JP2632151B2 - Manufacturing method of circuit block - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a circuit block that does not require a substrate (base material).

[Prior art and problems] As a conventional circuit block, like a hybrid IC, a circuit pattern is formed on a substrate (base material) made of a material such as ceramic or paper epoxy resin and electronic components are mounted. is there.

However, since these circuit blocks essentially use a substrate (base material), (1) a thinner and lighter weight than the substrate (base material) cannot be achieved.

(2) Since a circuit is formed on a substrate (base material),
It is impossible to obtain a performance higher than the electrical performance (volume resistance, surface resistance, insulation resistance, dielectric constant, dielectric loss tangent, etc.) of the substrate (base material).

(3) Since the substrate (base material) is used, the cost is increased accordingly.

Had the disadvantage that

[Object of the invention]

The present invention has been made in order to solve the above-described drawbacks, and has as its object to provide a method of manufacturing a circuit block in which a substrate (base material) is omitted.

[Summary of the Invention]

The method for manufacturing a circuit block according to the present invention includes a step of forming a release layer on a support, a step of forming a circuit pattern on the release layer, and forming an insulating layer by filling an insulating agent between the circuit patterns. And a step of mounting an electronic component at a predetermined position of the circuit pattern, and a step of peeling the support from a peeling layer.

(Example of the invention)

 One embodiment of the present invention will be described with reference to FIG.

In FIG. 1, reference numeral 1 denotes a support, and a release agent is applied to the upper surface of the support 1 to form a release layer 2 as shown in FIG.

A predetermined circuit pattern 3 is applied on the release layer 2 using a photo-curing type baking paste (FIG. 1 (b)).
The photocurable firing paste contains conductive fine powder, vitreous frit, photocurable resin, and the like.

Next, in order to cure the photo-curing type firing paste applied in the shape of the circuit pattern 3, light is irradiated (first
(FIG. 1 (c)), a circuit pattern 3 is formed (FIG. 1 (d)).

Subsequently, an insulating agent 4 having an adhesive property and an insulating property is filled between the formed circuit patterns 3 to form an insulating layer 4 (FIG. 1E). Thereby, the circuit patterns 3 are insulated and bonded.

Further, the upper surface of the circuit pattern 3 is polished (FIG. 1 (f)). FIG. 1 (f) shows a state where polishing has been completed. This polishing involves mounting electronic components in the post-process.
This is performed in order to prevent misalignment and to remove the insulating layer 4 adhered to the upper surface of the circuit pattern 3.

This polishing step can be omitted if the method of filling the insulating layer 4 with the insulating agent and the thickness of the filling can be appropriately controlled.

Next, an electronic component 6 (a flat electronic component such as a chip component) is mounted on a predetermined circuit pattern 3 and soldered. The soldering 7 may be any of reflow soldering, dip soldering, and point soldering, and may be performed by welding.
Due to this soldering 7, the electronic component 6 becomes the circuit pattern 3
And is mechanically fixed.

Next, as shown in FIG. 1 (h), an overcoat 5 is formed from the upper surface of the circuit pattern 3 including the electronic components using an adhesive having an insulating property. This overcoat 5
Is to insulate the circuit pattern 3 and the electronic component 6 to prevent a short circuit and firmly fix the electronic component 6. However, in consideration of the usage state of the circuit block, it may be omitted when it is considered unnecessary.

Finally, the support 1 is removed from the release layer 2 as shown in FIG. 1 (i).

In this embodiment, the insulating material 4 is used for the circuit pattern 3.
Although the space is filled, it may be applied so as to cover the circuit pattern 3 as shown in FIG. In this case, the polishing step cannot be omitted, and is polished to form a state as shown in FIG. 2 (b), and thereafter the steps shown in FIG. 1 (g) and thereafter are performed.

Further, in the present embodiment, the circuit pattern 3 was made of a photo-curing type baked paste, but in addition to this, a copper foil was adhered and etched, or a predetermined amount of copper was deposited using a catalyst. A circuit pattern may be formed.

〔The invention's effect〕

According to the present invention, since no substrate (base material) is used, the circuit block can be made extremely thin and lightweight.

Further, since a circuit is not formed on the substrate, deterioration of electric performance due to the substrate (base material) can be eliminated, and a circuit block having good electric performance can be obtained.

[Brief description of the drawings]

FIG. 1 is a diagram showing a manufacturing process according to one embodiment of the present invention, and FIG. 2 is a diagram showing a case where a part of the process shown in FIG. 1 is changed. DESCRIPTION OF SYMBOLS 1 ... Support body 2 ... Release layer 3 ... Circuit pattern 4 ... Insulating layer 5 ... Overcoat 6 ... Electronic components 7 ... Solder

Claims (1)

(57) [Claims] 1. A step of forming a release layer on a support, and a step of forming a circuit pattern on the upper surface of the release layer by using a photocurable baking paste, or by attaching a copper tube and etching or depositing copper. Forming, filling an insulating agent having adhesiveness between the circuit patterns to form an insulating layer, mounting an electronic component at a predetermined position of the circuit pattern, and peeling the support from the release layer And a method of manufacturing a circuit block.