JP2021170601A - ウエーハ生成装置 - Google Patents
ウエーハ生成装置 Download PDFInfo
- Publication number
- JP2021170601A JP2021170601A JP2020073430A JP2020073430A JP2021170601A JP 2021170601 A JP2021170601 A JP 2021170601A JP 2020073430 A JP2020073430 A JP 2020073430A JP 2020073430 A JP2020073430 A JP 2020073430A JP 2021170601 A JP2021170601 A JP 2021170601A
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- Prior art keywords
- wafer
- ingot
- cassette
- tray
- accommodating portion
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
- H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3202—Mechanical details, e.g. rollers or belts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3218—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3222—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3404—Storage means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H10P72/3412—Batch transfer of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Robotics (AREA)
Abstract
Description
4:搬送トレー
6:ベルトコンベアーユニット
8:カセット
10:カセットラック
12:移し替え手段
22:インゴット収容部
22a:第一のインゴット収容部
22b:第二のインゴット収容部
28:ウエーハ収容部
28a:第一のウエーハ収容部
28b:第二のウエーハ収容部
34:搬送トレーの識別マーク
34’:カセットラックの識別マーク
34”:カセットの識別マーク
Claims (2)
- インゴットからウエーハを生成するウエーハ生成装置であって、
インゴットを収容するインゴット収容部とインゴットから生成されたウエーハを収容するウエーハ収容部とを備えた搬送トレーと、該搬送トレーを各加工機に搬送するベルトコンベアーユニットと、ウエーハを収容するカセットが該搬送トレーに対応して載置されるカセットラックと、該搬送トレーの該ウエーハ収容部から該カセットラックに載置された該カセットにウエーハを移し替える移し替え手段と、を含み、
該搬送トレーには識別マークが施され、該搬送トレーに対応する該カセットラックまたは該カセットには該搬送トレーに施された識別マークと同じ識別マークが施されるウエーハ生成装置。 - 該識別マークは、色彩、記号、文字、図形、模様、絵のいずれか、または組み合わせである請求項1記載のウエーハ生成装置。
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020073430A JP7408474B2 (ja) | 2020-04-16 | 2020-04-16 | ウエーハ生成装置 |
| KR1020210034352A KR102861251B1 (ko) | 2020-04-16 | 2021-03-17 | 웨이퍼 생성 장치 |
| US17/211,176 US11328945B2 (en) | 2020-04-16 | 2021-03-24 | Wafer forming apparatus |
| CN202110387862.4A CN113539911A (zh) | 2020-04-16 | 2021-04-12 | 晶片生成装置 |
| TW110113265A TWI912306B (zh) | 2020-04-16 | 2021-04-13 | 晶圓生成裝置 |
| DE102021203685.6A DE102021203685B4 (de) | 2020-04-16 | 2021-04-14 | Waferausbildungsvorrichtung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020073430A JP7408474B2 (ja) | 2020-04-16 | 2020-04-16 | ウエーハ生成装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021170601A true JP2021170601A (ja) | 2021-10-28 |
| JP7408474B2 JP7408474B2 (ja) | 2024-01-05 |
Family
ID=77919690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020073430A Active JP7408474B2 (ja) | 2020-04-16 | 2020-04-16 | ウエーハ生成装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11328945B2 (ja) |
| JP (1) | JP7408474B2 (ja) |
| KR (1) | KR102861251B1 (ja) |
| CN (1) | CN113539911A (ja) |
| DE (1) | DE102021203685B4 (ja) |
| TW (1) | TWI912306B (ja) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04159902A (ja) * | 1990-10-18 | 1992-06-03 | Nippon Steel Corp | 在庫管理システム及び在庫管理方法 |
| JPH06183522A (ja) * | 1992-12-17 | 1994-07-05 | Mitsubishi Electric Corp | 半導体ウエハ搬送装置 |
| JP2002347911A (ja) * | 2001-05-21 | 2002-12-04 | Daifuku Co Ltd | 仕分け設備 |
| JP2007150369A (ja) * | 2007-03-14 | 2007-06-14 | Renesas Technology Corp | 半導体装置の製造方法 |
| JP2011144000A (ja) * | 2010-01-14 | 2011-07-28 | Techno Craft Co Ltd | カラーコード印刷体 |
| JP2019106458A (ja) * | 2017-12-12 | 2019-06-27 | 株式会社ディスコ | ウエーハ生成装置および搬送トレー |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000094221A (ja) | 1998-09-24 | 2000-04-04 | Toyo Advanced Technologies Co Ltd | 放電式ワイヤソー |
| JP2003347200A (ja) * | 2002-05-29 | 2003-12-05 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
| JP4849804B2 (ja) * | 2004-09-28 | 2012-01-11 | 日本電産サンキョー株式会社 | ロボットの作動方法 |
| JP6858452B2 (ja) * | 2017-06-23 | 2021-04-14 | 株式会社ディスコ | 識別マーク付きウェーハ治具 |
-
2020
- 2020-04-16 JP JP2020073430A patent/JP7408474B2/ja active Active
-
2021
- 2021-03-17 KR KR1020210034352A patent/KR102861251B1/ko active Active
- 2021-03-24 US US17/211,176 patent/US11328945B2/en active Active
- 2021-04-12 CN CN202110387862.4A patent/CN113539911A/zh active Pending
- 2021-04-13 TW TW110113265A patent/TWI912306B/zh active
- 2021-04-14 DE DE102021203685.6A patent/DE102021203685B4/de active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04159902A (ja) * | 1990-10-18 | 1992-06-03 | Nippon Steel Corp | 在庫管理システム及び在庫管理方法 |
| JPH06183522A (ja) * | 1992-12-17 | 1994-07-05 | Mitsubishi Electric Corp | 半導体ウエハ搬送装置 |
| JP2002347911A (ja) * | 2001-05-21 | 2002-12-04 | Daifuku Co Ltd | 仕分け設備 |
| JP2007150369A (ja) * | 2007-03-14 | 2007-06-14 | Renesas Technology Corp | 半導体装置の製造方法 |
| JP2011144000A (ja) * | 2010-01-14 | 2011-07-28 | Techno Craft Co Ltd | カラーコード印刷体 |
| JP2019106458A (ja) * | 2017-12-12 | 2019-06-27 | 株式会社ディスコ | ウエーハ生成装置および搬送トレー |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102021203685B4 (de) | 2025-10-02 |
| KR102861251B1 (ko) | 2025-09-17 |
| TWI912306B (zh) | 2026-01-21 |
| DE102021203685A1 (de) | 2021-10-21 |
| JP7408474B2 (ja) | 2024-01-05 |
| KR20210128336A (ko) | 2021-10-26 |
| CN113539911A (zh) | 2021-10-22 |
| TW202141678A (zh) | 2021-11-01 |
| US20210327733A1 (en) | 2021-10-21 |
| US11328945B2 (en) | 2022-05-10 |
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