JP3077413B2 - Disk polishing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a disk polishing apparatus for polishing a magnetic disk or the like, and more particularly to a method suitable for polishing a small disk.

[0002]

2. Description of the Related Art As a method of polishing the surface of a disk such as a magnetic disk, generally, a spindle is provided, and a disk holding means for clamping or chucking the inner peripheral edge of the disk is attached to the tip of the spindle. Conventionally, a spindle is rotated while the disc is held by the disc holding means, and during this time, the polishing tape is pressed against the front and back surfaces of the disc with a predetermined pressing force by a pressure roller.

[0003]

By the way, as described above, holding a disk by means such as a clamp is limited to a disk having a certain size or more. However, in recent years, small-diameter disks have been used, and there are, for example, 1-inch disks. Such a small-diameter disk naturally has a small inner diameter (for example, about 4 mm), and it is extremely difficult to clamp the inner diameter of the disk. In the case of a small-diameter disk, it is conceivable to perform an outer-diameter chuck, but since its thickness is as thin as, for example, about 0.5 mm,
If an excessive force is applied inward from the outer peripheral side, there is a disadvantage such as deformation.

The present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to enable a small-diameter disk to be smoothly polished. It is in.

[0005]

In order to achieve the above-mentioned object, the present invention provides a disk contacting surface at the tip of a spindle, and the disk contacting surface rotates the disk by vacuum suction. A polishing tape is brought into contact with the surface of the disk, one side of the disk is polished, and then the disk is turned over, and the other side is polished. The feature is that the polishing position on one side is brought into contact with a position shifted by 180 ° in phase, and the spindle is rotated in the direction opposite to that for processing on one side.

[0006]

When polishing a small-diameter disk or the like, it is impossible to perform simultaneous double-side polishing because of the problem of means for holding and rotating the disk. Therefore, processing was performed on each side. That is, a disk contact surface for holding the disk by vacuum suction is formed at the tip of the spindle, and the disk is brought into contact with this disk contact surface. Then, while the spindle is driven to rotate, a polishing tape is brought into contact with the disc, and the polishing tape is fed to perform polishing on one side. When the processing of one side surface is completed, the disk is turned over and the other side surface is processed, but the rotation direction of the other side surface is opposite to the already processed surface. Therefore, when processing the other side surface, the polishing tape is brought into contact with a position where the phase is changed by 180 °, and the polishing is performed while rotating the spindle in the opposite direction to that described above. This allows both surfaces to be processed under substantially the same conditions.

[0007]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, FIG. 1 shows a configuration of a spindle. 1
Indicates a spindle, and the spindle 1 is formed by connecting a disk contact portion 3 to the tip of a rotating shaft 2,
The rotating shaft 2 is rotatably supported by a bearing 4. A pulley 5 is mounted on a side of the rotating shaft 2 opposite to the portion connected to the disk abutting portion 3 so as to rotate and drive the rotating shaft 2. The pulley 7 is mounted on the shaft 6a, and the pulley 7 is
A transmission belt 8 is wound around the pulley 5.

The disk contact portion 3 is for holding the disk D by suction. For this reason, the tip end surface of the disk contact portion 3 is a flat contact surface 3a, The disk D is positioned and fixed to the contact surface 3a by vacuum suction. In order to hold the disk D by suction, a plurality of vacuum suction holes 9 are opened in the contact surface 3a. The vacuum suction hole 9 communicates with a vacuum passage 10 formed along the center line of the rotating shaft 2, and a vacuum pump (see FIG. 1) is provided at the end of the rotating shaft 2 opposite to the disk contact portion 3. A coupling portion 12 provided at the tip of a pipe 11 (not shown) is relatively rotatably connected.

Reference numeral 13 denotes a polishing tape. The polishing tape 13 is pressed against the surface of the disk D by a pressure roller 14 at a constant pressure, and is run at a predetermined speed by a tape feeding means (not shown). It has become. As shown in FIGS. 2 and 3, a polishing unit 15 including the polishing tape 13, the pressure roller 14, and the tape feeding unit is configured.
Disk D with polishing tape 13 mounted on spindle 1
On the other hand, two portions can be selectively brought into contact with a portion indicated by the polishing line A and a portion indicated by the polishing line B whose phase is shifted by 180 ° from the polishing line A.

Further, reference numeral 16 denotes a disk reversing device,
The disc reversing device 16 has two sets of reversing arms 18 each provided with two chuck members 17.
It can be displaced in the direction of separation. The actuator 19 is connected to a drive unit 20. The drive unit 20 can displace the reversing arm 18 together with the actuator 19 in a direction approaching / separating from the spindle 1, and can also reverse the rotation by 180 °. It has become.

In the present embodiment, a disk D is processed by a polishing apparatus having such an apparatus configuration. Next, a method of processing the disk D using this apparatus will be described.

For example, the disk D is held by a pick-and-place means that vacuum-adsorbs one side surface of the disk D and is brought into contact with the contact surface 3a of the disk contact portion 3 of the spindle 1. By bringing the vacuum passage 10 on the spindle 1 side into a vacuum state, the contact surface 3a
The disk D is held by the suction force of the vacuum suction hole 9 that is opened at the same time, the vacuum suction force on the pick-and-place means side is released, and the disc is retracted. And the motor 6
, The spindle 1 is rotationally driven, the polishing unit 15 is operated, the polishing tape 13 is arranged at the position of the polishing line A of the disk D, and the pressure roller 14 is displaced toward the disk D. As a result, the polishing tape 13 is pressed against the disk D, and the polishing tape 13 is caused to run at a predetermined speed, so that one side surface of the disk D is polished.

When the processing of one side of the disk D is completed,
The polishing tape 13 is separated from the disk D, and the rotation of the spindle 1 is stopped. Then, the disk reversing device 16 is operated to bring the chuck members 17 provided on the pair of reversing arms 18 into contact with the disk D. Here, the chuck member 17 is only applied with a light force for holding the disk D so that the disk D does not fall off. For this reason, even if the chuck D is chucked by the chuck member 17, the disk D may be deformed. There is no. Then, the disk D is separated from the spindle 1 and
At this time, the suction force against the disk D by the vacuum suction hole 9 is prevented from being generated. Preferably, the compressed air is blown out from the vacuum suction hole 9 so that the disc D is released from the contact surface 3a. Promotes separation.

After the disk D is inverted by the disk inverting device 16, the disk D is sucked and held on the disk contact portion 3 of the spindle 1 again.
Evacuation. Thereafter, the polishing tape 13 in the polishing unit 15 is displaced to a position facing the disc D, and the polishing tape 13 is brought into contact with the disc D by the pressing roller 14. However, when the other side surface is polished, it is brought into contact with the position of the polishing line B which is 180 ° out of phase with the polishing line A at the time of polishing the one side surface. Then, the other side surface is polished by rotating the motor 6 in a direction opposite to the above.

That is, when actually writing or reading information by incorporating the disk D into the magnetic disk device, the magnetic head is configured to face the disk D from both the front and back sides. If processing is performed while rotating in the same rotation direction as one side surface, the polishing direction and the rotation direction of the disk D will be opposite when viewed from the magnetic head side. Therefore, when processing the other side,
The disk D is rotated in a direction opposite to one side. Further, the contact position of the polishing tape 13 with respect to the disk D on one side is such that when the disk D is turned over,
This is a position where the phase is changed by 180 °. Therefore, when processing the other side surface, the polishing line of the polishing tape 13 is changed from the position A to the position B. Thus, the disk D
Will be machined under substantially the same conditions.

[0016] That is, as shown in FIG. 3, when processing one side D ₁ of the disc D is brought into contact with the polishing tape 13 on the polishing line A, is run the polishing tape 13 in the direction of arrow S Then, the disk D is rotated in the direction of arrow T. Also,
When processing other side D ₂ of the disc D, the polishing tape 13 is brought into contact with the position of the polishing line B, running direction of the polishing tape 13 in the same S-direction with one side D _1, the rotation of the disk D The direction is the opposite direction as indicated by arrow V. Thus, as it is clear Orimagere in line indicated by R in Figure, so that the surface D ₁ of the disc D may be surface D ₂ are processed under the same conditions.

[0017]

As described above, according to the present invention, when polishing the front and back surfaces of a disk, the disk is rotated by vacuum suction of the disk on the disk contact surface provided at the tip of the spindle. Along with the polishing tape, one side of the disk is polished, and then the disk is turned over and the other side is polished. In the case of polishing, the abutment was made at a position 180 ° out of phase, and the spindle was rotated in the opposite direction to that for processing one side. Thus, simultaneous processing on both sides cannot be performed, and even when processing is performed on one side at a time, both sides of the disk can be polished under substantially the same conditions.

[Brief description of the drawings]

FIG. 1 is a sectional view of a spindle.

FIG. 2 is an explanatory diagram showing an overall configuration of a disk polishing apparatus.

FIG. 3 is an operation explanatory view of a polishing process.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Spindle 3 Disc contact part 6 Motor 9 Vacuum suction hole 13 Polishing tape 16 Disk reversing device D Disk D ₁ One side D ₂ Other side

Continuation of the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B24B 21/00, 41/06 G11B 5/84

Claims (1)

(57) [Claims] A disk contact surface is provided at a tip of a spindle, and a polishing tape is brought into contact with a surface of the disk while the disk is being vacuum-sucked and rotated by the disk contact surface. Then, the disc is turned over, and the other side is polished. When the other side is polished, the disc is brought into contact with a position shifted by 180 ° from the polishing position of the one side. And a spindle is rotated in a direction opposite to a direction in which one side is machined.