JP2020004874A - Electronic component with lead wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component with a lead wire which can be easily and surely connected between a circuit board and a lead wire without a connection failure or deterioration. SOLUTION: This is an electronic component 1 with a lead wire including a circuit board 10, a case 30 for accommodating the circuit board 10, and a lead wire 50 connected to a connection pattern 23 of the circuit board 10 via a terminal 80. .. The connection portion A in which the lead wire 50 is connected to the terminal 80 by the solder 60 is sealed by a sealing body 70 made of a material different from the material of the case 30. The sealant 70 is made of a molding material that has adhesiveness when melted. [Selection diagram] Fig. 3

Description

  The present invention relates to an electronic component with a lead wire.

  2. Description of the Related Art Conventionally, among rotary electronic components, as shown in FIG. 1 of Patent Document 1, for example, a metal terminal plate (20) is directed outward from an outer peripheral side wall of a molded product (30) for a rotary electronic component. Some have a protruding structure. This type of rotary electronic component is placed on a separately prepared main circuit board, for example, and each metal terminal plate (20) is soldered to a terminal connection pattern formed on the main circuit board. Used as

  On the other hand, conventionally, as another method of using the rotary electronic component, there is a case where the metal terminal plate (20) is used by connecting to a lead wire instead of a separately prepared main circuit board. In such a case, a lead wire is soldered to each metal terminal plate (20).

JP-A-10-172630

However, when a lead wire is soldered to each metal terminal plate (20), there are the following problems.
That is, although the connecting portion between the metal terminal plate (20) and the lead wire is generally exposed, stress is easily concentrated on the connecting portion when the lead wire is bent. There is a possibility that deterioration or poor connection may occur.

  In addition, the exposed connection portion is easily affected by various liquids, dusts, and the like, and from this point, there is a possibility that the connection portion may be deteriorated or poorly connected.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a lead wire capable of easily and reliably connecting between a circuit board and a lead wire connected via terminals without connection failure or deterioration. Provided is an electronic component with the same.

The present invention relates to a circuit board on which a circuit pattern and a connection pattern connected to the circuit pattern are formed, a case for housing the circuit board, and a lead wire connected to the connection pattern of the circuit board via a terminal. And a connection part connecting the lead wire to the terminal is sealed with a sealing body made of a material different from a material of the case.
According to the present invention, the connection portion between the terminal and the lead wire is sealed by the sealing body, so that the connection portion can be reinforced, and even if stress is applied to the connection portion by bending the lead wire, The connection failure of the connection portion can be prevented. At the same time, sealing is performed by the sealing body, so that waterproofing and dustproofing can be achieved. This also prevents deterioration and poor connection of the connection portion.
In addition, since the sealing body and the case are made of different materials, the case selects a material suitable for housing the circuit board, and the sealing body selects a material suitable for sealing the connection portion. The connection state of the connection portion can be suitably maintained.

In addition, in the present invention, in addition to the above features, the lead wire is connected to a portion of the terminal connected to the connection pattern of the circuit board, the portion protruding outward from the case, and the sealing body is connected to the connection portion. Is sealed.
Preferably, the sealing body is formed up to a position where the sealing body is bonded to a surface of the case from which the terminal protrudes. If the sealing body is bonded to the surface of the case, when the lead wire is bent or the like, the stress is received by the case and the sealing body, and the stress on the connection portion can be more effectively reduced.

Further, the present invention is characterized in that, in addition to the above features, the sealing body is made of a molding material having an adhesive property when melted.
ADVANTAGE OF THE INVENTION According to this invention, since the adhesiveness of the sealing body with respect to the connection part between a circuit board and a lead wire can be improved, more effective waterproofing and dust proofing can be achieved.

  ADVANTAGE OF THE INVENTION According to this invention, connection between the circuit board connected via a terminal and a lead wire can be performed easily easily, without connection failure or deterioration.

It is the perspective view which looked at electronic component 1 with a lead wire from the upper part. FIG. 2 is a perspective view of the electronic component with leads 1 as viewed from below. FIG. 2 is a schematic sectional view taken along the line BB of FIG. 1. FIG. 4 is an explanatory view of an assembling method of the electronic component 1 with lead wires. FIG. 4 is an explanatory view of an assembling method of the electronic component 1 with lead wires. FIG. 4 is an explanatory view of an assembling method of the electronic component 1 with lead wires. It is a figure which shows the sealing body 70 by itself.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a perspective view of an electronic component with leads 1 according to an embodiment of the present invention as viewed from above, FIG. 2 is a perspective view of the electronic component with leads 1 viewed from below, and FIG. 4 to 6 are explanatory diagrams of an assembling method of the electronic component 1 with lead wires, and FIG. 7 is a diagram showing the sealing body 70 alone.

  As shown in FIGS. 1 to 3, the electronic component 1 with lead wires includes a circuit board 10, a case 30 for housing the circuit board 10, and a plurality of (three in this example) connected to the circuit board 10. The terminal 80, a plurality of (three in this example) lead wires 50 connected to each terminal 80, a connection portion A where the lead wire 50 is connected to the terminal 80 are sealed, and the lead wires 50 are bundled. And a sealing body 70. In the following description, “upper” refers to the direction in which the surface of the circuit board 10 on which the following circuit patterns (such as the current collecting pattern 13 and the resistor pattern 15) are formed is viewed from the opposite surface side. It refers to the opposite direction.

  As shown in FIG. 4, the circuit board 10 is formed concentrically on a top surface of a hard and insulative board (hereinafter referred to as a “hard board”) 11 with a current collecting pattern (circuit pattern) 13 and a resistor pattern (circuit pattern). (Pattern) 15 are formed. At a substantially central portion of the hard substrate 11, a shaft support hole 17 formed of a circular through hole that rotatably supports a rotating body to which a slider (not shown) is attached is provided. A connection pattern forming portion 19 is formed on a part of the outer periphery of the hard substrate 11 by projecting it outward in a rectangular shape.

  The current collecting pattern 13 is formed in a ring shape so as to surround the shaft support hole 17 by screen printing a conductive paste having a low resistance value. One lead-out pattern (circuit pattern) 13a is drawn radially outward (in the direction of the connection pattern forming portion 19) from the outer periphery of the current collecting pattern 13, and a connection pattern 23 is formed at the tip thereof. I have. This connection pattern 23 is located at the center of the connection pattern forming section 19.

  The resistor pattern 15 is formed in a C-shape so as to surround the current collecting pattern 13 by, for example, screen printing a resistor paste having a desired resistance value. From both ends of the resistor pattern 15, a pair of extraction patterns (circuit patterns) 15a are respectively drawn outward in the radial direction (in the direction of the connection pattern forming portions 19), and connection patterns 23 are formed at the ends thereof. ing. The connection patterns 23 are respectively located near the left and right sides of the connection pattern forming section 19. Each of the lead patterns 13a and 15a and each of the connection patterns 23 are formed by screen printing of a conductive paste having a low resistance value.

  As shown in FIG. 5, the case 30 is an integrally molded product made of a hard synthetic resin, and is formed in a substantially box shape with an open upper surface. That is, the case 30 is configured to include side walls 31a, b, c, and d surrounding the periphery of the circuit board 10, and a bottom surface 31e covering the bottom surface of the circuit board 10. The center of the upper surface of the case 30 is a substantially circular rotating body storage section 33. The current collecting pattern 13 and the resistor pattern 15 on the upper surface of the circuit board 10 are exposed on the bottom surface of the rotator housing portion 33. A metal plate terminal 80 is connected to each connection pattern 23 of the circuit board 10 using a conductive adhesive or the like, and the upper and lower portions of the connected portion are molded into a case 30 (portion of the side wall 31d). The terminal 80 has a portion on the tip end side protruding outside from the side wall 31 d of the case 30. A circular through hole 35 communicating with the shaft support hole 17 of the circuit board 10 is formed at the center of the bottom surface 31 e of the case 30. Further, a groove 39 is formed from the left and right side walls 31a, 31c to the bottom surface of the case 30 to insert a locking claw of a cover (not shown) that covers the upper surface of the case 30.

  The lead wire 50 has a configuration in which the electric wire 51 is covered with an insulating coating tube 53, and the insulating coating tube 53 at the tip portion is peeled off to expose the electric wire 51.

  FIG. 7 is a diagram illustrating the sealing body 70 alone. Although the lead wire 50 and the terminal 80 are actually insert-molded inside the sealing body 70 shown in the figure, a cavity or the like is formed, but for convenience of illustration, it is shown in a solid state. I have. As shown in FIG. 1 and FIGS. 1 to 3, the sealing body 70 is made of a hot-melt adhesive for low-pressure molding and has flexibility after curing, that is, a material different from the material of the case 30. It is constituted by. A hot-melt adhesive (hot-melt resin) has a property of being solid at normal temperature and being liquid at high temperature, and contains a thermoplastic resin as a main component. The sealing body 70 is formed in a substantially rectangular shape (substantially a band shape) as a whole, and includes a sealing body body portion 71 that seals a connection portion A where the lead wire 50 is connected to the terminal 80, and a portion of the lead wire 50. And a lead wire sealing portion 73 for sealing the wire. In this embodiment, the thickness of the sealing body main portion 71 and the thickness of the lead wire sealing portion 73 are the same.

  The sealing body main part 71 is plate-shaped and substantially rectangular, and is formed in such a size as to enclose and seal the entire connection portion A. The case 30 side end surface of the sealing body main body 71 is in close contact (adhesion / fixation) with the outer surface of the side wall 31 d protruding the terminal 80 of the case 30. On the other hand, the lead wire sealing portion 73 is plate-shaped and substantially rectangular, and all the three lead wires 50 are bundled and fixed over a predetermined length.

  A plurality of (three) linear grooves 75 extending in the width direction (the direction intersecting the longitudinal direction of the lead wire 50) are provided at opposing positions on the upper and lower surfaces of the sealing body 70. The depth of the two groove portions 75 on the side closer to the case 30 is formed shallow, and the depth of the groove portion 75 on the side away from the case 30 is increased so that a part of the surface of the insulating coating tube 53 of the lead wire 50 is exposed. It is formed so that.

  The lead wires 50 used in this embodiment are spaced at a predetermined interval in each connection portion A, but are installed so as to come into contact with each other from the middle. For this reason, the lead wire 50 bends in the middle thereof, but since the bent portion is fixed by the sealing body 70, the bent state can be easily maintained.

  Next, a method for manufacturing the electronic component 1 with lead wires will be described. In order to manufacture the electronic component 1 with lead wires, first, as shown in FIG. 4, one end of the terminal 80 is placed on each connection pattern 23 of the circuit board 10, and Is stored in the mold. A conductive adhesive may be interposed between each connection pattern 23 and the terminal 80. Then, a molten thermoplastic molding material for injection molding is injection molded into a cavity having the shape of the case 30 formed around the housed circuit board 10. When the mold is removed, the case 30 in which the circuit board 10 and the terminals 80 are insert-molded is completed. The thermoplastic molding material for injection molding used here is a material suitable for integrating the circuit board 10 by insert molding, for example, polybutylene terephthalate (PBT), polyethylene terephthalate (PET), or polyphenylene sulfe. Synthetic resin such as PPS (PPS) is used. FIG. 5 shows the circuit board 10, the case 30, and the terminals 80 (although the lead wires 50 are also shown together) at this time. As shown in the figure, the current collecting pattern 13 and the resistor pattern 15 are exposed in the rotating body housing portion 33 of the case 30. The other side of the terminal 80 connected to the connection pattern 23 protrudes from the outer side surface of the side wall 31 d of the case 30.

  Next, as shown in FIG. 6, the electric wire 51 of each lead wire 50 and each terminal 80 are connected by soldering a solder 60 or the like. This connection may be performed using various conductive adhesives other than the solder 60, or may be performed using a separate metal fitting or the like.

  Next, the circuit board 10 with the case 30 to which the respective lead wires 50 are connected is housed in a mold, and the cabinet having the shape of the sealing body 70 formed on the outer peripheral side of the side wall 31 d of the housed case 30 is housed. A molten hot-melt adhesive for low-pressure molding is injected into the tee, and the sealing body 70 is molded. In the case of this hot melt adhesive, the connection portion A due to the solder 60 is not damaged because it can be molded at a low pressure. Then, when the mold is removed, the electronic component 1 with lead wires according to the present embodiment is completed. Note that the above assembling procedure is one example, and it goes without saying that the assembling may be performed using other various assembling procedures.

  The hot-melt adhesive for low-pressure molding used here is, as described above, a molding material having an adhesive property upon melting, and the surface of the terminal 80 projecting outward from the side wall 31d of the case 30; The exposed surfaces of the electric wires 51 and the distal end portion of the insulating coating tube 53, the surface of the solder 60, and the outer surface of the side wall 31 d of the case 30 from which the terminal 80 protrudes are adhered and sealed. That is, the sealing body 70 has an adhesive property over the entire connection portion A (see FIG. 3) of the electric wire 51 of the lead wire 50 connected indirectly to the connection pattern 23 of the circuit board 10 via the terminal 80 by the solder 60. And is securely connected (fixed) to the case 30 with adhesiveness, and furthermore, the insulating coating tube 53 at the tip of each lead wire 50 is securely attached to a predetermined position with adhesiveness. Hold. As described above, since the sealing body 70 seals each member to be sealed with adhesiveness, it is possible to surely prevent liquid or dust from entering. In addition, since the sealing body 70 has elasticity (flexibility), the lead wire 50 can be easily bent.

  Here, the reason why the groove portion 75 having a depth reaching the insulating coating tube 53 of the lead wire 50 is formed in the lead wire sealing portion 73 of the sealing body 70 is as follows. That is, since the lead wires 50 are flexible, they are set in a state of being floated in a cavity of a mold, and when a molten hot melt adhesive is injected into the cavity, each lead wire 50 becomes hot. It may move due to the injection pressure of the melt adhesive, and their positions may not be constant. Therefore, a linear projection extending from the top and bottom of the mold to the lead wire 50 is provided in the mold having the cavity, and the lead wire 50 is sandwiched and held by the upper and lower projections. The hot melt adhesive was filled. The groove 75 is formed by the projection at this time, and a part of the surface of the insulating coating tube 53 of the lead wire 50 is exposed at the bottom surface. In particular, in this example, the tip of each lead wire 50 widens the interval between each lead wire 50 to connect each wire 51 to the terminal 80 arranged at a predetermined interval, while sealing the lead wire 50 The portion of the side protruding from the body 70 is narrowed so that the respective lead wires 50 come into contact with each other. For this reason, since the lead wire 50 is bent in the middle thereof, the bent portion is pressed by the projecting portion of the mold, thereby changing the bent state of the electric wire 50 in the cavity when the sealing body 70 is formed. It is configured not to. The reason why the groove 75 is provided in a direction (orthogonal direction in this example) that intersects with the lead-out direction of the lead wire 50 is that the sealing body 70 (that is, the three lead wires 50) can be easily bent in the vertical direction. In order to That is, the deeper groove portion 75 is provided for two reasons for holding the lead wire 50 by the mold at the time of molding the sealing body 70 and for giving the sealing body 70 flexibility. The shallow groove 75 is provided to give the sealing body 70 flexibility. The depth of each groove 75 can be changed as necessary. For example, the depth of all the grooves 75 may be a deep groove reaching the surface of the insulating coating tube 53.

  As described above, in the electronic component with lead wire 1, the connection portion A with the lead wire 50 that is indirectly connected to the connection pattern 23 of the circuit board 10 via the terminal 80 is sealed by the sealing body 70. Therefore, the connection portion A can be reinforced, and even if stress is applied due to bending of the lead wire 50 or the like, connection failure of the connection portion A can be prevented. At the same time, since the sealing is performed by the sealing body 70, waterproofing and dustproofing can be achieved, so that the deterioration and the poor connection of the connection portion A can be prevented.

  In addition, since the sealing body 70 and the case 30 are made of different materials, the case 30 is made of a material suitable for housing the circuit board 10, and the sealing body 70 is suitable for sealing the connection portion A. Materials can be selected, and the connection state of the connection portion A can be suitably maintained. In particular, in this embodiment, since the molding material having adhesiveness at the time of melting is used as the sealing body 70, the adhesion of the sealing body 70 to the connection portion A can be increased, and more effective waterproofing and dustproofing can be achieved. Can be achieved.

  Further, as in the case of the electronic component 1 with a lead wire, the sealing body 70 is formed from the connection portion A to a position where the sealing body 70 is bonded to the surface of the case 30 from which the terminals 80 protrude. When the lead wire 50 is bent or the like, the case 30 and the sealing body 70 receive the stress when the lead wire 50 is bent, so that the stress on the connection portion A is more effectively reduced.

  Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications may be made within the scope of the claims and the technical idea described in the specification and the drawings. It is possible. Note that any shape, structure, or material not directly described in the specification and drawings is within the scope of the technical idea of the present invention as long as the effects and effects of the present invention are exhibited. For example, in the above-described embodiment, an example in which the present invention is applied to a circuit board for a rotary electronic component has been described. However, the present invention is not limited to this. For example, a circuit board for a sliding electronic component and other various circuits It may be applied to a substrate. Also, various changes can be made to the shape and structure of the case, the sealing body, the terminals, the number of lead wires, and the like. Also, various changes can be made to the material of the case and the material of the sealing body. In short, both materials may be different materials according to the members to be molded. Further, the embodiments described in the above description and in the respective drawings can be combined with each other as long as there is no inconsistency in the object and the configuration. In addition, the above description and the contents of each drawing may be independent embodiments even if they are a part thereof, and the embodiment of the present invention is one embodiment in which the above description and each drawing are combined. However, the present invention is not limited to this.

DESCRIPTION OF SYMBOLS 1 Electronic component with a lead wire 10 Circuit board 13 Current collection pattern (circuit pattern)
13а Withdrawal pattern (circuit pattern)
15 Resistor pattern (circuit pattern)
15a Drawing pattern (circuit pattern)
23 connection pattern A connection part 30 case 50 lead wire 70 sealing body 80 terminal

Claims (3)

A circuit board formed with a circuit pattern and a connection pattern connected to the circuit pattern; a case for housing the circuit board; and a lead wire connected to the connection pattern of the circuit board via a terminal. Electronic components with lead wires
An electronic component with a lead wire, wherein a connection portion connecting the lead wire to the terminal is sealed with a sealing body made of a material different from a material of the case. It is an electronic component with a lead wire according to claim 1,
The lead wire is connected to a portion of the terminal connected to the connection pattern of the circuit board, the portion protruding outward from the case, and the sealing body seals the connection portion. Electronic parts with lead wires. The electronic component with a lead wire according to claim 1 or 2,
The electronic component with a lead wire, wherein the sealing body is made of a molding material having an adhesive property when melted.

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