JP3424497B2 - Manufacturing method of ceramic electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic electronic component.

[0002]

2. Description of the Related Art A conventional method for forming an electrode on a ceramic element is to apply an electrode paste after firing the ceramic element, align the electrode paste on a heat-resistant metal net or a ceramic plate in a plane, and perform an electrode baking process. Was going on.

[0003]

In the method of manufacturing an electronic component having the above-mentioned structure, when baking is performed while the electrode surfaces of adjacent ceramic elements coated with electrodes are in contact with each other, the electrode surfaces are fused to each other. However, when this is peeled off, a part of the electrode is peeled off, so it was necessary to arrange the electrodes in a flat plane so that the electrode surfaces would not come into contact with each other, and then to bake.

The present invention solves this problem, and an object of the present invention is to provide a method of manufacturing a ceramic electronic component which allows a large number of electrodes to be baked at one time without damaging the electrode surface.

[0005]

To achieve this object, the present invention provides NiO between electrodes of adjacent ceramic elements.
Electrode baking is performed with an anti-fusing body containing
After that, the fusion preventing body is separated . According to this method, since the electrode surfaces do not come into direct contact with each other, fusion of the electrodes does not occur even if they are not aligned in a plane, and it is possible to perform electrode baking processing for many ceramic elements at once.

[0006]

The invention according to claim 1 of the embodiment of the present invention is, between the electrodes of the ceramic element adjacent, have row electrodes baked with intervening fusion preventive member including NiO, its
A method of manufacturing a ceramic electronic component for separating the fusion preventive body, wherein the interposed fusion preventive body prevents the electrodes of adjacent ceramic elements from contacting each other, and the ceramic elements are stacked in a stacked state. It is possible to prevent fusion between electrodes even if baking is performed, and since NiO forming the fusion prevention body has low reactivity with the ceramic element and electrode components, the ceramic element after fusion and the fusion prevention body Can be easily separated, and the productivity of the ceramic element is improved.

[0007] The invention according to claim 2 of the present invention, the powder or granular anti-fusing body is interposed between electrodes of adjacent ceramic elements have the row electrodes baking, then before
A method for producing a ceramic electronic component for separating the fusion preventing body, wherein the powder or granular fusion preventing body interposed is:
The fusion of the electrodes is prevented, and the electrodes are easily separated from the ceramic element after baking.

[0008] The invention according to claim 3 of the present invention, the plate-like anti-blocking body have the row electrodes baking stacked alternately with ceramic element coated with electrodes, then, the fusion Chakubo
A method of manufacturing a ceramic electronic component that separates a stopper ,
By interposing the plate-shaped anti-fusing body, it becomes easier to separate the ceramic element after the electrodes are baked, and the preparation work for the electrodes is also simplified.

According to a fourth aspect of the present invention, a plate-shaped fusion preventing body having a plurality of holes is alternately stacked with a ceramic element coated with an electrode to perform an electrode baking process.
After that, it is a method for manufacturing a ceramic electronic component in which the fusion preventing body is separated , and by providing a plurality of holes in the plate-shaped fusion preventing body, the volume of the fusion preventing body is reduced, As a result, the heat capacity becomes small, and the energy required for heating and cooling when baking the electrodes can be reduced.

According to a fifth aspect of the present invention, the fusion preventive body containing NiO is interposed between the electrodes of the ceramic molded body to which the electrodes are applied, and the ceramic molded body and the electrodes are simultaneously fired , and thereafter, , A ceramic for separating the fusion preventing body
(C) A method of manufacturing electronic components, which prevents fusion between ceramic compacts and applied electrodes, and enables simultaneous firing of ceramic compacts and coated electrodes, and prevention of intervening fusion. The removal of the body is also easy and the work process can be simplified.

According to a sixth aspect of the present invention, the ceramic molded body is embedded in a powder or granular fusion preventing body, and the ceramic molded body and the applied electrode are simultaneously fired , and thereafter, A ceramic manufacturing method for separating the anti-fusing body, the method comprising the steps of: burying a ceramic molded body coated with an electrode in a powder or granular anti-fusion body to form a firing atmosphere. Can be kept constant, and variations in characteristics of the obtained ceramic sintered body can be reduced.

An embodiment of the present invention will be described below with reference to the accompanying drawings. (Embodiment 1) In FIG. 1, reference numeral 1 denotes a varistor sintered body used as an example of a ceramic element containing ZnO as a main component and Bi ₂ O ₃ , Co ₂ O ₃ , MnO _{2 and the} like as subcomponents. After the electrode paste is applied to the main surface of the varistor sintered body 1 and the electrodes 2 are provided, NiO powder 3 is interposed on each electrode 2 surface as a fusion preventing body, and then the varistor sintered body 1 is applied to the varistor sintered body 1 for three times. Electrode 2 was baked at a temperature of 800 ° C. in a stacked manner, and the defective appearance rate of electrode 2 of the obtained varistor is shown in (Table 1).

[0013]

[Table 1]

As is clear from Table 1, in the case of baking an electrode using a conventional wire mesh, the ceramic sintered body is displaced during the process movement to overlap the electrode surface, or the glass frit in the electrode sticks to the wire mesh. However, the varistor sintered body 1 having the NiO powder 3 interposed therein has a large appearance defect rate.
It can be seen that the formed electrodes 2 have a low appearance defect rate. Here, the poor appearance means that a part of the electrode 2 is peeled off or a foreign substance is attached to the electrode surface, which is considered to be a problem in soldering. The present invention is not limited to the number of stacked varistor sintered bodies 1.

(Embodiment 2) NiO powder 3 is granulated by adding a binder and then sintered at 1300 ° C. to prevent fusion of NiO granules 4 to the electrode 2 surface of varistor sintered body 1 as shown in FIG. After arranging them as a body, they were stacked in three stages, and the electrode 2 was baked under the same conditions as in Embodiment 1. The defective appearance rate of the electrode 2 of the obtained varistor sintered body 1 is shown in (Table 1). .

As is clear from Table 1, since the NiO granules 4 are larger than the NiO powder 3, the contact between the surfaces of the electrodes 2 can be prevented, and the appearance defect of the electrodes 2 can be further reduced. Further, the separation from the varistor sintered body 1 after baking and the separation of the NiO granules 4 from the surface of the electrode 2 become easier.

(Embodiment 3) A binder is added to NiO powder 3 to form granules, which are molded into a plate shape and then at 1300 ° C.
Then, the NiO plate 5 as a fusion preventing body was obtained by firing. As shown in FIG. 3, this NiO plate 5 was alternately baked with the varistor sintered body 1 after coating the electrode 2, and the electrode 2 was baked under the same conditions as in the first embodiment. )Pointing out toungue.

As is clear from (Table 1), the NiO plate 5
Also when using, the occurrence of appearance defects of the electrode 2 is low. Further, by using the plate-shaped NiO plate 5, it becomes easier to separate it from the varistor sintered body 1 after baking the electrode 2, and
The baking preparation work becomes easy.

(Embodiment 4) NiO used in Embodiment 3
Instead of the plate 5, a NiO plate 6 having holes 7 smaller than the varistor sintered body 1 was used as a fusion preventing body, and the varistor sintered body 1 after coating the electrodes 2 was arranged as shown in FIG. The electrode 2 was baked under the same conditions as in Form 1, and the results are shown in (Table 1).

As is clear from (Table 1), even in this case, the occurrence rate of the appearance defect of the obtained electrode was low. Since the NiO plate 6 having the holes 7 has a smaller volume than the NiO plate 5 and has a small heat capacity, the amount of heat required for heating and cooling during baking of the electrode 2 can be reduced, and the same effect as that of the third embodiment can be obtained. This is an effective means.

(Embodiment 5) Using ZnO as a main component and a composition of Bi ₂ O ₃ , Co ₂ O ₃ and MnO ₂ as auxiliary components, both principal planes of a disk-shaped varistor molded body 8 are formed. After applying the electrode 2, the NiO granules 4 produced in Embodiment 2 are interposed between the varistor molded body 8 and the surface of the electrode 2 and stacked in three stages as shown in FIG. 5, and the varistor molded body 8 is formed at a temperature of 950 ° C. The electrode 2 was co-fired. The evaluation results of the electrode appearance of the obtained varistor fired body are shown in (Table 1) and the varistor performance is shown in (Table 2).

[0022]

[Table 2]

As is clear from (Table 1), the occurrence rate of appearance defects is low in this case as well, and as shown in (Table 2), the standard deviation of the varistor voltage is somewhat large, but this is not a particularly problematic value. . Since the NiO granules 4 are interposed between the varistor molded body 8 and the surface of the electrode 2, stacked varistor molded bodies 8
It can be seen that it is possible to prevent the mutual adhesion between the electrodes 2 at the time of firing and the fusion bonding between the electrodes 2. Furthermore, since the varistor molded body 8 and the electrode 2 can be fired at the same time, the working process can be simplified. In this case, needless to say, the composition of the varistor molded body needs to be selected so that it can be sintered at a temperature of about 950 ° C.

(Embodiment 6) As in Embodiment 5, Zn
O as a main component and Bi ₂ O ₃ , Co ₂ O ₃ and M as auxiliary components
After applying the electrodes 2 to both principal planes of the disk-shaped varistor molded body 8 using the composition of nO ₂ , the varistor molded body 8 and the NiO granules 4 produced in Embodiment 2 are formed on the surfaces of the electrodes 2. After interposing, as shown in FIG.
Further, the whole was embedded in NiO granules 4 and the varistor compact 8 and the electrode 2 were simultaneously fired at a temperature of 950 ° C. The evaluation results of the obtained varistor are shown in (Table 1) and (Table 2).

As is clear from (Table 1) and (Table 2),
Since the NiO granules 4 are interposed, the stacked varistor compacts 8 are not attached to each other, and the electrodes 2 are not fused to each other, so that the defective appearance ratio of the electrodes is small, and the varistor compacts 8 are embedded in the NiO granules 4. Since firing is performed, the atmosphere during firing is stable, and the variation in the varistor voltage of the obtained varistor fired body is extremely smaller than that in the case where the varistor is not buried, which is an effective firing means.

Although the varistor molded body 8 has been described in the present embodiment, the same effect can be obtained with other ceramic elements.

[0027]

INDUSTRIAL APPLICABILITY According to the present invention, a fusion preventing body containing NiO is interposed between the electrodes of adjacent ceramic elements so that the electrodes do not come into direct contact with each other. Even if the electrodes are randomly and overlappingly subjected to the electrode baking treatment, the electrodes are not fused to each other, so that the productivity can be improved.

[Brief description of drawings]

FIG. 1 is a sectional view showing a method of manufacturing an electronic component according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a method of manufacturing an electronic component according to a second embodiment of the present invention.

FIG. 3 is a sectional view showing a method of manufacturing an electronic component according to a third embodiment of the present invention.

FIG. 4 is a perspective view showing a method of manufacturing an electronic component according to a fourth embodiment of the present invention.

FIG. 5 is a sectional view showing a method for manufacturing an electronic component according to a fifth embodiment of the present invention.

FIG. 6 is a sectional view showing a method of manufacturing an electronic component according to a sixth embodiment of the present invention.

[Explanation of symbols]

1 Varistor sintered body 2 electrodes 3 NiO powder 4 NiO granules 5 NiO plate 6 NiO plate 7 holes 8 Varistor molding

Claims (6)

(57) [Claims] Between [Claim 1] of adjacent ceramic element of the plurality of ceramic elements and the electrodes coated electrodes, it has rows with intervening electrodes baking the anti-fusing material containing NiO, then,
A method for manufacturing a ceramic electronic component, wherein the fusion preventing body is separated . 2. The method for producing a ceramic electronic component according to claim 1, wherein an electrode baking treatment is performed by interposing a powder or granular fusion preventing body between electrodes of adjacent ceramic elements. 3. The method for producing a ceramic electronic component according to claim 1, wherein the plate-shaped fusion preventing body is alternately stacked with the ceramic element coated with the electrode to perform the electrode baking treatment. 4. The method of manufacturing a ceramic electronic component according to claim 3, wherein a plate-shaped fusion preventing body having a plurality of holes is used. 5. A fusion preventive body containing NiO is interposed between electrodes of adjacent ceramic molded bodies of a plurality of ceramic molded bodies coated with electrodes, the ceramic molded body and the electrodes are simultaneously fired , and thereafter, Ceramic to separate the anti-fusing body
Click method of manufacturing an electronic component. 6. The method for producing a ceramic electronic component according to claim 5, wherein the ceramic molded body is embedded in a powder or granular fusion preventing body, and the ceramic molded body and the electrode are simultaneously fired.