JP2865097B2 - - Google Patents

Info

Publication number
JP2865097B2
JP2865097B2 JP9247065A JP24706597A JP2865097B2 JP 2865097 B2 JP2865097 B2 JP 2865097B2 JP 9247065 A JP9247065 A JP 9247065A JP 24706597 A JP24706597 A JP 24706597A JP 2865097 B2 JP2865097 B2 JP 2865097B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP9247065A
Other languages
Japanese (ja)
Other versions
JPH1187586A (ja
JP2865097B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9-247065A priority Critical patent/JP2865097B1/ja
Application granted granted Critical
Publication of JP2865097B1 publication Critical patent/JP2865097B1/ja
Publication of JP2865097B2 publication Critical patent/JP2865097B2/ja
Publication of JPH1187586A publication Critical patent/JPH1187586A/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP9-247065A 1997-09-11 マルチチップモジュールの冷却構造 Expired - Lifetime JP2865097B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9-247065A JP2865097B1 (ja) 1997-09-11 マルチチップモジュールの冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9-247065A JP2865097B1 (ja) 1997-09-11 マルチチップモジュールの冷却構造

Publications (3)

Publication Number Publication Date
JP2865097B1 JP2865097B1 (ja) 1999-03-08
JP2865097B2 true JP2865097B2 (fr) 1999-03-08
JPH1187586A JPH1187586A (ja) 1999-03-30

Family

ID=17157910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9-247065A Expired - Lifetime JP2865097B1 (ja) 1997-09-11 マルチチップモジュールの冷却構造

Country Status (1)

Country Link
JP (1) JP2865097B1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2665351A3 (fr) * 2012-05-17 2016-10-05 Hamilton Sundstrand Corporation Agencement de refroidissement de composant électronique à deux phases
CN111628247A (zh) * 2020-06-30 2020-09-04 广州极飞科技有限公司 电池装置及无人设备

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040011509A1 (en) * 2002-05-15 2004-01-22 Wing Ming Siu Vapor augmented heatsink with multi-wick structure
KR100631900B1 (ko) 2005-01-28 2006-10-11 삼성전기주식회사 열전달 액체를 포함하는 고출력 발광다이오드 패키지
WO2011111126A1 (fr) 2010-03-10 2011-09-15 パナソニック株式会社 Dispositif semi-conducteur et son procédé de fabrication
JP6848417B2 (ja) * 2016-12-19 2021-03-24 日本電気株式会社 冷却装置
US11644249B2 (en) 2018-04-02 2023-05-09 Nec Corporation Electronic apparatus
JP7214565B2 (ja) * 2019-05-22 2023-01-30 古河電気工業株式会社 電力変換装置及び冷却構造体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2665351A3 (fr) * 2012-05-17 2016-10-05 Hamilton Sundstrand Corporation Agencement de refroidissement de composant électronique à deux phases
CN111628247A (zh) * 2020-06-30 2020-09-04 广州极飞科技有限公司 电池装置及无人设备

Also Published As

Publication number Publication date
JPH1187586A (ja) 1999-03-30
JP2865097B1 (ja) 1999-03-08

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Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19981117