JP3100843B2 - 半導体パッケージ成形用モルドプレス - Google Patents

半導体パッケージ成形用モルドプレス

Info

Publication number
JP3100843B2
JP3100843B2 JP06235918A JP23591894A JP3100843B2 JP 3100843 B2 JP3100843 B2 JP 3100843B2 JP 06235918 A JP06235918 A JP 06235918A JP 23591894 A JP23591894 A JP 23591894A JP 3100843 B2 JP3100843 B2 JP 3100843B2
Authority
JP
Japan
Prior art keywords
mold
resin
transfer
cavity
moving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP06235918A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0794543A (ja
Inventor
魯 權 郭
Original Assignee
株式會社韓美金型
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社韓美金型 filed Critical 株式會社韓美金型
Publication of JPH0794543A publication Critical patent/JPH0794543A/ja
Application granted granted Critical
Publication of JP3100843B2 publication Critical patent/JP3100843B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP06235918A 1993-09-04 1994-09-05 半導体パッケージ成形用モルドプレス Expired - Fee Related JP3100843B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR2019930017572U KR0124755Y1 (ko) 1993-09-04 1993-09-04 반도체 팩키지 성형용 몰드프레스
KR1993-17572 1993-09-04

Publications (2)

Publication Number Publication Date
JPH0794543A JPH0794543A (ja) 1995-04-07
JP3100843B2 true JP3100843B2 (ja) 2000-10-23

Family

ID=19362785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP06235918A Expired - Fee Related JP3100843B2 (ja) 1993-09-04 1994-09-05 半導体パッケージ成形用モルドプレス

Country Status (5)

Country Link
US (1) US5501587A (2)
JP (1) JP3100843B2 (2)
KR (1) KR0124755Y1 (2)
MY (1) MY111308A (2)
TW (1) TW321790B (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0550459U (ja) * 1991-12-05 1993-07-02 株式会社リコー 写真フィルム及びカメラ

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4020987B2 (ja) * 1996-01-19 2007-12-12 信越半導体株式会社 ウエーハ周辺部に結晶欠陥がないシリコン単結晶およびその製造方法
US5811041A (en) * 1997-08-13 1998-09-22 Miken Composites Company, Llc. Method and apparatus for vacuum transfer molding
JP2000164781A (ja) * 1998-12-01 2000-06-16 Towa Corp リードフレームの加工方法及び装置
US6439869B1 (en) 2000-08-16 2002-08-27 Micron Technology, Inc. Apparatus for molding semiconductor components
JP3561266B2 (ja) * 2002-12-10 2004-09-02 株式会社名機製作所 燃料電池用セパレータの製造方法および成形金型
US7781899B2 (en) * 2008-02-27 2010-08-24 Infineon Technologies Ag Leadframe having mold lock vent
CN107053618A (zh) * 2017-03-08 2017-08-18 安徽国晶微电子有限公司 一种集成电路塑封模注射系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5886315U (ja) * 1981-12-07 1983-06-11 坂東　一雄 半導体樹脂封入成形用金型装置
DE3336173C2 (de) * 1983-10-05 1985-08-29 Maschinenfabrik Lauffer GmbH & Co KG, 7240 Horb Presse mit mehreren Spritzkolben zur gleichzeitigen Herstellung mehrerer Kunststoffpreßteile
US4723899A (en) * 1984-11-12 1988-02-09 Michio Osada Molding apparatus for enclosing semiconductor chips with resin
US4615857A (en) * 1984-11-30 1986-10-07 Motorola, Inc. Encapsulation means and method for reducing flash
US5326243A (en) * 1992-06-25 1994-07-05 Fierkens Richard H J Compression-cavity mold for plastic encapsulation of thin-package integrated circuit device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0550459U (ja) * 1991-12-05 1993-07-02 株式会社リコー 写真フィルム及びカメラ

Also Published As

Publication number Publication date
MY111308A (en) 1999-10-30
JPH0794543A (ja) 1995-04-07
US5501587A (en) 1996-03-26
TW321790B (2) 1997-12-01
KR950010192U (ko) 1995-04-24
KR0124755Y1 (ko) 1999-02-18

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