JP3149745B2 - Chip mounting device and mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip mounting apparatus and a chip mounting method for automatically mounting various kinds of chips on a substrate.

[0002]

2. Description of the Related Art In a chip mounting apparatus for mounting a chip on a substrate, a chip provided in a chip supply unit is picked up by a head and mounted at a predetermined coordinate position on the substrate. There are many types of chips, of which lead feeders such as tape feeders are commonly used as chip supply units for leadless chips such as resistance chips and capacitor chips, and as chip supply units for leads with chips such as QFP. The tray feeder is frequently used. Thus, in a chip mounting device,
The form of the chip supply unit differs depending on the type of chip.

As described in, for example, JP-A-2-36598, a tray feeder generally stores trays stacked in a magazine, and a desired tray is pulled out of the magazine and stored in the tray. The chip is supplied to a chip mounting device.

[0004]

A tray feeder and a parts feeder are mounted on a base provided on a side of a conveyor for transporting substrates. For this reason, when the tray feeder is mounted on the base, the mounting space for a plurality of parts feeders is reduced accordingly, resulting in a problem that the number of types of chips that can be mounted on the chip mounting apparatus is reduced.

A chip mounting apparatus usually forms an assembly line of a substrate together with a screen printing machine, a bond coater, a reflow furnace, etc. In a conventional chip mounting apparatus, a tray feeder protrudes in the width direction of the assembly line. Therefore, there is a problem that an extra installation space is required.

Accordingly, the present invention provides a chip mounting apparatus and a chip mounting method capable of preventing the number of types of chips supplied from other than the tray from being reduced even when chips are supplied from the tray and reducing the installation space. The purpose is to do.

[0007]

SUMMARY OF THE INVENTION For this purpose, the present invention provides a conveyor for transferring a substrate, a substrate holder provided in the middle of the conveyor, a parts feeder provided on a side of the substrate holder, and a tray. A chip supply unit that supplies chips stored in a chip feeder, and a mounting head that picks up chips provided in a parts feeder and a chip supply unit and transfers and mounts the chips to a substrate held by a substrate holder. A movable table that is provided on the conveyor and transports a pallet on which a tray for chip storage is mounted in the same direction as the substrate is transported by the conveyor; and a chip supply unit is provided on a side of the movable table. The magazine includes a magazine for stacking and storing pallets, and a transfer unit for transferring the pallets between the movable table and the magazine.

A head for tray pickup, a tray collecting device, and a moving table for moving the tray collecting device on the movable table are provided on the movable table.

[0009]

According to the above construction, the tray accommodated in the magazine is pulled out onto the movable table provided on the substrate transport conveyor, and the movable table is moved in a desired direction to be provided on the tray. The operation of mounting the chip on the substrate held by the substrate holder and the operation of collecting the tray in which the chip is out of stock can be performed smoothly with good setup.

[0010]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a chip mounting apparatus according to one embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a side view thereof, FIG. 4, FIG. 5, FIG. 6, FIG. It is a perspective view of the same chip supply part.

In FIG. 1, reference numeral 1 denotes a main body of a chip mounting apparatus, on which a chip supply section 4 (tray feeder) is provided. The main body 1 includes a base 2 and a ceiling 3 erected on the base 2.

In FIG. 2, at the center of the upper surface of the base 2, conveyors 6a and 6b for transferring substrates are provided. A substrate holder 7 is provided in the middle of the upstream conveyor 6a and the downstream conveyor 6b (see also FIG. 3). The substrate 8 is positioned by being clamped to the substrate holder 7, on which various kinds of chips P1, P2, P3... Are mounted. A large number of parts feeders 10 are provided on both sides of the substrate holder 7. As the parts feeder 10, a tape feeder or a tube feeder is frequently used. The tape feeder is generally provided with a small leadless chip such as a resistor chip or a capacitor chip. In addition, the tube feeder is provided with a leaded chip having leads in two directions such as an SOP.

In FIG. 3, an XY table 11 is provided on the ceiling 3. The XY table 11 holds a mounting head 12. The mounting head 12 has a plurality of nozzles 13. When the XY table 11 is operated, the mounting head 12 moves horizontally in the X direction and the Y direction, and the chips provided in the parts feeder 10 are moved to the nozzle 1.
The substrate 3 is picked up by vacuum suction and mounted on the substrate 8 at a predetermined coordinate position. In FIG. 3, the substrate holder 7 moves up and down by a vertical movement mechanism (not shown). When carrying the substrate 8 from the upstream conveyor 6a to the substrate holder 7 or carrying out the substrate 8 from the substrate holder 7 to the downstream conveyor 6b, as shown by a solid line in FIG. , 6b, but when mounting the chip on the substrate 8 with the mounting head 12, the substrate holder 7 is raised to the position shown by the dashed line in FIG. 3, thereby shortening the vertical movement stroke of the nozzle 13. The chip can be mounted on the substrate 8 at a high speed. Note that the substrate holder 7 may be provided integrally with the conveyors 6a and 6b instead of being separate from the conveyors 6a and 6b.

In FIG. 1, the chip supply section 4 is constructed by assembling the following elements inside a cover box 20. In FIG. 4, reference numeral 21 denotes a movable table, which is disposed above and parallel to the downstream conveyor 6b. Conveyor 6b at the center of the movable table 21
And a feed screw 22 parallel to the feed screw 22 is provided. Feed screw 22
Is screwed with a nut 23.

The nut 23 is provided with a claw 24 for engaging with a pallet 25. A tray 26 is placed on the pallet 25. The tray 26 stores relatively large chips with leads such as QFP. Motor 2
When the drive screw 7 rotates the feed screw 22, the nut 23 moves in the X direction along the feed screw 22. The X direction is the direction in which the substrates 8 are transported by the conveyors 6a and 6b. As described later, near the left end of the movable table 21, the chips of the tray 26 are mounted on the nozzle 13 of the mounting head 12.
Is a pickup stage A for picking up. The right end of the movable table 21 is the tray storage device 2.
8 is the standby stage B. This tray storage device 2
The tray 26 on which chips are out of stock is placed on 8. Reference numeral 29 denotes a moving table for moving the tray collecting device 28 on the movable table 21 in the X direction.

Pickup stage A and standby stage B
During this period, the tray 26 is in the loading / unloading stage C. A pickup head 31 of the tray 26 is provided on the loading / unloading stage C. Pickup head 31
A suction pad 32 is provided at the lower part of. A moving table 33 moves the pickup head 31 in the Y direction. The pickup head 31 vacuum-adsorbs and picks up the tray 26 on the pallet 25 as the suction pad 32 moves up and down.

Magazines 35 are provided on both sides of the loading / unloading stage C. Inside the magazine 35, the pallets 25 on which the trays 26 are placed are stacked and stored (see also FIG. 1). The magazine 35 is an elevator 34
(FIG. 3). 4 and 5,
An arm 36 has a claw 37 at its tip.
The arm 36 is driven by a moving table 38 (FIG. 3) to
Move in the direction. The pawl 37 engages with the edge of the pallet 25 stored in the magazine 35 and pulls the pallet 25 to the center of the movable table 21. The pallet 25 at the center of the movable table 21 is stored in the magazine 35. That is, the arm 36, the claw 37, and the moving table 38
5 serves as a transfer means for transferring between the movable table 21 and the magazine 35.

The chip mounting apparatus has the above-described configuration, and its operation will be described below. First, an operation of mounting a chip provided in the parts feeder 10 on the substrate 8 will be described. 2 and 3, the conveyor 6a
As a result, the substrate 8 is transported to the substrate holder 7 and clamped and positioned on the substrate holder 7. Next, as shown by a chain line in FIG. 3, the substrate holder 7 is raised. Then, the mounting head 12 moves horizontally in the X direction or the Y direction, picks up the chip provided in the parts feeder 10 by vacuum suction with the nozzle 13, and transfers the chip to the substrate 8.

Next, the operation of mounting the chips on the tray 26 on the substrate 8 will be described. First, as shown in FIG. 4, the claw 37 of the arm 36 is advanced in the Y direction, and the claw 37 is engaged with the edge of the pallet 25 in the magazine 35 (the claw 37 advanced to the right in FIG. 4). Next, the pallet 25 is pulled out to the center of the movable table 21 by retracting the claw 37 to the left. FIG. 4 shows a state where the pallet 25 on which the tray 26 is placed is pulled out to the center of the movable table 21.

Next, the motor 27 is driven. Then, the nut 23 moves leftward along the feed screw 22 in FIG. 4, and the pawl 24 engages with the edge of the pallet 25. Motor 2
When the pallet 7 is further driven, the pallet 25 is pushed to the left by the claw 24, and stops at the pickup stage A shown in FIG. Then, the mounting head 12 moves between the pickup stage A and the substrate 8, picks up the chips on the tray 26 by vacuum suction with the nozzles 13, and mounts the chips on the substrate 8 (see also FIG. 3).

The chips on the tray 26 of the pickup stage A are mounted on the substrate 8 one after another. Therefore, next, the chip of the tray 26 becomes out of stock, the tray 26
There will be described the operation of recovering the empty tray 26 when empty. In this case, by driving the motor 27 in reverse, the empty tray 26 is
It is moved to a position directly below the pickup head 31 in the opposite loading / unloading stage C (FIG. 6). In this case, the moving table 33 is driven to move in the Y direction so that the pickup head 31 is located at the center of the tray 26,
The position is adjusted in advance.

Next, as shown in FIG. 7, the suction pad 32 is moved up and down to pick up the tray 26, and the moving table 29 is driven to move the tray collecting device 28 directly below the picked tray 26. . Next, when the vacuum suction state of the tray 26 by the suction pad 32 is released, the tray 26 falls onto the tray collection device 28 and is collected. Then, the movable table 29 is driven to move the tray collection device 28 backward to the standby stage B at the right end of the movable table 21 (FIG. 8). At the same time, the tray 26
Is moved to the standby stage B at the right end of the movable table 21.

When the tray collecting device 28 or the pallet 25 moves to the right end of the movable table 21, the operator is notified by a notifying means (not shown) such as a buzzer. Then, the operator moves to the standby stage B at the right end of the movable table 21, collects the empty tray 26 in the tray collection device 28, and replenishes the pallet 25 with a new tray 26 (FIG. 9). In this case, the operator can replenish the tray 26 on the pallet 25 from any direction on both sides of the movable table 21. When the operator refills the tray 26 on the pallet 25, the pallet 25 moves below the pickup head 31. Then, the pawl 37 of the arm 36 engages with the edge of the pallet 25, and the arm 36 moves in the Y direction.
5 is stored in the magazine 35. Thus, the collection of the empty tray 26 and the replenishment of the new tray 26 are completed. Normally, a chip mounting device is used together with a screen printing device, a bond coater, a reflow furnace, and the like to form a substrate assembly line, and the chip mounting device is located at an intermediate portion of the assembly line. In the chip mounting apparatus of this embodiment, the empty tray 26 is conveyed to the standby stage at the end of the movable table 21 above the conveyor 6b. Since the operation of collecting the old tray 26 and replenishing the new tray 26 can be performed, the collection and replenishment of the tray 26 can be smoothly performed in a good setup.

[0024]

According to the present invention, the movable table is arranged on the conveyor for transferring the substrate, and the magazine for accommodating the tray is arranged on the side of the movable table. Installation space can be used effectively. Also
Collection and replenishment of empty trays can be performed smoothly
Can be performed

[Brief description of the drawings]

FIG. 1 is a perspective view of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a chip mounting apparatus according to one embodiment of the present invention.

FIG. 3 is a side view of a chip mounting apparatus according to one embodiment of the present invention.

FIG. 4 is a perspective view of a chip supply unit of the chip mounting apparatus according to one embodiment of the present invention;

FIG. 5 is a perspective view of a chip supply unit of the chip mounting apparatus according to one embodiment of the present invention.

FIG. 6 is a perspective view of a chip supply unit of the chip mounting apparatus according to one embodiment of the present invention.

FIG. 7 is a perspective view of a chip supply unit of the chip mounting apparatus according to one embodiment of the present invention.

FIG. 8 is a perspective view of a chip supply unit of the chip mounting apparatus according to one embodiment of the present invention.

FIG. 9 is a perspective view of a chip supply unit of the chip mounting apparatus according to one embodiment of the present invention.

[Explanation of symbols]

 4 Chip Supply Unit 6a, 6b Conveyor for Transferring Substrate 7 Substrate Holder 8 Substrate 10 Parts Feeder 12 Mounting Head 21 Movable Table 25 Pallet 26 Tray 28 Tray Collector 31 Pickup Head 35 Magazine 36 Arm 37 Claw 38 Moving Table

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 13/00-13/04

Claims (5)

(57) [Claims] 1. A substrate transport conveyor, a substrate holder provided in the middle of the conveyor, a parts feeder provided on a side of the substrate holder, and a chip supply unit for supplying chips stored in a tray. And a mounting head for picking up the chips provided in the parts feeder and the chip supply unit and transferring and mounting the chips on a substrate held by the substrate holder, wherein the chip supply unit is A movable table provided on the conveyor and carrying a chip storage tray mounted thereon in the same direction as the substrate is transported by the conveyor, and a pallet provided on a side portion of the movable table. A magazine to be stored, and a delivery means for delivering a pallet between the movable table and the magazine. Mounting apparatus. 2. The apparatus according to claim 1, further comprising a tray pickup head, a tray collecting device, and a moving table for moving the tray collecting device on the movable table. Chip mounting equipment. 3. A chip of a parts feeder provided on a side of a conveyor for transferring a substrate or a substrate holder, or stored in a tray.
A chip mounting method for picking up a chip of a chip supply unit for supplying a chip with a nozzle of a mounting head and transferring and mounting the chip on a substrate positioned in a substrate holder,
After the tray provided in the chip supply unit is pulled out onto a movable table disposed above the conveyor by a transfer means, the tray thus drawn is moved to a movable table.
In is conveyed to the pickup stage, chip mounting method which is characterized in that so as to mount the substrate to the tray of the chip on the pickup stage to pick up by the mounting head. 4. The chip mounting method according to claim 3, wherein when mounting the chip with the mounting head, the substrate holder is raised to shorten a vertical movement stroke of a nozzle of the mounting head. . When 5. The tray become the tray chip shortage becomes empty, the empty tray on the opposite side to the pickup stage by the movable table tray
Immediately below the pickup head in the loading / unloading stage
5. The chip mounting method according to claim 3, wherein an empty tray is picked up and collected by a pickup head.