JP2013189498A5 - - Google Patents
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- Publication number
- JP2013189498A5 JP2013189498A5 JP2012054887A JP2012054887A JP2013189498A5 JP 2013189498 A5 JP2013189498 A5 JP 2013189498A5 JP 2012054887 A JP2012054887 A JP 2012054887A JP 2012054887 A JP2012054887 A JP 2012054887A JP 2013189498 A5 JP2013189498 A5 JP 2013189498A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- silicone composition
- conductive silicone
- mass
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920001296 polysiloxane Polymers 0.000 claims 10
- 239000000203 mixture Substances 0.000 claims 7
- 239000002245 particle Substances 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 125000003342 alkenyl group Chemical group 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 230000003197 catalytic effect Effects 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012054887A JP5940325B2 (ja) | 2012-03-12 | 2012-03-12 | 熱伝導性シリコーン組成物 |
| CN201910871684.5A CN110527302A (zh) | 2012-03-12 | 2013-03-08 | 导热性有机硅组合物 |
| KR1020147028507A KR102106759B1 (ko) | 2012-03-12 | 2013-03-08 | 열전도성 실리콘 조성물 |
| US14/384,419 US20150097138A1 (en) | 2012-03-12 | 2013-03-08 | Thermally Conductive Silicone Composition |
| PCT/JP2013/057327 WO2013137423A1 (en) | 2012-03-12 | 2013-03-08 | Thermally conductive silicone composition |
| EP13714705.4A EP2825612A1 (en) | 2012-03-12 | 2013-03-08 | Thermally conductive silicone composition |
| CN201380013711.6A CN104169390A (zh) | 2012-03-12 | 2013-03-08 | 导热性有机硅组合物 |
| TW102108723A TW201341471A (zh) | 2012-03-12 | 2013-03-12 | 熱傳導性聚矽氧組合物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012054887A JP5940325B2 (ja) | 2012-03-12 | 2012-03-12 | 熱伝導性シリコーン組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013189498A JP2013189498A (ja) | 2013-09-26 |
| JP2013189498A5 true JP2013189498A5 (2) | 2015-04-30 |
| JP5940325B2 JP5940325B2 (ja) | 2016-06-29 |
Family
ID=48050202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012054887A Active JP5940325B2 (ja) | 2012-03-12 | 2012-03-12 | 熱伝導性シリコーン組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20150097138A1 (2) |
| EP (1) | EP2825612A1 (2) |
| JP (1) | JP5940325B2 (2) |
| KR (1) | KR102106759B1 (2) |
| CN (2) | CN110527302A (2) |
| TW (1) | TW201341471A (2) |
| WO (1) | WO2013137423A1 (2) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3467043B1 (en) * | 2016-05-31 | 2020-10-28 | Sekisui Polymatech Co., Ltd. | Heat-conducting member, heat-conducting composition and heat-conducting composition production method |
| JP6841547B2 (ja) * | 2017-01-18 | 2021-03-10 | 出光興産株式会社 | グリース組成物及びその製造方法 |
| TWI746856B (zh) * | 2017-05-31 | 2021-11-21 | 日商邁圖高新材料日本合同公司 | 熱傳導性聚矽氧烷組成物 |
| CN107964380B (zh) * | 2017-12-28 | 2020-05-12 | 石家庄惠得科技有限公司 | 一种非正态分布氢氧化铝粉及其制备方法和应用 |
| KR102498951B1 (ko) * | 2018-01-11 | 2023-02-15 | 다우 실리콘즈 코포레이션 | 전자 구성요소 상에 열 전도성 조성물을 도포하는 방법 |
| JP7033047B2 (ja) * | 2018-10-26 | 2022-03-09 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその硬化物 |
| JP7001071B2 (ja) * | 2019-01-10 | 2022-01-19 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物 |
| EP3986967A4 (en) | 2019-06-21 | 2023-01-25 | Dow Silicones Corporation | METHOD OF PREPARING A THIXOTROPIC CURING SILICONE COMPOSITION |
| US12378363B2 (en) | 2019-06-21 | 2025-08-05 | Dow Silicones Corporation | Thermal conductive silicone composition |
| EP3988607A4 (en) | 2019-06-24 | 2023-07-26 | Shin-Etsu Chemical Co., Ltd. | Highly thermally-conductive silicone composition and cured product thereof |
| JP7136065B2 (ja) * | 2019-11-14 | 2022-09-13 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び熱伝導性シリコーンシート |
| JP7165647B2 (ja) * | 2019-12-26 | 2022-11-04 | 信越化学工業株式会社 | 熱伝導性シリコーン樹脂組成物 |
| KR102928483B1 (ko) * | 2020-03-16 | 2026-02-23 | 다우 실리콘즈 코포레이션 | 열 전도성 실리콘 조성물 |
| MX2023001422A (es) * | 2020-08-03 | 2023-03-06 | Henkel Ag & Co Kgaa | Pasta termicamente conductora de baja viscosidad. |
| WO2023188491A1 (ja) * | 2022-03-31 | 2023-10-05 | 富士高分子工業株式会社 | 熱伝導性シリコーン組成物、熱伝導性シリコーンシート及びその製造方法 |
| JP2024172885A (ja) | 2023-06-01 | 2024-12-12 | 信越化学工業株式会社 | 熱伝導性２液付加硬化型シリコーン組成物、硬化物及びシート |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2590654B2 (ja) | 1991-11-20 | 1997-03-12 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物の製造方法 |
| JP2557604B2 (ja) * | 1993-08-17 | 1996-11-27 | 東レ・ダウコーニング・シリコーン株式会社 | 碍 子 |
| US5668205A (en) * | 1994-05-27 | 1997-09-16 | Shin-Etsu Chemical Co., Ltd. | Silicone rubber compositions for high-voltage electrical insulators |
| EP0928008A3 (en) * | 1997-12-30 | 2000-01-05 | General Electric Company | Silicone compositions for high voltage insulator applications |
| US6232387B1 (en) * | 1998-05-19 | 2001-05-15 | Shin-Etsu Chemical Co., Ltd. | Silicone rubber compositions for high-voltage electrical insulators |
| JP4780256B2 (ja) * | 1998-08-24 | 2011-09-28 | 信越化学工業株式会社 | ポリマー碍子用シール材及びポリマー碍子用補修材 |
| JP4759122B2 (ja) * | 2000-09-12 | 2011-08-31 | ポリマテック株式会社 | 熱伝導性シート及び熱伝導性グリス |
| US6448329B1 (en) * | 2001-02-28 | 2002-09-10 | Dow Corning Corporation | Silicone composition and thermally conductive cured silicone product |
| JP4663153B2 (ja) * | 2001-05-22 | 2011-03-30 | ポリマテック株式会社 | 熱伝導性複合材料組成物 |
| US20030113461A1 (en) * | 2001-12-14 | 2003-06-19 | Farooq Ahmed | Coated composite high voltage electrical insulator |
| WO2004092278A1 (en) * | 2003-04-15 | 2004-10-28 | Dow Corning Toray Co. Ltd. | Thermoconductive addition-curable liquid silicone rubber composition and coated fixing roll |
| KR20060020672A (ko) * | 2003-06-12 | 2006-03-06 | 쇼와 덴코 가부시키가이샤 | 알루미나 입자의 제조방법 및 알루미나 입자를 함유하는조성물 |
| CN101168620B (zh) * | 2007-09-04 | 2012-07-25 | 东莞兆舜有机硅新材料科技有限公司 | 导热阻燃液体硅橡胶及其制备方法 |
| JP5507059B2 (ja) * | 2008-05-27 | 2014-05-28 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーン組成物および電子装置 |
| JP2010018786A (ja) * | 2008-06-09 | 2010-01-28 | Shin-Etsu Chemical Co Ltd | 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース |
| JP5300408B2 (ja) | 2008-10-21 | 2013-09-25 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
| JP5108825B2 (ja) * | 2009-04-24 | 2012-12-26 | 信越化学工業株式会社 | 光半導体装置用シリコーン樹脂組成物及び光半導体装置 |
| JP5488326B2 (ja) * | 2009-09-01 | 2014-05-14 | 信越化学工業株式会社 | 光半導体装置用白色熱硬化性シリコーンエポキシ混成樹脂組成物及びその製造方法並びにプレモールドパッケージ及びｌｅｄ装置 |
| JP5304588B2 (ja) | 2009-10-26 | 2013-10-02 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその硬化物 |
| JP5418298B2 (ja) * | 2010-02-26 | 2014-02-19 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその硬化物 |
| TWI532815B (zh) * | 2012-01-20 | 2016-05-11 | 先鋒材料科技股份有限公司 | 導熱、絕緣、耐燃及耐高溫之黏著劑及其組合物 |
-
2012
- 2012-03-12 JP JP2012054887A patent/JP5940325B2/ja active Active
-
2013
- 2013-03-08 US US14/384,419 patent/US20150097138A1/en not_active Abandoned
- 2013-03-08 KR KR1020147028507A patent/KR102106759B1/ko active Active
- 2013-03-08 EP EP13714705.4A patent/EP2825612A1/en not_active Withdrawn
- 2013-03-08 CN CN201910871684.5A patent/CN110527302A/zh active Pending
- 2013-03-08 CN CN201380013711.6A patent/CN104169390A/zh active Pending
- 2013-03-08 WO PCT/JP2013/057327 patent/WO2013137423A1/en not_active Ceased
- 2013-03-12 TW TW102108723A patent/TW201341471A/zh unknown
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