% Cu, 15 to 40 mass% Ag and inevitable impurities, and the processing rate [processing rate (%) = ((Cross sectional area before processing-Cross sectional area after processing) / Cross sectional area before processing) × 100] is within the range of 55-99.6%, and the Vickers hardness during processing is 280-440 This is achieved by a probe pin made of material.
上記の材料を300〜500℃で加熱、析出処理を行うことにより、ビッカース硬さが450以上の材料からなるプローブピンが得られる。 A probe pin made of a material having a Vickers hardness of 450 or more can be obtained by heating and precipitating the above material at 300 to 500 ° C.
本発明は、析出処理前の加工性が良好で、且つ析出処理により十分な硬度を有し、さらに貴金属を60mass%以上含有することから、耐酸化性にも優れるため検査対象物を汚染することなく、長期間安定して使用可能なプローブピンを得ることができる。 The present invention has good workability before the precipitation treatment and has sufficient hardness by the precipitation treatment, and further contains no less than 60 mass% of precious metal, so that the object to be inspected is contaminated due to excellent oxidation resistance. Thus, a probe pin that can be used stably for a long time can be obtained.
また本発明において、プローブピンの製造に用いられるプローブピン用材料は、280〜440のビッカース硬さを有し、55〜99.6%の加工率で加工が施されている。この特徴により、良好な加工性が得られるとともに、後に加熱、析出処理を行うことで十分な析出硬化が得られる。 In the present invention, the probe pin material used for manufacturing the probe pin has a Vickers hardness of 280 to 440 and is processed at a processing rate of 55 to 99.6%. Due to this feature, good workability can be obtained, and sufficient precipitation hardening can be obtained by performing heating and precipitation treatment later.
また本発明では、上記特徴のプローブピン用材料を所望の形状に加工した後、300〜500℃で加熱、析出処理する。これにより、繰り返し検査に耐えうる十分な強度のプローブピンが得られる。 Moreover, in this invention, after processing the material for probe pins of the said characteristic into a desired shape, it heats and precipitates at 300-500 degreeC. As a result, a probe pin having sufficient strength to withstand repeated inspection can be obtained.
プローブピンは、プローブカードに組み込むため所定の形状に加工する必要があることから、最低でも加熱、析出処理前は90°の折り曲げに耐える必要がある。
そのため、加工率は55〜99.6%の範囲とし、HVが280〜440の範囲とする。加工率が55%未満の場合、加工性は良好だが、その後の加熱、析出処理を行っても十分な析出硬化が得られず、HVで450未満になる場合があるため、加工率を55%以上にする必要がある。一方、加工率が99.6%を上回ると90°の折り曲げにも耐えられず破折するため、加工率は99.6%以下とする必要がある。
Since the probe pin needs to be processed into a predetermined shape in order to be incorporated into the probe card, it is necessary to withstand at least 90 ° bending before heating and precipitation treatment.
Therefore, the processing rate is in the range of 55-99.6%, and the HV is in the range of 280-440. If the processing rate is less than 55%, the workability is good, but even if the subsequent heating and precipitation treatment is performed, sufficient precipitation hardening cannot be obtained, and the HV may be less than 450, so the processing rate is 55%. It is necessary to do more. On the other hand, if the processing rate exceeds 99.6%, it will not be able to withstand 90 ° bending and will break, so the processing rate needs to be 99.6% or less.
また本発明のプローブピンの材料は、Inまたは/およびSnが0.2〜1.2mass%、30〜50mass%のPd、26〜40mass%のCu、15〜40mass%のAgおよび不可避不純物からなる合金からなるものである。またより好ましい組成は、Inまたは/およびSnが0.3〜1.0mass%、Pdが35〜48mass%、Cuが26〜38mass%、Agが18〜38mass%である。またPdとAgの合計を50mass%以上にすることにより、大気中での酸化を抑えることができ、検査対象物への酸化物の付着が起こりにくくなる。 The material of the probe pin of the present invention is made of an alloy consisting of In or / and Sn of 0.2 to 1.2 mass%, 30 to 50 mass% Pd, 26 to 40 mass% Cu, 15 to 40 mass% Ag, and inevitable impurities. Is. Further, a more preferable composition is 0.3 to 1.0 mass% for In or / and Sn, 35 to 48 mass% for Pd, 26 to 38 mass% for Cu, and 18 to 38 mass% for Ag. In addition, when the total of Pd and Ag is 50 mass% or more, oxidation in the air can be suppressed, and the adhesion of oxide to the inspection object is less likely to occur.
本発明のプローブピンの材料は、300〜500℃の範囲で熱処理し、析出硬化によりより硬くすることができる。熱処理温度は、300℃未満では、十分な硬さの上昇がみられず、500℃を超えると熱処理により軟化することから、上記の温度範囲とする。熱処理を行うことにより、HV450以上の硬さに上昇する。 The material of the probe pin of the present invention can be hardened by heat treatment in the range of 300 to 500 ° C. and precipitation hardening. When the heat treatment temperature is less than 300 ° C., a sufficient increase in hardness is not observed, and when the heat treatment temperature exceeds 500 ° C., the heat treatment is softened. By performing heat treatment, the hardness increases to HV450 or higher.
熱処理の時間は、析出硬化が十分生じる時間が好ましいが、例えば線径がφ0.05〜0.5mmの場合、1分程度でも十分な析出硬化が得られる。また熱処理による析出硬化後の硬さは、HV450以上、さらに好ましくはHV460以上が好ましい。HVが450未満の場合、プローブピンとしての強度が十分ではなく、繰り返し検査に耐えられず、検査回数が低下するためである。 The heat treatment time is preferably a time at which precipitation hardening is sufficiently caused. However, for example, when the wire diameter is 0.05 to 0.5 mm, sufficient precipitation hardening can be obtained even for about 1 minute. The hardness after precipitation hardening by heat treatment is preferably HV450 or more, more preferably HV460 or more. This is because when the HV is less than 450, the strength as a probe pin is not sufficient, the test cannot be repeated, and the number of inspections decreases.
本発明に従うプローブピンに使用する合金は、それ自体既知の方法に従い、例えばPdにAgとCuとInおよび/またはSnを上記の量で添加、原料配合物を調整し、それをガス炉、高周波溶解炉など適当な金属溶解炉で溶解することにより製造することができる。溶解時の炉雰囲気としては、通常大気が用いられるが、必要に応じて不活性ガスまたは真空を使用することができる。また溶融状態の上記の合金を適当な型に鋳造し、インゴットを作製する。必要に応じて、インゴットを鍛造やスェージング加工を施し、溝ロールにより角形または多角形の棒材または線材に加工する。さらにダイスを用い伸線加工することにより、プローブピン用材料を作製することができる。 The alloy used for the probe pin according to the present invention is prepared in accordance with a method known per se, for example, Ag, Cu, In and / or Sn are added to Pd in the above amounts, the raw material composition is adjusted, It can be produced by melting in a suitable metal melting furnace such as a melting furnace. As the furnace atmosphere at the time of melting, air is usually used, but an inert gas or a vacuum can be used as necessary. Further, the above alloy in a molten state is cast into an appropriate mold to produce an ingot. If necessary, the ingot is subjected to forging or swaging, and processed into a square or polygonal bar or wire by a groove roll. Furthermore, a probe pin material can be produced by wire drawing using a die.
以下、本発明を実施例によりさらに具体的に説明する。 Hereinafter, the present invention will be described more specifically with reference to examples.
Pd、Agに、Cu、In、Snを所定量に配合し、ガス炉にて溶解、鋳造、鍛造またはスェージング加工し、さらに溝ロール加工にて□4.9mmの棒材を作製した。
その後、□4.9mmの棒材を800℃×1hr熱処理後、水冷により焼鈍した試料に伸線加工を施し、加工率を変え調査した。作製したプローブピン用材料の組成を表1に示す。
Cu, In and Sn were mixed in a predetermined amount to Pd and Ag, melted, casted, forged or swaged in a gas furnace, and further a □ 4.9 mm bar was produced by groove roll processing.
After that, a 4.9 mm rod was heat-treated at 800 ° C. for 1 hour and then annealed by water cooling. Table 1 shows the composition of the produced probe pin material.
（加工率調査用試料）
作製した表1の各サンプルについて、加工率の異なる複数の試料を作製した。
□4.9mm(断面積：24mm2)を起点とし、加工により所定の加工率になった段階で試料を採取し、以後の調査用試料とした。
(Sample for processing rate investigation)
A plurality of samples having different processing rates were prepared for each sample of the prepared Table 1.
□ Starting from 4.9 mm (cross-sectional area: 24 mm 2 ), a sample was taken when the processing rate reached a predetermined processing rate, and used as a sample for subsequent investigation.
（折曲げ試験）
表1の組成の各サンプルを加工率96%以上まで加工、棒材にした試料（プローブピン用材料）を、折曲げ試験機を用い90°になるまで曲げ、破折もしくは表面に割れが発生するかを確認した。
(Bending test)
Each sample with the composition shown in Table 1 was processed to a processing rate of 96% or more, and the specimen (probe pin material) was bent to 90 ° using a bending tester, causing breakage or cracks on the surface. I confirmed what to do.
曲げ試験の条件は、φ20mmのロールを25mm離し、ロール間距離を5mmとしたロール上にL30mmの長さの棒材を置き、厚さ2mm、棒材との接触部の曲率半径が1mmの押し板を押し当て、棒材が90°まで曲がるよう押込み、押し込んだ後の状態を調査した。 The condition of the bending test is that a 20 mm roll is placed 25 mm apart, a 30 mm long bar is placed on the roll with a distance between rolls of 5 mm, the thickness is 2 mm, and the radius of curvature of the contact part with the bar is 1 mm. The board was pressed, the bar was pushed to 90 °, and the state after the push was investigated.
評価基準として、○を破折および割れ無、△を割れ有り、×を破折と表記する。(各試料数：n＝3) As evaluation criteria, ◯ is described as broken and unbroken, Δ is cracked, and x is broken. (Number of samples: n = 3)
表3のように各サンプルとも、96.7%までは割れずに90°まで曲げることができた。加工率が上がると、実施例は99.2%まで破折、割れ無に曲げることができたが、比較例1〜4および比較例6は、99.2%で破折または割れが発生しており、実施例において加工性が向上していることがわかる。ただし加工率が99.9%になると実施例も破折や割れが生じており、加工率は99.9%未満にする必要がある。また比較例6は、伸線時に割れが発生し加工率96.7%以上の加工ができなかった。 As shown in Table 3, each sample could be bent up to 90 ° without breaking up to 96.7%. When the processing rate increased, the example could be bent to 99.2% and could be bent without cracking, but Comparative Examples 1 to 4 and Comparative Example 6 were broken or cracked at 99.2%. It can be seen that the workability is improved in the example. However, when the processing rate reaches 99.9%, breakage and cracks also occur in the examples, and the processing rate needs to be less than 99.9%. In Comparative Example 6, cracking occurred during wire drawing, and processing with a processing rate of 96.7% or more could not be performed.
（硬さ試験）
表1の組成のサンプルの各加工率に対する硬さを測定、その後300〜500℃の範囲で1hr熱処理し、再度硬さを測定した。測定結果を表4に示す。
(Hardness test)
The hardness with respect to each processing rate of the sample of the composition of Table 1 was measured, and then heat treated for 1 hour in the range of 300 to 500 ° C., and the hardness was measured again. Table 4 shows the measurement results.
表4のように実施例の場合、加工率が50%以下だと熱処理による析出硬化を行ってもHVが450に満たない。加工率が62.5%以上だとHVが450以上となることが分かる。このため、加工率は50%を超える必要がある。 In the case of Examples as shown in Table 4, when the processing rate is 50% or less, the HV is less than 450 even if precipitation hardening is performed by heat treatment. It can be seen that the HV is 450 or more when the processing rate is 62.5% or more. For this reason, the processing rate needs to exceed 50%.
比較例1〜5は、加工率が96.7%でもHVが450未満であり、実施例よりも析出硬化が低い。また、比較例6は、加工率が62.5%の場合でもHVが450未満であり、Inの添加量が多いと逆に析出硬化しにくくなる。 In Comparative Examples 1 to 5, even when the processing rate is 96.7%, the HV is less than 450, and the precipitation hardening is lower than that of the Examples. Further, in Comparative Example 6, even when the processing rate is 62.5%, the HV is less than 450, and when the amount of In added is large, the precipitation hardening is difficult.
（比抵抗調査）
300〜500℃の範囲で1hr熱処理した析出硬化処理後の比抵抗を測定した。測定時の温度は、25℃とし、各試料の抵抗を測定し、式1に従い比抵抗を算出した。
(Resistivity survey)
The specific resistance after precipitation hardening after heat treatment for 1 hour in the range of 300 to 500 ° C. was measured. The measurement temperature was 25 ° C., the resistance of each sample was measured, and the specific resistance was calculated according to Equation 1.
式1：比抵抗=(抵抗×断面積)／測定長 Formula 1: Specific resistance = (resistance x cross-sectional area) / measurement length
比抵抗測定結果を表5に示す。 Table 5 shows the specific resistance measurement results.
実施例は、熱処理後の比抵抗が20μΩ・cm以下であり、低い比抵抗となっており、良好な結果が得られた。 In the examples, the specific resistance after heat treatment was 20 μΩ · cm or less, and the specific resistance was low, and good results were obtained.
Claims (5)
55〜99.6%の加工率[加工率(%)=((加工前の断面積−加工後の断面積)/加工前の断面積)×100とする]で加工が施されており、
ビッカース硬さが280〜440であることを特徴とするプローブピン用材料。 In or / and Sn: 0.2 to 1.2 mass%, Pd: 35 to 50 mass%, Cu: 25 to 40 mass%, Ag: 15 to 40 mass% and an alloy composed of inevitable impurities,
Processing is performed at a processing rate of 55-99.6% [processing rate (%) = (cross-sectional area before processing−cross-sectional area after processing) / cross-sectional area before processing) × 100],
A probe pin material having a Vickers hardness of 280 to 440.
280〜440のビッカース硬さを有し上記加工率のプローブピン用材料を、所望の形状に加工した後、加熱、析出処理することを特徴とするプローブピンの製造方法。 In or / and Sn: 0.2 to 1.2 mass%, Pd: 35 to 50 mass%, Cu: 25 to 40 mass%, Ag: 15 to 40 mass%, and an alloy of inevitable impurities, a processing rate of 55 to 99.6% [processing rate (%) = ((Cross sectional area before processing−Cross sectional area after processing) / Cross sectional area before processing) × 100]
A method for producing a probe pin, comprising: processing a probe pin material having a Vickers hardness of 280 to 440 and having the above processing rate into a desired shape, followed by heating and precipitation treatment.
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