JP2019176028A5 - - Google Patents

Download PDF

Info

Publication number
JP2019176028A5
JP2019176028A5 JP2018063188A JP2018063188A JP2019176028A5 JP 2019176028 A5 JP2019176028 A5 JP 2019176028A5 JP 2018063188 A JP2018063188 A JP 2018063188A JP 2018063188 A JP2018063188 A JP 2018063188A JP 2019176028 A5 JP2019176028 A5 JP 2019176028A5
Authority
JP
Japan
Prior art keywords
electronic component
holding head
mounting
film
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018063188A
Other languages
English (en)
Japanese (ja)
Other versions
JP7023154B2 (ja
JP2019176028A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2018063188A priority Critical patent/JP7023154B2/ja
Priority claimed from JP2018063188A external-priority patent/JP7023154B2/ja
Priority to KR1020190032935A priority patent/KR102253289B1/ko
Priority to CN201910237691.XA priority patent/CN110323146B/zh
Priority to TW108110637A priority patent/TWI723362B/zh
Publication of JP2019176028A publication Critical patent/JP2019176028A/ja
Publication of JP2019176028A5 publication Critical patent/JP2019176028A5/ja
Application granted granted Critical
Publication of JP7023154B2 publication Critical patent/JP7023154B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2018063188A 2018-03-28 2018-03-28 電子部品実装装置 Active JP7023154B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018063188A JP7023154B2 (ja) 2018-03-28 2018-03-28 電子部品実装装置
KR1020190032935A KR102253289B1 (ko) 2018-03-28 2019-03-22 전자 부품 실장 장치
CN201910237691.XA CN110323146B (zh) 2018-03-28 2019-03-27 电子零件封装装置
TW108110637A TWI723362B (zh) 2018-03-28 2019-03-27 電子零件封裝裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018063188A JP7023154B2 (ja) 2018-03-28 2018-03-28 電子部品実装装置

Publications (3)

Publication Number Publication Date
JP2019176028A JP2019176028A (ja) 2019-10-10
JP2019176028A5 true JP2019176028A5 (2) 2021-04-22
JP7023154B2 JP7023154B2 (ja) 2022-02-21

Family

ID=68113034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018063188A Active JP7023154B2 (ja) 2018-03-28 2018-03-28 電子部品実装装置

Country Status (4)

Country Link
JP (1) JP7023154B2 (2)
KR (1) KR102253289B1 (2)
CN (1) CN110323146B (2)
TW (1) TWI723362B (2)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7497838B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497842B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497839B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497843B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497841B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497837B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7507396B2 (ja) * 2020-12-25 2024-06-28 パナソニックＩｐマネジメント株式会社 部品圧着装置および部品移送方法
CN115148616B (zh) * 2021-03-31 2025-09-23 芝浦机械电子装置株式会社 电子零件安装装置
JP7812679B2 (ja) * 2021-03-31 2026-02-10 芝浦メカトロニクス株式会社 電子部品実装装置
JP7837178B2 (ja) * 2021-03-31 2026-03-30 芝浦メカトロニクス株式会社 電子部品実装装置
CN115148617A (zh) * 2021-03-31 2022-10-04 芝浦机械电子装置株式会社 电子零件安装装置
JP7154449B1 (ja) * 2021-10-28 2022-10-17 芝浦メカトロニクス株式会社 電子部品実装装置
CN116180022B (zh) * 2021-11-19 2025-05-23 芝浦机械电子装置株式会社 供给装置及成膜装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2685561B1 (fr) * 1991-12-20 1994-02-04 Thomson Hybrides Procede de cablage d'une barrette de lasers et barrette cablee par ce procede.
JP4109905B2 (ja) * 2002-05-31 2008-07-02 松下電器産業株式会社 部品実装基板生産装置
KR101065907B1 (ko) * 2002-12-02 2011-09-19 파나소닉 주식회사 부품 공급 헤드 장치, 부품 공급 장치, 부품 실장 장치, 및실장 헤드부의 이동 방법
JP4627643B2 (ja) 2004-08-20 2011-02-09 芝浦メカトロニクス株式会社 実装用電子部品の供給装置
JP4323410B2 (ja) * 2004-10-22 2009-09-02 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP4518257B2 (ja) 2005-01-19 2010-08-04 株式会社日立ハイテクノロジーズ 半導体装置実装装置
JP4802003B2 (ja) * 2006-01-30 2011-10-26 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
US8328498B2 (en) 2007-01-25 2012-12-11 Panasonic Corporation Component feeding unit and method, and component mounting apparatus and method
KR101166058B1 (ko) * 2007-02-22 2012-07-19 시바우라 메카트로닉스 가부시키가이샤 전자 부품의 실장 장치 및 실장 방법
CN100561696C (zh) * 2007-03-01 2009-11-18 全懋精密科技股份有限公司 嵌埋半导体芯片的结构及其制法
US8646171B2 (en) * 2008-04-01 2014-02-11 Panasonic Corporation Component mounting apparatus and method
US8528196B2 (en) * 2009-01-08 2013-09-10 Panasonic Corporation Component mounting apparatus and method
JP2011040489A (ja) * 2009-08-07 2011-02-24 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
KR101399973B1 (ko) * 2012-12-21 2014-06-19 세광테크 주식회사 인라인 자동 ｏｌｂ 본딩장치

Similar Documents

Publication Publication Date Title
JP2019176028A5 (2)
CN107432106B (zh) 安装作业机
MY172198A (en) A test handler that picks up electronic devices for testing and an orientation-changing apparatus for use in a test handler
JPWO2016129069A1 (ja) 部品供給装置
JP5679432B2 (ja) 部品実装機
JPWO2016129057A1 (ja) 装着作業機
JP2018105730A5 (2)
MY198794A (en) Workpiece processing method and processing apparatus
US10555447B2 (en) Component supply device that supplies components from a scattered state and mounting machine that mounts the component
JP6748713B2 (ja) 部品供給装置
TW200642933A (en) Substrate carrying device
CN111096098B (zh) 元件供给装置
JPWO2017037926A1 (ja) 部品実装機
CN108136595B (zh) 元件供给系统及分散元件的拾取装置
EP2755462A3 (en) Electronic component mounting apparatus
CN107926152B (zh) 作业分配装置
JP2017038012A5 (2)
JP2017067591A5 (2)
JP6096292B2 (ja) 電子部品装着機
CN105379445B (zh) 电子元件的分配方法及电子元件安装系统
CN111713185B (zh) 元件安装系统及元件保持方法
JP2019204973A5 (ja) エラー対応方法
JP2009277907A (ja) 部品供給装置およびこれを備えた表面実装機
US10939599B2 (en) Component-mounting device
CN111386755A (zh) 元件供给装置