JP2017183302A - Light emitting device - Google Patents

Abstract

In a light emitting device in which a wavelength conversion member is caulked and fixed to a resin frame, it is difficult to dissipate heat from the wavelength conversion member and to adhere to a translucent member such as a lens disposed on the wavelength conversion member. was there.
A notch is formed in the peripheral edge of the upper surface of the wavelength conversion member disposed on the LED element, and the wavelength conversion member is placed on a step formed in the metal frame, and then the metal frame The notch was fixed by caulking. At that time, the height from the lower surface of the substrate to the upper surface of the metal frame was the same as the height from the lower surface of the substrate to the upper surface of the wavelength conversion member.
[Selection] Figure 2

Description

  The present invention relates to a light emitting device using an LED element as a light emitting element.

  Conventionally, improvement of the heat dissipation of an LED element has been cited as a problem of a light emitting device including an LED element and a phosphor.

  As an example of the structure of a light emitting device that solves such a conventional problem, one described in Patent Document 1 below can be cited. The conventional light-emitting device described in Patent Document 1 includes a lead frame that is an electrode member that is insert-molded in a resin package, and an LED element is mounted on the front surface (upper surface side of the representative drawing) of the lead frame. The lead frame is extended to the outer surface of the package, and heat dissipation from the LED element is improved by releasing heat from the lead frame to the outside. Further, a lid member, which is a wavelength conversion member containing a phosphor, is disposed in an opening portion of a package in which a resin is molded above the LED element, and is fixed by caulking with the resin.

JP 2004-335740 A (page 4, FIG. 1)

  However, in the conventional light emitting device described in the cited document 1, when the excitation heat of the wavelength conversion member is also increased due to the increase in the luminance of the LED element, the wavelength conversion member is fixed by caulking with a resin having low thermal conductivity. For this reason, the wavelength conversion member is heated up without being able to release the excitation heat. Thus, the wavelength conversion member described in the cited document 1 has a problem that the light conversion efficiency is lowered.

  Further, in the conventional light emitting device, when the wavelength conversion member is caulked and fixed, a convex portion of resin is formed in the caulked region. Accordingly, when a light-transmitting member such as a lens is placed in close contact with the wavelength conversion member, a light-transmitting member having a complicated structure that takes into account the shape of the convex portion formed in the crimped region must be created. There was also a problem of not becoming.

  Accordingly, an object of the present invention is to positively dissipate heat from the wavelength conversion member in a light emitting device in which the wavelength conversion member is fixed by caulking, and to transmit light having a simple structure in which the lower surface is a planar shape on the upper surface of the wavelength conversion member. It is an object of the present invention to provide a light-emitting device in which a light member can be closely arranged.

  In order to achieve the above object, the light emitting device of the present invention employs the following configuration.

  The light-emitting device of the present invention includes an LED element mounted on a substrate, a metal frame disposed so as to surround the LED element, a stepped portion formed inside the metal frame, and a stepped portion. A wavelength conversion member on a flat plate, wherein the wavelength conversion member has a notch at the upper surface end, and the metal frame has a protrusion at a location corresponding to the notch, from the lower surface of the substrate. The protrusion is fixed by caulking so that the height from the lower surface of the substrate to the upper surface of the metal frame is the same as the height from the upper surface of the wavelength conversion member.

  Moreover, the said notch part is good to have a slope shape.

  Moreover, you may provide the translucent member by which a lower surface is planar shape and arrange | positioned closely to the upper surface of a metal frame and a wavelength conversion member.

  The translucent member may be a lens.

Since the wavelength conversion member is directly caulked and fixed to the metal frame having high thermal conductivity, heat dissipation from the wavelength conversion member is improved. This has the effect of increasing the light conversion efficiency of the wavelength conversion member.
In addition, by making the height from the lower surface of the substrate to the upper surface of the wavelength conversion member the same as the height from the lower surface of the substrate to the upper surface of the metal frame, the lower surface is said to be planar on the wavelength conversion member and the metal frame There is also an effect that a light-transmitting member having a simple shape can be easily and closely arranged.

It is a principal part perspective view of embodiment of the light-emitting device of this invention. It is sectional drawing of embodiment of the light-emitting device of this invention. It is sectional drawing provided with the lens of embodiment of the light-emitting device of this invention. In each Example of this invention, the arrangement | positioning of the metal frame before a deformation | transformation and the wavelength conversion member in the inside is shown, (a) is a perspective view, (b) is sectional drawing. An example of the upper mold | type of the metal mold | die which deform | transforms a metal frame is shown, (a) is the perspective view of the lower surface side, (b) is a perspective view of the upper surface side. The state before and after the deformation of the metal frame is shown together with the upper mold, (a) is a perspective view immediately before the deformation, (b) is a sectional view thereof, (c) is a perspective view after the deformation is completed, and (d) is a sectional view thereof. is there.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Description of Structure FIGS. 1 to 3>
The external structure of the light emitting device according to this embodiment will be described with reference to FIGS. FIG. 1 is a perspective view of a main part illustrating only the metal frame 3 and the wavelength conversion member 4, and description of other members is omitted. FIG. 2 is a cross-sectional view of the light emitting device according to this embodiment.

  As shown in FIGS. 1 and 2, in the present embodiment, the wavelength conversion member 4 is disposed on the upper surface of the light emitting device 10, and all the peripheral portions are fixed by the metal frame 3. The substrate 2 is formed with a metal or ceramic material as a main component with the electrode surface exposed, and the plurality of LED elements 1 and electrode surfaces (not shown) are electrically joined. Here, the heat generated when the LED element 1 emits light is configured to dissipate to the surroundings via the substrate 2, but is not limited to this configuration. For example, the conventional example described in Patent Document 1 or other It may be a conventional example not described.

  The metal frame 3 is disposed on the substrate 2 and surrounds the periphery so as to accommodate the plurality of LED elements 1. The metal frame 3 is formed from a metal material, such as aluminum or copper, which is relatively easily deformed and has high plasticity and excellent thermal conductivity. The metal frame 3 has a stepped portion 3a in the inner region, and the peripheral portion of the lower surface of the wavelength conversion member 4 is placed on the upper surface of the stepped portion 3a.

The wavelength conversion member 4 is a flat plate member in which phosphors are dispersedly arranged in a transparent base material. In this example, the planar shape is a square and a thick plate. The material of the base material is preferably made of translucent ceramics or glass material rather than translucent resin from the viewpoint of translucency, thermal conductivity and heat resistance. This phosphor is excited by the light of the LED element 1 that emits blue light or ultraviolet light, and emits light having a wavelength different from that of the LED element 1. Thereby, by mixing the light of the LED element and the colors of a plurality of phosphors, it is possible to have a color rendering effect different from the original emission color of the LED element 1 such as, for example, whitening.

  Moreover, the wavelength conversion part 4 is provided with the notch part 4a in the peripheral edge part. As shown in FIG. 2, the cutout 4 a in the present embodiment is formed so that the side surface of the wavelength conversion member 4 has a slope shape. The notches 4a are formed on the four side surfaces excluding the upper surface and the lower surface of the wavelength conversion member, whereby the shape of the wavelength conversion member 4 is a frustum shape whose cross-sectional area gradually decreases from the lower surface to the upper surface. It has become. The notch 4 a is caulked and fixed by a deformed portion 3 d that is applied to a part of the metal frame 3 to plastically deform the metal and project toward the inside of the metal frame 3. In this way, the wavelength conversion member 4 is fixed to the step portion 3a of the metal frame 3.

  Further, the metal of the metal frame 3 caulks only the notch portion 4 a of the wavelength conversion portion so that the metal does not reach the upper surface of the wavelength conversion member 4, so that the lower surface of the substrate 2 to the upper surface of the wavelength conversion member 4. And the height from the lower surface of the substrate 2 to the upper surface of the metal frame 3 can be made substantially the same.

  With such a configuration, as shown in FIG. 3, when the front translucent member 5 whose lower surface is planar is disposed on the upper surfaces of the metal frame 3 and the wavelength conversion member 4, the metal frame 3 and The wavelength conversion member 4 and the front translucent member 5 can be disposed in close contact with each other. In the present embodiment, a convex lens having a flat bottom surface is used for the front translucent member 5, but other configurations (prisms including a plate-like member) are used as long as the bottom surface is a planar optical member. May be.

<Operation of Embodiment>
Since the excitation heat generated from the wavelength conversion member 4 is directly transmitted from the cutout portion 4a to the metal frame 3 through the heat conduction without the resin such as an adhesive, the heat is effectively radiated to the outside. In addition, since the height of the upper surface of the metal frame 3 and the upper surface of the wavelength conversion member 4 are substantially the same, the front surface of the metal frame 3 and the wavelength conversion member 4 having a simple bottom surface with a flat bottom surface. It becomes possible to arrange the translucent member 5 closely.

<Effect of embodiment>
Thus, according to the configuration of the present embodiment, the excitation heat generated from the wavelength conversion member 4 is effectively radiated to the metal frame 3, thereby reducing the temperature quenching of the phosphor, and the wavelength conversion member. The luminous efficiency of 4 can be increased. Further, by arranging the front translucent member 5 having a planar lower surface in close contact with the metal frame 3 and the wavelength conversion member 4, the metal frame 3 passes through the front translucent member 5 from the wavelength conversion member 4. A new heat dissipation path can be formed. Thereby, since the excitation heat can be further dissipated, the light emission efficiency of the wavelength conversion member 4 is further increased. Further, if the front translucent member 5 is an optical member such as a convex lens as in the present embodiment, the lower surface of the front translucent member can be formed into a simple planar shape, so that optical design is facilitated, resulting in a desired It becomes easy to obtain an optical effect.

Next, a method for manufacturing the light emitting device according to this embodiment will be described.
The manufacturing method of a light-emitting device includes: Step 1: a step of placing an LED element and a frame on a substrate; Step 2: a step of placing a wavelength conversion member on a step portion of the frame body; and Step 3: a wavelength conversion member. And caulking and fixing. Among these, regarding the process 1, any conventionally known method may be used, and since it is not a main part of the present invention, description thereof is omitted. Hereinafter, the specific manufacturing method which crimps and fixes the wavelength conversion member 4 to the metal frame 3 from the process 2 and the process 3 is demonstrated.

<Step 2: Step of Placing Wavelength Conversion Member on Frame Step Step> FIG.
4A and 4B are views showing the positional relationship between the metal frame 13 and the wavelength deforming member 4 before caulking, in which FIG. 4A is a perspective view and FIG. 4B is a cross-sectional view. The metal frame 13 before being caulked and fixed includes an upright portion 13b outside the stepped portion 3a. The wavelength conversion member 4 is dropped and placed on the stepped portion 3a so that the slope shape of the cutout portion 4a faces upward. The height from the stepped portion 3 a to the upper surface of the upright portion 13 b is set to be larger than the height from the upper surface of the wavelength conversion member 4. Further, the upper corner portion of each side of the upright portion 13 b is provided with a notch portion 13 c to form a slope, and the metal frame 3 is provided with a mold engaging portion 3 e at the four corners.

<Mold Figure 5>
Next, a mold for performing caulking and fixing will be described.
FIG. 5 shows an upper mold of a mold used for fixing the wavelength conversion member 4 to the metal frame 3 by caulking the upright portion 13b of the metal frame 13 before being caulked and fixed. It is a figure which shows an example of the form of 6. (A) is the perspective view of the lower surface side turned upside down in order to show the shape of the lower surface of the upper mold | type 6, (b) is the perspective view of the upper surface side made into the original direction. 6a is an upper surface portion, 6b is a side surface portion, 6c is a ceiling portion on the lower surface side, 6d is a protruding portion, and 6e is a slope portion.

  The mold consists of an upper mold and a lower mold. The lower mold is a quadrangular cylinder having a bottomed and upright wall surface, and is fixed to a press machine, but is not shown. The cylindrical inner surface of the lower mold has a size that fits the outer surface of the metal frame 13 and the side surface portion 6b of the upper mold before being caulked and fixed, and the upper mold 6 slides up and down inside the lower mold. Further, the slope 6e is formed with a shallower angle with respect to the horizontal plane than the notch 13c of the metal frame 3 shown in FIG.

<Step 3: Step of Caulking and Fixing Wavelength Conversion Member FIG. 6>
6A and 6B are views showing the state before and after the deformation of the metal frame together with the upper mold. FIG. 6A is a perspective view of the state immediately before the deformation process, FIG. 6B is a cross-sectional view thereof, and FIG. , (D) is a sectional view thereof.
At this time, the metal frame 13 before being caulked and fixed in FIGS. 6A and 6B is placed on the stepped portion 3a of the metal frame 13 before the wavelength conversion member 4 is caulked and fixed. It is placed on the bottom of the lower mold (not shown).
At this time, the lower mold of the rectangular tube shape prevents the metal of the upright portion 3b of the metal frame 3 from flowing only to the inside of the metal frame 13 before being caulked and fixed and protruding outward. Although not shown, the operation is self-evident.

  6 (a) and 6 (b), the ceiling portion 6c of the upper mold 6 has a planar shape and rests on the upper surface of the upright portion 13b of the metal frame 13 before being caulked and fixed. Since the upper surface of the upright portion 13b is higher than the upper surface of the wavelength conversion member as described above, a predetermined amount of gap is generated between the upper surface of the wavelength conversion member 4 and the ceiling portion 6c. Further, the protruding end side of the protruding portion 6d is partially engaged with the mold engaging portion 13e of the metal frame 13 before being caulked and fixed.

  6 (c) and 6 (d), the metal frame 13 is placed before the top surface 6a of the upper mold 6 is pressed by a press machine (not shown) and the tip of the protrusion 6d of the upper mold 6 is fixed by caulking. The upper die 6 is lowered until it comes into contact with the bottom surface of the lower die. At this time, the ceiling portion 6c on the lower surface side of the upper mold 6 is brought into contact with the upper surface of the wavelength conversion member 4 by adjusting the amount of metal above the wavelength conversion member in the upright portion of FIG. Can do. That is, the upright portion 13b shown in FIG. 6 (a) is crushed by the ceiling portion 6c and protrudes to the inside of the metal frame to become a deformed portion 3d, and only the notch portion 4a of the wavelength conversion member 4 is caulked and fixed. 3 and the height of the upper surface of the wavelength conversion member 4 can be made the same.

At this time, excessive pressing can be prevented by having the protrusion 6d.
In addition, as described above, the upper mold 6 has both the slope portion 6e and the notch portion 13c of the metal frame 13 before being caulked and fixed, and the slope portion 6e has a shallower angle with respect to the horizontal plane than the notch portion 13c. Is formed. As a result, both the inclined portion 6e and the notch portion 13c serve as a guide, so that the corner portion of the wavelength conversion member 4 with less metal can be caulked and fixed neatly.
In addition, when the upper mold 6 of the mold is lowered, the upright portion 13b of the metal frame 13 before being fixed by caulking so that the metal does not run on the upper surface of the wavelength conversion member 4 and an unnecessary gap is not formed. Of course, the height, the shape / dimension of the notch 13c, the protrusion 6d of the upper mold 6 and the shape / dimension of the slope 6e are set. In this way, the caulking and fixing of the wavelength conversion member 4 is completed.

<About other embodiments>
In the present embodiment, the cutout portion 4a of the wavelength conversion member 4 has a slope shape, but the cutout portion 4 may be formed in a step (step) shape instead of the slope shape. However, since the slope shape can more smoothly plastically deform the metal than the step shape, the caulking and fixing can be performed more cleanly.

In the present embodiment, the upper surface of the wavelength conversion member 4 is a square, but is not limited thereto, and may be a rectangle or a circle. Further, the shape of the metal frame 3 may be arbitrarily changed according to the shape of the wavelength conversion member 4.
In the present embodiment, all four sides of the wavelength conversion member 4 are caulked and fixed. However, the present invention is not limited to this. For example, only two sides facing each other may be fixed.
In the present embodiment, the front translucent member 5 is a convex lens. However, the front translucent member 5 is not limited to this and may be, for example, an optical member such as another lens or a prism, or a transparent heat conducting member having no optical function. May be.

In the present embodiment, a plurality of LED elements 1 have been described. However, the number is not limited, and one LED element 1 may be used.
Furthermore, the mounting method of the LED element is not particularly limited, and the electrode surface and the electrode of the LED element may be joined by wire bonding after flip chip mounting on the substrate or die bonding mounting.

  In addition, it is possible to give various changes to the material and shape of each member. In addition, you may comprise a light-emitting device using light emitting elements other than an LED element.

DESCRIPTION OF SYMBOLS 1 LED element 2 Board | substrate 3 Metal frame 3a Step part 3d Deformation part 4 Wavelength conversion member 4a Notch part 5 Front light-transmitting member 6 Mold 6a Upper surface part 6b Side surface part 6c Ceiling part 6d Projection part 6e Slope part 10 Light-emitting device 13 Caulking Metal frame 13b before being fixed Upright portion 13c Notch portion 13e Mold engaging portion

Claims (4)

An LED element mounted on a substrate;
A metal frame disposed so as to surround the LED element;
A step portion formed inside the metal frame;
A wavelength conversion member on a flat plate disposed in the step portion,
The wavelength conversion member has a notch at the upper surface end,
The metal frame has a protrusion at a location corresponding to the notch,
The protrusion is caulked and fixed so that the height from the lower surface of the substrate to the upper surface of the wavelength conversion member is the same as the height from the lower surface of the substrate to the upper surface of the metal frame. A light emitting device.   The light-emitting device according to claim 1, wherein the notch has a slope shape.   The light emitting device according to claim 1, further comprising a translucent member having a flat bottom surface and disposed in close contact with the top surfaces of the metal frame and the wavelength conversion member.   The light-emitting device according to claim 3, wherein the translucent member is a lens.

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