JP2020004877A - Flattening device, flattening method, article manufacturing method, and method of creating droplet arrangement pattern data - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an advantageous technique for flattening a composition on a substrate. SOLUTION: A composition and a mold are brought into contact with a droplet supply unit for arranging a plurality of droplets of the composition on a first region including a center position of a substrate and a second region outside the first region. It has a mechanism for flattening the composition and then separating the mold from the composition, and is thicker than the composition arranged in the first region by stacking droplets of the composition on the second region. The composition is placed on the two regions, and the composition on the first region and the composition stacked on the second region are brought into contact with the mold to flatten the composition on the first region. Separate the mold from the composition on the first and second regions. [Selection diagram] Fig. 3

Description

  The present invention relates to a flattening device, a flattening method, an article manufacturing method, and a method of creating droplet arrangement pattern data.

  The demand for miniaturization of semiconductor devices has been increasing, and in addition to the conventional photolithography technology, a microfabrication technology that forms an uncured composition on a substrate with a mold and cures it to form a pattern of the composition on the substrate has been developed. Attention has been paid. Such a technique is called an imprint technique, and can form a fine pattern on the order of several nanometers on a substrate.

  One of the imprint techniques is, for example, a photo-curing method. An imprint apparatus employing a photo-curing method molds a photo-curable composition supplied to a shot area on a substrate with a mold, irradiates light to cure the composition, and forms a mold from the cured composition. By separating, a pattern is formed on the substrate.

  In recent years, a technique for planarizing a composition on a substrate has been proposed (see Patent Document 1). The technology disclosed in Patent Literature 1 aims to improve the accuracy of flattening by dropping a composition based on a step of a substrate and curing the composition in a state in which a plane of a mold is in contact with the dropped composition. Things.

JP 2011-529626 A

  However, in the conventional flattening apparatus, since the mold and the composition on the substrate are brought into contact with each other in a larger area than the imprint apparatus, the mold is separated from the mold. When the release force is increased, the release operation itself cannot be performed normally, or the composition on the substrate is not properly planarized.

  Therefore, an object of the present invention is to provide a technique advantageous for flattening a composition on a substrate.

  According to one embodiment of the present invention, there is provided a planarization apparatus for planarizing a composition on a substrate using a mold, wherein the first region includes a center position of the substrate and the first region. A droplet supply unit for disposing a plurality of droplets of the composition on the outer second region, and contacting the composition and the mold arranged by the droplet supply unit to flatten the composition, A mechanism for separating the composition and the mold, wherein the droplet supply unit is configured to stack the droplets of the composition on the second region so as to be thicker than the composition disposed in the first region. Disposing a composition on the second region; and contacting a mold with the composition on the first region and the composition stacked on the second region to form the first region. After planarizing the above composition, the first region and the second region Release the formed product and the mold, characterized in that.

  ADVANTAGE OF THE INVENTION According to this invention, the technique advantageous in planarizing the composition on a board | substrate can be provided.

It is the schematic which shows the structure of a flattening apparatus. FIG. 9 is a diagram for describing an outline of a flattening process. It is sectional drawing of the board | substrate with which the composition was arrange | positioned. It is sectional drawing at the time of making the board | substrate contact the board | substrate at the time of a planarization process. 5 is a flowchart for explaining a flattening process in the flattening device. It is sectional drawing after a planarization process. 5 is a flowchart of a method for creating a droplet arrangement pattern.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, the same members are denoted by the same reference numerals, and redundant description will be omitted.

  FIG. 1 is a schematic diagram showing the configuration of the planarizing device 100. The planarization apparatus 100 is embodied as a molding apparatus that forms a composition on the substrate 1 using a mold 11 (mold, template). In the present embodiment, the composition on the substrate is planarized. The planarizing apparatus 100 cures the composition in a state where the composition on the substrate and the mold are in contact with each other, and separates the cured composition from the mold to form a global or local flat surface of the composition on the substrate. To form

  The substrate is typically a silicon wafer, but is not limited to this. The substrate 1 can be arbitrarily selected from those known as substrates for semiconductor devices such as aluminum, titanium-tungsten alloy, aluminum-silicon alloy, aluminum-copper-silicon alloy, silicon oxide, and silicon nitride. it can. Note that, as the substrate 1, a substrate in which an adhesion layer is formed by a surface treatment such as a silane coupling treatment, a silazane treatment, or the formation of an organic thin film to improve the adhesion with the curable composition may be used. . The substrate 1 is typically circular with a diameter of 300 mm, but is not limited to this.

  As the mold 11, a mold made of a light transmissive material may be used in consideration of a light irradiation step. Specific examples of the material of the material forming the mold 11 include glass, quartz, a light-transparent resin such as PMMA (Polymethyl methacrylate), a polycarbonate resin, a transparent metal vapor-deposited film, a flexible film such as polydimethylsiloxane, and photo-curing. Films, metal films and the like are preferred. The mold 11 is preferably a circle having a diameter larger than 300 mm and smaller than 500 mm, but is not limited to this. The thickness of the mold 11 is preferably not less than 0.25 mm and less than 2 mm, but is not limited thereto.

  As the composition, a UV curable liquid is preferably used in consideration of a light irradiation step. Typically, monomers such as acrylates and methacrylates may be used.

  As shown in FIG. 1, the flattening apparatus 100 includes a chuck 2, a substrate stage 3, a base platen 4, a support 5, a top plate 6, a guide bar plate 7, a guide bar 8, a mold driving unit 9, a support 10, a mold It has a chuck 12, a head 13, and an alignment shelf 14. The flattening device 100 includes a droplet supply unit 20, an off-axis alignment (OA) scope 21, a substrate transport unit 22, an alignment scope 23, a light source 24, a stage drive unit 31, a mold transport unit 32, a cleaning unit 33, It has a control unit 200. The chuck 2 and the substrate stage 3 constitute a substrate holder for holding the substrate 1, and the mold chuck 12 and the head 13 constitute a mold holder for holding the mold 11. Here, the XYZ coordinate system is defined such that the horizontal plane is the XY plane and the vertical direction is the Z-axis direction.

  Referring to FIG. 1, a substrate 1 is carried in from outside of a flattening apparatus 100 or a storage box in which a wafer is stored by a substrate transfer unit 22 including a transfer hand or the like, and is held by a chuck 2. The substrate stage 3 is supported by a base platen 4 and driven in the X-axis direction and the Y-axis direction to position the substrate 1 held by the chuck 2 at a predetermined position. The stage driving unit 31 includes, for example, a linear motor and an air cylinder, and drives (moves) the substrate stage 3 in at least the X-axis direction and the Y-axis direction. (Six axis directions). The stage drive unit 31 includes a rotation mechanism, and drives (rotates) the chuck 2 or the substrate stage 3 around an axis parallel to the Z-axis direction.

  The mold 11 is carried in from outside of the flattening apparatus 100 or from a storage box in which the mold is stored, and is held by the mold chuck 12 by a mold transfer unit 32 including a transfer hand or the like. The mold 11 has, for example, a circular or square outer shape, and includes a flat portion 11a on a lower surface. The flat portion 11a has such a rigidity that it comes into contact with the composition on the substrate and follows the surface shape of the substrate 1. The flat portion 11 a has the same size as the substrate 1 or a size larger than the substrate 1. The mold chuck 12 is supported by the head 13 and has a function of correcting the inclination of the mold 11 around the Z axis. Each of the mold chuck 12 and the head 13 includes an opening through which light (ultraviolet light) emitted from the light source 24 via the collimator lens passes. A load cell for measuring a pressing force (imprinting force) of the mold 11 against the composition on the substrate is arranged on the mold chuck 12 or the head 13.

  On the base platen 4, a column 5 for supporting a top plate 6 is arranged. The guide bar 8 penetrates the top plate 6, one end is fixed to the guide bar plate 7, and the other end is fixed to the head 13. The mold driving unit 9 drives the head 13 in the Z-axis direction via the guide bar 8 to bring the mold 11 held by the mold chuck 12 into contact with the composition on the substrate, or from the composition on the substrate. It is a mechanism that separates. The mold driving unit 9 has a function of driving (moving) the head 13 in the X-axis direction and the Y-axis direction, and a function of rotating and driving the mold chuck 12 or the head 13 around an axis parallel to the Z-axis direction. Have.

  The alignment shelf 14 is suspended from the top plate 6 via the columns 10. The guide bar 8 penetrates the alignment shelf 14. Further, a height measuring system (not shown) for measuring the height (flatness) of the substrate 1 held by the chuck 2 is disposed on the alignment shelf 14 using, for example, an oblique incident image shift method. ing.

  The OA scope 21 is supported by the alignment shelf 14. The OA scope 21 is used for global alignment processing for detecting alignment marks provided in a plurality of shot areas of the substrate 1 and determining respective positions of the plurality of shot areas.

  The alignment scope 23 includes an optical system and an imaging system for observing a reference mark provided on the substrate stage 3 and an alignment mark provided on the mold 11. However, when no alignment mark is provided on the mold 11, the alignment scope 23 may not be provided. The alignment scope 23 is used for alignment that measures a relative position between a reference mark provided on the substrate stage 3 and an alignment mark provided on the mold 11 and corrects the positional deviation. By performing a relative alignment between the mold 11 and the substrate 1 by obtaining a positional relationship between the mold 11 and the substrate stage 3 by the alignment scope 23 and obtaining a positional relationship between the substrate stage 3 and the substrate 1 by the OA scope 21. Can be.

  The droplet supply unit 20 is configured by a dispenser including a discharge port (nozzle) that discharges an uncured (liquid) composition to the substrate 1, and drops (disposes) (drops) the composition on the substrate. . The droplet supply unit 20 can supply, for example, a piezo jet method, a micro solenoid method, or the like, and a droplet-shaped composition having a small volume on a substrate. Further, the number of discharge ports in the droplet supply unit 20 is not limited, and may be one (single nozzle) or may exceed 100. That is, a linear nozzle array may be used, or a plurality of linear nozzle arrays may be combined.

  The cleaning unit 33 cleans (cleans) the mold 11 while the mold 11 is held by the mold chuck 12. The cleaning unit 33 removes the composition adhered to the mold 11, in particular, the plane part 11 a by separating the mold 11 from the cured composition on the substrate. The cleaning unit 33 may wipe off the composition attached to the mold 11 or may remove the composition attached to the mold 11 using UV irradiation, wet cleaning, plasma cleaning, or the like.

  The control unit 200 includes a processing unit such as a CPU, another processor, and an FPGA, and a storage unit such as a memory, and controls the entire flattening apparatus 100. The control unit 200 functions as a processing unit that controls each unit of the flattening apparatus 100 and performs a flattening process. Here, the flattening process is a process of flattening the composition by bringing the flat portion 11a of the mold 11 into contact with the composition on the substrate and causing the flat portion 11a to follow the surface shape of the substrate 1. The flattening process is generally performed in lot units, that is, for each of a plurality of substrates included in the same lot.

  Next, an outline of the flattening process will be described with reference to FIGS. In the present embodiment, a process in which the composition and the mold on the entire surface of the substrate are brought into contact with each other and the composition is planarized will be described. It may be flattened.

  First, as shown in FIG. 2A, a plurality of droplets of the composition IM are dropped from the droplet supply unit 20 onto the substrate 1 on which the underlying pattern is formed. FIG. 2A shows a state before the composition IM is supplied onto the substrate and the mold 11 is brought into contact with the composition IM. Next, as shown in FIG. 2B, the composition IM on the substrate is brought into contact with the plane portion 11a of the mold 11. FIG. 2B shows a state in which the flat portion 11 a of the mold 11 is completely in contact with the composition IM on the substrate, and the flat portion 11 a of the mold 11 follows the surface shape of the substrate 1. Then, in the state shown in FIG. 2B, the composition IM on the substrate is irradiated with light from the light source 24 via the mold 11 to cure the composition IM. Next, as shown in FIG. 2C, the mold 11 is separated from the cured composition IM on the substrate. Thereby, a flattening layer of the composition IM having a uniform thickness can be formed on the entire surface of the substrate 1. FIG. 2C shows a state where a planarizing layer of the composition IM is formed on the substrate.

  When performing such a planarization process, it is difficult to bring the large-area mold 11 into contact with the composition on the entire surface of the substrate 1 and then peel off the composition over the entire surface. The greater the contact area, the greater the force required to peel off (release force). When the release force is increased, the release operation itself cannot be performed normally, or the composition on the substrate is not properly planarized.

  In order to solve such a problem, in the present embodiment, a large number of the compositions IM are dropped on the outer peripheral area of the substrate 1 and a height difference is formed with respect to the inner area of the substrate by the distribution of the composition IM. The mold 11 or the substrate 1 is warped when the composition comes into contact with the mold. When the outer peripheral region of the substrate 1 is in a warped state, it becomes a mold release starting point at which peeling of the composition from the mold is started, and the mold is easily released. Once the separation of the mold 11 and the substrate 1 is started, if the treatment is performed for a sufficient time, the mold release is completed, and the composition IM having a desired thickness and flatness is obtained.

  As shown in FIG. 3, the droplet supply unit 20 includes a plurality of liquids of the composition IM on a first region 1a including the center position C of the outer shape of the substrate and a second region 1b outside the first region 1a. Place the drops. When the composition IM is dropped, a large amount is dropped on the outer peripheral region of the substrate 1. Specifically, the composition is arranged on the second region 1b such that the composition droplets are stacked on the second region 1b so as to be thicker than the composition arranged on the first region 1a. FIG. 3 shows a state in which the compositions are stacked on the second region 1b (deposition state). The droplet supply unit 20 scans the second region 1b a plurality of times, or continuously arranges the droplets of the composition IM at a predetermined position on the second region 1b to thereby arrange the second region 1b. Stack the composition droplets on top.

  When a droplet is dropped on the first region 1a of the substrate 1, the final pattern density (roughness / density) of the base of the first region 1a and the final shape of the flattening layer when the composition IM is flattened by the mold are obtained. By calculating the thickness, the total drop amount and drop position are obtained. Further, in the present embodiment, the drop amount is increased to a width within 2 mm or 3 mm from the outermost peripheral edge of the substrate in the second region 1 b of the substrate 1 so as to be several times or more of the droplet amount in the first region 1 a. To be dropped.

  Next, a method for creating data of a droplet arrangement pattern for dropping a composition onto a substrate, which is used in a planarization apparatus, will be described with reference to FIG. FIG. 7 is a flowchart of a method for creating data of a droplet arrangement pattern. The data of the droplet arrangement pattern is created in advance by an external computer (information processing device) or a control unit (information processing device) of the flattening device 100. When the external computer creates the data of the droplet arrangement pattern, the control unit of the flattening apparatus 100 acquires the data of the droplet arrangement pattern from the external computer. The information processing apparatus creates data of a first droplet arrangement pattern for dropping the composition by the droplet supply unit 20 on the first region 1a including the center position of the substrate. The first droplet arrangement pattern includes the density (roughness), pitch, width, and the like of the underlying pattern in the first region 1a, and the final thickness of the planarization layer when the composition IM is planarized by the mold. Is required based on

  Further, data of a second droplet arrangement pattern for dropping the composition onto the second region 1b by the droplet supply unit 20 is created. The second droplet arrangement pattern is created so that the composition droplets are stacked on the second region 1b so as to be thicker than the composition arranged in the first region 1a. Specifically, as shown in FIG. 3, a droplet arrangement pattern is created in which the droplets of the composition are arranged on the second region 1b without gaps. In addition, a droplet pattern for performing a plurality of scans to stack droplets of the composition on the second region 1b is also created. Further, a second droplet arrangement pattern may be created such that droplets of the composition IM are continuously discharged at predetermined positions on the second region 1b.

  Further, the second droplet arrangement pattern may be created based on the first droplet arrangement pattern. Specifically, the thickness of the composition on the first region 1a when the mold is brought into contact with the composition on the first region 1a dropped on the basis of the first droplet arrangement pattern is determined. When the mold is brought into contact with the composition on the second region 1b dropped based on the second droplet arrangement pattern, the thickness of the composition in the second region 1b is determined on the first region 1a. The second droplet arrangement pattern may be created so as to be thicker than the thickness of the composition.

  Next, using the mold of the flattening apparatus 100 and the driving mechanism of the substrate, the mold is brought into contact with the composition on the first region 1a and the composition stacked on the second region 1b to form the first region. After the composition on 1a is flattened, the mold is separated from the composition on the first region 1a and the second region 1b.

  FIG. 4 is a cross-sectional view illustrating a state in which the mold 11 and the substrate 1 are entirely contacted after the composition IM of FIG. 3 is dropped. Since the amount of the composition IM on the outer periphery of the substrate 1 is large, the mold 11 and the substrate 1 are not in a parallel state at the outer periphery of the substrate 1 and the mold 11 is warped. When the composition on the substrate comes into contact with the mold, the thickness of the composition IM on the outer peripheral portion of the substrate 1 is set to be several times or more, for example, 1 μm or more of the thickness of the composition IM in the first region 1a. By releasing the mold in this state, the mold 11 is warped, so that the release starting point is easily formed. Furthermore, since a large number of the compositions IM are dropped on the outer peripheral portion of the substrate 1, a large amount of the release material present in the composition adheres to the surface of the mold 11. Therefore, the energy when the composition and the mold in the second region 1b are separated from the composition in the first region 1a or when the second region 1b has the same thickness as the first region 1a. When the is dropped, the release energy becomes smaller than that of the above, and the release becomes easier.

  With reference to FIG. 5, a flattening process in the flattening apparatus 100 will be described. As described above, the flattening process is performed by the control unit 200 integrally controlling each unit of the flattening apparatus 100.

  In S <b> 602, the mold 11 is carried into the flattening device 100 by the mold transport unit 32, and the mold 11 is held by the mold chuck 12. In step S604, setting information regarding the flattening process is obtained. The setting information regarding the flattening processing includes information on the density (period, width, etc.) of the underlying pattern already formed in the first region 1a of the substrate 1. Further, the final thickness (thickness at the time of curing) of the composition IM, the maximum thickness of the outermost peripheral portion (the second region 1b), the width at which the composition of the outermost peripheral portion is thickened, and the maximum thickness at the next flattening. It may include how much the maximum thickness of the composition at the outer periphery is increased.

  In step S <b> 606, the substrate 1 to be processed is loaded into the flattening apparatus 100 by the substrate transport unit 22 from among the plurality of substrates included in the same lot, and the substrate 1 is held by the chuck 2. In step S608, the flattening process described with reference to FIGS. 2A to 2C is performed on the substrate 1 loaded in step S606. However, in the present embodiment, since the compositions are stacked on the second region 1b, when the mold and the composition are in contact with each other, the mold is turned upward in the outer periphery as shown in FIG. . That is, in S608, the first step of disposing a plurality of droplets of the composition on the first region 1a and the second region 1b, and the step of bringing the composition and the mold into contact with each other to flatten the composition, And the second step of releasing the mold, the composition on the substrate is planarized using the mold. In the first step, the composition is disposed on the second region such that the composition droplets are stacked on the second region to be thicker than the composition disposed on the first region. In the second step, the composition on the first region and the composition stacked on the second region are brought into contact with the mold, and curing light is irradiated through the mold to cure the composition. Then, after the composition on the first region is flattened, the composition on the first region and the second region is separated from the mold.

  In S610, the substrate 1 on which the planarization processing has been performed is unloaded from the chuck 2 by the substrate transport unit 22. In S612, it is determined whether the flattening process has been performed on all the substrates included in the same lot. If the flattening process has not been performed on all the substrates included in the same lot, the process proceeds to S606 in order to arrange the next substrate 1 to be processed on the chuck 2. On the other hand, when the flattening process has been performed on all the substrates included in the same lot, the process proceeds to S614.

  In S614, the cleaning unit 33 cleans the mold 11 held on the mold chuck 12. That is, the composition adhered to the plane portion 11a of the mold 11 is removed. In S616, the cleaned mold 11 is unloaded from the flattening device 100 by the mold transport unit 32.

  Further, in the present embodiment, the following special processing can be performed on the mold 11 and the substrate 1 after the mold release. Since a large number of compositions IM are dropped on the outermost peripheral portion of the substrate 1 on the substrate 1 side, there is a high possibility that the composition IM adheres to the mold 11 after the mold release. Therefore, at the time of the next flattening process of the substrate 1, the amount of the composition IM on the outermost periphery of the substrate 1 is increased so that the deposits already attached to the mold do not hinder the flattening process. That is, the number of droplets is larger than the number of droplets discharged from the droplet supply unit 20 to the previous substrate and arranged in the second region 1b.

  On the substrate 1 side after release, a solidified composition IM of several μm or more remains on the outer peripheral portion of the substrate 1. FIG. 6A is a diagram showing the composition IM on the substrate 1 after release. Since the composition IM of the second region 1b of the substrate 1 has a thicker shape than the IM of the first region 1a, when the composition IM is dropped on the second region 1b of the substrate 1, or the mold comes into contact with the composition. At this time, the composition IM may have protruded (bleeding) 400 from the outer peripheral edge of the substrate 1.

  Therefore, in the present embodiment, an EBR (Edge Bead Removal) process is performed in the flattening apparatus 100 or the coating apparatus. EBR is a well-known process performed in a resist coating process of a photolithography process. In order to remove a chemical solution (composition) at the outer peripheral portion of a substrate after applying the resist (composition) to the substrate, And removing the composition only at the outer peripheral portion of the substrate using a rinsing liquid. FIG. 6B is a diagram illustrating the composition on the substrate 1 during the EBR process in the external device such as the planarizing device 100 or the coating device. The rinsing nozzle 500 is used to rinse and remove the thick composition IM on the outer peripheral portion of the substrate 1 using the rinsing liquid 501.

  FIG. 6C shows the composition IM on the substrate 1 after the EBR. The thick composition IM on the outer peripheral portion of the substrate 1 is almost removed. The shape of the composition after the removal is equivalent to the shape of EBR of photolithography used in normal production. In the present embodiment, only the portion of the outer periphery of the substrate 1 where a large number of the compositions IM are dropped is peeled off, and the substrate is transported to the next step.

  In the present embodiment, the flattening process is completed on all the substrates 1 included in the same lot, and the mold 11 is washed before the mold 11 is carried out from the flattening apparatus 100. However, the present invention is not limited to this. Not something. For example, the mold 11 may be cleaned even if the flattening process has not been completed for all the substrates 1 included in the same lot. Further, when the flattening device 100 includes a detection unit that detects the state of adhesion of the composition on the plane portion 11a of the mold 11, the mold 11 may be cleaned according to the detection result of the detection unit. Good.

  In the present embodiment, the flattening apparatus is described. However, the present invention can also be applied to a batch imprint that collectively imprints the entire surface of a substrate using a mold on which a pattern is formed. Further, although the light curing method is described, the invention can also be applied to a heat curing method.

(Product manufacturing method)
Next, a method for manufacturing an article (semiconductor IC element, liquid crystal display element, color filter, MEMS, etc.) using the above-described flattening apparatus or flattening method will be described. In this manufacturing method, the composition and the mold are brought into contact with the composition disposed on the substrate (wafer, glass substrate, and the like) by using the above-described planarization apparatus, and the composition and the mold are cured. Separating. Then, a step of performing processing such as forming a pattern using a lithography apparatus on the substrate having the planarized composition, and processing the processed substrate in another well-known processing step, Is manufactured. Other well-known steps include etching, resist stripping, dicing, bonding, packaging and the like. According to the present manufacturing method, it is possible to manufacture a higher quality article than before.

  The preferred embodiments of the present invention have been described above. However, it is needless to say that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist.

Claims (13)

In a flattening apparatus for flattening the composition on the substrate using a mold,
A droplet supply unit for disposing a plurality of droplets of the composition on a first region including a center position of the substrate and a second region outside the first region;
And a mechanism for separating the composition and the mold after the composition and the mold arranged in contact with the droplet supply unit are brought into contact with each other to flatten the composition.
The droplet supply unit arranges the composition on the second region so as to be thicker than the composition arranged in the first region by stacking the droplets of the composition on the second region,
The mechanism contacts a mold with the composition on the first region and the composition stacked on the second region to planarize the composition on the first region, and then the A flattening apparatus, wherein a mold is separated from a composition on the first region and the second region.   The flattening of the composition on the first region is performed by bringing the composition on the second region into contact with the composition on the first region while the mold is bent upward. 2. The flattening device according to 1.   The flatness according to claim 1 or 2, wherein, when separating the composition and the mold, after separating the mold from the composition on the second region, the mold is separated from the composition on the first region. Device.   The droplet supply unit scans a plurality of times or continuously at a predetermined position on the second region, and arranges the droplets of the composition on the second region to stack the droplets of the composition on the second region. The flattening device according to any one of claims 1 to 3, wherein   The flattening device according to claim 1, wherein the second region is a region having a predetermined width from an outer periphery of the substrate.   The flattening device according to claim 5, wherein the predetermined width is a width of 3 mm or less.   The flattening device according to any one of claims 1 to 6, wherein the first region is a region where a pattern is already formed, and the second region is a region where a pattern is not formed. apparatus. The droplet supply unit arranges the composition on the entire surface of the substrate,
2. The mechanism according to claim 1, wherein the mold is brought into contact with the composition on the entire surface of the substrate to planarize the composition in the first region, and then the mold is separated from the composition on the entire surface of the substrate. The flattening apparatus according to any one of claims 1 to 7. A processing unit that creates data of a droplet arrangement pattern for dropping the composition on the substrate,
The processing unit creates data of the droplet arrangement pattern in the first region and the second region based on a pattern formed on the substrate,
9. The liquid droplet supply section according to claim 1, wherein the liquid droplet supply unit arranges the liquid droplets of the composition on the substrate based on data of the created liquid droplet arrangement pattern. 10. Flattening device.   The flattening apparatus according to any one of claims 1 to 9, wherein the composition on the second region is removed after separating the mold from the composition on the second region. In a planarization method for planarizing a composition on a substrate using a mold,
A first step of disposing a plurality of droplets of the composition on a first region including a center position of the substrate and a second region outside the first region;
A second step of releasing the composition and the mold after the composition and the mold are placed in contact with each other to level the composition and
In the first step, disposing the composition on the second region so as to be thicker than the composition disposed on the first region by stacking the droplets of the composition on the second region,
In the second step, the composition on the first region and the composition stacked on the second region are brought into contact with a mold to planarize the composition on the first region, And separating the mold from the composition on the first region and the second region. Flattening the composition of the substrate using the flattening method according to claim 11,
Processing a substrate having the planarized composition;
A method for manufacturing an article, comprising obtaining an article from a processed substrate. In a creation method of creating data of a droplet arrangement pattern for dropping a composition on a substrate in a flattening apparatus that flattens a composition on a substrate using a mold,
Creating data of a first droplet arrangement pattern for arranging a composition on a first region including a center position of the substrate;
Generating data of a second droplet arrangement pattern for arranging the composition on the second area outside the first area,
Forming the second droplet arrangement pattern such that the composition droplets are stacked on the second region so as to be thicker than the composition arranged in the first region. Method.

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