JP2012248657A - Die bonder and die bonding method - Google Patents

Abstract

A small die bonder and a die bonder and a bonding method capable of reducing a decrease in throughput are provided.
A die is picked up from a wafer held in a die supply unit, the die is placed on a pre-alignment stage 31s, and the bonding head 41p picks up the die from the pre-alignment stage. An image of the holding state of the die picked up by the bonding head 41p is picked up by a component recognition camera 42 provided above the upper surface, and the bonding position / orientation is corrected based on the image pickup result of the image pickup step and bonded to the substrate. This is the first feature. Also, the mounting position for mounting the die on the pre-alignment stage 31s is relatively lowered from the same or substantially the same level of the bonding position to the substrate and the front end surface of the component recognition camera 42, and the upper surface of the die supply unit The second feature is that it is provided on the upper side.
[Selection] Figure 4

Description

  The present invention relates to a die bonder and a bonding method, and more particularly to a die bonder and a bonding method that can reduce a decrease in throughput.

Part of the process of assembling a package by mounting a die (semiconductor chip) on a substrate such as a wiring board or a lead frame includes a die bonding process of picking up (sucking) the die from the wafer and bonding it to the substrate.
As a method of performing the die bonding process, the picked-up die is once placed on the pre-alignment stage (first work stage), the die is picked up again from the pre-alignment stage by the bonding head, and the second work stage is conveyed. There is a method (Patent Document 1) for bonding (attaching) to a substrate. In addition, there is a method (Patent Document 2) in which a holding state of a die obtained by picking up (sucking) a die from a wafer is imaged by a component recognition camera, and bonding positions and postures are corrected based on the imaging result.

JP 2009-246285 A JP 2009-105352 A

  However, it is necessary to provide the die supply unit outside the component recognition camera so that the die supply unit including the wafer supply table holding the wafer does not interfere with the component recognition camera. In particular, when the die supply unit has a plurality of wafers to supply a plurality of types of dies, it is necessary to move the wafers. In that case, since the wafer holding table holding each wafer is provided so as not to interfere with the component recognition camera, the installation area of the die supply unit is widened, and the size of the apparatus is increased. As the apparatus becomes larger, there is a problem that the moving distance between picking up the die and bonding (mounting) to the substrate becomes longer, the bonding cycle time becomes longer, and the throughput decreases. The above-mentioned Patent Documents 1 and 2 do not recognize the above-mentioned problem, and naturally do not disclose or suggest means for solving the problem.

Accordingly, a first object of the present invention is to provide a small die bonder.
In addition, a first object of the present invention is to provide a die bonder and a bonding method that can reduce a decrease in throughput.

In order to achieve the above object, the present invention has at least the following features.
The present invention picks up a die from a wafer held in a die supply unit, places the die on a pre-alignment stage, and a bonding head picks up the die from the pre-alignment stage. First, imaging a holding state of the die picked up by the bonding head with a component recognition camera provided on the upper side, correcting the bonding position / orientation based on an imaging result of the imaging step, and bonding to the substrate It is characterized by.

  Further, the present invention provides that the mounting position for mounting the die on the pre-alignment stage is relatively lower than the bonding position on the substrate and the front end surface of the component recognition camera, or relatively lower than the same level. A second feature is that the upper surface is provided above the upper surface.

Furthermore, a third feature is that the pre-alignment stage is moved to a delivery position where the bonding head picks up the die.
According to a fourth aspect of the present invention, the movement of the prestage includes at least one of raising / lowering of the prealignment stage and horizontal movement toward the component recognition camera.

The fifth aspect of the present invention is that the movement of the prestage is performed in parallel with the movement of the prestage rising and the horizontal movement of the prestage toward the component recognition camera.
Further, the present invention is characterized in that the bonding head is close to a delivery position for picking up the die, and then the bonding head picks up the die from the pre-alignment stage.

Further, according to the present invention, the die supply unit includes a plurality of the wafers and a wafer holding stage for holding the plurality of wafers, and is configured to rotate the wafer holding stage in the vertical plane. It is characterized by.
The eighth feature of the present invention is that the pick-up positions of a plurality of wafer dies are moved.

Therefore, according to the present invention, a small die bonder can be provided by providing the die supply unit below the installation position of the component recognition camera so as to avoid interference between the wafer holder of the die supply unit and the component recognition camera.
Further, according to the present invention, it is possible to provide a die bonder and a bonding method that can reduce a decrease in throughput by cooperatively moving the pre-alignment stage and the bonding head to the delivery position.

It is a figure which shows the schematic of the die bonder which is embodiment of this invention. It is a figure which shows typically operation | movement of the wafer holding stand which is embodiment of this invention. It is a figure which shows the relationship with the component recognition camera of the wafer holding stand which has the wafer shown in the grid | lattice form among the four wafer holding stands (wafer) shown in FIG. It is a figure which shows the movement pattern of the prestage and bonding head in embodiment of this invention. It is a figure which shows the detailed structure of a pre-alignment part, and is a figure which shows the state mounted in a pre-stage, after a pre-alignment part picks up die | dye from a wafer. It is a figure showing the detailed configuration of the pre-alignment unit. After the dies are placed on the pre-stage from the wafer of each wafer holder, the pre-stage moves to the delivery position with the bonding head via a predetermined movement route. FIG. It is a figure which shows the example of the processing flow of this embodiment of this invention.

FIG. 1 is a diagram showing a schematic view of a die bonder 100 according to an embodiment of the present invention. FIG. 1A is a top view of the die bonder 100, and FIG. 1B is a front view as viewed from the arrow A in FIG.
The die bonder 100 is roughly divided into a die supply unit 1 having four wafer holding bases 12 for holding a plurality of wafers 11 (four in FIG. 1) and a push-up unit 13 indicated by a dotted line for pushing up the die D from the wafer 11; A pickup unit 2 that picks up and picks up the die D pushed up by the push-up unit 13 and places the die D on a pre-alignment stage (hereinafter simply referred to as a pre-stage) 31 and a pre-stage 31, and mounts a plurality of dies D. Bonding the pre-alignment unit 3 for moving the prestage 31 placed (not shown) in the X and Y directions shown in FIG. 1A and the Z direction shown in FIG. 1B and the die D on the prestage 31 The pickup is picked up by the head 41, and the holding state of the die D of the bonding head 41 is imaged by the component recognition camera 42, and based on the imaging result A bonding unit 4 for bonding to the substrate P that has been transported by correcting the bonding position / posture, a substrate supply unit 6 that supplies a substrate to a substrate transport pallet 51 that transports a plurality (4) of substrates P, and a substrate transport pallet 51 from the substrate supply unit 6 via the bonding position to the substrate unloading unit 7, the substrate P on which the die D is bonded (attached) is received from the substrate transfer pallet 51, and the substrate unloading unit 7 And a control unit 8 that monitors and controls the operation of

Next, the configuration and operation of each part of the die bonder 100 according to the embodiment will be described in detail with reference to FIG.
First, the die supply unit 1 will be described. FIG. 2 is a diagram schematically showing the operation of the wafer holder 12. The wafer holding table 12 is fixed to the four sides of the wafer holding stage 14 (see FIG. 1A). The wafer holding stage 14 is moved in the X and Y directions by the XY driving unit 15 provided on the holding unit base 17 shown in FIG. 1B as in the Y direction shown in FIG. Further, the rotary drive unit 16 provided on the XY drive unit 15 is rotatably provided as shown in FIG. On the other hand, the push-up unit 13 is basically fixed at a predetermined position of the holding unit base 17 and pushes up the die D of the wafer 11 existing at that position. Basic means that a fine adjustment mechanism may be provided.

The wafer 11 (wafer holder 12) is selected by the rotation drive unit 16 in the above configuration, and the die D at a predetermined position on the wafer selected by the XY drive unit 15 is moved to the upper part of the push-up unit 13. In this embodiment, since the dies are picked up one by one from four wafers, first, the position of the picked up die, that is, the XY driving unit (in two directions) that moves the die supply unit 1 in a plane perpendicular to the pickup head 21. Moving means) 15, and then sequentially rotating the wafer holding table 12 by 90 degrees to sequentially pick up the dies D from the four wafers. In this case, it is desirable to place each wafer on the wafer holder so that the die D is in the same posture at the pickup position when rotated. Next, the wafer holding stage 14 is moved by the XY drive unit 15 so that adjacent dies can be picked up. Thereafter, these operations are repeated.
In the above embodiment, the pick-up position of the die is determined by the XY drive unit 15, but a push-up unit moving means for moving the push-up unit 13 in the XY direction may be provided to move the push-up unit 13.

  Next, the pickup unit 2 picks up and picks up the die pushed up by the push-up unit 13, an X drive shaft 22 that moves the pickup head 21 in the X direction, and an alignment mark ( And a wafer recognition camera 23 (see FIG. 1B) that picks up images and recognizes the position of the die D to be picked up. The pickup head 21 reciprocates between the push-up position of the die D and the prestage 31 by the X drive shaft 22 and arranges four dies on the prestage 31 in a row in the longitudinal (Y) direction of the prestage.

  Next, the bonding unit 4 and the like will be described before the pre-alignment unit 3 is described. The bonding unit 4 picks up the die D from the prestage 31 and bonds the bonding head 41 to the substrate P that has been conveyed, a component recognition camera 42 that images the holding state of the die D of the bonding head 41, and the bonding head 41. A Y drive shaft 43 that moves in the Y direction and a substrate recognition camera 44 that captures an image of a position recognition mark (not shown) of the transported substrate P and recognizes the bonding position of the die D to be bonded. In addition to the Y drive shaft 43, the bonding head 41 has a head lifting / lowering means (not shown) for lifting / lowering a plurality of suction nozzles 41a provided at the tip.

  With such a configuration, the bonding head 41 picks up the die D from the prestage 31, images the holding state of the die D by the component recognition camera 42 while moving along the Y drive axis, and bonds based on the result. The die D is bonded to the substrate P by correcting the position / posture. This operation is performed on four dies on the prestage 31 simultaneously or individually.

  The transfer unit 5 includes a substrate transfer pallet 51 on which one or a plurality of substrates (four in FIG. 1) are placed and a pallet rail 52 on which the substrate transfer pallet 51 moves. Two transport units are provided in parallel. The substrate transfer pallet 51 moves by driving a nut (not shown) provided on the substrate transfer pallet with a ball screw (not shown) provided along the pallet rail 52.

  With such a configuration, the substrate transport pallet 51 has the substrate placed on the substrate supply unit 6, moves to the bonding position along the pallet rail 52, moves to the substrate unloading unit 7 after bonding, and moves to the substrate unloading unit 7. Pass the board. The first and second transfer units are driven independently of each other, and while the die D is being bonded to the substrate P placed on one substrate transfer pallet 51, the other substrate transfer pallet 51 carries out the substrate P. Returning to the substrate supply unit 6, preparations such as placing a new substrate are made.

  In the die bonder of this embodiment, a ball screw / nut system or the like is also used for the drive mechanism that moves linearly. Further, the drive mechanism such as the conveying unit is not limited to the above-described ball screw / nut method, and a linear motor method may be used.

Finally, the configuration and operation of the pre-alignment unit 3 that solves the problem will be described together with the problem of the present invention.
First, the problem of the present invention and the operation of the pre-alignment unit 3 will be described with reference to FIGS. FIG. 3 shows the relationship in the Y direction between the wafer holding table 12 having the wafer 11 shown in a lattice shape and the component recognition camera 42 among the four wafer holding tables 12 (wafer 11) shown in FIG. FIG. The wafer holder 12 (wafer 11) moves in the X and Y directions as already described with reference to FIG.

  Conventionally, as shown in FIG. 3 (c), the bonding head 41 moves up and down the minimum necessary for pick-up bonding of the die D, as indicated by an arrow G between the prestage 31 and the substrate P. It was moving horizontally back and forth. Therefore, in order to monitor the holding state of the die D picked up by the bonding head 41, the component recognition camera 42 is set to the same or almost the same level as the pre-stage 31 and the wafer holder 12 below the substrate P. Had been placed in. The almost same level means a position close to the moving level so that the bonding head 41 can move horizontally and reciprocally.

  On the other hand, in the present embodiment shown in FIGS. 3A and 3B, first, in order to reduce the size of the die supply unit 1, the component recognition camera 42 is not interfered with the die supply unit. It is installed at a high position above the upper surface of the die supply unit. As a result, the four wafer holding bases 12 can be narrowed at the maximum to positions adjacent to each other. For example, if the effect of one wafer holding table 12 when the component recognition camera 42 is arranged above the center position of four wafer holding tables 12 is Δα as shown in FIG. The effect of the wafer holding table 12 facing the wafer holding table 12 is also Δα, and as a result, the width of the die supply unit 1 in the X and Y directions can be reduced by 2Δα. Although there is a balance between the other components, it cannot always be reduced by 2Δα, but at least the effect of Δα in the Y direction at the lattice-like position shown in FIG.

In the above description, the case where four wafer holding tables 12 (wafers 11) are provided has been described, but the same effect can be obtained with the same means with one, two, three, or five or more. it can.
Further, as a result of miniaturization of the die bonder having the die supply unit 1, it is possible to shorten the processing time during which the die D is picked up from the wafer 11 and bonded to the substrate P.

  Secondly, in order to shorten the processing time, a placement position 31 s of the prestage 31 at the time of placement by the pickup unit 2 is set. In the first method, as shown in FIG. 3A, the positional relationship between the bonding head 41, the component recognition camera 42, and the substrate P is the same as that of the prior art, in other words, the bonding position to the substrate and the component. The position of the front end surface of the recognition camera is the same or substantially the same level, and the position of the prestage 31 at the time of mounting by the pickup unit 2 is lowered relative to the two positions so as to be above the upper surface of the die supply unit 1. Provide. In the second method, as shown in FIG. 3B, the mounting position 31s of the prestage 31 is set to the same level or substantially the same level as the bonding position to the substrate and the position of the front end surface of the component recognition camera. It is. The third method is a method in which the placement position 31s of the prestage 31 is provided at an intermediate position between the first method and the second method. In the second and third, it is necessary to widen the operating range of the pickup head 21.

  Thirdly, in order to shorten the processing time, the processing time is reduced by sharing the processing time during which the die D is picked up from the wafer 11 and bonded to the substrate P with the prestage 31 and the bonding 41. FIG. 4 shows a movement pattern of the prestage 31 and the bonding head 41 mainly showing the first method.

  Next, the operations of the prestage 31 and the bonding head 41 will be specifically described with reference to FIG. In FIG. 4, a solid line or a two-dot chain line indicates the prestage 31, and a broken line indicates the bonding head 41. The subscript s of the prestage 31 indicates the placement position 31s by the pickup head 21 as described above. Similarly, the subscript p indicates a delivery position that is a pickup position by the bonding head 41, and the subscript c similarly indicates a relay position of 31p from the placement position 31s to the delivery position. Further, the subscript p of the bonding head 41 indicates a delivery position from the prestage 31, and the subscript c similarly indicates a relay position from the delivery position 41p to the substrate P. As shown in FIGS. 4A to 4F, the delivery position 31p of the pre-stage 31 where the bonding head 41 picks up the die D is necessary for the bonding head 41 to image the holding state of the die D. In addition, it is necessary to satisfy the condition that the component recognition camera 42 is on the pickup position side.

  4 (a) to 4 (c) show a typical example of the first method, in which the processing time for the pickup head 21 to mount the die D on the prestage 31 and the bonding head 41 for the die D are shown. This is an example suitable for a case where the processing time for picking up and bonding to the substrate P is significantly shorter. In this case, the prestage 31 moves in the horizontal direction toward the component recognition camera 42 and rises to the horizontal movement level of the bonding head 41. FIG. 4A shows a pattern in which the prestage 31 moves horizontally toward the component recognition camera 42 and then rises to the horizontal movement level of the bonding head 41. FIG. 4B shows a pattern in which the prestage 31 rises to the horizontal movement level of the bonding head 41 and then moves horizontally to the component recognition camera 42 side. FIG. 4C shows a pattern in which the prestage 31 moves horizontally toward the component recognition camera 42 while rising to the horizontal movement level of the bonding head 41. 4A to 4C, for example, the bonding head moves while the prestage 31 moves.

  4D to 4E show the case where the processing time for the pickup head 21 to mount the die D on the prestage 31 and the processing time for the bonding head 41 to pick up the die D and bond to the substrate P are in conflict. This is an example. In this case, the bonding head 41 also moves together with the prestage 31 toward the delivery position 41p. FIG. 4D shows a pattern in which the prestage 31 is raised in the horizontal movement level of the bonding head 41, and the bonding head 41 is further moved horizontally in the raised placement position 31p. In FIG. 4D, if the delivery position 31p is set to the placement position 31s by widening the lifting / lowering range of the pickup head, the second method described above is obtained.

  FIG. 4E shows a pattern in which both the prestage 31 and the bonding head 41 rise or fall while moving horizontally as shown in FIG. FIG. 4 (e) is the third method described above if the delivery position 31p is set to the placement position 31s as in FIG. 4 (d).

  4 (f) is different from FIGS. 4 (a) to 4 (c) in that the processing time for the bonding head 41 to pick up the die D and bond it to the substrate P is different from that in FIG. It is an example which shows the case where it is shorter than the processing time which mounts. In this case, unlike the movement of the prestage 31 shown in FIGS. 4A to 4C, a pattern in which the bonding head 41 moves can be considered. FIG. 4 (f) shows a pattern in which the bonding head 41 moves corresponding to FIG. 4 (c) as an example. That is, a pattern is shown in which the prestage 31 does not move, and the bonding head 41 moves down to the prestage 31 side and descends to the upper level of the prestage 31.

  4 (e) and 4 (f), the bonding head 4 portion further moves up / down stroke required for the bonding head 41 to pick up the die D from the prestage 31 and bond it to the substrate P, and further to the prestage 31. Lifting means having a stroke necessary to approach the delivery position 31s is required.

  Next, returning to FIG. 1, the configuration of the pre-alignment unit 3 shown in FIGS. 4 (a) to 4 (e) will be described. The pre-alignment unit 3 is a diagram in which the pre-stage 31 on which the die D picked up by the pickup 21 is placed, the Z drive shaft (pre-stage lifting means) 32 for moving the pre-stage 31 up and down, and the Z drive shaft 32 are horizontal. A Y drive shaft (prestage horizontal movement means) 33 that moves in the vertical (Y) direction of the paper 1 (a), and an X drive shaft that moves the Y drive shaft 33 in the horizontal (X) direction of the paper in FIG. 34 and a mounted component recognition camera 35 that images the mounted state of the die D on the prestage 31.

  5 and 6 are diagrams illustrating a detailed configuration of the pre-alignment unit 3. FIG. 5 is a diagram illustrating a state in which the pre-alignment unit 3 picks up the die D from the wafer 11 and places it on the pre-stage 31. In FIG. 6, after the dies D are placed on the prestage 31 from the wafer 11 of each wafer holding table 12, the prestage 31 is connected to the bonding head 41 via the moving route shown in FIG. It is a figure which shows the state which moved to the delivery position 31p. 5 (a) and 6 (a) are top views of the pre-alignment unit 3, and FIGS. 5 (b) and 6 (b) are arrows shown in FIGS. 5 (a) and 6 (a), respectively. The side view seen from the direction of J is shown.

  The Z drive shaft 32, Y drive shaft 33, and X drive shaft 34 of the present embodiment basically have the same configuration. Each shaft contains, for each symbol, a drive motor indicated by a subscript m, a ball screw indicated by a subscript b driven by the drive motor, a nut indicated by a subscript n moving on the ball screw, and a nut. A connecting body indicated by a subscript s connected to the drive body and a traveling base indicated by a subscript d serving as a sliding traveling path of the connecting body are provided. However, the travel base 34d of the X drive shaft 34 is fixed to the constituent members of the die bonder 100, the Z drive shaft 32 is not provided with a connecting body, and the nut 32n is directly connected to the prestage 31 as a driven body.

  Of these three drive shafts, the Z drive shaft 32 raises and lowers the prestage 31 as a driven body fixed to the nut 32n moved by the ball screw 32b in the axial direction along the traveling base 32d. The Y drive shaft 33 has the entire Z drive shaft 33 holding the prestage 31 as a driven body, is fixed to the travel base 32d by a ball screw 33b, and a connecting body 33s having a nut 33n therein is provided along the travel base 33d. To move in the Y direction. Further, the X drive shaft 34 has a Y drive shaft 33 holding the prestage 31 and the Z drive shaft 33 as a driven body, is fixed to the travel base 33d by a ball screw 34b, and has a coupling body 34s having a nut 34n therein. Is moved in the X direction along the traveling base 34d. Note that the X drive shaft 33 is not always necessary, but is useful for fine adjustment at the time of initial setting or when necessary for the configuration.

  The movement of the prestage 31 shown in FIGS. 4A to 4E in FIG. 4 can be realized by the drive unit of the pre-alignment unit 3 shown in FIGS.

  On the other hand, the movement of the bonding head 41 shown in FIGS. 4D to 4F in FIG. 4 can be realized by widening the operation range of the bonding head 41 in the Y direction and the Z direction, respectively, or both.

Finally, the processing flow of the present embodiment described above will be described with reference to FIG. 7 based on the example of FIG.
First, at least one of the XY drive unit 15 and the rotation drive unit 16 is controlled to set the wafer holding stage 14 to the initial position so that the predetermined die D is positioned at the push-up unit 13 (step 1 (hereinafter referred to as S1). Notation, the same applies below)). Next, the die D is picked up from the wafer 11 by the pickup unit 2 and placed on the prestage 31 (S2). Then, it is determined whether or not the process of S2 has been performed on the 12 wafers 11 of the four (all) wafer holders (S3). If not, the rotation driving unit 16 is controlled to rotate the wafer holding stage 14 by 90 degrees, and the process goes to S2.

  If so, the following three processes are performed. In the die supply unit 1, the wafer holding stage 14 is moved XY so that the next adjacent die D is picked up (S5), and the process goes to S11. The pre-alignment unit 3 moves the pre-stage 31 to the delivery position 31p while drawing the curve shown in FIG. 4C while controlling both the Y drive shaft 33 and the Z drive shaft 32 as an example (S6). In the bonding unit 4, the bonding head 41 is moved to the delivery position 41p (S7).

  Next, four dies D are picked up by the bonding head 41 (S8). Thereafter, the bonding head 41 moves to the bonding position and bonds the four dies D to the substrate P transported by the transport unit 5 (S9). On the other hand, the prestage 31 moves to the placement position after S8 (S10). In S11, it is determined whether or not the process is performed for a predetermined die D or substrate P. If not performed, the process returns to S2, and if it is performed, the process is terminated.

  In the above processing flow, the movement of the prestage 31 and the bonding head 41 is shown in an easy-to-understand manner, but it is actually more complicated. Basically, except for S8 in which the prestage 31 and the bonding head 41 perform the same process, they can be processed freely. For example, the process of S7 of the bonding head 41 may be performed after the end of S9 and before the end of S3. Further, during the process of bonding S9, the process S10 of the prestage 31 and the processes S2 to S4 of the pickup 21 may be performed.

  According to the embodiment described above, the component recognition camera 42 is provided on the upper side of the prestage, and the die D can be reliably picked up from the wafer 11 via the prestage 31 and bonded to the substrate P.

Next, how to select various methods shown in FIG. 4 will be described. As can be seen from the processing flow of FIG. 7, the single processing time TB of the bonding head 41 is the time required for the processing of S7 and S9. On the other hand, the processing time TP related to the prestage 31 is the sum of the processing time of the prestage 31 of S6 and S10 and the constraint time of S2 to S4 for mounting the die D on the prestage 31.
The pattern in FIG. 4 is selected so that the overall processing time is shortened due to the size relationship between TB and TP.

  If TB is sufficiently larger than TP, the pattern of FIG. 4A to FIG. 4C in which the prestage 31 moves to the delivery position is selected. On the contrary, if TP is sufficiently larger than TB, a pattern as shown in FIG. 4F is selected in which the bonding head 41 moves to the delivery position. If TB and TP are substantially antagonized, a pattern as shown in FIGS. 4D and 4E is selected in which the prestage 31 and the prestage 31 move to the delivery position according to the degree of antagonism. . The pattern shown in FIG. 4 is an example, and there are other patterns.

According to the present embodiment described above, a small die bonder can be provided by providing the wafer holder below the position where the component recognition camera is installed so as to avoid interference with the component recognition camera.
Further, according to the present embodiment described above, there is provided a die bonder and a bonding method capable of reducing a decrease in throughput by providing a wafer holder below the position where the component recognition camera 42 is installed so as to avoid interference with the component recognition camera. Can be provided.

  Furthermore, according to this embodiment described above, it is possible to provide a die bonder and a bonding method that can reduce a decrease in throughput by cooperatively moving the pre-alignment stage and the bonding head to the delivery position.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1: Die supply part 11: Wafer 12: Wafer holding stand 13: Pushing unit 14: Wafer holding stage 15: XY drive part 16: Rotation drive part 2: Pickup part 21: Pickup head 22: X drive shaft 23: Wafer recognition camera 24: Pickup nozzle stocker 3: Pre-alignment section
31: Pre-alignment stage (pre-stage)
32: Z drive shaft 33: Y drive shaft 34: X drive shaft 35: Mounted component recognition camera 4: Bonding part 41: Bonding head 42: Component recognition camera 43: Y drive shaft 44: Board recognition camera
45: Nozzle stocker for bonding head 5: Transport unit 51: Substrate transport pallet 52: Pallet rail 6: Substrate supply unit 7: Substrate unloading unit 8: Control unit 100: Die bonder D: Die P: Substrate

Claims (17)

A die supply unit for holding a wafer;
A pickup unit having a pickup head for picking up a die from the wafer and mounting the die on a pre-alignment stage;
A bonding head unit having a bonding head that picks up the die from the pre-alignment stage and bonds the die to a substrate, and a component recognition camera that images the holding state of the die by the bonding head;
The die bonder is characterized in that the component recognition camera is provided above the upper surface of the die supply unit.   The mounting position of the prestage when the die is mounted by the pick-up unit is relatively lower than the bonding position to the substrate and the front end surface of the component recognition camera or lower than the same level, and from the upper surface of the wafer The die bonder according to claim 1, wherein the die bonder is provided on an upper side.   The die bonder according to claim 1, further comprising: a pre-alignment unit including the pre-alignment stage and a pre-stage moving unit that moves the pre-alignment stage to a delivery position where the bonding head picks up the die. .   The prestage moving means includes at least one of a prestage elevating means for elevating the prealignment stage and a prestage horizontal moving means for reciprocating horizontally in the component recognition camera side. The die bonder described in 1.   The bonding head portion is necessary for the up / down stroke required for the bonding head to pick up the die from the pre-stage and bond it to the substrate, and to be close to the delivery position for the bonding head to pick up the die. The die bonder according to claim 1, further comprising an elevating means having a simple stroke.   The die supply unit includes: a plurality of the wafers; a wafer holding stage that holds the plurality of wafers; and a rotation driving unit that rotates the wafer holding stage in the vertical plane. The die bonder according to 1.   The die bonder according to claim 6, wherein the die supply unit includes a pickup position moving unit that moves a pickup position of a die of each of the wafers.   The pickup position moving unit is a two-way moving unit that moves the die supply unit in a plane perpendicular to the pickup head, or a push-up unit moving unit that moves a push-up unit that pushes the die from the wafer. The die bonder according to claim 7.   2. The prestage mounting position when the die is mounted by the pickup unit is provided at the same or substantially the same level as the bonding position to the substrate and the front end surface of the component recognition camera. The die bonder described in 1. A first pickup step of picking up a die from a wafer held in a die supply unit and placing the die on a pre-alignment stage;
A second pick-up step in which a bonding head picks up the die from the pre-alignment stage;
An imaging step of imaging the holding state of the die picked up by the bonding head by a component recognition camera provided above the upper surface of the die supply unit, and correcting the bonding position and orientation based on the imaging result of the imaging step Bonding step for bonding to the substrate,
A bonding method comprising:   The bonding method according to claim 10, further comprising a prestage moving step of moving the prealignment stage to a delivery position where the bonding head picks up the die.   12. The pre-stage moving step includes at least one of a pre-stage raising / lowering step for raising / lowering the pre-alignment stage and a pre-stage horizontal moving step for horizontally reciprocating to the component recognition camera side. The bonding method described.   13. The bonding according to claim 12, wherein the prestage moving step performs ascending movement by the prestage raising / lowering step and horizontal movement to the component recognition camera side by a prestage horizontal moving step in parallel. Method.   The bonding method according to claim 10, wherein a proximity step of approaching a delivery position where the bonding head picks up the die is performed, and then a second pickup step is performed.   The die supply unit includes a plurality of the wafers and a wafer holding stage for holding the plurality of wafers, and a rotation step for rotating the wafer holding stage in the vertical plane. 10. The bonding method according to 10.   The bonding method according to claim 10, further comprising a pickup position moving step of moving pickup positions of a plurality of the wafer dies.   The pickup position moving step is performed by a step of moving the die supply unit in a plane perpendicular to the pickup head, or a push-up unit moving step of moving a push-up unit that pushes up the die from the wafer. Item 17. A bonding method according to Item 16.

Images