JP2015138976A - 基板保持のシステム及び方法 - Google Patents

基板保持のシステム及び方法 Download PDF

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Publication number
JP2015138976A
JP2015138976A JP2015008325A JP2015008325A JP2015138976A JP 2015138976 A JP2015138976 A JP 2015138976A JP 2015008325 A JP2015008325 A JP 2015008325A JP 2015008325 A JP2015008325 A JP 2015008325A JP 2015138976 A JP2015138976 A JP 2015138976A
Authority
JP
Japan
Prior art keywords
wafer
edge
flag
assemblies
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015008325A
Other languages
English (en)
Japanese (ja)
Inventor
ジョンソン，ヘイル
johnson Hale
ジョージ，グレゴリー
George Gregory
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suess Microtec Lithography GmbH
Original Assignee
Suess Microtec Lithography GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/597,298 external-priority patent/US20150206783A1/en
Application filed by Suess Microtec Lithography GmbH filed Critical Suess Microtec Lithography GmbH
Publication of JP2015138976A publication Critical patent/JP2015138976A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2015008325A 2014-01-20 2015-01-20 基板保持のシステム及び方法 Pending JP2015138976A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201461929192P 2014-01-20 2014-01-20
US61/929,192 2014-01-20
US14/597,298 2015-01-15
US14/597,298 US20150206783A1 (en) 2014-01-20 2015-01-15 System amd method for substrate holding

Publications (1)

Publication Number Publication Date
JP2015138976A true JP2015138976A (ja) 2015-07-30

Family

ID=53498044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015008325A Pending JP2015138976A (ja) 2014-01-20 2015-01-20 基板保持のシステム及び方法

Country Status (6)

Country Link
JP (1) JP2015138976A (de)
KR (1) KR20150087133A (de)
CN (1) CN104835771A (de)
AT (1) AT515435A3 (de)
DE (1) DE102015200698A1 (de)
TW (1) TW201539645A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11183401B2 (en) * 2015-05-15 2021-11-23 Suss Microtec Lithography Gmbh System and related techniques for handling aligned substrate pairs
TWI701708B (zh) * 2016-02-24 2020-08-11 德商蘇士微科技印刷術股份有限公司 半導體接合設備及相關技術
CN107665847B (zh) 2016-07-29 2020-01-24 上海微电子装备（集团）股份有限公司 一种键合对准设备和方法
CN108565234B (zh) * 2018-05-29 2024-06-21 上海科发电子产品有限公司 一种用于半导体器件倒装装配的基板整理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302415A (ja) * 2008-06-17 2009-12-24 Hitachi High-Technologies Corp 荷電粒子線装置，試料保持システム，試料の保持方法、および、試料の離脱方法
JP2012524399A (ja) * 2009-04-16 2012-10-11 スス マイクロテク リソグラフィー，ゲーエムベーハー 一時的なウェハーボンディング及びデボンディングのための改善された装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5775000A (en) * 1996-05-13 1998-07-07 Ebara Corporation Substrate gripper device for spin drying
US6537416B1 (en) * 1999-10-01 2003-03-25 Novellus Systems, Inc. Wafer chuck for use in edge bevel removal of copper from silicon wafers
US6827092B1 (en) * 2000-12-22 2004-12-07 Lam Research Corporation Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same
JP4330393B2 (ja) * 2003-07-14 2009-09-16 日東電工株式会社 基板貼合せ方法およびその装置
DE102004036435B4 (de) * 2003-08-07 2007-08-30 Nanophotonics Ag Haltevorrichtung für scheibenförmige Objekte
DE102007010224B4 (de) * 2007-02-28 2010-08-05 Vistec Semiconductor Systems Jena Gmbh Vorrichtung zum Haltern von scheibenförmigen Objekten

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302415A (ja) * 2008-06-17 2009-12-24 Hitachi High-Technologies Corp 荷電粒子線装置，試料保持システム，試料の保持方法、および、試料の離脱方法
JP2012524399A (ja) * 2009-04-16 2012-10-11 スス マイクロテク リソグラフィー，ゲーエムベーハー 一時的なウェハーボンディング及びデボンディングのための改善された装置

Also Published As

Publication number Publication date
AT515435A3 (de) 2017-05-15
KR20150087133A (ko) 2015-07-29
CN104835771A (zh) 2015-08-12
AT515435A2 (de) 2015-09-15
TW201539645A (zh) 2015-10-16
DE102015200698A1 (de) 2015-07-23

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