JP2021027352A - 垂直バッチ炉組立体 - Google Patents
垂直バッチ炉組立体 Download PDFInfo
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D15/00—Handling or treating discharged material; Supports or receiving chambers therefor
- F27D15/02—Cooling
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3312—Vertical transfer of a batch of workpieces
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3404—Storage means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/045—Storage devices mechanical in a circular arrangement, e.g. towers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D3/0084—Charging; Manipulation of SC or SC wafers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D3/12—Travelling or movable supports or containers for the charge
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3218—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H10P72/3412—Batch transfer of wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0297—Wafer cassette
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D2003/0034—Means for moving, conveying, transporting the charge in the furnace or in the charging facilities
- F27D2003/0051—Means for moving, conveying, transporting the charge in the furnace or in the charging facilities comprising means to pick up the charge and put it down
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D2003/0085—Movement of the container or support of the charge in the furnace or in the charging facilities
- F27D2003/0087—Rotation about a vertical axis
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Robotics (AREA)
Abstract
Description
12 ウェーハボート
16 ウェーハカセット
18 カセット収納カルーセル
20 内壁
22 ウェーハ移送開口部
24 ウェーハ移送位置
26 カセット操作空間
28 カセットハンドラ
30 ウェーハ操作空間
32 ウェーハハンドラ
34 ウェーハボート移送位置
36 (垂直バッチ炉組立体の)幅
38 (垂直バッチ炉組立体の)長さ
48 カセット出入ポート
50 カセットハンドラアーム
52 昇降機構
56 第1のプロセスチャンバ
58 第2のプロセスチャンバ
60 ウェーハボート操作デバイス
62 第1のウェーハボート搭載/受入れ位置
64 第2のウェーハボート搭載/受入れ位置
70 基台ステージ
72 回転可能なテーブル
74 ウェーハボート支持面
76 中心軸
78および78’ ウェーハボートリフト組立体
80 冷却位置
82 中間位置
84 ウェーハボート移送機構
Claims (13)
- ウェーハを処理するための垂直バッチ炉組立体(10)であって、
複数のウェーハを備えた複数のウェーハカセット(16)を収納するように構成されたカセット収納部、およびウェーハカセット(16)を前記カセット収納部とウェーハ移送位置(24)の間で移送するように構成されたカセットハンドラ(28)を備えるカセット操作空間(26)と、
ウェーハを、前記ウェーハ移送位置(24)にあるウェーハカセット(16)と、ウェーハボート移送位置(34)にあるウェーハボート(12)の間で移送するように構成されたウェーハハンドラ(32)を備えたウェーハ操作空間(30)と、
前記カセット操作空間(26)と前記ウェーハ操作空間(30)とを分離する内壁(20)であって、ウェーハの移送元または移送先となる、ウェーハカセット(16)のための前記ウェーハ移送位置(24)に隣接したウェーハ移送開口部(22)を備える内壁(20)とを備え、
前記カセット収納部が、1.1メートルから1.6メートルの間の直径を有するカセット収納カルーセル(18)を備える、垂直バッチ炉組立体(10)。 - 前記垂直バッチ炉組立体(10)の幅(36)を画定する2つの対向する短辺を有し、かつ前記垂直バッチ炉組立体(10)の長さ(38)を画定する2つの対向する長辺を有する実質的に長方形の設置面積を備え、前記垂直バッチ炉組立体(10)の前記幅(36)は、1.65メートル以下である、請求項1に記載の垂直バッチ炉組立体。
- 前記カセット収納カルーセル(18)は、少なくとも1つの基台ステージ(70)を有し、かつ基台ステージ(70)ごとに、5個から8個の間のウェーハカセット(16)を収納する容量を有する、請求項1または2に記載の垂直バッチ炉組立体。
- 前記カセット収納カルーセル(18)は、約1.1メートルから1.2メートルの直径を有し、かつ基台ステージ(70)ごとに5個のウェーハカセット(16)を収納する容量を有する、請求項3に記載の垂直バッチ炉組立体。
- 前記カセット収納カルーセル(18)は、約1.3メートルから1.5メートルの直径を有し、かつ基台ステージ(70)ごとに6個のウェーハカセット(16)を収納する容量を有する、請求項3に記載の垂直バッチ炉組立体。
- 前記カセット収納カルーセル(18)は、約1.4メートルから1.6メートルの直径を有し、かつ基台ステージ(70)ごとに約8個のウェーハカセット(16)を収納する容量を有する、請求項3に記載の垂直バッチ炉組立体。
- ウェーハボート(12)に収容されたウェーハを処理するための第1のプロセスチャンバ(56)と、
ウェーハボート(12)に収容されたウェーハを処理するための第2のプロセスチャンバ(58)と、
ウェーハボート(12)を支持するようにそれぞれが構成された複数のウェーハボート支持面(74)を有する1つの回転可能なテーブル(72)を備える単一のウェーハボート操作デバイス(60)であって、前記回転可能なテーブル(72)は、各ウェーハボート支持面(74)を、
前記ウェーハボート操作デバイス(60)がウェーハボート(12)を前記回転可能なテーブル(72)から前記第1のプロセスチャンバ(56)へと垂直に搭載し、かつ前記ウェーハボート(12)を前記第1のプロセスチャンバ(56)から前記回転可能なテーブル(72)上に受け入れるように構成される、第1のウェーハボート搭載/受入れ位置(62)に、また
前記ウェーハボート操作デバイス(60)が前記ウェーハボート(12)を前記回転可能なテーブル(72)から前記第2のプロセスチャンバ(58)へと垂直に搭載し、かつ前記ウェーハボート(12)を前記第2のプロセスチャンバ(58)から前記回転可能なテーブル(72)上に受け入れるように構成される、第2のウェーハボート搭載/受入れ位置(64)に
移送するように、中心の実質的に垂直な軸(76)の回りで作動器により回転可能である、単一のウェーハボート操作デバイス(60)と
をさらに備える、請求項1から6のいずれか一項に記載の垂直バッチ炉組立体。 - 前記ウェーハボート操作デバイス(60)は、ウェーハボート(12)を前記第1のウェーハボート搭載/受入れ位置(62)と前記第1のプロセスチャンバ(56)の間で移送するように構成された第1のウェーハボートリフト組立体(78)を備える、請求項7に記載の垂直バッチ炉組立体。
- 前記ウェーハボート操作デバイス(60)は、ウェーハボート(12)を前記第2のウェーハボート搭載/受入れ位置(64)と前記第2のプロセスチャンバ(58)の間で移送するように構成された第2のウェーハボートリフト組立体(78)を備える、請求項7または8に記載の垂直バッチ炉組立体。
- 前記回転可能なテーブル(72)は、各ウェーハボート支持面(74)を、
前記ウェーハボート操作デバイス(60)が前記ウェーハボート(12)を冷却するように構成される冷却位置(80)にさらに移送するように回転可能である、請求項7から9のいずれか一項に記載の垂直バッチ炉組立体。 - 前記回転可能なテーブル(72)は、各ウェーハボート支持面(74)を中間のウェーハボート位置(82)にさらに移送するように回転可能であり、前記垂直バッチ炉組立体は、前記中間位置(82)にあるウェーハボート支持面(74)上にあるウェーハボート(12)を前記ボート移送位置(34)に、またその逆も同様に移送するように構成されたボート移送機構(84)をさらに備える、請求項7から10のいずれか一項に記載の垂直バッチ炉組立体。
- 前記カセット操作空間(26)の境界を定める壁(84)に設けられた少なくとも1つのカセット出入ポート(48)をさらに備え、前記カセットハンドラ(28)は、ウェーハカセット(16)を、前記カセット収納部、前記ウェーハ移送位置(24)、および前記少なくとも1つのカセット出入ポート(48)の間で移送するように構成される、請求項1から11のいずれか一項に記載の垂直バッチ炉組立体。
- 前記カセットハンドラ(28)は、カセットハンドラアーム(50)と、前記カセット収納部内の異なる垂直高さにあるウェーハカセット(16)に達するように構成された昇降機構(52)とを備える、請求項1から12のいずれか一項に記載の垂直バッチ炉組立体。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962880946P | 2019-07-31 | 2019-07-31 | |
| US62/880,946 | 2019-07-31 |
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| Publication Number | Publication Date |
|---|---|
| JP2021027352A true JP2021027352A (ja) | 2021-02-22 |
| JP7654365B2 JP7654365B2 (ja) | 2025-04-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2020129117A Active JP7654365B2 (ja) | 2019-07-31 | 2020-07-30 | 垂直バッチ炉組立体 |
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| Country | Link |
|---|---|
| US (1) | US11915960B2 (ja) |
| JP (1) | JP7654365B2 (ja) |
| KR (1) | KR102902020B1 (ja) |
| CN (1) | CN112309935B (ja) |
| TW (1) | TWI894159B (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024102748A (ja) * | 2023-01-19 | 2024-07-31 | 株式会社Kokusai Electric | 基板処理装置、基板処理方法、半導体装置の製造方法及びプログラム |
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| CN112309935A (zh) | 2021-02-02 |
| KR102902020B1 (ko) | 2025-12-18 |
| TW202120403A (zh) | 2021-06-01 |
| US11915960B2 (en) | 2024-02-27 |
| CN112309935B (zh) | 2025-09-23 |
| JP7654365B2 (ja) | 2025-04-01 |
| TWI894159B (zh) | 2025-08-21 |
| US20210035841A1 (en) | 2021-02-04 |
| KR20210016282A (ko) | 2021-02-15 |
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