JP2013123771A - Cmp pad conditioner, and method for manufacturing the same - Google Patents

Abstract

An object of the present invention is to improve the corrosion resistance, wear resistance and holding power of abrasive grains of a CMP pad conditioner.
A CMP pad conditioner according to the present invention includes a plurality of abrasive grains held by a nickel plating layer, and the nickel plating layer includes at least an amorphous chromium plating layer including an amorphous structure. 12 is covered.
[Selection] Figure 3

Description

  The present invention relates to a CMP pad conditioner used for CMP pad conditioning and a method for manufacturing the CMP pad conditioner.

  In recent years, with the progress of the semiconductor industry, there has been an increasing need for processing techniques for finishing surfaces of metals, semiconductors, ceramics, etc. with high precision. In particular, in semiconductor wafers (hereinafter simply referred to as wafers), the degree of integration is improved At the same time, surface finishing of nanometer order is required.

  In order to cope with such high-precision surface finishing, CMP (Chemical Mechanical Polishing), which chemically and mechanically polishes the surface of a wafer cut out from a silicon ingot, is used.

  CMP is a complex mechano-chemical polishing that uses free abrasive grains that have a mechanical polishing effect such as fine-particle silica, and an acid or alkali solution that chemically dissolves an object to be polished such as a silicon wafer. Is the law. For example, when polishing a silicon wafer, a slurry solution obtained by mixing free abrasive grains and an acid or alkali solution is supplied to a polishing pad (hereinafter referred to as a CMP pad) to polish the silicon wafer surface. In addition to oxidizing agents such as hydrogen peroxide and ammonium persulfate being added to this slurry solution, in metal wiring wafers, organic complexing agents for stabilizing metal ions, corrosion inhibitors that suppress transient etching, or solutions A suitable amount of a surfactant or the like that lowers the surface tension is added.

  Here, the CMP pad is clogged or compressed and deformed as the polishing time elapses, and the flatness of the polished surface is lost. When the flatness of the polished surface is lost, undesirable phenomena such as a decrease in the polishing rate of the wafer and an uneven surface of the wafer occur.

  For this reason, in order to keep the state of the polishing surface of the CMP pad constant, a CMP pad conditioner is used for grinding the CMP pad. This CMP pad conditioner is generally used in which abrasive grains such as diamond are electrodeposited at predetermined positions on a pedestal such as stainless steel by a metal fixing layer such as nickel or a nickel-based alloy.

  However, when the CMP pad is abraded with the CMP pad conditioner, problems such as abrasive wear, wear on the surface of the CMP pad conditioner, dissolution of the metal fixing layer, and accompanying abrasive dropout occur. Further, when CMP is performed with the dropped abrasive grains adhering to the CMP pad surface, scratch marks are generated on the surface of the wafer. Further, when metal ions such as dissolved nickel contained in the metal fixing layer adhere to the CMP pad, the silicon surface of the wafer is contaminated. Therefore, in order to prevent the occurrence of such a problem, the CMP pad conditioner has been periodically replaced even before the grinding life.

  The main factor that the metal fixing layer dissolves is that a slurry solution used in CMP adheres to the surface of the CMP pad conditioner. This is because the metal fixing layer is dissolved by the action of corrosive components (acid, alkali, oxidizing agent, organic complexing agent, etc.) in the slurry solution adhering to the CMP pad conditioner surface via the CMP pad. This is because dropout occurs.

  Therefore, as a method for preventing the metal fixing layer from being dissolved, a technique for suppressing the metal fixing layer of the CMP pad conditioner from coming into contact with the slurry solution has been proposed. Specifically, a CMP pad conditioner is coated with Ni-W alloy plating having excellent chemical resistance (Patent Document 1), and a CMP pad conditioner is coated with a SiC film by PVD or CVD (Patent Document 1). Document 2), a method of coating a CMP pad conditioner with plating of Au or Rh (Patent Document 3), a method of coating a CMP pad conditioner with a fluororesin having a cyclic perfluoroether structure (Patent Document 4), A method of coating a CMP pad conditioner with a fluororesin or a trifluoride resin (Patent Document 5), a method of coating a CMP pad conditioner with an oxide by sol-gel or aerosol (Patent Document 6, Patent Document 7), etc. are proposed. Has been.

JP 2002-264014 A (published on March 31, 2002) Japanese Unexamined Patent Publication No. 2003-094332 (published on April 03, 2003) JP 2003-117822 A (published April 23, 2003) Japanese Patent Laying-Open No. 2004-025377 (released on January 29, 2004) JP 2004-066409 A (published Mar. 04, 2004) JP 2008-073825 A (released on April 03, 2008) JP 2008-073826 A (released on April 03, 2008)

Tsutomu Morikawa, Seichiro Eguchi, “Hardness of chromium plating from oxalic acid bath”, Metal Surface Technology, Vol.37, NO.7, p.341-345,1986 Tsutomu Morikawa, Masayuki Yokoi, Kiyoichiro Eguchi, Yukio Fukumoto, "Chromium (III) sulfate-amorphous Cr-C alloy plating from ammonium oxalate bath", Surface Technology, Vol.42, No.1, p.100- 104,1991 S. Hoshino, H.A. Laitinen, G.B.Hoflund; J. Electrochem. Soc., 133, 681 (1986)

  However, for example, in the coating method by Ni-W alloy plating disclosed in Patent Document 1, the corrosion rate of the metal fixed layer can be somewhat delayed, but the Ni-W plating alloy dissolves in the slurry solution. There is a problem that a sufficient corrosion prevention effect cannot be obtained.

  Further, in the coating method using a SiC film using PVD or CVD disclosed in Patent Document 2, the processing cost increases due to the dry coating method, and a portion where the coating film is not easily formed is likely to occur. There is a problem of corrosion.

  Further, the coating method using Au or Rh disclosed in Patent Document 3 requires an expensive metal such as gold or rhodium, which increases the manufacturing cost of the CMP pad conditioner. Furthermore, since the potential difference of corrosion with nickel constituting the metal fixing layer is large, there is a problem that the dissolution of the metal fixing layer by the slurry solution that has entered through the pinhole of the coating layer is accelerated.

  Moreover, in the coating method using oxides such as fluororesin or sol-gel disclosed in Patent Documents 4 to 7, the adhesion between the coating layer and the metal fixing layer is not sufficient, and the coating layer is used during the polishing of the CMP pad. Dropout occurs. Furthermore, there exists a subject that a metal fixed layer melt | dissolves from the slurry solution which penetrate | invaded through the pinhole which arose in the coating layer.

  As described above, since these techniques cannot effectively prevent the dissolution of the metal fixing layer, it is desired to develop a CMP pad conditioner having excellent corrosion resistance against various slurry solutions.

  Further, in order to extend the life of the CMP pad conditioner, not only the above-described dissolution of the metal fixing layer by the slurry liquid is suppressed, but also the wear resistance of the CMP pad conditioner surface and the retention force of the abrasive grains are improved. desired.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a CMP pad conditioner having improved corrosion resistance, wear resistance, and abrasive holding power against various slurry solutions, and the CMP pad condition. It is to realize a manufacturing method of na.

  In order to solve the above problems, a CMP pad conditioner according to the present invention includes a plurality of abrasive grains held by a metal fixing layer formed on a substrate surface, and is used for chemical mechanical polishing by the abrasive grains. A CMP pad conditioner for grinding a CMP pad, wherein the metal fixing layer is covered with an amorphous chromium plating layer containing at least an amorphous structure.

  In order to solve the above problems, a method for manufacturing a CMP pad conditioner according to the present invention includes a plurality of abrasive grains held by a metal fixing layer formed on a substrate surface, and chemical mechanical polishing using the abrasive grains. A method of manufacturing a CMP pad conditioner for grinding a CMP pad used in manufacturing, comprising a covering step of covering the metal fixing layer with an amorphous chromium plating layer containing at least an amorphous structure. And

  In the above configuration, the metal fixed layer holding a plurality of abrasive grains is covered with the amorphous chromium plating layer including at least an amorphous structure. The coating in the present invention includes a direct coating in which an amorphous chromium plating layer is directly formed on the metal fixing layer, and an amorphous chromium plating layer is formed on the metal fixing layer via another different layer. Both indirect coatings are included.

  The chemical properties of amorphous chromium have excellent corrosion resistance against acidic, oxidizing, alkaline solutions, etc. The amorphous chromium plating layer formed from this amorphous chromium is used in CMP. Excellent corrosion resistance to various slurry solutions. Therefore, by covering the metal fixing layer with an amorphous chromium plating layer containing at least an amorphous structure, the metal fixing layer is protected from the slurry solution and effectively prevents the metal fixing layer from dissolving. Can do.

  Further, in a normal chrome plating layer, when the thickness of the porous film is about 0.5 μm or more, the chrome plating layer breaks due to the electrodeposition stress remaining in the chrome plating layer, and a crack is generated. For this reason, it is difficult for a normal chromium plating layer to sufficiently prevent corrosion of the metal fixed layer due to the occurrence of this crack.

  On the other hand, since the amorphous chromium plating layer has a small electrodeposition stress, even if the thickness of the amorphous chromium plating layer exceeds about 0.5 μm, the generation of cracks can be suppressed. It becomes possible. In addition, the amorphous chrome plating layer is prone to passivation on the surface, and the corrosion resistance to the slurry solution is remarkably superior to that of the normal chrome plating layer, effectively preventing corrosion of the metal fixed layer. be able to.

  Furthermore, the Vickers hardness of the amorphous chromium plating layer is usually about HV 800 to 1100, which is higher than the hardness of the metal fixing layer made of nickel or the like (about HV 200 to 300). Therefore, the wear resistance of the CMP pad conditioner and the holding power of the abrasive grains can be improved by covering the metal fixing layer with the amorphous chromium plating layer.

  Therefore, according to said structure, the CMP pad conditioner which improved the corrosion resistance with respect to various slurry solutions, abrasion resistance, and the retention strength of an abrasive grain, and the manufacturing method of the said CMP pad conditioner are realizable.

  As described above, the present inventors have coated the metal fixing layer with an amorphous chromium plating layer containing at least an amorphous structure, whereby corrosion resistance, wear resistance, and resistance to various slurry solutions of the CMP pad conditioner are improved. The inventors have found that the holding power of abrasive grains is remarkably improved and have reached the present invention. Such a technical idea has not been disclosed so far.

  In the CMP pad conditioner according to the present invention, it is preferable that the amorphous chromium plating layer is partially crystallized and has a Vickers hardness of HV1100 or more and HV1800 or less.

  As described above, the Vickers hardness of the amorphous chromium plating layer is about HV800 to 1100, but by partially crystallizing the amorphous chromium plating layer, the Vickers hardness is increased to HV1100 or more and HV1800 or less. be able to.

  Therefore, according to said structure, the abrasion resistance of a CMP pad conditioner and the retention strength of an abrasive grain can further be improved.

  In the CMP pad conditioner according to the present invention, an oxide film is preferably formed on the surface of the amorphous chromium plating layer.

  According to the above configuration, since the oxide film is formed on the surface of the amorphous chromium plating layer, it is possible to further improve the corrosion resistance of the CMP pad conditioner against the slurry solution.

  In the CMP pad conditioner manufacturing method according to the present invention, in the covering step, the amorphous chromium plating layer is heat-treated at a temperature range of 200 ° C. or higher, 300 ° C. or lower, or 500 ° C. or higher and 600 ° C. or lower. It is preferable to do.

  By heat-treating the amorphous chromium plating layer in a temperature range of 200 ° C. or more, 300 ° C. or less, or 500 ° C. or more and 600 ° C. or less, the crystallization reaction in the amorphous chromium plating layer can be promoted.

  Therefore, in the covering step, the amorphous chromium plating layer is thermally crystallized in a temperature range of 200 ° C. or more, 300 ° C. or less, or 500 ° C. or more and 600 ° C. or less, thereby efficiently crystallizing the amorphous chromium plating layer. Can be

  Therefore, according to the above method, it is possible to efficiently crystallize a part of the amorphous chromium plating layer, and to further improve the wear resistance and abrasive retention of the CMP pad conditioner.

  Moreover, in the manufacturing method of the CMP pad conditioner according to the present invention, it is preferable that the heat treatment is performed in the atmosphere.

  In the above method, by performing the heat treatment in the atmosphere, an oxide film can be formed on the surface of the amorphous chromium plating layer simultaneously with the crystallization of the amorphous chromium plating layer.

  Therefore, according to the above configuration, the corrosion resistance of the CMP pad conditioner against the slurry solution can be further improved.

  As described above, the CMP pad conditioner according to the present invention includes a plurality of abrasive grains held by the metal fixing layer formed on the substrate surface, and the CMP pad used for chemical mechanical polishing is ground by the abrasive grains. A CMP pad conditioner for machining, wherein the metal fixing layer is covered with an amorphous chromium plating layer including at least an amorphous structure.

  The CMP pad conditioner manufacturing method according to the present invention includes a plurality of abrasive grains held by a metal fixing layer formed on a surface of a substrate, and the CMP pad used for chemical mechanical polishing is ground by the abrasive grains. A method of manufacturing a CMP pad conditioner for machining, comprising a coating step of covering the metal fixing layer with an amorphous chromium plating layer containing at least an amorphous structure.

  Therefore, according to the present invention, it is possible to realize a CMP pad conditioner with improved corrosion resistance, wear resistance and abrasive holding power against various slurry solutions, and a method of manufacturing the CMP pad conditioner. Play.

(A) is a top view which shows the CMP pad conditioner which concerns on this embodiment, (b) is a schematic diagram which shows the cross section of the CMP pad conditioner shown by (a). FIG. 3 is an enlarged view showing a portion surrounded by a broken line of the CMP pad conditioner shown in FIG. It is an enlarged view which shows the grinding | polishing part shown by FIG.

  An embodiment of a CMP pad conditioner according to the present invention will be described below with reference to FIGS.

[Configuration of CMP Pad Conditioner 1]
First, the configuration of the CMP pad conditioner 1 according to the present embodiment will be described with reference to FIGS. 1 and 2.

  FIG. 1A is a top view showing a CMP pad conditioner 1 according to this embodiment, and FIG. 1B is a schematic view showing a cross section of the CMP pad conditioner 1 shown in FIG.

  As shown in FIGS. 1A and 1B, the CMP pad conditioner 1 includes a circular pedestal (base material) 2, and a plurality of abrasive portions 3 are provided on the surface of the pedestal 2. Yes.

  The pedestal 2 is a disk-shaped member made of metal or the like. In this embodiment, the base 2 is made of stainless steel, and has a diameter of 105 mm and a thickness of 5 mm. A plurality of grinding portions 3 are provided concentrically on the surface of the pedestal 2.

  The grinding part 3 is a part from which a part of the surface of the pedestal 2 protrudes, and a plurality of abrasive grains 4 (see FIG. 2) are fixed to each grinding part 3.

  In the present embodiment, the grinding part 3 includes a cylindrical grinding part 3a and an annular grinding part 3b. A plurality of cylindrical grinding portions 3 a are provided in three rows so as to form three concentric circles on the surface of the pedestal 2, and an annular grinding portion 3 b is further provided on the outer side of the pedestal 2. It is provided along.

  FIG. 2 is an enlarged view showing a portion surrounded by a broken line of the CMP pad conditioner 1 shown in FIG. As shown in FIG. 2, a plurality of abrasive grains 4 are respectively fixed to the upper surface of the grinding part 3.

The abrasive grains 4 are used for grinding the surface of the CMP pad. For example, diamond, cBN, alumina Al ₂ O ₃ , silicon carbide SiO ₂ or the like can be used. As will be described later, the abrasive grains 4 are electrodeposited and fixed on the upper surface of the abrasive part 3 by a nickel plating layer (metal fixing layer) 11.

  Note that the position, size, shape, and the like of the grinding portion 3 provided on the surface of the base 2 can be changed as appropriate. Further, the abrasive grains 4 may be directly fixed to the surface of the flat pedestal 2 without providing the grinding part 3 on the surface of the pedestal 2.

[Layer structure of CMP pad conditioner 1]
Next, the layer structure of the CMP pad conditioner 1 according to the present embodiment will be described with reference to FIG. In the following, the layer structure of the CMP pad conditioner 1 will be described by taking the layer structure in the grinding portion 3a as an example.

  FIG. 3 is an enlarged view showing the grinding part 3a shown in FIG. As shown in FIG. 3, a nickel plating layer 11 and an amorphous chrome plating layer 12 are laminated in this order on the upper surface of the grinding portion 3a.

  The nickel plating layer 11 is for holding the abrasive grains 4 and is formed over the surface of the pedestal 2 including the grinding portion 3a by an electro nickel plating method or the like. Further, a plurality of abrasive grains 4 are embedded in the nickel plating layer 11 of the grinding portions 3a and 3b. In the present embodiment, each abrasive grain 4 is held by the Ni plating layer 11 in a state where a portion of about 55% or more and 80% or less of the grain size is embedded.

  Here, in the conventional CMP pad conditioner, a slurry solution used in CMP adheres to the nickel plating layer 11 and corrosive components (acid, alkali, oxidizing agent, organic complexing agent, etc.) in the attached slurry solution. The nickel plating layer 11 was dissolved by the action, and the abrasive grains dropped off.

  Therefore, in the CMP pad conditioner 1 according to the present embodiment, the nickel plating layer 11 is protected by covering the nickel plating layer 11 with an amorphous chromium plating layer 12 including at least an amorphous structure.

  The chemical properties of amorphous chromium have excellent corrosion resistance against acidic, oxidizing, alkaline solutions, etc. The amorphous chromium plating layer 12 formed of amorphous chromium is formed by CMP. Excellent corrosion resistance to the various slurry solutions used. Therefore, by covering the nickel plating layer 11 with the amorphous chromium plating layer 12, it is possible to effectively prevent the nickel plating layer 11 from being dissolved by the slurry solution.

  Further, in a normal chrome plating layer, when the thickness of the porous film is about 0.5 μm or more, the chrome plating layer breaks due to the electrodeposition stress remaining in the chrome plating layer, and a crack is generated. For this reason, it is difficult for a normal chromium plating layer to sufficiently prevent corrosion of the metal fixed layer due to the occurrence of this crack.

  On the other hand, since the amorphous chrome plating layer 12 has a small electrodeposition stress, it suppresses the generation of cracks even when the thickness of the amorphous chrome plating layer 12 exceeds about 0.5 μm. Is possible. Further, the amorphous chrome plating layer 12 is likely to cause a passivation phenomenon on the surface, and has excellent corrosion resistance against the slurry solution as compared with a normal chrome plating layer, so that the corrosion of the nickel plating layer 11 is effectively prevented. Can be prevented.

  Furthermore, the Vickers hardness of the amorphous chromium plating layer 12 is about HV 800 to 1100, which is higher than the hardness of the nickel plating layer 11 formed of nickel (about HV 200 to 300). Therefore, by covering the nickel plating layer 11 formed on the surface of the pedestal 2 with the amorphous chromium plating layer 12, the wear resistance of the CMP pad conditioner 1 and the holding power of the abrasive grains can be improved. .

[Manufacturing method of CMP pad conditioner 1]
Next, a method for manufacturing the CMP pad conditioner 1 according to this embodiment will be described. In the manufacturing method of the CMP pad conditioner 1, the steps from forming the nickel plating layer 11 on the surface of the pedestal 2 and electrodepositing the abrasive grains 4 on the grinding portions 3 a and 3 b are the same as in the prior art. Therefore, hereinafter, a process of coating the nickel plating layer 11 with the amorphous chromium plating layer 12 (hereinafter referred to as a coating step) will be described.

  The amorphous chromium plating layer 12 can be formed using, for example, a Cr—C alloy in which carbon is eutectoid. Specifically, a Cr—C alloy from an oxalic acid bath in which carbon (C) is eutectoid to 0.1 wt% or more and 0.5 wt% or less can be used. Thus, the corrosion resistance with respect to an acid can further be improved by forming the amorphous chromium plating layer 12 using a Cr-C alloy.

  Further, for the purpose of improving the corrosion resistance and smoothness of the amorphous chromium plating layer 12, an alloy component such as phosphorus (P) and sulfur (S) is contained in the Cr—C alloy, and the amorphous chromium plating is performed. Layer 12 may be formed.

  As a method for forming the amorphous chromium plating layer 12 on the nickel plating layer 11, for example, plating methods disclosed in Non-Patent Documents 1 to 3 and the like can be applied.

  The thickness of the amorphous chromium plating layer 12 to be formed is preferably 0.1 μm or more and 5 μm or less in order to ensure corrosion resistance to the slurry solution and to suppress the generation of pits and cracks.

  In order not to reduce the abrasive force of the abrasive grains 4 by forming the amorphous chromium plating layer 12, the thickness of the amorphous chromium plating layer 12 is set to the height of the abrasive grains 4 exposed from the nickel plating layer 11. Must be less than For example, when the height of the abrasive grains 4 exposed from the nickel plating layer 11 is 30 μm, the maximum value of the thickness of the amorphous chromium plating layer 12 is less than 30 μm.

  Here, in the covering step, the amorphous chromium plating layer 12 formed on the nickel plating layer 11 is heat-treated at a temperature range of 200 ° C. or more and 600 ° C. or less for about 0.5 to 2.0 hours. Thus, the characteristics of the amorphous chromium plating layer 12 can be modified.

  Specifically, Cr of the amorphous chromium plating layer 12 can be crystallized by performing heat treatment on the amorphous chromium plating layer 12 in a temperature range of 200 ° C. or more and 600 ° C. or less. In particular, by performing heat treatment in a temperature range of 200 ° C. or higher and 300 ° C. or lower, the Cr crystallization reaction in a part of the amorphous chromium plating layer 12 can be promoted.

Further, by performing heat treatment on the amorphous chromium plating layer 12 at 500 ° C. or higher, carbides such as Cr ₂₆ C ₇ in the amorphous chromium plating layer 12 can be crystallized. In particular, by performing a heat treatment in a temperature range of 500 ° C. or more and 600 ° C. or less, a crystallization reaction of a carbide such as Cr ₂₆ C ₇ in a part of the amorphous chromium plating layer 12 can be promoted.

  In the coating step, the Vickers hardness of the crystal-deposited amorphous chromium plating layer 12 can be increased to HV1100 or more and HV1800 or less by performing the above-described heat treatment, so that the wear resistance of the CMP pad conditioner 1 and The holding power of the abrasive grains 4 can be further improved.

  Furthermore, by performing this heat treatment in the air, the surface of the amorphous chromium plating layer 12 is oxidized, and an oxide layer having a thickness of several tens of nm can be formed. By forming this oxide layer, the corrosion resistance of the CMP pad conditioner 1 against the slurry solution can be further improved.

  On the other hand, when the temperature of the heat treatment performed in the air is 700 ° C. or higher, the oxidation of the amorphous chromium plating layer 12 becomes intense, the pedestal 2 of the CMP pad conditioner 1 is softened, and the nickel plating layer 11 that fixes the abrasive grains 4 is fixed. Oxidation, decomposition reaction of the abrasive grains 4 and the like may occur. Therefore, the heat treatment is preferably performed at a temperature lower than 700 ° C.

  The crystallinity of the amorphous chromium plating layer 12 depends on the content of the eutectoid carbon, but it is not necessary to crystallize the entire amorphous chromium plating layer 12. Therefore, the carbon content of the amorphous chromium plating layer 12 is preferably in the range of 0.1 wt% or more and 0.5 wt% or less as described above.

[Summary of Embodiment]
As described above, the CMP pad conditioner 1 according to this embodiment includes a plurality of abrasive grains 4 held by the nickel plating layer 11 formed on the surface of the pedestal 2, and chemical abrasive polishing is performed by the abrasive grains 4. In the CMP pad conditioner 1 for grinding a CMP pad to be used, a nickel plating layer 11 is covered with an amorphous chromium plating layer 12 including at least an amorphous structure.

  Further, the CMP pad conditioner manufacturing method according to the embodiment includes a plurality of abrasive grains 4 held by a nickel plating layer 11 formed on the surface of the pedestal 2, and is used for chemical mechanical polishing by the abrasive grains 4. A method of manufacturing a CMP pad conditioner for grinding a CMP pad, comprising a coating step of covering a nickel plating layer 11 with an amorphous chromium plating layer 12 containing at least an amorphous structure.

  According to said structure, since the nickel plating layer 11 is coat | covered with the amorphous chromium plating layer 12, the nickel plating layer 11 is protected from a slurry solution and it is effective that the nickel plating layer 11 melt | dissolves. Can be prevented.

  Therefore, according to the present embodiment, it is possible to realize the CMP pad conditioner 1 and the manufacturing method of the CMP pad conditioner 1 with improved corrosion resistance, wear resistance, and abrasive holding power against various slurry solutions. .

[Modification]
In the above-described embodiment, the configuration in which the amorphous chromium plating layer 12 is directly formed on the nickel plating layer 11 has been described, but the present invention is not limited to this. The amorphous chromium plating layer 12 only needs to be formed above the nickel plating layer 11, and another different layer is formed between the nickel plating layer 11 and the amorphous chromium plating layer 12. It may be.

  That is, the coating in the present invention includes a direct coating in which the amorphous chromium plating layer 12 is directly formed on the nickel plating layer 11 and another amorphous layer on the nickel plating layer 11. As well as indirect coatings formed there between.

  In any configuration, since the nickel plating layer 11 located in the lower layer is protected by the amorphous chromium plating layer 12, the corrosion resistance against various slurry solutions, the wear resistance, and the holding power of the abrasive grains are improved. A CMP pad conditioner can be realized.

〔Example〕
Next, a corrosion resistance test performed on the CMP pad conditioner according to the present invention coated with an amorphous chromium plating layer will be described.

  In this corrosion resistance test, a CMP pad conditioner in which diamond is fixed on a stainless steel pedestal 2 is coated with a Cr—C alloy plating layer from an oxalic acid bath by a nickel plating layer formed by an electro nickel plating method. Was used. The carbon content of the Cr—C alloy plating layer is 0.5 wt%, and the film thickness is 5 μm.

  The results of the immersion test and spray test performed on this CMP pad conditioner are shown in the following table. The presence or absence of corrosion on the CMP pad conditioner surface was observed with a scanning electron microscope (SEM).

  As shown in this table, in this corrosion resistance test, a CMP pad conditioner immersion test and a spray test were conducted for various corrosive components, but no corrosion was observed on the CMP pad conditioner surface in any of the tests. .

  This is because the formation of the Cr-C alloy plating layer having high corrosion resistance against various corrosion components on the upper layer of the nickel plating layer suppresses dissolution of the nickel plating layer located in the lower layer due to the corrosion components. .

  Thus, it was confirmed that the corrosion resistance of the CMP pad conditioner is greatly improved by covering the nickel plating layer with the amorphous chromium plating layer.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and the embodiments can be obtained by appropriately combining technical means disclosed in different embodiments. The form is also included in the technical scope of the present invention.

[Supplement]
The CMP pad conditioner according to the present invention can also be expressed as follows. That is, the CMP pad conditioner according to the present invention is characterized in that amorphous chromium plating is applied to the uppermost layer of the CMP pad conditioner having an abrasive layer in which a plurality of abrasive grains are fixed by a metal binder phase by plating. And

  The CMP pad conditioner according to the present invention is characterized in that the amorphous chromium plating layer has an amorphous structure in a crystalline state and no cracks.

  Further, the CMP pad conditioner according to the present invention partially heats the amorphous chromium plating layer by heat-treating the amorphous chromium plated CMP pad conditioner in a temperature range of 200 ° C. or more and 600 ° C. or less. By making it crystallize, Vickers hardness is hardened to HV1100 or more and HV1800 or less.

  The CMP pad conditioner according to the present invention is obtained by heat-treating an amorphous chromium plated CMP pad conditioner in the atmosphere at a temperature range of 200 ° C. or more and 600 ° C. or less. An oxide film is formed on the substrate.

  The present invention can be used in a CMP pad conditioner used for conditioning a CMP pad and a method for manufacturing the CMP pad conditioner.

1 CMP pad conditioner 2 Base (base material)
3 Abrasive part 3a Abrasive part 3b Abrasive part 4 Abrasive grain 11 Nickel plating layer (metal fixed layer)
12 Amorphous chromium plating layer

Claims (6)

A CMP pad conditioner comprising a plurality of abrasive grains held by a metal fixed layer formed on a substrate surface, and grinding a CMP pad used for chemical mechanical polishing with the abrasive grains,
The CMP pad conditioner, wherein the metal fixing layer is covered with an amorphous chromium plating layer containing at least an amorphous structure.   2. The CMP pad conditioner according to claim 1, wherein the amorphous chromium plating layer is partially crystallized and has a Vickers hardness of HV1100 or more and HV1800 or less.   The CMP pad conditioner according to claim 1, wherein an oxide film is formed on a surface of the amorphous chromium plating layer. A manufacturing method of a CMP pad conditioner comprising a plurality of abrasive grains held by a metal fixed layer formed on a substrate surface, and grinding a CMP pad used for chemical mechanical polishing with the abrasive grains,
A method of manufacturing a CMP pad conditioner, comprising a coating step of covering the metal fixing layer with an amorphous chromium plating layer containing at least an amorphous structure.   5. The CMP pad condition according to claim 4, wherein in the covering step, the amorphous chromium plating layer is heat-treated in a temperature range of 200 ° C. or higher and 300 ° C. or lower, or 500 ° C. or higher and 600 ° C. or lower. Na production method.   The method of manufacturing a CMP pad conditioner according to claim 5, wherein the heat treatment is performed in the atmosphere.

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