JP2020006600A - Mold cleaning device and method, resin molding apparatus, and manufacturing method of resin molded article - Google Patents

Abstract

To provide a mold cleaning device capable of being used while suppressing effects by heat even when a mold is heated to a temperature at which resin molding can be conducted.SOLUTION: A mold cleaning device 10 is a device removing deposit adhered to one surface of an upper mold 251 constituting a mold 25 and a lower mold 252 facing the upper mold 251. The mold cleaning device 10 comprises: a laser beam source 11 provided outside a space between the upper mold 251 and the lower mold 252 and ejecting a laser beam; a laser beam reflection mechanism which has a reflection mirror 13 and an XY stage (reflection mirror movement mechanism) 14, and in which a direction of the reflection mirror 13 is set so that surfaces of the upper mold 251 and the lower mold 252 are irradiated with laser beam reflected in the reflection mirror 13 when the reflection mirror 13 is at a first position; and a laser beam movement part (laser beam movement mechanism) 12 arranged outside the space, and moving the laser beam to the reflection mirror 13 at the first position.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a mold cleaning device and method, a resin molding device, and a method of manufacturing a resin molded product.

  When resin molding is performed using a molding die in a resin molding device, the resin slightly adheres to the surface of the molding die even after the molded product is taken out, and adhered substances are repeatedly formed by repeating the resin molding with the same molding die. It gradually increases. When resin molding is performed in a state where such attached matter is attached to the surface of the mold, the shape of the attached matter may be transferred to the resin molded product.

  Therefore, the production of the resin molded product is temporarily stopped, and cleaning for removing the deposits on the mold is performed. Patent Literature 1 discloses that a laser light source is arranged in a space between an upper mold and a lower mold constituting a molding die, and a laser beam is moved while moving the laser light source along an upper surface of the lower mold (or a lower surface of the upper mold). It describes an apparatus for performing a process of irradiating a lower mold (upper mold) to peel off attached matter from the lower mold (upper mold).

JP 2008-149705 A

  In molding the resin, it is necessary to raise the temperature of the molding die to, for example, about 180 ° C. in order to melt the resin. In the apparatus described in Patent Literature 1, when cleaning is performed while the mold is heated, a laser light source and a moving device for moving the laser light source are disposed near the mold (for example, between the upper mold and the lower mold). Since the laser light source and the moving device are arranged in a space where the laser light source and the moving device are arranged, and heat such as radiation heat from a molding die, the accuracy of the laser irradiation position and the like may be deteriorated. . In order to avoid such inconveniences, once the mold is cooled and then cleaned, the waiting time including the time until the temperature of the mold is raised again to a stable temperature for resin molding after the cleaning is reached. May occur, the tact time may be extended in the resin molding process, and the production efficiency of the resin molded product may be reduced.

  The problem to be solved by the present invention is to provide a mold cleaning apparatus and method which can be used while suppressing the influence of heat even in a state where the mold is heated to a temperature at which resin molding can be performed, and a resin. An object of the present invention is to provide a molding apparatus and a method for producing a resin molded product.

The mold cleaning device according to the present invention is an apparatus that removes deposits attached to at least one surface of a first mold and a second mold that faces the first mold that constitute the mold,
a) a laser light source that is provided outside a space between the first mold and the second mold and emits the laser beam;
b) a reflecting mirror, and a reflecting mirror moving mechanism for moving the reflecting mirror between a first position in the space and a second position outside the space, wherein the reflecting mirror is in the first position. A laser beam reflecting mechanism in which the direction of the reflecting mirror is set so that the laser beam reflected by the reflecting mirror is applied to the surface of the first type or the second type when the mirror is located at
c) a laser beam moving mechanism provided outside the space and configured to move the laser beam with respect to the reflector when the laser beam is at the first position.

The molding die cleaning method according to the present invention is a method for removing deposits adhering to at least one surface of a first die constituting a molding die and a second die facing the first die,
Disposing a reflecting mirror in a space between the first type and the second type;
While emitting a laser beam from a laser light source provided outside the space, while moving the laser beam with respect to the reflecting mirror by a laser beam moving mechanism provided outside the space, the laser beam Irradiate the reflector,
The laser beam reflected by the reflecting mirror is irradiated to the first type or the second type.

  A resin molding device according to the present invention includes the molding die and the molding die cleaning device.

  A method for manufacturing a resin molded product according to the present invention is characterized in that after performing the mold cleaning method, a resin molded product is manufactured using the molding die.

  ADVANTAGE OF THE INVENTION According to this invention, it can be used, suppressing the influence of heat even in the state where the temperature of the mold is raised to a temperature at which resin molding can be performed.

Molding mold (a) after cleaning and resin molding has not yet been performed, and resin cleaning 200 times (b), 400 times (c), 600 times (d) and 800 times (e), respectively, after cleaning An electron micrograph of the surface of the mold after the molding. FIG. 1 is a schematic configuration diagram showing an embodiment of a mold cleaning device and a resin molding device having the same according to the present invention. FIG. 2 is an enlarged view of a molding die and its vicinity in the resin molding device of the present embodiment. FIG. 3A is a plan view (a) and FIG. FIG. 2 is a perspective view and a partial cross-sectional view of a reflecting mirror and its attachment part in the mold cleaning device of the present embodiment. It is a partial cross-sectional enlarged view of the attachment portion of the reflector, a diagram showing the vicinity of one rotating shaft (a), a diagram showing the vicinity of the other rotating shaft (b), and the other rotating shaft is FIG. 7C shows a state where the mirror has been moved to the opposite side of the reflecting mirror as compared with the case of FIG. (A) showing a state in which a pair of holding tools for holding the reflecting mirror are connected by a shaft, and (b) showing a state in which one holding tool has been moved to the opposite side of the reflecting mirror as compared with the case of (a). ). FIG. 3 is a schematic diagram showing a state in which the mold cleaning device of the present embodiment is at a use position (a) and a standby position (b). The figure which shows the structure which connected the laser light source and the laser beam moving part, and the reflection mirror with the connection rod extended in the Y direction. FIG. 6 is a diagram illustrating an example in which a reflecting mirror having a width in the X direction larger than an irradiation range of a laser beam in the X direction is used. FIG. 3A is a diagram showing an operation during resin molding in the resin molding apparatus of the present embodiment, showing a state in which a lead frame is placed on a lower mold and a resin material is supplied to a lower mold pot, FIG. 4B shows a state in which the resin material is supplied to the cavity by being tightened. FIG. 5 is a diagram showing a state in which a spot of a pulsed laser beam moves in a zigzag manner. FIG. 4 is a diagram showing a locus of a laser beam on the surface of a lower die or an upper die (thin solid line), and a boundary (thick broken line) of a region irradiated with the laser beam when the laser beam moves zigzag once. Schematic diagram (a) showing a state where plasma is generated near the surface of the mold by irradiating the mold with a pulsed laser beam, and the plasma is heated by repeatedly irradiating the pulsed laser beam to the plasma. FIG. 3B is a schematic diagram showing a state in which the deposit is vaporized. FIG. 3A is a top view and FIG. 3B is a longitudinal sectional view illustrating an example in which a shielding unit is used. Another example of the trajectory of the laser beam on the surface of the lower mold or the upper mold, an example of repeated one-way movement in the irradiation area (a), and an example of moving the entire surface of the lower mold or the upper mold in a zigzag shape ( FIG. FIG. 4 is a schematic diagram illustrating an example of an X-direction moving mechanism that moves a reflecting mirror in the X direction. FIG. 5 is a plan view showing another embodiment of the mold cleaning device according to the present invention. FIG. 10 is a view showing still another embodiment of the mold cleaning device according to the present invention, and is a plan view (a-1) and a side view (a-2) showing a state in which a first reflecting mirror is used; FIG. 4B is a plan view illustrating a state in which the second reflecting mirror is used. The schematic block diagram which shows an example of the resin molding unit which consists of several modules, such as a molding module. FIG. 3 is a schematic configuration diagram showing a state in which a molding die cleaning device is carried into one of the molding modules in the resin molding unit. The schematic block diagram which shows the other example of the resin molding unit which consists of several modules. A spot (a) of a laser beam having a circular cross section and a state where the spot moves (b), and a spot (c) of a laser beam having a circular cross section and a state where the spot moves (d) ).

  In the molding die cleaning apparatus according to the present invention, when performing processing by irradiating the molding die with a laser beam after temporarily stopping the resin molding (cleaning in the molding die cleaning apparatus), reflection is performed by the reflecting mirror moving mechanism. After the mirror is moved to a first position in the space between the first and second molds, a laser beam is applied to the reflecting mirror by a laser light source provided outside the space. As a result, the laser beam is reflected by the reflecting mirror and is applied to the surface of the first type or the second type. Here, a laser beam moving mechanism provided outside the space moves the laser beam with respect to the reflecting mirror, so that the spot of the laser beam applied to the surface of the first type or the second type is formed on the surface. Move up. Thereby, the laser beam is irradiated to a certain area of the surface of the first type or the second type. As a result, the first mold or the second mold is subjected to processing such as removal (cleaning) of the adhered substances adhered to the surfaces thereof. After the processing of the mold is completed, the reflecting mirror is moved to the second position outside the space, and the resin molding is restarted.

  According to the mold cleaning device of the present invention, the laser light source and the laser beam moving mechanism are provided outside the space even when the first mold and the second mold are being heated. It is possible to suppress the influence of heat such as heat in the space or radiant heat from the first and second molds on them. On the other hand, although the reflecting mirror is arranged in the space, it is less affected by heat than the laser light source and the laser beam moving mechanism. For these reasons, the mold cleaning device according to the present invention can be used while suppressing the influence of heat even when the mold is heated to a temperature at which resin molding can be performed.

  In the mold cleaning apparatus according to the present invention, it is preferable that the laser beam moving mechanism is a galvano scan head. Galvano scan head is a device that moves a laser beam in one direction or two different directions by using one mirror that rotates with one rotation axis or a combination of two mirrors with different inclinations of the rotation axis. It is. Thereby, the spot of the laser beam applied to the surface of the first type or the second type can be moved one-dimensionally or two-dimensionally. Since the galvano scan head can move the spot of the laser beam at high speed, the processing time can be shortened. In addition, when the spot of the laser beam is moved, it is not necessary to move the galvano scan head itself with respect to the mold, so that the installation space can be reduced.

  The mold cleaning apparatus according to the present invention may further have a reflection direction changing mechanism for changing the direction of the reflecting mirror. Alternatively, in the mold cleaning device according to the present invention, the reflecting mirror includes a first reflecting mirror and a second reflecting mirror whose directions are different from each other, and the laser beam reflecting mechanism further includes a mirror irradiated with the laser beam. A configuration in which a mirror switching mechanism for switching is provided may be employed. In any case, the angle at which the laser beam is incident on the first mold or the second mold can be changed. For example, when the first mold is irradiated with a laser beam in a certain direction and the wall forming the cavity of the first mold is parallel to the laser beam, the incident angle is changed. In addition, the wall surface can be easily irradiated with the laser beam.

The mold cleaning device according to the present invention further comprises:
A first rotating shaft and a second rotating shaft connected in a pair to both sides of the reflecting mirror;
It is possible to adopt a configuration including a rotating shaft holder that holds at least one of the first rotating shaft and the second rotating shaft so as to be movable in the axial direction. Accordingly, even if the reflecting mirror thermally expands during the processing of the molding die due to the heat generated during the resin molding, or the reflecting mirror shrinks due to a decrease in temperature caused by moving the reflecting mirror to the second position. Since the rotating shaft held by the rotating shaft holder is axially moved and the reflecting mirror is allowed to expand or contract in the axial direction, deformation of the reflecting mirror can be suppressed. Note that both the first rotating shaft and the second rotating shaft may be movably held in the rotating shaft holder in the axial direction, respectively, or the other rotating shaft may be (rotated). It may be fixed in the axial direction (while allowing rotation about the axis).

  The molding die cleaning device according to the present invention is a device for removing an adhering substance adhered to the molding die having at least a part of a surface coated thereon, wherein the laser light source and the laser beam moving mechanism include the attachment. A laser beam having an irradiation intensity capable of heating the plasma to a temperature equal to or higher than a temperature at which the attached matter is vaporized after generating plasma on the kimono, and an irradiation intensity lower than the irradiation intensity that damages the coating; Is preferably applied to the mold.

  As a result, at least a part of the deposit is vaporized by being heated to a temperature higher than the temperature at which the deposit is vaporized, and is removed from the surface of the mold. On the other hand, the surface of the mold is often provided with a coating made of chromium or the like (the coating material of the mold is not particularly limited in the present invention). Damage must be suppressed. The present inventor examined the formation process of the deposit by observing the surface of the mold in order to obtain knowledge on the damage that the laser beam causes to the coating of the mold. It was found that the film adhered, and then gradually approached a film-like shape covering almost the entire cavity surface of the mold (the electron microscope photograph of FIG. 1 is denoted by the letter A to indicate the adhered matter). . Therefore, when the laser beam is irradiated at the stage where the deposits are point-like, there is a gap between the deposits (the portion where the deposits do not adhere) that is point-like or the area of which is not sufficiently enlarged, and the laser is irradiated. The beam irradiates the coating directly, which can damage the coating. Therefore, by irradiating a laser beam to the mold with an irradiation intensity lower than the irradiation intensity that damages the coating, it is possible to suppress the damage to the coating.

Here, the irradiation intensity of the laser beam irradiating the mold, the intensity of the laser beam emitted from the laser light source and the moving speed of the laser beam by the laser beam moving mechanism, for example, scanning laser power density per second is 2 ~ It can be determined by adjusting to be 15 W / cm ² . The “scanning laser power density per second” is the energy of a laser (unit: J (joule) = Wsec (watt-second) applied to a unit area (unit, cm ² ) for a unit time (unit, sec (second)) ), And the unit is J / (cm ² sec) = Wsec / (cm ² sec), that is, expressed in W / cm ² . The scanning laser power density per second is the average output of the irradiated laser beam, the area derived from the distance that the spot of the laser beam moves relative to the mold and the width of the spot per second. And the area of one spot (the part irradiated to the initial position before movement) can be calculated by dividing the area by the sum of the area and the area of the laser beam per second. Is the output per unit area in the portion irradiated while moving).

When the scanning laser power density per ^second is ² to 15 W / cm ² , it is desirable that the laser light source emits a pulsed laser beam having a laser fluence per pulse of 0.04 to 0.7 J / cm ² . In addition, when the scanning laser power density per ^second is ² to 15 W / cm ² , it is desirable that the overlap ratio (described later) of adjacent pulse laser beams is 85% or more. By taking one or both of these configurations, it is possible to generate plasma on the adhered matter adhered to the surface of the mold, and to heat the plasma to a temperature higher than the temperature at which various kinds of adhered matter are vaporized. Can be.

  Here, the “overlap rate” is defined as the ratio of the volume of a portion overlapping with a pulse laser beam generated adjacently to the volume occupied by one pulse laser beam in the space where plasma is generated. If two adjacent pulsed laser beams are parallel, the overlap rate is determined by the pulse lasers generated adjacent to each other in the cross section perpendicular to that of one pulsed laser beam at an arbitrary position in the space where the plasma is generated. It can be determined by the ratio of the area of the portion overlapping the cross section perpendicular to that of the beam. The reciprocal of the overlap rate corresponds to the number of times of the pulse laser beam applied to the same location. If the pulse laser beam is not moved, the overlap ratio is 100%. However, in the present invention, since the pulse laser beam is moved, the overlap ratio is less than 100%.

In the mold cleaning device according to the present invention,
The laser beam moving mechanism,
Reciprocating the laser beam in a first direction with respect to the mold,
Each time the laser beam is moved one way in the first direction, the laser beam is moved in the second direction perpendicular to the first direction by one spot of the laser beam irradiated on the mold. Thing,
Further, it is preferable that a shielding portion is provided between the laser beam moving mechanism and the mold so as to shield portions of one spot at both ends of the reciprocating movement in the first direction. Accordingly, when the laser beam moves in the second direction at the both ends, the shielding portion shields the laser beam that is excessively irradiated as compared with a position other than the both ends, so that the surface of the mold is more uniform. It can be cleaned by nature.

  So far, the mold cleaning apparatus according to the present invention has been described. However, the mold cleaning method, the resin molding apparatus, and the method for manufacturing a resin molded article have the same operation and effect.

  Hereinafter, more specific embodiments of the mold cleaning apparatus and method, the resin molding apparatus, and the method of manufacturing a resin molded product according to the present invention will be described with reference to FIGS.

(1) Configuration of the Mold Cleaning Device and the Resin Molding Device of the Present Embodiment As shown in FIG. 2, the mold cleaning device 10 of the present embodiment is a part of the components of the resin molding device 1 of the present embodiment. is there. The resin molding device 1 has a resin molding unit 20 together with the mold cleaning device 10.

  First, the configuration of the resin molding section 20 will be described. In the present embodiment, the resin molding section 20 is an apparatus that performs transfer molding, and includes a base 211 and four (two shown in FIG. 2) tie bars 212 erected on the base 211. A movable platen 221 held by the tie bar 212 so as to be movable up and down, a fixed platen 222 fixed to the upper end of the tie bar 212, and a toggle link 213 provided on the base 211 for moving the movable platen 221 up and down. And Between the upper surface of the movable platen 221 and the lower surface of the fixed platen 222, a molding die 25 provided with an upper die (first die) 251 and a lower die (second die) 252 facing each other is arranged.

  FIG. 3 shows the molding die 25 and its vicinity in an enlarged manner. Two cavities C are formed side by side on the lower surface of the upper mold 251, and two cavities C are formed on the upper surface of the lower mold 252. The lower surface of the upper die 251, the upper surface of the lower die 252, and the surfaces of the upper die 251 and the lower die 252 surrounding each cavity C are coated with chromium nitride coating CT. Instead of chromium nitride, another material such as hard chromium may be used for the coating CT. In the present embodiment, the cavity has a rectangular parallelepiped shape, but may have a cylindrical shape or the like depending on the shape of the resin molded product to be manufactured.

  Each of the upper surfaces of the lower mold 252 around the two cavities C of the lower mold 252 can receive the lead frame L thereon. Note that a substrate or the like may be placed on the upper surface of the lower mold 252 instead of the lead frame L.

  Between the two cavities C of the lower mold 252, a pot 2521 for storing the resin material and a plunger 2522 for extruding the resin material from the pot 2521 are provided. The two cavities C of the lower mold 252 are connected to the pot 2521 by runners 2523, which are passages through which the softened or molten resin material passes, as described later. A cull block 2511 is provided between the two cavities C of the upper mold 251 and at a position facing the pot 2521. Each of the two cavities C of the upper mold 251 is connected to a space directly below the cull block 2511 by a runner 2513.

  The resin molding section 20 has a heater plate 253 that raises the temperature of the upper mold 251 and the lower mold 252 to maintain the lead frame L and the resin material at a predetermined temperature during resin molding. The heater 2531 has a built-in heater 2531. As the heater 2531, for example, a cartridge heater can be used.

  The molding die cleaning device 10 includes a laser light source 11, a laser beam moving unit (laser beam moving mechanism) 12, a reflecting mirror 13, an XY stage 14, and an XY stage driver 15.

The laser light source 11 is a light source that emits a pulse laser. In the present embodiment, the pulse laser emitted by the laser light source 11 has a laser fluence per pulse within the range of 0.04 to 0.7 J / cm ² and a scanning laser power density per ^second of ² to 15 W for the reason described later. / cm ² , the pulse width is in the range of 1 to 200 nsec, and the pulse repetition frequency is in the range of 300 kHz to 10 MHz. Further, in this embodiment, the laser light source 11 is shaped such that the shape (beam spot) in a cross section perpendicular to the beam is a square, and the top hat type irradiation is substantially equal from the center to the end of the cross section. A device that emits a pulsed laser beam having an intensity distribution is used. The shape of the beam spot may be a shape other than a square, such as a rectangle, a circle, and a ring. Here, the range (size) of the beam spot is defined by the 1 / e ² method (86% method). The spot size can be measured with an Ophir or Coherent camera beam profiler. Further, using a power meter manufactured by Ophir or Coherent, the average output of the laser beam is obtained, and the scanning laser power density per second can be obtained from the spot size and the average output of the laser beam. The laser fluence per pulse is a value obtained by dividing the above average output of the laser beam by the pulse repetition frequency. The pulse width can be measured using an oscilloscope manufactured by Agilent Technologies. The average output of the laser beam can be obtained by the formula of “average output of laser beam [W] = pulse energy [J] × pulse repetition frequency [Hz]”.

  The laser beam moving unit 12 has a galvano scan head 121 and a lens 122 (see FIG. 4). The galvano scan head 121 repeatedly reciprocates the pulse laser beam B introduced from the laser light source 11 in the X direction (the direction perpendicular to the paper surface of FIG. 2) (FIG. 4A) and the Z direction (FIG. 2A). (In the vertical direction) (FIG. 4B). In this embodiment, the moving speed of the pulse laser beam by the laser beam moving unit 12 is set so that the overlapping ratio is 85% or more. During this movement, the spot size may change near the center position and near the end depending on the size of the moving range of the pulsed laser beam B, and the irradiation intensity will change depending on the position. Therefore, it is desirable to use a lens that is telecentric or has a sufficiently long irradiation depth as the lens 122 to suppress a change in spot size depending on the position. In the example shown in FIG. 4, the lens 122 is arranged at the subsequent stage of the galvano scan head 121, but at the preceding stage of the galvano scan head 121, an electric beam diameter variable lens (not shown) having a plurality of lenses is arranged. Alternatively, the lens 122 and a motorized variable beam diameter lens may be used in combination. In the case of using a motorized variable beam diameter lens, the spot size on the surface of the mold 25 can be made substantially constant by changing the beam diameter in accordance with the reciprocating movement.

  The reflecting mirror 13 is a mirror that reflects the pulse laser beam B, and has a width in the X direction wider than a range in which the laser beam moving unit 12 reciprocates the pulse laser beam B. As the reflecting mirror 13, a mirror containing, for example, synthetic quartz glass (fused silica) can be used. The surface of the reflecting mirror 13 may be coated with a metal film. As such a coating, an optimal coating may be selected from a gold coating, a silver coating, an aluminum coating, a dielectric multilayer film and the like.

  As shown in FIG. 5, the reflecting mirror 13 has one end in the X direction held by a first holding member 131L and the other end held by a second holding member 131R. The first gripper 131L and the second gripper 131R are respectively provided with a first rotation shaft 132L and a second rotation shaft 132R extending in the X direction. The first rotation shaft 132L is inserted into the bearing 133L. The second rotating shaft 132R is inserted into the rotating shaft movable holder 133R. The rotating shaft movable holder 133R may be a bearing. In FIG. 5, a cross section in the Z direction passing through the first rotation shaft 132L and the second rotation shaft 132R is also shown in the perspective view, and the reflecting mirror 13 is more Y direction than the cross section. Is indicated by a solid line, and the near side is indicated by a broken line (that is, the reflecting mirror 13 is also present at the portion indicated by the broken line).

  As shown in FIG. 6A in an enlarged manner, the surface of the first rotating shaft 132L outside the bearing 133L in the direction of the rotating shaft (the side opposite to the reflecting mirror 13 in the X direction) is provided with a rotating shaft. A groove 1321L that makes one round around is provided. The first fixture 135L is fitted into the groove 1321L. Note that the first fixture 135L only needs to extend from the groove 1321L, and has a smaller outer diameter than the bearing 133L. The first fixing member 135L is axially sandwiched between the first fixing member 135L and a step formed on the first turning shaft member 132L so as to have a different diameter, so that the first turning shaft member 132L moves in the X direction. While allowing rotation about the rotation axis, the movement is restricted via the bearing 133L so as to hardly move in a direction parallel to the rotation axis. The bearing 133L is fixed by being sandwiched between a bearing holding portion 134L and a bearing fixture 137L provided outside the bearing holding portion 134L when viewed from the reflecting mirror 13.

  As shown in an enlarged view in FIG. 6B, a groove 1321R is provided on the surface of the second rotating shaft 132R outside the rotating shaft movable holder 133R in the rotating axis direction. . The second fixture 135R is fitted into the groove 1321R. Note that the second fixture 135R does not need to be provided over the entire groove 1321R. The rotating shaft movable holder 133R is axially sandwiched between the second fixing shaft 135R and a step formed on the second rotating shaft 132R so as to have a different diameter, so that the second rotating shaft 132R is second rotated in the axial direction. The second rotation shaft 132R is held so that the second rotation shaft 132R is allowed to rotate around the rotation axis in the X direction while fixing the positional relationship with the shaft 132R. ing. The rotating shaft movable holder 133R is held by an outer holder 134R, and is axially movable with respect to the outer holder 134R together with the second rotating shaft 132R. In FIG. 6C, the reflecting mirror 13 expands more than in the case of FIG. 6B, and accordingly, the second rotating shaft 132R and the rotating shaft movable holder 133R move to the opposite side of the reflecting mirror 13. The example of a state is shown. By moving the second rotating shaft 132R and the rotating shaft movable holder 133R in this manner, the load applied to the reflecting mirror 13 can be suppressed, and the deformation of the reflecting mirror 13 can be suppressed. When the reflecting mirror 13 contracts, the second rotating shaft 132R and the rotating shaft movable holder 133R move in the opposite directions, whereby the deformation of the reflecting mirror 13 can be suppressed. The combination of the rotating shaft movable holder 133R, the outer holder 134R, and the second fixing member 135R may be regarded as the rotating shaft movable holder.

  Here, one of the pair of rotating shafts (the first rotating shaft 132L) is parallel to the rotating shaft by the first fixture 135L and the bearing 133L fixed by the bearing holding portion 134L and the bearing fixture 137L. Although it is restricted so that it is hardly moved in any direction, both rotating shafts may be movable within a certain range in a direction parallel to the rotating shaft by a rotating shaft movable holder and a fastener. .

  As shown in FIG. 7A, the first gripper 131L and the second gripper 131R are provided on two shafts 138 (FIG. 5) on the back side of the reflecting mirror 13 (the back side of the reflecting mirror 13 shown in FIG. 5). 5 are not shown). The shaft 138 is fixed to the first gripper 131L, while being attached to the second gripper 131R via a slide bearing (bush) 139. The shaft 138 has a role of reducing a load such as a twist generated in the reflecting mirror 13 when the reflecting mirror 13 rotates, and also rotates the first rotating shaft 132L and the second rotating shaft 132R during assembly. It has the role of aligning the axis centers. FIG. 7B shows an example in which the reflecting mirror 13 expands more than in the case of FIG. 7A and the second gripper 131R moves to the opposite side of the reflecting mirror 13 accordingly. By moving the second grip 131R in this way, the load applied to the reflecting mirror 13 can be suppressed, and the deformation of the reflecting mirror 13 can be suppressed. When the reflecting mirror 13 contracts, the second gripper 131R moves in the opposite direction, whereby the deformation of the reflecting mirror 13 can be suppressed.

  The reflecting mirror 13 further includes a motor (reflection direction changing mechanism) 136 (see FIG. 2) for rotating the reflecting mirror 13 about a rotation axis, and a power transmission mechanism (not shown) such as a gear or a pulley and a belt. Connected through. The power transmission mechanism normally acts on at least one of the bearing holder 134L and the outer holder 134R. The power transmitted from the power transmission mechanism to one of the bearing holder 134L and the outer holder 134R is transmitted to the other via the reflector 13. At this time, since the shaft 138 functions to reduce a load such as torsion applied to the reflector 13, deformation can be suppressed even when the thickness of the reflector 13 is not sufficiently large. When the reflecting surface of the reflecting mirror 13 is directed downward by the motor 136 and tilted by 45 ° with respect to the Y axis, the pulse laser beam B is applied to the surface of the lower mold 252 vertically. When the reflecting surface of the reflecting mirror 13 faces upward and is inclined at an angle of 45 ° with respect to the Y axis, the pulse laser beam B is irradiated perpendicularly to the surface of the upper mold 251. On the other hand, when the reflecting surface of the reflecting mirror 13 is downward or upward and is inclined at an angle other than 45 ° with respect to the Y axis, the pulse laser beam B is inclined at an angle with respect to the surface of the lower mold 252 or the upper mold 251. Irradiation.

  The laser light source 11, the laser beam moving unit 12, and the reflecting mirror 13 are mounted on an XY stage 14. The XY stage 14 controls the laser light source 11, the laser beam moving unit 12, and the reflecting mirror 13 in the X direction and the Y direction while maintaining the relative positional relationship of the three components under the control of the XY stage driver 15. Move. During cleaning, the XY stage 14 moves the reflecting mirror 13 and the like within a range slightly wider than the widths of the upper die 251 and the lower die 252 in the X direction and the Y direction, respectively. At the same time, the XY stage 14 sets the position of the mold cleaning device 10 in the Y direction, and the use position where the reflecting mirror 13 is disposed in the space between the upper die 251 and the lower die 252 during cleaning (see FIG. )) Also has a function of moving the entire mold cleaning device 10 including the reflecting mirror 13 to a standby position (FIG. 8B) outside the space during resin molding. .

  As shown in FIG. 9, the XY stage 14 moves the laser light source 11, the laser beam moving unit 12, and the reflecting mirror 13 in the X direction while maintaining the relative positional relationship. The portion 12 and the reflecting mirror 13 may be connected by a connecting rod 141 extending in the Y direction. Here, the laser light source 11 and the laser beam moving unit 12 are mounted on a table 112, and the connecting rod 141 is fixed to the table 112. On the side of the reflecting mirror 13, the connecting rod 141 is fixed to the bearing holding portion 134L and the outer holding member 134R. The bearing holder 134L and the outer holder 134R are provided with holes (not shown) extending in the same direction as the first rotation shaft 132L and the second rotation shaft 132R, and are inserted through these holes. Along the guide rod 142, the reflecting mirror 13 and the bearing holder 134L and the outer holder 134R, which are accessories thereof, move in the Y direction. With such a configuration, the laser light source 11, the laser beam moving unit 12, and the reflecting mirror 13, which are separated from each other in the Y direction, can be moved in the X direction by only one power source (not shown). . By reducing the number of power sources in this way, the number of cooling mechanisms (not shown) for cooling the power sources in order to suppress the influence of heat received from the mold on the power sources can also be reduced.

  When the width in the X direction of the upper mold 251 and the lower mold 252 is smaller than the range of the reciprocating movement of the pulse laser beam B by the laser beam moving unit 12, the XY stage 14 and the XY stage driver 15 are used instead of the above. A mechanism for moving the three components only in the Y direction may be used. Alternatively, it is not essential to maintain the relative positional relationship between the laser light source 11 and the laser beam moving unit 12 and the reflecting mirror 13 in the Y direction, and only the reflecting mirror 13 may be moved in the Y direction. Further, as shown in FIG. 10, when using the reflecting mirror 13W having a width in the X direction larger than the irradiation range of the laser beam in the X direction of the molding die 25, only the laser light source 11 and the laser beam moving unit 12 are set to Y. The reflecting mirror 13W need not be moved in the X direction.

  In addition to the above-described components, the molding die cleaning device 10 is configured to remove a vaporized adhering matter (not shown) that sucks gas in a space between the upper die 251 and the lower die 252 and discharges the gas to the outside of the resin molding device 1. ) May be included. In this case, a vaporized deposit collecting filter (not shown) may be further provided in the vaporized deposit removing section.

(2) Operations of the Mold Cleaning Device and the Resin Molding Device of the Present Embodiment, and the Mold Cleaning Method and the Resin Molding Method of the Present Embodiment Operations of the Mold Cleaning Device 10 and the Resin Molding Device 1 of the Embodiment, and The molding die cleaning method and the resin molding method of the embodiment will be described. Hereinafter, first, an operation at the time of resin molding (excluding an operation of cleaning the molding die) by the resin molding unit 20 in the resin molding device 1 will be described. Next, an operation of the molding die cleaning device 10 in the resin molding device 1 will be described. Will be described. The operation of the mold cleaning device 10 corresponds to an embodiment of the mold cleaning method according to the present invention. A combination of the operation of the resin molding unit 20 and the operation of the mold cleaning device 10 corresponds to an embodiment of the resin molding method according to the present invention.

(2-1) Operation at the time of resin molding by the resin molding unit 20 The operation at the time of manufacturing a resin molded product by the resin molding unit 20 will be described with reference to FIG. When manufacturing a resin molded product, the entire mold cleaning device 10 is moved to a standby position (FIG. 8B) by the XY stage 14 in advance. The standby position is a position outside the space between the upper mold 251 and the lower mold 252 as described above, and the operation of the resin molding unit 20 at the time of manufacturing a resin molded product is not hindered by the mold cleaning device 10. .

  First, by lowering the movable platen 221, the upper die 251 and the lower die 252 are opened vertically (FIG. 11A). In this state, the lead frame L on which the electronic component is mounted on the upper surface and the lower surface is placed on the upper surface of the lower mold 252 such that the position of the electronic component and the cavity C in the horizontal direction are aligned. Further, a tablet-shaped resin material P is supplied into the pot 2521 by a resin material supply mechanism (not shown). The resin material P is a composite material containing, for example, a thermosetting resin (such as an epoxy resin). The resin material P may contain a wax (such as a higher fatty acid ester), a curing accelerator (such as a phosphorus-based catalyst or an amino-based catalyst), a coupling agent, a coloring agent, a flame retardant, or a flame retardant auxiliary. . The resin material supply mechanism is widely used in a conventional resin molding apparatus, and a detailed description is omitted. The thermosetting resin in the resin material P is softened or melted in the pot 2521 by the heat supplied from the heater plate 253. The upper mold 251 is also kept at a predetermined temperature by the heater plate 253.

  When the thermosetting resin in the pot 2521 is softened or melted, the movable platen 221 is raised by the toggle link 213 (FIG. 11B). As a result, the lower mold 252 on the movable platen 221 abuts on the upper mold 251 via the lead frame L and pushes the upper mold 251, and the upper mold 251 is fixed to the fixed platen 222. Is clamped. By raising the plunger 2522 in this state, the resin material P in the pot 2521 is supplied to the cavities C of the upper mold 251 and the lower mold 252 through the runners 2513 and 2523. After a lapse of a predetermined time, the thermosetting resin in the resin material P is cured, and a resin molded product in which the resin is molded on the lead frame L is obtained. Thereafter, the movable platen 221 is lowered by the toggle link 213 to open the mold 25, and the resin molded product is removed from the mold 25.

  By repeatedly performing the above operations, a large number of resin molded products can be manufactured. However, a part of the thermosetting resin, the filler, and the like contained in the resin material P gradually adheres to the surface of the molding die 25 during repeated production of the resin molded product. Therefore, the surface of the molding die 25 is cleaned by operating the molding die cleaning device 10 as described below every time a predetermined number of resin molded products are manufactured or every predetermined time.

(2-2) Operation of Mold Cleaning Apparatus 10 First, with the mold 25 opened, the XY stage 14 moves the mold cleaning apparatus 10 to the use position (FIG. 8A), that is, the reflecting mirror. 13 is moved so as to be disposed between the upper die 251 and the lower die 252 (see FIG. 2). At this time, the reflecting surface of the reflecting mirror 13 may be in an upward or downward state. In the former case, the upper mold 251 is first cleaned, and in the latter case, the lower mold 252 is first cleaned. become. Hereinafter, a case where the reflecting surface of the reflecting mirror 13 at this time is downward as shown by a solid line in FIGS. 2 and 4B will be described as an example. The deposit attached to the molding die 25 contains any material or component contained in the resin material P, the substrate, or the lead frame. Further, deposits may adhere to the parting surface (the lower surface of the upper die 251 and the upper surface of the lower die 252) and resin passages such as runners, which may hinder continuous molding.

  In this state, the laser light source 11 emits the pulse laser beam B having the above-described laser fluence and pulse width per pulse at the above-described pulse repetition frequency. As a result, the pulse laser beam B is reflected 90 ° by the reflecting mirror 13 and is irradiated on the surface of the lower mold 252. At that time, the laser beam moving unit 12 applies the pulse laser beam B to the X direction in a predetermined range (see FIG. 4A) as conceptually shown in the plan view and the side view in FIG. While repeatedly reciprocating within the range between XL and XR, each time it moves one way in the X direction, one spot BS of the pulsed laser beam B is moved in the Z direction in a predetermined range (ZT and ZT in the figure). (Range between ZB). Thus, on the surface of the lower mold 252, first, the spot of the pulse laser beam B moves in the X direction by the predetermined range (FIG. 4A). Thereafter, when the pulse laser beam B moves in the Z direction by one spot BS, the pulse laser beam B is reflected at 90 ° by the reflecting mirror 13 and the spot BS generated on the surface of the lower mold 252 corresponds to one spot in the Y direction. (Fig. 4 (b)). Thereby, the spot BS on the surface of the lower mold 252 moves one way in the X direction, then moves by one spot BS in the Y direction, and moves in the X direction in the opposite direction to the previous one. The movement is repeated (FIG. 12).

  As the spot BS moves zigzag in this manner, the pulse laser beam B is applied to a part or the whole area of the surface of the lower mold 252. Here, when the pulse laser beam B is irradiated only on a part of the surface of the lower mold 252, after the irradiation of the pulse laser beam B by one zigzag movement is completed, the XY stage 14 moves the reflecting mirror 13 downward. The surface of the mold 252 is moved to a region not irradiated with the pulse laser beam B yet. When an electric beam diameter variable lens having a sufficient movable distance is mounted, the spot size can be adjusted by an internal lens. Therefore, the laser beam moving unit 12 may be configured to include only the XY stage 14. It is possible. Then, in the same manner as described above, the pulse laser beam B is applied to the area while moving it in a zigzag manner. By repeating the above operation, the entire surface of the lower mold 252 is irradiated with the pulse laser beam B. FIG. 13 illustrates the zigzag locus of the pulse laser beam B on the surface of the lower die 252 by a thin solid line, and the boundary of the irradiation area of the pulse laser beam B by one zigzag movement is illustrated by a thick broken line.

  After that, the reflecting surface is switched from downward to upward by rotating the reflecting mirror 13. Then, similarly to the case of the lower mold 252, the surface of the upper mold 251 is irradiated with the pulse laser beam B.

In the molding die cleaning apparatus 10 of the present embodiment, the pulse laser beam B having a laser fluence per pulse within the range of 0.04 to 0.7 J / cm ² is applied to the surface of the molding die 25 (the upper die 251 and the lower die 252). The irradiation generates plasma PL on the surface of the mold 25 (FIG. 14A). The source of the plasma PL is not particularly limited, but by irradiating the deposit with the pulsed laser beam B, the vicinity of the surface of the deposit AG becomes high temperature and high pressure, and the plasma PL can be generated. Then, by moving the pulse laser beam B having the same laser fluence as described above so that the overlapping rate becomes 85% or more, the same position in the plasma PL is irradiated with the pulse laser beam B six times or more. Then, the plasma PL is heated to a temperature at which the resin contained in the deposit A adhering to the surface of the molding die 25 in normal resin molding can be vaporized (FIG. 14B). Thereby, at least a part of the deposit A on the surface of the mold 25 is vaporized and removed from the surface. At this time, heat generated by heat transfer and radiation (radiation) from the coating CT heated by the plasma PL may act on the attached matter AG from the coating CT side. It should be noted that both ends in the X direction of the range in which the pulse laser beam B moves are less than one width of the pulse laser beam B in the X direction (for example, when the overlap ratio is 85%, the width of the width is 17 times). In the part of (/ 20), the number of times of irradiation of the pulse laser beam B may be less than six times. However, the width is usually sufficiently small, and the plasma PL heated around the part flows into the part. Does not. The vaporized deposits AG are suctioned and removed from the vicinity of the surface of the molding die 25 when the mold cleaning device 10 has a vaporized deposit removal device.

  In the state where the upper mold 251 and the lower mold 252 are heated by the heater plate 253 as described above, the space between the upper mold 251 and the lower mold 252 can be heated. However, in the mold cleaning device 10 of the present embodiment, the laser light source 11 and the laser beam moving unit 12 that are easily affected by heat are disposed outside the space, and the reflecting mirror 13 is disposed in the space. However, it is less affected by heat than the laser light source 11 and the laser beam moving unit 12. Therefore, the mold cleaning device 10 of the present embodiment can be used even at the high temperature as described above.

  The reflecting mirror 13 thermally expands when disposed in the space. However, since the second rotation shaft 132R is allowed to move in a direction parallel to the rotation axis until the second gripper 131R comes into contact with the outer holder 134R, the reflecting mirror 13 is thermally expanded. Deformation can be suppressed. Further, since the shaft 138 moves in the axial direction by sliding on the slide bearing 139 in accordance with the thermal expansion of the reflecting mirror 13, it is possible to suppress the deformation of the reflecting mirror 13 by applying a force to the reflecting mirror 13. Further, when the reflecting mirror 13 is retracted out of the space after the completion of the mold cleaning device 10, the reflecting mirror 13 contracts with a decrease in temperature. Is allowed to move in a direction parallel to the rotation axis, so that deformation of the reflecting mirror 13 can be suppressed.

  Furthermore, in the mold cleaning apparatus 10 of the present embodiment, the plasma PL is generated as described above, and then the plasma PL is heated, and the heat is used to vaporize at least a portion of the deposit A, thereby causing the deposit A to be vaporized. By removing A, the laser beam having a higher irradiation intensity (laser fluence, laser power density) is applied to the coating CT of the molding die 25 than when the deposit A is removed by directly irradiating the deposit A. Damage can be reduced.

In the case of using the laser light source 11 and the laser beam moving unit 12 that oscillate a pulsed laser beam, the attached matter is more reliably removed from the surface of the molding die 25, and the coating made of chromium nitride, hard chrome, or the like is more damaged. in order to suppress the pulse width 50～120Nsec, laser fluence 0.1~0.6J / cm ² per pulse, the overlap rate is 90%, the scanning laser power density per one second is 3~11W / cm ² It is desirable.

Further, in the case of using the laser light source 11 and the laser beam moving unit 12 that oscillate a pulsed laser beam, the adhered substances are more reliably removed from the surface of the mold, and the coating made of chromium nitride, hard chrome, or the like is damaged. To further suppress, the pulse width is 50 to 120 nsec, the laser fluence per pulse is 0.04 to 0.1 J / cm ² , the overlap ratio is 98% or more, and the scanning laser power density per second is 5 to 11 W / it is also possible to take a configuration that cm ^2.

(3) Another Embodiment of Mold Cleaning Device Another embodiment of the molding device cleaning device according to the present invention will be described below.
The configuration shown in FIG. 15 is a case where the spot BS of the pulse laser beam B moves on the lower surface of the upper die 251 or the upper surface of the lower die 252 along the path shown in FIG. That is, the direction in which the spot BS reciprocates (corresponding to the first direction) between the laser beam moving unit 12 and the upper mold 251 or the lower mold 252, and the pulse laser corresponding to the width of one spot BS. A shielding part 17 (shown by a thick solid line in FIG. 15A) for shielding the beam B can be provided. The shielding unit 17 may be provided both between the laser beam moving unit 12 and the upper mold 251 and between the laser beam moving unit 12 and the lower mold 252.

  In the portion where the shielding portion 17 is provided, the spot BS is moved in the Y direction (the second direction) without providing the shielding portion 17 and maintaining the emission of the pulse laser beam B from the laser light source 11 as in the above-described embodiment. ), The pulsed laser beam B is irradiated with a larger number of pulses than in other parts, depending on the speed of the movement. For example, a portion serving as a starting point of irradiation or a portion where movement in the X direction and movement in the Y direction are switched may include a portion where the number of times of irradiation of the pulse laser beam B is different from other portions. The portion where the shielding portion 17 is provided is also a position where the number of times of irradiation of the pulse laser beam B can be less than six times as described above. On the other hand, the pulse laser beam B is shielded by the shielding portions 17 at both ends in the X direction by one spot BS, and cleaning is performed by the pulse laser beam B passing through the unshielded portion. Processing uniformity can be further improved.

  Instead of using the shielding unit 17, the emission of the pulse laser beam B from the laser light source 11 may be stopped while the spot BS is moved in the Y direction. Further, the moving speed of the pulse laser beam may be changed, and the laser fluence and / or the repetition frequency per pulse may be changed accordingly. For example, by moving the laser beam faster, and thereby increasing the laser fluence per pulse and / or increasing the repetition frequency, the area that can be irradiated with the pulse laser beam in the same time can be expanded. it can.

  The spot BS may be moved in one direction in the X direction (path shown by a thin solid line in the figure), for example, as shown in FIG. 16A, in addition to being moved in a zigzag shape as shown in FIGS. Then, the emission of the pulse laser beam B from the laser light source 11 is stopped, and the laser beam returns to the initial position in the X direction and moves by one spot BS in the Y direction (the path indicated by the thin broken line in the figure). The operation of moving one way in the direction may be repeated. Alternatively, as shown in FIG. 16 (b), one zigzag movement (or one-way repetitive movement in FIG. 16 (a)) can be applied to the entire cleaning target (without dividing into a plurality of irradiation areas as described above). The pulse laser beam B may be applied.

  In order to move the reflecting mirror 13 in the X direction, as shown in FIG. 17, an X direction rail 181, an X direction belt 182, a belt attaching member 183, an X direction motor 184, an X direction pulley 185, a motor block The X-direction moving mechanism 18 having the 186, the pulley block 187, and the Y-direction rail 188 may be used. The X-direction rail 181 is a rail that extends in the X direction directly under the upper mold 251 or directly above the lower mold 252 so as to cross the molds. The X-direction belt 182 extends substantially parallel to the X-direction rail 181, and the bearing holding portion 134 </ b> L or the outer holding member 134 </ b> R of the reflecting mirror 13 is attached by a belt attaching member 183. The bearing holder 134L or the outer holder 134R attached to the X-direction belt 182 is supported by the X-direction rail 181. The X-direction motor 184 is housed in a motor block 186, and the motor block 186 is fixed to one end of the X-direction rail 181. The X-direction pulley 185 is housed in a pulley block 187, and the pulley block 187 is fixed to the other end of the X-direction rail 181. The X-direction belt 182 is hung on an X-direction motor 184 and an X-direction pulley 185. The motor block 186 is mounted on a Y-direction rail 188, and each component of the X-direction moving mechanism 18 other than the Y-direction rail 188 can move in the Y-direction along the Y-direction rail 188.

  In the X-direction moving mechanism 18, the X-direction pulley 185 rotates with the rotation of the X-direction motor 184, thereby moving the X-direction belt 182 in the X-direction. The reflection mirror 13 attached to the X-direction belt 182 moves in the X-direction. According to the X-direction moving mechanism 18, since the X-direction motor 184 is disposed outside the upper mold 251 and the lower mold 252 in the X-direction, heat from the upper mold 251 and the lower mold 252 is dissipated. Can be suppressed. In addition, in order to move the laser light source 11 and the laser beam moving part 12 in the X direction, the same one as the X direction moving mechanism 18 can be used.

  FIG. 18 shows another embodiment of the mold cleaning device according to the present invention. The molding die cleaning device 10A of this embodiment includes a laser light source 11, a laser beam moving unit 12, an XY stage 14, and an XY stage driver 15 similar to the molding die cleaning device 10. In FIG. 18, the XY stage 14 and the XY stage driver 15 are not shown. Further, the mold cleaning device 10A includes a first reflecting mirror 13X and a second reflecting mirror 13Y instead of the reflecting mirror 13 in the above-described mold cleaning device 10. Further, the mold cleaning device 10A includes a mirror switching unit (mirror switching mechanism) 16 including an optical path switching mirror 161 and an optical path switching mirror moving unit 162.

  The first reflecting mirror 13X is rotatable about a rotating shaft extending in the X direction, and is arranged on the optical path of the pulse laser beam B emitted from the laser beam moving unit 12. The second reflecting mirror 13Y has a configuration in which the first reflecting mirror 13X is rotated by 90 ° around the Z axis, is rotatable around a rotating shaft extending in the Y direction, and has a laser beam moving unit. It is arranged on the side of the optical path of the pulsed laser beam B emitted from 12.

  The light path switching mirror 161 has a reflecting surface parallel to the Z axis and faces a direction inclined by 45 ° with respect to the pulse laser beam B emitted from the laser beam moving unit 12. The optical path switching mirror moving section 162 moves the optical path switching mirror 161 between the outside (side) and the inside of the optical path of the pulse laser beam B emitted from the laser beam moving section 12.

  The operation of the mold cleaning device 10A will be described. First, with the optical path switching mirror 161 arranged outside the optical path of the pulse laser beam B by the optical path switching mirror moving unit 162, the reflecting surface of the first reflecting mirror 13X is tilted downward and inclined by 45 ° with respect to the XZ plane. Then, similarly to the case of the mold cleaning device 10, the pulse laser beam B is emitted from the laser light source 11, and then reciprocated in the X direction and moved in the Y direction by the laser beam moving unit 12. Thereby, the pulsed laser beam B is reflected by the first reflecting mirror 13X and is irradiated on the surface of the lower mold 252. Here, since the reflecting surface of the first reflecting mirror 13X is inclined by 45 ° with respect to the XZ plane, the pulse laser beam B is vertically incident on the upper surface of the lower mold 252. However, in this case, it is difficult to irradiate the pulse laser beam B to a surface perpendicular to the upper surface in the lower mold 252, for example, a side surface facing the cavity C. Therefore, after the above operation is completed, the angle of the reflecting surface of the first reflecting mirror 13X is changed from 45 ° to another size, and the side surface of the lower mold 252 parallel to the X direction is irradiated with the pulse laser beam B. can do.

  Subsequently, the pulse laser beam B is reciprocated in the X direction and moved in the Y direction by the laser beam moving unit 12 after the reflecting surface of the first reflecting mirror 13X is inclined upward by 45 ° with respect to the XZ plane. Thereby, the surface of the upper mold 251 is irradiated with the pulse laser beam B. Also at this time, after the operation is performed with the angle of the reflecting surface of the first reflecting mirror 13X set to 45 °, the angle is changed to a size other than 45 °, so that the side surface of the upper die 251 parallel to the X direction can be formed. Irradiation with the pulse laser beam B can be performed.

  However, even with the above operations, the side surface parallel to the Y direction in the lower mold 252 and the upper mold 251 cannot be irradiated with the pulse laser beam B. Therefore, the optical path switching mirror moving unit 162 moves the optical path switching mirror 161 into the optical path of the pulse laser beam B emitted from the laser beam moving unit 12. Then, the reflection surface of the second reflecting mirror 13Y is directed downward and the angle formed with the XZ plane is set to a value other than 45 °. The pulse laser beam B is emitted from the laser light source 11, and the laser beam moving unit 12 controls the X-direction. The pulse laser beam B can be applied to the side surface of the lower mold 252 parallel to the Y direction by reciprocating the laser beam and moving the same in the Y direction. Further, when an electric beam diameter variable lens is mounted, the spot size can be adjusted according to the angle of the second reflecting mirror 13Y by electrically moving the built-in lens. Each operation described here can also be performed on the upper mold 251.

  As described above, according to the mold cleaning device 10A, the side surfaces parallel to the X direction and the Y direction in the lower mold 252 and the upper mold 251 can be irradiated with the pulsed laser beam B, so that the lower mold 252 and the upper mold 251 can be more reliably lowered. The mold 252 and the upper mold 251 can be cleaned.

  FIG. 19 shows a mold cleaning device 10B which is still another embodiment of the mold cleaning device according to the present invention. The mold cleaning device 10B of this embodiment has a laser light source 11, a laser beam moving unit 12, an XY stage 14, and an XY stage driver 15 similar to the mold cleaning device 10 described above. In FIG. 19, the XY stage 14 and the XY stage driver 15 are not shown. Further, the molding die cleaning device 10B has a first reflecting mirror 13A and a second reflecting mirror 13B instead of the reflecting mirror 13 in the molding die cleaning device 10. Further, the mold cleaning device 10B includes a mirror switching unit (mirror switching mechanism) 16A.

  The first reflecting mirror 13A is rotatable around the axis in the Z direction by the mirror switching unit 16A as described above, and is also rotatable about a rotation axis on the XY plane. It is arranged on the optical path of the emitted pulse laser beam B. The second reflecting mirror 13 </ b> B is rotatable about a rotating shaft extending in the Y direction, and is disposed on a side of the optical path of the pulse laser beam B emitted from the laser beam moving unit 12. The mirror switching unit 16A is provided below the first reflecting mirror 13A, and is configured to rotate the first reflecting mirror 13A about an axis in the Z direction along an annular rail.

  The operation of the mold cleaning device 10B will be described. First, the direction of the first reflecting mirror 13A is set by the mirror switching unit 16A such that the intersection line between the reflecting surface of the first reflecting mirror 13A and the XY plane is parallel to the X axis (FIG. 19A). In this state, similarly to the first reflecting mirror 13X in the above-described mold cleaning device 10A, the first reflecting mirror 13A is rotated by a rotating shaft extending in the X direction, and the reflecting surface of the first reflecting mirror 13A is directed downward. And inclined at 45 ° to the XZ plane, downward and inclined at an angle other than 45 ° to the XZ plane, upward and inclined at 45 ° to the XZ plane, upward and XZ The pulsed laser beam B is applied to the first reflecting mirror 13A in four states, that is, in a state of being inclined at an angle other than 45 ° with respect to the plane. As a result, the pulsed laser beam B is reflected by the first reflecting mirror 13A, and can be applied to the surface of the lower mold 252 or the upper mold 251 including the side surface substantially parallel to the XZ plane. When irradiating the lower mold 252 with the pulse laser beam B with the reflecting surface facing downward, the pulse laser beam B reflected by the first reflecting mirror 13A is hollow inside the annular rail of the mirror switching unit 16A. Through the department.

  Next, the first reflecting mirror 13A is erected so that the reflecting surface is perpendicular to the XY plane, and the mirror switching unit 16A is operated by the first reflecting mirror so that the reflecting surface is oriented at 45 ° with respect to the XZ plane. 13A is rotated around the Z axis (FIG. 19B). In this state, the pulsed laser beam B applied to the first reflecting mirror 13A is reflected by the first reflecting mirror 13A and enters the second reflecting mirror 13B. The reflection surface of the second reflecting mirror 13B is directed downward, and the angle formed with the XZ plane is set to a value other than 45 °. The pulse laser beam B is emitted from the laser light source 11, and the laser beam moving unit 12 transmits the pulse laser beam B in the X direction. The pulse laser beam B can be applied to the side surface of the lower mold 252 parallel to the Y direction by reciprocating the laser beam and moving the same in the Y direction. Further, when an electric beam diameter variable lens is mounted as the lens 122, the built-in lens is moved electrically so that the second reflecting mirror 13B has the same spot size as that reflected by the first reflecting mirror 13A. The spot size can be adjusted in accordance with the optical path when the light is reflected by the light source and the angle of the second reflecting mirror 13B. Each operation described here can also be performed on the upper mold 251.

  As described above, similarly to the molding die cleaning device 10A, the molding die cleaning device 10B also irradiates the pulse laser beam B to the XZ plane and the side surface substantially parallel to the XZ plane in the lower die 252 and the upper die 251. Thus, the lower mold 252 and the upper mold 251 can be more reliably cleaned.

  FIG. 20 shows a configuration of a resin molding unit 30 including a plurality of sets of the resin molding units 20 and one set of the mold cleaning device 10. The resin molding unit 30 has one material receiving module 31, a plurality of molding modules 32, one dispensing module 33, and one molding die cleaning device standby module. The material receiving module 31 is a device for receiving the tablet-shaped resin material P and the lead frame L from the outside and sending them to the molding module 32, and has a lead frame receiving section 311 and a tablet supply section 312. One molding module 32 has one resin molding unit 20 in the resin molding apparatus 1 of the above embodiment. Although three molding modules 32 are shown in FIG. 20, any number of molding modules 32 can be provided in the resin molding unit 30. Further, even after the resin molding unit 30 has been assembled and used, the number of molding modules 32 can be increased or decreased. The dispensing module 33 carries in and holds the resin molded product manufactured by the molding module 32 from the molding module 32, and has a resin molded product holding portion 331. The mold cleaning device standby module 34 accommodates the mold cleaning device 10 when not in use.

  The transfer device 35 carries the substrate and the resin material from the material receiving module 31 to the forming module 32 along the transfer rail provided in the resin forming unit 30 and discharges the formed resin molded product from the forming module 32. It is a device that is carried out to the module 33. In addition, when cleaning the molding die in a certain molding module 32, the transport device 35 carries the molding die cleaning device 10 into the molding module 32 (FIG. 21), and after the cleaning of the molding die is completed. It also has a function to carry out the mold cleaning device 10 from the molding module 32.

  The resin molding unit 30 is suitable for mass-producing resin molded products because a plurality of molding modules 32 can produce resin molded products in parallel. At that time, a certain amount of time is required from mounting the substrate on the molding die to producing the resin molded article and then carrying out the molded article, so that a certain molding module 32 produces the resin molded article. By attaching the molding object to another molding module 32 or carrying out the resin molded product from another molding die, the production efficiency of the resin molded product can be increased, and the cost required for the transfer device can be suppressed. . Further, the molding die cleaning device 10 can be shared by a plurality of molding modules 32.

  In the resin molding unit 30, the molding die cleaning device standby module 34 arranged in the same row as the other modules is used. However, instead of the resin molding unit 30A shown in FIG. A mold cleaning device housing and moving module 34A extending along the line may be used. The configurations of the material receiving module 31, the molding module 32, and the dispensing module 33 in the resin molding unit 30A are the same as those of the resin molding unit 30. The mold cleaning device housing / moving module 34A has therein a mold cleaning device moving unit 35A that houses the mold cleaning device 10 and moves the mold cleaning device 10 in the direction in which other modules are arranged. As viewed from the resin molding unit 20 of each molding module 32, the molding die cleaning device housing / moving module 34A and the molding die cleaning device moving unit 35A therein are provided on the opposite side of the transport device 35. The operation of the resin molding unit 30A is the same as that of the resin molding unit 30 except that the molding die cleaning device moving unit 35A is used when the molding die cleaning device 10 is carried into and out of the molding module 32. .

  The present invention is not limited to the above embodiments, and various other modifications are possible within the scope of the present invention.

For example, in the above embodiment, the laser fluence per pulse is 0.04 to 0.7 J / cm ² , the scanning laser power density per ^second is ² to 15 W / cm ² , the pulse width is 1 to 200 nsec, and the pulse repetition is Pulsed laser beams having a frequency in the range of 300 kHz to 10 MHz are used, but their values are not limited to the above ranges. Further, a continuous oscillation laser beam may be used instead of the pulse laser beam. Further, in the above embodiment, a (pulse) laser beam which is shaped so that the cross section perpendicular to the beam becomes a square and has a top hat type irradiation intensity distribution is used. A laser beam having another shape such as a ring shape or a concave shape or a laser beam having another irradiation intensity distribution such as a Gaussian shape may be used. In FIG. 23, the spot (a) of the laser beam having a circular cross section and the manner in which the spot moves (b), and the spot (c) of the laser beam having a circular cross section and the spot moving The situation (d) is shown.

  In the above embodiment, the pulse laser beam is moved so that the overlap ratio becomes 85% or more. However, the moving speed of the pulse laser beam is not limited thereto, and the moving speed is reduced when a continuously oscillating laser beam is used. What is necessary is just to set suitably. In the above embodiment, the (pulse) laser beam is moved so that the spot moves zigzag on the surface of the upper mold 251 or the lower mold 252, but the movement path of the spot is not limited to this. For example, after the laser beam is moved one way in the X direction, the laser beam is stopped, the laser beam returns to the initial position in the X direction, moves by one spot in the Y direction, and further moves one way in the X direction. You may.

  In the above embodiment, the pulse laser beam B is reciprocated in the X direction using the galvano scan head 121 and is moved in the Z direction (the spot is in the Y direction on the surface of the upper mold 251 or the lower mold 252). The scan head 121 may perform only the reciprocating movement in the X direction, and move the reflecting mirror 13 in the Y direction to move the spot on the surface of the upper mold 251 or the lower mold 252 in the Y direction.

10, 10A, 10B ... Mold cleaning device 11 ... Laser light source 112 ... Table 12 ... Laser beam moving unit (laser beam moving mechanism)
121 Galvano scan head 122 Lenses 13 and 13W Reflecting mirrors 13A and 13X First reflecting mirrors 13B and 13Y Second reflecting mirror 131L First gripper 131R Second gripper 132L First rotating shaft 132R... Second rotating shaft 1321L, 1321R... Groove 133L... Bearing 133R... Rotating shaft movable holder 134L... Bearing holding portion 134R... Outer holding member 135L. 137L ... bearing fixture 14 ... XY stage 141 ... connecting rod 142 ... guide rod 15 ... XY stage driver 16, 16A ... mirror switching unit (mirror switching mechanism)
161, optical path switching mirror 162, optical path switching mirror moving section 17, shielding section 18, X direction moving mechanism 181, X direction rail 182, X direction belt 183, belt mounting member 184, X direction motor 185, X direction pulley 186, motor Block 187 Pulley block 188 Y-direction rail 20 Resin molding section 211 Base 212 Tie bar 213 Toggle link 221 Movable platen 222 Fixed platen 25 Mold 251 Upper mold 2511 Cul block 2513 Runner 252 Lower mold 2521 Pot 2522 Plunger 2523 Runner 253 Heater plate 2531 Heater 30 Resin molding unit 31 Material receiving module 311 Lead frame receiving unit 312 Tablet supply unit 32 Molding module 33 Dispensing module 331 Resin Molding Holding unit 34: Mold cleaning device standby module 34A: Mold cleaning device housing / moving module 35 ... Transport device 35A: Mold cleaning device moving unit A: Deposits AG: Vaporized deposits B: Pulsed laser beam BS: Pulse Laser beam spot C Cavity CT Coating L Lead frame P Resin material PL Plasma

Claims (15)

An apparatus for removing deposits attached to at least one surface of a first mold and a second mold opposed to the first mold that constitute a molding die,
a) a laser light source that is provided outside a space between the first mold and the second mold and emits the laser beam;
b) a reflecting mirror, and a reflecting mirror moving mechanism for moving the reflecting mirror between a first position in the space and a second position outside the space, wherein the reflecting mirror is in the first position. A laser beam reflecting mechanism in which the direction of the reflecting mirror is set so that the laser beam reflected by the reflecting mirror is applied to the surface of the first type or the second type when the mirror is located at
and c) a laser beam moving mechanism provided outside the space for moving the laser beam with respect to the reflecting mirror when the laser beam is at the first position.   The mold cleaning apparatus according to claim 1, wherein the laser beam moving mechanism is a galvano scan head.   The mold cleaning apparatus according to claim 1, wherein the laser beam reflecting mechanism further includes a reflecting direction changing mechanism that changes a direction of the reflecting mirror.   The reflection mirror includes a first reflection mirror and a second reflection mirror having different directions, and the laser beam reflection mechanism further includes a mirror switching mechanism for switching a mirror to be irradiated with the laser beam. Item 3. The mold cleaning device according to Item 1 or 2. further,
A first rotating shaft and a second rotating shaft connected in a pair to both sides of the reflecting mirror;
The rotating shaft holder for holding at least one of the first rotating shaft and the second rotating shaft movably in the axial direction is provided. Mold cleaning device. An apparatus for removing deposits attached to the mold having at least a part of its surface coated,
The laser light source and the laser beam moving mechanism generate plasma on the deposit, and have an irradiation intensity capable of heating the plasma to a temperature equal to or higher than a temperature at which the deposit vaporizes, and damage the coating. The molding die cleaning apparatus according to any one of claims 1 to 5, wherein the molding die is irradiated with a laser beam at an irradiation intensity lower than the irradiation intensity that gives the laser beam. The laser beam moving mechanism,
Reciprocating the laser beam in a first direction with respect to the mold,
Each time the laser beam is moved one way in the first direction, the laser beam is moved in the second direction perpendicular to the first direction by one spot of the laser beam irradiated on the mold. Thing,
7. The image forming apparatus according to claim 1, further comprising a shielding portion between the laser beam moving mechanism and the molding die, the shielding portion shielding one portion of the spot at both ends of the reciprocating movement in the first direction. The mold cleaning device according to any one of the above. A method for removing deposits attached to a surface of at least one of a first mold and a second mold opposed to the first mold constituting a molding die,
Disposing a reflecting mirror in a space between the first type and the second type;
While emitting a laser beam from a laser light source provided outside the space, while moving the laser beam with respect to the reflecting mirror by a laser beam moving mechanism provided outside the space, the laser beam Irradiate the reflector,
A method of cleaning a molding die, comprising irradiating the first die or the second die with the laser beam reflected by the reflecting mirror.   The method according to claim 8, wherein the laser beam moving mechanism is a galvano scan head.   The method according to claim 8, wherein the direction of the reflecting mirror is changed.   10. The molding die cleaning method according to claim 8, wherein the reflecting mirror includes a first reflecting mirror and a second reflecting mirror having different directions, and switches a mirror to be irradiated with the laser beam.   A first rotating shaft and a second rotating shaft connected to both sides of the reflector in a pair, and at least one of the first rotating shaft and the second rotating shaft being movable in an axial direction; The mold cleaning method according to any one of claims 8 to 11, wherein a holding tool for holding the rotating shaft is used. A method for removing deposits attached to the mold having at least a portion of the surface coated,
An irradiation intensity capable of heating the plasma to a temperature equal to or higher than a temperature at which the attached matter is vaporized after generating plasma on the attached matter, and an irradiation intensity lower than the irradiation intensity that damages the coating, The mold cleaning method according to claim 8, wherein the laser beam is applied to the mold.   A resin molding apparatus comprising the molding die and the molding die cleaning device according to claim 1.   A method for producing a resin molded product, comprising: performing a molding die cleaning method according to any one of claims 8 to 13, and then producing a resin molded product using the molding die.