JP2013509247A5 - - Google Patents

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Publication number
JP2013509247A5
JP2013509247A5 JP2012536917A JP2012536917A JP2013509247A5 JP 2013509247 A5 JP2013509247 A5 JP 2013509247A5 JP 2012536917 A JP2012536917 A JP 2012536917A JP 2012536917 A JP2012536917 A JP 2012536917A JP 2013509247 A5 JP2013509247 A5 JP 2013509247A5
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JP
Japan
Prior art keywords
traces
feedthrough
contact pads
substrate
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012536917A
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English (en)
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JP5788888B2 (ja
JP2013509247A (ja
Filing date
Publication date
Priority claimed from US12/608,443 external-priority patent/US8373075B2/en
Application filed filed Critical
Publication of JP2013509247A publication Critical patent/JP2013509247A/ja
Publication of JP2013509247A5 publication Critical patent/JP2013509247A5/ja
Application granted granted Critical
Publication of JP5788888B2 publication Critical patent/JP5788888B2/ja
Active legal-status Critical Current
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Claims (3)

  1. 移植可能な医療器具のための、第1端部及び第2端部を含む多層フィードスルーであって、
    前記フィードスルーの前記第1端部に対応する第1端部と、当該フィードスルーの前記第2端部に対応する第2端部と、基板長さと、第1面と、当該第1面とは反対の第2面と、を有する基板と、
    前記第1面上に形成され、前記基板長さに沿って延在する、第1の複数のトレースと、
    前記第2面上に形成され、前記基板長さに沿って延在する、第2の複数のトレースと、
    前記第1の複数のトレースと電気的に結合された第1の複数の接触パッドと、
    前記第2の複数のトレースと電気的に結合された第2の複数の接触パッドと、
    前記第1面と前記第1の複数のトレースとの上に形成された第1絶縁層と、
    前記第2面と前記第2の複数のトレースとの上に形成された第2絶縁層と、
    第1接地面層と、
    第2接地面層と、
    を備え、
    前記第1の複数の接触パッド及び第2の複数の接触パッドは、前記フィードスルーの前記第1端部及び前記第2端部に延在する、多層フィードスルー。
  2. 請求項1に記載の多層フィードスルーにおいて、
    前記基板の前記第1面上に形成された統合型トランシーバを更に備える、多層フィードスルー。
  3. 請求項2に記載の多層フィードスルーにおいて、
    前記第1の複数のトレースは、前記統合型トランシーバのための少なくとも1つの動力線と少なくとも1つの信号線とを含む、多層フィードスルー。
JP2012536917A 2009-10-29 2010-10-25 移植可能な同時焼成された電気フィードスルー Active JP5788888B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/608,443 US8373075B2 (en) 2009-10-29 2009-10-29 Implantable co-fired electrical feedthroughs
US12/608,443 2009-10-29
PCT/US2010/053905 WO2011059682A1 (en) 2009-10-29 2010-10-25 Implantable co-fired electrical feedthroughs

Publications (3)

Publication Number Publication Date
JP2013509247A JP2013509247A (ja) 2013-03-14
JP2013509247A5 true JP2013509247A5 (ja) 2013-11-14
JP5788888B2 JP5788888B2 (ja) 2015-10-07

Family

ID=43432172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012536917A Active JP5788888B2 (ja) 2009-10-29 2010-10-25 移植可能な同時焼成された電気フィードスルー

Country Status (5)

Country Link
US (1) US8373075B2 (ja)
EP (1) EP2470264B1 (ja)
JP (1) JP5788888B2 (ja)
CN (1) CN102481454B (ja)
WO (1) WO2011059682A1 (ja)

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US20130058004A1 (en) 2011-09-01 2013-03-07 Medtronic, Inc. Feedthrough assembly including underfill access channel and electrically insulating material
US8644936B2 (en) 2012-01-09 2014-02-04 Medtronic, Inc. Feedthrough assembly including electrical ground through feedthrough substrate
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US10420949B2 (en) 2012-01-16 2019-09-24 Greatbatch Ltd. Method of manufacturing a feedthrough insulator for an active implantable medical device incorporating a post conductive paste filled pressing step
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US9387331B2 (en) 2013-10-08 2016-07-12 Medtronic, Inc. Implantable medical devices having hollow cap cofire ceramic structures and methods of fabricating the same
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US9196303B2 (en) * 2014-03-06 2015-11-24 HGST Netherlands, B.V. Feedthrough connector for hermetically sealed electronic devices
US9431759B2 (en) 2014-10-20 2016-08-30 HGST Netherlands B.V. Feedthrough connector for hermetically sealed electronic devices
JP6752135B2 (ja) * 2016-12-19 2020-09-09 マイクロ モーション インコーポレイテッド 防炎性の電気フィードスルー
EP3449973B1 (en) 2017-08-30 2022-12-21 Greatbatch Ltd. Hermetically sealed filtered feedthrough assembly
JP2018049015A (ja) * 2017-09-26 2018-03-29 マイクロ モーション インコーポレイテッド 防炎性の電気フィードスルー
US11896835B2 (en) * 2017-10-25 2024-02-13 Cochlear Limited Electrical shielding in implantable medical devices
US10918874B2 (en) * 2018-06-28 2021-02-16 Medtronic, Inc. Sealed package and method of forming same
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EP4327348A4 (en) * 2021-04-21 2025-01-08 Kyocera International, Inc. Ceramic feedthrough assemblies for electronic devices with metal housings
US11424053B1 (en) 2021-04-21 2022-08-23 Kyocera International, Inc. Ceramic feedthrough assemblies for electronic devices with metal housings
EP4516347A1 (en) * 2023-08-31 2025-03-05 Dyconex AG Partial pushing-in of conductive patterns in lcp

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