JP2017508291A - 積層された支持リングを備えるウエハシッパー - Google Patents

積層された支持リングを備えるウエハシッパー Download PDF

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Publication number
JP2017508291A
JP2017508291A JP2016553865A JP2016553865A JP2017508291A JP 2017508291 A JP2017508291 A JP 2017508291A JP 2016553865 A JP2016553865 A JP 2016553865A JP 2016553865 A JP2016553865 A JP 2016553865A JP 2017508291 A JP2017508291 A JP 2017508291A
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JP
Japan
Prior art keywords
wafer
wafer support
support ring
tab
axial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016553865A
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English (en)
Japanese (ja)
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JP2017508291A5 (2
Inventor
エイ． カークランド、エリック
エイ． カークランド、エリック
ヴィ． ラシュケ、ラッセル
ヴィ． ラシュケ、ラッセル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of JP2017508291A publication Critical patent/JP2017508291A/ja
Publication of JP2017508291A5 publication Critical patent/JP2017508291A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
JP2016553865A 2014-02-25 2015-02-24 積層された支持リングを備えるウエハシッパー Pending JP2017508291A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201461944455P 2014-02-25 2014-02-25
US61/944,455 2014-02-25
US201462089087P 2014-12-08 2014-12-08
US201462089103P 2014-12-08 2014-12-08
US62/089,103 2014-12-08
US62/089,087 2014-12-08
PCT/US2015/017345 WO2015130690A1 (en) 2014-02-25 2015-02-24 Wafer shipper with stacked support rings

Publications (2)

Publication Number Publication Date
JP2017508291A true JP2017508291A (ja) 2017-03-23
JP2017508291A5 JP2017508291A5 (2) 2018-04-12

Family

ID=54009550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016553865A Pending JP2017508291A (ja) 2014-02-25 2015-02-24 積層された支持リングを備えるウエハシッパー

Country Status (8)

Country Link
US (1) US10896834B2 (2)
EP (1) EP3111472B1 (2)
JP (1) JP2017508291A (2)
KR (1) KR20160126020A (2)
CN (1) CN106463437B (2)
SG (1) SG11201607061WA (2)
TW (1) TWI733648B (2)
WO (1) WO2015130690A1 (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200143485A (ko) 2018-08-01 2020-12-23 히라따기꼬오 가부시키가이샤 반송 장치 및 제어 방법
JP2021089927A (ja) * 2019-12-03 2021-06-10 三菱電機株式会社 キャリアスペーサおよび半導体装置の製造方法
JP7218482B1 (ja) * 2022-03-30 2023-02-06 アキレス株式会社 半導体ウェーハ搬送容器

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201607061WA (en) 2014-02-25 2016-09-29 Entegris Inc Wafer shipper with stacked support rings
US10658212B2 (en) 2014-11-27 2020-05-19 Achilles Corporation Ring spacer
USD799825S1 (en) * 2015-08-31 2017-10-17 Entegris, Inc. Container
USD801046S1 (en) * 2015-08-31 2017-10-31 Entegris, Inc. Container
US10832927B2 (en) * 2015-12-18 2020-11-10 Texas Instruments Incorporated Interlocking nest wafer protector
DE102016113924B4 (de) 2016-07-28 2024-06-13 Infineon Technologies Ag Waferbox und Verfahren zum Anordnen von Wafern in einer Waferbox
JP6966541B2 (ja) 2016-09-30 2021-11-17 チェ, チェ ソンCHOI, Jae Seung 電動歯ブラシ
USD812907S1 (en) * 2017-01-16 2018-03-20 Endural, Llc Container
WO2019046477A1 (en) 2017-08-29 2019-03-07 Daewon Semiconductor Packaging Industrial Company SEPARATORS FOR HANDLING, TRANSPORTING OR STORING SEMICONDUCTOR WAFERS
DE202019101793U1 (de) * 2018-06-27 2019-10-09 Murata Machinery, Ltd. Vorrichtungen zum mindestens einen aus Substrat-Handhabung, Substrat-Lagerung, Substrat-Behandlung und Substrat-Verarbeitung
US10811292B2 (en) * 2018-09-12 2020-10-20 Texas Instruments Incorporated Transport packaging and method for expanded wafers
US12165905B2 (en) * 2019-05-20 2024-12-10 Applied Materials, Inc. Process kit enclosure system
USD917825S1 (en) 2019-07-16 2021-04-27 Entegris, Inc. Wafer support ring
US12159795B2 (en) 2021-03-08 2024-12-03 Applied Materials, Inc. Enclosure system having walls comprising sidewalls and radio-frequency identifier holder coupled to rear wall
US11664257B2 (en) * 2021-09-21 2023-05-30 Intel Corporation Contactless wafer separator
US12614052B2 (en) 2024-05-28 2026-04-28 Globalfoundries U.S. Inc. Fixture for radio frequency identification tag

Citations (7)

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Publication number Priority date Publication date Assignee Title
JPH0872974A (ja) * 1994-09-07 1996-03-19 Shinon Denki Sangyo Kk 半導体デバイス用トレー
JP3054701U (ja) * 1998-06-05 1998-12-18 株式会社倉元製作所 膜付きガラス基板のスペーサ
JP2004241705A (ja) * 2003-02-07 2004-08-26 Daifuku Co Ltd 被支持体積層支持装置
JP3130509U (ja) * 2007-01-16 2007-03-29 山汰科技企業有限公司 基板搬送装置
JP2008044636A (ja) * 2006-08-11 2008-02-28 Sanyu Kikaku:Kk 収納用トレー
JP2009076646A (ja) * 2007-09-20 2009-04-09 Shin Etsu Polymer Co Ltd 基板保持具
JP2009105116A (ja) * 2007-10-22 2009-05-14 Shin Etsu Polymer Co Ltd ウェーハ収納容器およびウェーハのハンドリング方法

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Publication number Priority date Publication date Assignee Title
JPS61291336A (ja) 1985-06-20 1986-12-22 Matsushita Electric Ind Co Ltd 送出装置
JP2910684B2 (ja) 1996-07-31 1999-06-23 日本電気株式会社 ウエハー容器
DE60044028D1 (de) * 1999-07-23 2010-04-29 Ray G Brooks Sicherungssystem für wafer mit integriertem schaltkreis (ic)
US6550619B2 (en) * 2000-05-09 2003-04-22 Entergris, Inc. Shock resistant variable load tolerant wafer shipper
US7040487B2 (en) 2001-07-14 2006-05-09 Entegris, Inc. Protective shipper
JP4261170B2 (ja) * 2002-11-08 2009-04-30 株式会社ヴァンテック 半導体ウェハ搬送容器
US6926150B2 (en) * 2003-02-05 2005-08-09 Texas Instruments Incorporated Protective interleaf for stacked wafer shipping
JP4329536B2 (ja) 2003-12-26 2009-09-09 アキレス株式会社 半導体ウェハーの収納具
US7225929B2 (en) * 2004-12-30 2007-06-05 Illinois Tool Works Inc. Adjustable height wafer box
TW200746349A (en) 2006-02-08 2007-12-16 Entegris Inc Stacking rings for wafers
FR2901543B1 (fr) * 2006-05-23 2009-02-27 Mezrag Mohamed Seiffeddine Bou Recipient modulaire pour contenir des denrees sensibles a leur mise a l'air.
JP4716928B2 (ja) * 2006-06-07 2011-07-06 信越ポリマー株式会社 ウェーハ収納容器
JP5043475B2 (ja) 2007-03-05 2012-10-10 ミライアル株式会社 半導体ウエハ収納容器
CN101888957B (zh) * 2007-10-12 2013-01-02 大元半导体包装产业有限公司 带有交错壁结构的晶圆容器
US20100224517A1 (en) * 2009-03-03 2010-09-09 Haggard Clifton C Disk separator device
US9224627B2 (en) * 2011-02-16 2015-12-29 Texchem Advanced Products Incorporated Sdn Bhd Single and dual stage wafer cushion and wafer separator
JP5712058B2 (ja) 2011-06-03 2015-05-07 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20140076774A1 (en) * 2012-09-18 2014-03-20 Kurt F. Kaashoek Automated Wafer Container with Equipment Interface
SG11201607061WA (en) 2014-02-25 2016-09-29 Entegris Inc Wafer shipper with stacked support rings
JP6427674B2 (ja) 2014-12-08 2018-11-21 インテグリス・インコーポレーテッド 基板格納用の一体型コーナースプリングを備える水平基板コンテナ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0872974A (ja) * 1994-09-07 1996-03-19 Shinon Denki Sangyo Kk 半導体デバイス用トレー
JP3054701U (ja) * 1998-06-05 1998-12-18 株式会社倉元製作所 膜付きガラス基板のスペーサ
JP2004241705A (ja) * 2003-02-07 2004-08-26 Daifuku Co Ltd 被支持体積層支持装置
JP2008044636A (ja) * 2006-08-11 2008-02-28 Sanyu Kikaku:Kk 収納用トレー
JP3130509U (ja) * 2007-01-16 2007-03-29 山汰科技企業有限公司 基板搬送装置
JP2009076646A (ja) * 2007-09-20 2009-04-09 Shin Etsu Polymer Co Ltd 基板保持具
JP2009105116A (ja) * 2007-10-22 2009-05-14 Shin Etsu Polymer Co Ltd ウェーハ収納容器およびウェーハのハンドリング方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200143485A (ko) 2018-08-01 2020-12-23 히라따기꼬오 가부시키가이샤 반송 장치 및 제어 방법
US11791188B2 (en) 2018-08-01 2023-10-17 Hirata Corporation Transport apparatus and control method
JP2021089927A (ja) * 2019-12-03 2021-06-10 三菱電機株式会社 キャリアスペーサおよび半導体装置の製造方法
JP7330081B2 (ja) 2019-12-03 2023-08-21 三菱電機株式会社 キャリアスペーサおよび半導体装置の製造方法
JP7218482B1 (ja) * 2022-03-30 2023-02-06 アキレス株式会社 半導体ウェーハ搬送容器
WO2023188147A1 (ja) * 2022-03-30 2023-10-05 アキレス株式会社 半導体ウェーハ搬送容器
CN117157742A (zh) * 2022-03-30 2023-12-01 阿基里斯株式会社 半导体晶圆搬运容器
TWI830592B (zh) * 2022-03-30 2024-01-21 日商阿基里斯股份有限公司 半導體晶圓搬運容器
US12159799B2 (en) 2022-03-30 2024-12-03 Achilles Corporation Container for transporting semiconductor wafer

Also Published As

Publication number Publication date
CN106463437A (zh) 2017-02-22
EP3111472A1 (en) 2017-01-04
SG11201607061WA (en) 2016-09-29
TWI733648B (zh) 2021-07-21
TW201539641A (zh) 2015-10-16
KR20160126020A (ko) 2016-11-01
EP3111472B1 (en) 2018-09-26
US20160365265A1 (en) 2016-12-15
WO2015130690A1 (en) 2015-09-03
US10896834B2 (en) 2021-01-19
CN106463437B (zh) 2019-09-06
EP3111472A4 (en) 2017-07-12

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