JP3558905B2 - Method for manufacturing flip-chip type semiconductor device and semiconductor manufacturing apparatus - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for filling a resin between a semiconductor element and a circuit board of a flip-chip type semiconductor device and a semiconductor manufacturing apparatus for performing the method.
[0002]
[Prior art]
A flip-chip type semiconductor device includes a semiconductor element and a circuit board on which the semiconductor element is mounted. FIG. 11 is a cross-sectional view of a manufacturing process illustrating a manufacturing process of a conventional flip-chip type semiconductor device. A plurality of connection electrodes (not shown) electrically connected to the integrated circuit are formed on the semiconductor element 1 having the integrated circuit formed therein. A ball-shaped connection terminal (bump) 2 made of, for example, solder is connected to the connection electrode. The circuit board 3 has wiring and connection electrodes (not shown) formed on a main surface on which the semiconductor element 1 is mounted. The plurality of bumps 2 are connected to connection electrodes on the main surface. A connection electrode (not shown) is formed on the back surface of the circuit board 3, and a ball-shaped external terminal 7 is attached so as to be connected to the connection electrode. The connection electrodes on the main surface of the circuit board 3 and the connection electrodes on the back surface are appropriately connected via internal wiring (not shown) of the circuit board 3. There is a gap between the semiconductor element 1 and the circuit board 3 by the thickness of the bump 2. A resin such as an epoxy resin is sealed in the gap.
[0003]
[Problems to be solved by the invention]
A method for filling a flip-chip type semiconductor device with resin will be described with reference to FIG. After the bumps 2 attached to the semiconductor element 1 are mounted on the circuit board 3, the liquid resin 5 is dropped from a dispense nozzle 4 onto a part of the outer periphery of the semiconductor element 1 in a gap between the semiconductor element 1 and the circuit board 3 (FIG. 11 (a)). The heat-softened liquid resin 5 penetrates into the gap between the semiconductor element 1 and the circuit board 3 by capillary action (FIG. 11B). The liquid resin 5 uniformly spreads in the gap between the semiconductor element 1 and the circuit board 3 and is cured by heating to form a resin sealing body 6 (FIG. 11C).
[0004]
After the filling of the gap between the semiconductor element 1 and the circuit board 3 with the resin is completed, the liquid resin is applied again to a part which has not been applied beforehand in order to form a resin sealing body. In this case, the time required for the resin coating process is the sum of not only the coating time but also the time required to fill the gap between the circuit boards from the outer periphery of the semiconductor element with the resin when one coating device is used. Very low resin filling equipment. The filling time can be shortened by coating so as to enclose the outer periphery of the semiconductor element to a greater extent. However, if the encapsulation is too large, air will be entrapped inside from the outer periphery. Therefore, the practically applicable coating area is 50% or less of the outer periphery of the semiconductor element. This is the same when intermittent application is performed. In short, if the resin is applied at an angle of 180 degrees or more when viewed from the center of the semiconductor element, there is a problem that air entrainment occurs.
The present invention has been made under such circumstances, and a flip-chip type semiconductor device capable of realizing resin filling in a shorter time than in the past and reducing void defects due to entrainment of air and gas generated from the resin. And a semiconductor manufacturing apparatus used in the method.
[0005]
[Means for Solving the Problems]
The present invention relates to a method for filling a resin between a semiconductor element and a circuit board of a flip-chip type semiconductor device and an outer periphery thereof, wherein a liquid resin is applied to an outer periphery of the semiconductor element, and a part of the outer periphery is coated with the liquid resin as an exhaust hole. The vacuum chamber is set in the vacuum chamber without the pressure, and the pressure in the vacuum chamber is reduced to, for example, 2 torr or less, and the exhaust hole is forcibly closed immediately after the pressure reduction. It is characterized in that the resin is filled using about 1 atm. In a resin filling apparatus for a flip-chip type semiconductor device, a means for applying a liquid resin while leaving at least a part of the outer periphery of the semiconductor element, a means for exposing the semiconductor device under reduced pressure, And a means for forcibly closing an uncoated portion of the portion and a means for heating under reduced pressure for a predetermined time.
Compared to the conventional technology, the exhaust hole is forcibly closed immediately after depressurization, so resin filling of the flip-chip type semiconductor device can be realized in a very short time, and void defects due to air entrapment and gas generated from the resin are reduced. it can.
[0006]
In the method for manufacturing a semiconductor device according to the present invention, a step of mounting a semiconductor element having ball-shaped connection terminals formed on connection electrodes formed on a main surface thereof on a circuit board connected via the ball-shaped connection terminals to a coating apparatus. And a step of applying a liquid resin while leaving at least a part of the outer periphery of the semiconductor element on the circuit board, and placing the semiconductor element and the circuit board under reduced pressure to form the semiconductor element and the circuit board. A means consisting of a vertically or horizontally movable shaft and a squeegee provided at its tip, or a means consisting of a vertically movable head and a tape in contact with the tip, while removing air in the gap and removing the remaining uncoated portion. Forcibly closing and filling the entire outer periphery of the semiconductor element with the liquid resin; and enlarging the semiconductor element and the circuit board filled with the liquid resin. It is characterized in that back to pressure and a step of completing the resin filling unfilled portion of the gap between the circuit board and the semiconductor element. The step of applying the liquid resin while leaving at least a part of the outer periphery of the semiconductor element on the circuit board may be performed at atmospheric pressure. The use of a tape as a means for forcibly closing has the advantage that the exhaust hole can be always closed on a clean surface and the appearance of the closed position becomes clean.
[0007]
The semiconductor manufacturing apparatus of the present invention is a means for mounting a semiconductor element in which a ball-shaped connection terminal is provided on a connection electrode formed on a main surface, a circuit board connected through the ball-shaped connection terminal to a coating apparatus, Means for applying a liquid resin while leaving at least a part of the outer periphery of the semiconductor element on the circuit board, and placing the semiconductor element and the circuit board under reduced pressure to form a gap between the semiconductor element and the circuit board. A means for eliminating air and forcibly closing the remaining uncoated portion and filling the entire outer periphery of the semiconductor element with the liquid resin, and applying atmospheric pressure to the semiconductor element and the circuit board filled with the liquid resin. Means for completing the resin filling of the unfilled portion of the gap between the semiconductor element and the circuit board, and the means for forcibly closing the uncoated portion is a shaft that can move vertically or horizontally. It is characterized in that it consists of the squeegee, which is provided on beauty its tip.
Further, the semiconductor manufacturing apparatus of the present invention is a means for mounting a semiconductor element having ball-shaped connection terminals provided on connection electrodes formed on a main surface on a circuit board connected via the ball-shaped connection terminals to a coating apparatus. Means for applying a liquid resin while leaving at least a part of the outer periphery of the semiconductor element on the circuit board, and placing the semiconductor element and the circuit board under reduced pressure to form the semiconductor element and the circuit board. A means for eliminating air in the gap and forcibly closing the remaining uncoated portion, filling the entire outer periphery of the semiconductor element with the liquid resin, and the semiconductor element and the circuit board filled with the liquid resin. Means for returning to atmospheric pressure to complete resin filling of an unfilled portion of the gap between the semiconductor element and the circuit board, wherein the means for forcibly closing the uncoated portion comprises a vertically movable head and It is characterized in that it consists of a tape in contact with. The means for eliminating air in the gap between the semiconductor element and the circuit board and forcibly closing the remaining uncoated portion and filling the entire outer periphery of the semiconductor element with the liquid resin is disposed in a reduced pressure reaction chamber. It may be.
[0008]
The viscosity of the liquid resin is preferably about 10 to 100,000 pois at the time of dispensing. It is appropriate that the total size of the uncoated portion used as the exhaust hole provided in the liquid resin applied around the semiconductor element is 5% to 70% of the semiconductor element. If it is less than 5%, there is no effect as an exhaust hole, and if it exceeds 70%, a reduced pressure space cannot be formed. The gap between the semiconductor element and the circuit board is about 20 to 200 μm. The circuit board is made of ceramics or synthetic resin. Further, liquid resins include thermosetting resins such as epoxy resins, silicone resins, vinyl polymer resins, phenolic resins, unsaturated polyester resins, diallyl phthalate resins, aromatic polyamides, nylon resins, ultrahigh molecular weight polyethylene, olefins, A thermoplastic resin such as a thermoplastic elastomer using amide or the like is used.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First, a first embodiment will be described with reference to FIGS.
FIG. 1 is a plan view of a flip-chip type semiconductor device illustrating a resin filling method, FIG. 2 is a plan view of a circuit board filled with a resin illustrating the resin filling method, and FIG. FIG. 4 is a perspective view and a side view of the applied semiconductor device, and FIG. 4 is a side view of the semiconductor device for explaining a method of connecting a resin around the semiconductor element.
The flip-chip type semiconductor device includes a semiconductor element 11, a circuit board 13 on which the semiconductor element is mounted, and a resin sealing body formed therebetween. That is, a plurality of connection electrodes electrically connected to the integrated circuit are formed on the semiconductor element 11 in which the integrated circuit is formed. For example, a ball-shaped connection terminal (bump) made of solder is connected to this connection electrode. Wiring and connection electrodes are formed on the main surface of the circuit board 13 on which the semiconductor elements 11 are mounted. The plurality of bumps of the semiconductor element 11 are connected to connection electrodes on the main surface of the circuit board 13. Connection electrodes are formed on the back surface of the circuit board 13, and ball-like external terminals are connected to the connection electrodes in the same manner as in the conventional flip-chip type semiconductor device shown in FIG. Installed.
[0010]
The connection electrodes on the main surface of the circuit board 13 and the connection electrodes on the back surface are appropriately connected via internal wiring of the circuit board 13. There is a gap between the semiconductor element 11 and the circuit board 13 by the thickness of the bump. A resin such as an epoxy resin is sealed in the gap, and FIGS. 1 and 2 show a method of filling the gap with the resin.
{Circle around (1)} The liquid resin 15 supplied from the dispenser is dispensed while leaving a part of the circuit element 13 where the resin is not applied on the outer periphery of the semiconductor element 11. Portions where the resin is not applied are used as exhaust holes 10 (FIGS. 1A, 3A, and 3B). That is, the liquid resin 15 is applied so as to surround the entire semiconductor element 11 except for a part of the outer periphery. Here, the reason why the resin is not applied to a part of the outer periphery of the semiconductor element 11 is to exhaust air between the semiconductor element and the circuit board in a decompression step described later. (2) Thereafter, by exposing the entire semiconductor device to a reduced-pressure atmosphere, the air between the semiconductor element 11 and the circuit board 13 is exhausted through a portion where the outer peripheral portion of the semiconductor element is not applied. At this time, in order to realize sufficient exhaust, it is effective to leave a portion of the outer periphery of the semiconductor element where the resin is not applied for a predetermined time. Exposing the semiconductor device under reduced pressure is performed in a vacuum chamber 18 (FIG. 1B).
[0011]
{Circle around (3)} Then, in a vacuum chamber 18 under vacuum or reduced pressure, the exhaust hole 10 of the portion of the semiconductor device where the outer peripheral portion of the semiconductor element is not applied is inserted into a squeegee provided at the tip of a shaft that operates horizontally with the semiconductor device. By 19, the liquid resin 15 around it is rocked and agitated to connect the liquid resin 15 around the semiconductor element 11 (FIG. 1 (c)). It is possible to connect the uncoated portions reliably and in a short time.
{Circle around (4)} After the liquid resin of the semiconductor element 11 is completely connected, the resin-unfilled portion existing in the center of the semiconductor element 11 between the semiconductor element 11 and the circuit board 13 is a closed reduced pressure space 101. Next, when the vacuum chamber 18 is brought to the atmospheric pressure state, that is, when the surroundings of the circuit board 13 and the liquid resin 15 are opened to the atmosphere under the condition that the closed depressurized space 101 exists, the inner depressurized space and its outer periphery are separated. Since there is a pressure difference between the two, the reduced pressure space 101 is crushed by the atmospheric pressure applied to the entire outer periphery of the liquid resin 15, and the inside of the gap between the semiconductor element 11 and the circuit board 13 is reliably filled (FIG. 2A). The atmospheric pressure means about 900 to 1060 hPa. Thereafter, the semiconductor device is taken out of the vacuum chamber 18 (FIG. 2B). Next, (5) the liquid resin is heated and cured to form a solid resin sealing body 16 between the semiconductor element and the circuit board 13.
[0012]
Next, the operation of connecting the resin on the outer periphery of the semiconductor element will be described in detail with reference to FIG. First, {circle around (1)} the vacuum chamber is depressurized, and a squeegee 19 is provided on the liquid resin 15 formed by coating the outer periphery of the semiconductor element 11 on the circuit board 13 by operating a shaft (not shown) attached to the vacuum chamber. It is lowered toward the exhaust hole 10 (FIG. 4A). {Circle around (2)} Next, the lowered squeegee 19 closes the exhaust hole 10 and further shakes and agitates the liquid resin 15 around the exhaust hole 10 to connect the liquid resin 15 around the semiconductor element 11 (FIG. 2 (b)). )). {Circle around (3)} Thereafter, the squeegee 19 is raised after the exhaust holes are crushed to connect the liquid resin 15.
The portions to which the liquid resin is not applied can be connected reliably and in a short time, and the resin filling of the flip-chip type semiconductor device can be realized in an extremely short time as compared with the related art. Further, since the resin is filled under reduced pressure, void defects due to entrainment of air and gas generated from the resin can be reduced.
[0013]
Next, a second embodiment will be described with reference to FIG.
This embodiment is characterized in that the liquid resin is connected by using a tape and a head for driving the tape as means for closing the exhaust hole. FIG. 5 is a side view of the semiconductor device illustrating a method of connecting the resin on the outer periphery of the semiconductor element.
The flip-chip type semiconductor device includes a semiconductor element 21, a circuit board 23 on which the semiconductor element 21 is mounted, and a resin sealing body formed therebetween. That is, a plurality of connection electrodes electrically connected to the integrated circuit are formed on the semiconductor element 21 in which the integrated circuit is formed. For example, a ball-shaped bump made of solder is connected to this connection electrode. Wiring and connection electrodes are formed on the main surface of the circuit board 23 on which the semiconductor element 21 is mounted. The plurality of bumps of the semiconductor element 21 are connected to connection electrodes on the main surface of the circuit board 13. Connection electrodes are formed on the back surface of the circuit board 23, and ball-like external terminals are connected to the connection electrodes in the same manner as in the conventional flip-chip type semiconductor device shown in FIG. Installed. The connection electrodes on the main surface and the connection electrodes on the back surface of the circuit board 23 are appropriately connected via internal wiring of the circuit board 23. There is a gap between the semiconductor element 21 and the circuit board 23 by the thickness of the bump. This gap is filled with a resin sealing body such as an epoxy resin formed from a liquid resin.
[0014]
Next, application of a liquid resin to a circuit board for forming a resin sealing body of a flip-chip type semiconductor device will be described.
The application of the liquid resin 25 is performed so as to surround the entire semiconductor element 21 except for a part of the outer periphery of the semiconductor element 21 which is flip-chip bonded to the circuit board 23. A portion of the outer periphery of the semiconductor element where the resin is not applied is used as an exhaust hole 20 for exhausting air between the semiconductor element and the circuit board in a pressure reducing step described later.
{Circle around (1)} The circuit board 23 coated with the liquid resin 25 so as to have the exhaust holes 20 is accommodated in a vacuum chamber (not shown) in a reduced pressure state. In the vacuum chamber, a tape feed 27, a tape 28 supported and moved by the tape feed, and a head 26 which moves up and down and presses the tape in the direction of the exhaust hole 20 are formed so as to be located above the exhaust hole 20. Are located. First, the head 26 pushes down the resin contact tape 28 from the upper part of the exhaust hole 20 and lowers it, and makes the tape come into contact with the liquid resin 25 around the exhaust hole 20 where the liquid resin is not applied (FIG. 5 (a)). After contact with the liquid resin 25, the tape 28 moves on the liquid resin 25 by the horizontal operation of the tape feed mechanism 27 and connects the liquid resin 25 on the outer periphery of the semiconductor element 21.
[0015]
Then, the exhaust hole 20 is closed (FIG. 5B). After the liquid resin 25 on the outer periphery of the semiconductor element 21 is connected and the exhaust hole 20 is closed, the head 26 is raised to separate the tape 28 from the liquid resin 25 (FIG. 5C).
After the liquid resin of the semiconductor element is completely connected, the resin-unfilled portion existing in the center of the semiconductor element between the semiconductor element and the circuit board is a closed reduced pressure space. In this state, the vacuum chamber is brought to the atmospheric pressure state, that is, when the surroundings of the circuit board and the liquid resin are opened to the air atmosphere in a state where the closed depressurized space exists, the pressure difference between the inner depressurized space and the outer periphery thereof is increased. Is generated, the reduced pressure space is crushed by the atmospheric pressure applied to the entire liquid resin, and the inside of the gap between the semiconductor element and the circuit board is reliably filled. Next, the liquid resin is heated and cured to form a solid resin sealing body between the semiconductor element and the circuit board. Thereafter, the semiconductor device is taken out of the vacuum chamber.
[0016]
It is possible to reliably and quickly connect portions where the liquid resin is not applied. The unfilled portion of the resin between the semiconductor element and the circuit board after the resin of the semiconductor element is completely connected is a closed decompression space. When the periphery of the semiconductor device is opened to the atmosphere in this state, the internal decompression space The pressure inside the liquid resin is filled with the atmospheric pressure applied to the entire outer periphery of the liquid resin.
The portions to which the liquid resin is not applied can be connected reliably and in a short time, and the resin filling of the flip-chip type semiconductor device can be realized in an extremely short time as compared with the related art. Further, since the resin is filled under reduced pressure, void defects due to entrainment of air and gas generated from the resin can be reduced.
[0017]
Next, a third embodiment will be described with reference to FIG.
This embodiment is characterized in that a liquid resin is connected using a squeegee having a comb-shaped contact surface as means for closing the exhaust hole. FIG. 6 is a plan view of a semiconductor device and a perspective view of a squeegee used for the method for connecting a resin on the outer periphery of the semiconductor element.
The flip-chip type semiconductor device is composed of a semiconductor element 31, a circuit board 33 on which the semiconductor element 31 is mounted, and a resin sealing body formed therebetween. That is, a plurality of connection electrodes electrically connected to the integrated circuit are formed on the main surface of the semiconductor element 31 in which the integrated circuit is formed. For example, a ball-shaped bump made of solder is connected to this connection electrode. Wiring and connection electrodes are formed on the main surface of the circuit board 33 on which the semiconductor element 31 is mounted. The plurality of bumps of the semiconductor element 31 are connected to connection electrodes on the main surface of the circuit board 33. Connection electrodes are formed on the back surface of the circuit board 33, and ball-like external terminals are connected to the connection electrodes in the same manner as in the conventional flip-chip type semiconductor device shown in FIG. Installed.
[0018]
The connection electrodes on the main surface and the connection electrodes on the back surface of the circuit board 33 are appropriately connected via internal wiring of the circuit board 33. There is a gap between the semiconductor element 31 and the circuit board 33 by the thickness of the bump. This gap is filled with a resin sealing body such as an epoxy resin formed from a liquid resin.
Next, application of a liquid resin to a circuit board for forming a resin sealing body of a flip-chip type semiconductor device will be described.
The application of the liquid resin 35 is performed so as to surround the entire semiconductor element 31 except for a part of the outer periphery of the semiconductor element 31 which is flip-chip bonded to the circuit board 33. A portion of the outer periphery of the semiconductor element where the resin is not applied is used as an exhaust hole 30 for exhausting air between the semiconductor element and the circuit board in a pressure reducing step described later.
[0019]
{Circle around (1)} The circuit board 33 coated with the liquid resin 35 so as to have the exhaust holes 30 is accommodated in a vacuum chamber (not shown) in a reduced pressure state. The squeegee 36 provided at the tip of the shaft is mounted in the vacuum chamber. First, the squeegee 36 disposed above the vacuum chamber is lowered to near the main surface of the circuit board 33 (FIG. 6A). Next, (2) the squeegee 36 is moved in the direction of the arrow at predetermined intervals in parallel along the side of the semiconductor element 31 where the exhaust holes 30 are formed, and the exhaust holes 30 are closed with the liquid resin 25 (FIG. b)). Next, as shown by the arrow (3), the squeegee 36 is moved perpendicularly to the side of the semiconductor element 31 where the exhaust hole 30 is formed so as to approach this side (FIG. 6C). Then, as shown by the arrow (4), the exhaust hole 30 is moved horizontally to the side where the exhaust hole 30 is located, in the direction opposite to the step (2), and close to this side. By this movement, the exhaust hole 30 is completely closed (FIG. 6D). Thereafter, (5) the squeegee 36 is moved above the vacuum chamber.
[0020]
As in the other embodiments, between the semiconductor element and the circuit board after the liquid resin of the semiconductor element is completely connected, the resin-unfilled portion existing in the center of the semiconductor element is a closed reduced pressure space. I have. In this state, the vacuum chamber is brought to the atmospheric pressure state, that is, when the surroundings of the circuit board and the liquid resin are opened to the air atmosphere in a state where the closed depressurized space exists, the pressure difference between the inner depressurized space and the outer periphery thereof is increased. Is generated, the reduced pressure space is crushed by the atmospheric pressure applied to the entire liquid resin, and the inside of the gap between the semiconductor element and the circuit board is reliably filled. Next, the liquid resin is cured to form a solid resin sealing body between the semiconductor element and the circuit board. Thereafter, the semiconductor device is taken out of the vacuum chamber.
It is possible to reliably and quickly connect portions where the liquid resin is not applied. After the liquid resin of the semiconductor element is completely connected, the unfilled portion between the semiconductor element and the circuit board is a closed decompression space. In this state, when the periphery of the semiconductor device is opened to the atmosphere, the internal decompression is reduced. A pressure difference is generated between the space and the space, and the inside is filled with resin. Further, since the resin is filled under reduced pressure, void defects due to entrainment of air and gas generated from the resin can be reduced.
[0021]
Next, a fourth embodiment will be described with reference to FIGS.
FIG. 7 is a schematic cross-sectional view of a semiconductor manufacturing apparatus used to carry out the method of manufacturing a flip-chip type semiconductor device of the present invention and forming a resin sealing body (underfill) in the semiconductor device. It is a flowchart which shows the manufacturing process which forms a resin sealing body.
As shown in FIG. 8, the steps from application of the liquid resin to the periphery of the semiconductor element mounted on the circuit board so as to provide an exhaust hole to formation of the resin sealing body are as follows. First, (1) a circuit board and a semiconductor element mounted thereon are set on a resin application stage. {Circle around (2)} In the resin application stage, the liquid resin supplied from the dispenser is dispensed so as to leave a part of the outer periphery of the semiconductor element on the circuit board where the resin is not applied as an exhaust hole. (3) Thereafter, the entire semiconductor device is housed in a vacuum chamber, and the circuit board on which the semiconductor element is mounted is placed on the heating stage. As a result, the semiconductor device is exposed to a reduced-pressure atmosphere, and exhausts air between the semiconductor element and the circuit board through the exhaust hole where the outer peripheral portion of the semiconductor element is not applied. At this time, in order to realize sufficient exhaust, it is effective to leave a portion of the outer periphery of the semiconductor element where the resin is not applied for a predetermined time.
[0022]
(4) Thereafter, the inside of the vacuum chamber is evacuated using a vacuum pump, and under this reduced pressure, the exhaust holes in the portions of the semiconductor device where the outer periphery of the semiconductor element is not coated are forcibly closed by a forced closing mechanism, and the semiconductor element is evacuated. Connect the surrounding liquid resin. {Circle around (5)} After the liquid resin is completely connected, the resin-unfilled portion existing in the center of the semiconductor element between the semiconductor element and the circuit board is a closed reduced pressure space. When the vacuum chamber is brought to the atmospheric pressure state, a pressure difference is generated between the internal depressurized space and the outer periphery thereof, and the depressurized space is crushed by the atmospheric pressure applied to the entire outer periphery of the liquid resin, and the inside of the gap between the semiconductor element and the circuit board is reduced Filling is assured. Next, (6) the circuit board on which the semiconductor element and the resin sealing body are mounted is taken out of the vacuum chamber. Later, the liquid resin between the semiconductor element and the circuit board is cured in an oven.
[0023]
As shown in FIG. 8, in the semiconductor manufacturing apparatus, a coating stage 41 and a heating stage 42 are separated. The heating stage 42 is provided in the vacuum chamber 40. The resin application stage 41 is operated at atmospheric pressure. The circuit board on which the semiconductor element is mounted is applied with a resin on a resin application stage 41. The liquid resin is supplied onto the circuit board from the nozzle head 43 of the dispenser controlled by the XYZ robot 45. The position of the circuit board is recognized by the recognition camera 44, and the nozzle position corrector 46 corrects the position of the nozzle based on the recognition. The circuit board coated with the liquid resin is transported into the vacuum chamber 40. The vacuum chamber 40 houses a forced closing mechanism 47 in addition to the heating stage 42. The forced closing mechanism 47 is operated inside or outside the vacuum chamber 40. In addition, a vacuum pump 48 is naturally attached. The steps (1) and (2) in FIG. 8 are performed on the resin application stage, and the steps (3) to (6) are performed on the resin heating stage 41.
[0024]
Next, a fifth embodiment will be described with reference to FIGS.
This embodiment relates to the shape of an exhaust hole formed in a liquid resin applied on a circuit board. 9 and 10 are plan views of the semiconductor element and the circuit board showing the shape of the liquid resin applied to the outer periphery of the semiconductor element on the circuit board.
As described above, the present invention relates to a method of filling a resin between a semiconductor element and a circuit board of a flip-chip type semiconductor device and an outer periphery thereof and forming a resin sealing body in the gap. A part of the outer periphery is set in a vacuum chamber without applying the liquid resin as an exhaust hole, and the inside of the vacuum chamber is depressurized. The method is characterized in that, after the formed reduced pressure space is formed, vacuum breaking is performed and resin filling is performed utilizing a pressure difference between the inside and outside of the semiconductor element.
[0025]
The shape and shape of the liquid resin 55 applied to the outer periphery of the semiconductor element 51 on the circuit board 53 can be freely changed in the number and size of the exhaust holes 50. FIG. 9 shows an example of the application shape of the liquid resin. The exhaust holes 50 are not limited to the case of the first embodiment in which the exhaust holes 50 are formed only at one location around the semiconductor element 51 (FIG. 9A), but can be formed at a plurality of locations (FIGS. 9B to 9B). (N)). In this case, the forcible closing mechanism in the vacuum chamber of FIG. 8 sets, for example, a plurality of squeegees at predetermined positions to close them. Since the exhaust efficiency at the time of pressure reduction is improved, it is important to form a plurality of exhaust holes and set their positions in a well-balanced manner. When the exhaust holes are formed on a plurality of sides, it is appropriate to use a plurality of squeegees. In addition, it can be formed not only on the sides of the semiconductor element but also on the corners (FIGS. 9F to 9M). Forming at the corners has the advantage that the appearance becomes beautiful. However, since the corners are where stress is most concentrated, it is preferable to apply the liquid resin in advance. Since such a means for forcibly closing the exhaust holes is used, it is not preferable to increase the number of exhaust holes too much. It is appropriate that the total size of the exhaust holes, that is, the size of the uncoated portion of the liquid resin is about 5% to 70% of the outer circumference of the semiconductor element.
[0026]
The exhaust hole is closed when the exhaust operation is completed. To close the exhaust hole and connect the liquid resin, the resin on both sides of the exhaust hole is approached and connected. However, if the exhaust hole is large, the resin on both sides is insufficient, and as a result, a reduced pressure space cannot be formed. FIG. 10 shows a method for solving such a concern, which is characterized by sufficiently preparing a resin for closing the exhaust hole. The semiconductor element 51 is mounted on the circuit board 53, and a liquid resin 55 is applied to the periphery of the circuit board 53 except for the uncoated portion. At this time, the excessively coated portion 52 is formed on both sides of the uncoated portion which becomes the exhaust hole 50. After the exhaust process is performed in such a configuration, the liquid resin in the excessively applied portion 52 is moved to the exhaust hole 55 and closed using a forced closing mechanism such as a squeegee.
The resin filling of the flip-chip type semiconductor device can be realized in an extremely short time as compared with the prior art, and void defects due to entrainment of air or gas generated from the resin can be reduced. Further, it is possible to reliably form the decompression space.
[0027]
【The invention's effect】
According to the present invention, the resin filling of the flip-chip type semiconductor device can be realized in an extremely short time as compared with the related art by the above configuration. In addition, since the filling of the flip-chip type semiconductor device with the resin is performed under reduced pressure, void defects due to entrainment of air and gas generated from the resin can be reduced.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a semiconductor device illustrating a method for filling a flip-chip type semiconductor device with a resin according to the present invention.
FIG. 2 is a cross-sectional view of a semiconductor device showing a method for filling a flip-chip type semiconductor device with a resin according to the present invention.
FIGS. 3A and 3B are a perspective view and a side view of a semiconductor device in which a resin is applied to an outer periphery of a semiconductor element of the present invention.
FIG. 4 is a side view of a semiconductor device for explaining a method of connecting a resin around a semiconductor element according to the present invention.
FIG. 5 is a side view of a semiconductor device illustrating a method of connecting a resin around a semiconductor element according to the present invention.
6A and 6B are a plan view of a semiconductor device and a perspective view of a squeegee used in the method for connecting a resin around a semiconductor element according to the present invention.
FIG. 7 is a schematic cross-sectional view of a semiconductor manufacturing apparatus used to carry out the method of manufacturing a flip-chip type semiconductor device of the present invention and forming a resin sealing body (underfill) in the semiconductor device.
FIG. 8 is a flowchart showing a manufacturing process for forming a resin sealing body used for the flip-chip type semiconductor device of the present invention.
FIG. 9 is a plan view of the semiconductor element and the circuit board showing the shape of the liquid resin applied to the periphery of the semiconductor element on the circuit board of the present invention.
FIG. 10 is a plan view of the semiconductor element and the circuit board showing the shape of the liquid resin applied to the outer periphery of the semiconductor element on the circuit board of the present invention.
FIG. 11 is a cross-sectional view of a semiconductor device showing a method of filling a conventional flip-chip type semiconductor device with resin.
[Explanation of symbols]
1, 11, 21, 31, 51 ... semiconductor element (chip),
2 ... connection terminal (bump),
3, 13, 23, 33, 53 ... circuit board,
4 ・ ・ ・ dispense nozzle,
5, 15, 25, 35, 55 ... liquid resin,
6, 16: resin sealing body (underfill), 7: external terminal,
10, 20, 30, 50 ... exhaust holes,
18, 40: vacuum chamber, 19, 36: squeegee,
26 ... head, 27 ... tape feed, 28 ... tape,
41: resin application stage, 42: heating stage,
43 ... nozzle head, 44 ... recognition camera,
45 ... XYZ robot, 46 ... Nozzle position correction device,
47: forced closing mechanism, 48: vacuum pump,
52: Excess coating part, 101: Decompression space.

Claims (5)

Mounting a semiconductor element having ball-shaped connection terminals formed on connection electrodes formed on the main surface thereof on a circuit board connected via the ball-shaped connection terminals to a coating apparatus; and mounting the semiconductor element on the circuit board. A step of applying a liquid resin while leaving at least a part of the outer periphery, and placing the semiconductor element and the circuit board under reduced pressure to eliminate air in a gap between the semiconductor element and the circuit board and leave the semiconductor element and the circuit board. The uncoated portion is forcibly closed by means of a vertically or horizontally movable shaft and a means of a squeegee provided at the tip thereof, or a vertically movable head and a means of a tape in contact with the tip thereof, forcibly closing the semiconductor element. Filling the entire outer periphery with the liquid resin, returning the semiconductor element and the circuit board filled with the liquid resin to atmospheric pressure, Method of manufacturing a flip chip type semiconductor device characterized by and a step of completing the resin filling unfilled portion of the gap between the road substrate. 2. The method according to claim 1, wherein the step of applying the liquid resin while leaving at least a part of the outer periphery of the semiconductor element on the circuit board is performed at atmospheric pressure. Means for mounting a semiconductor element having ball-shaped connection terminals provided on connection electrodes formed on a main surface thereof on a circuit board connected via the ball-shaped connection terminals to a coating apparatus; and the semiconductor element on the circuit board. A means for applying the liquid resin while leaving at least a part of the outer periphery, and the semiconductor element and the circuit board are placed under reduced pressure to remove air in a gap between the semiconductor element and the circuit board and remain. Means for forcibly closing the uncoated portion, filling the entire periphery of the semiconductor element with the liquid resin, returning the semiconductor element and the circuit board filled with the liquid resin to atmospheric pressure, and means to complete the resin filling unfilled portion of the gap between the circuit board, said means for closing the uncoated portion forcibly, the vertical or scan provided on the shaft and the tip horizontally movable The semiconductor manufacturing apparatus characterized by comprising the over-di. Means for mounting a semiconductor element having ball-shaped connection terminals provided on connection electrodes formed on a main surface thereof on a circuit board connected via the ball-shaped connection terminals to a coating apparatus; and the semiconductor element on the circuit board. A means for applying a liquid resin while leaving at least a part of the outer periphery; and placing the semiconductor element and the circuit board under reduced pressure to remove air in a gap between the semiconductor element and the circuit board, and to remove remaining air. Means for forcibly closing the coating portion and filling the entire periphery of the semiconductor element with the liquid resin, and returning the semiconductor element and the circuit board filled with the liquid resin to the atmospheric pressure, thereby setting the semiconductor element and the circuit and means to complete the resin filling unfilled portion of the gap between the substrate, said means for closing the uncoated portion forcibly is characterized by comprising a tape in contact with the head and the tip are movable vertically Semiconductor manufacturing apparatus for. The means for eliminating air in the gap between the semiconductor element and the circuit board and forcibly closing the remaining uncoated portion and filling the entire outer periphery of the semiconductor element with the liquid resin is disposed in a reduced pressure reaction chamber. The semiconductor manufacturing apparatus according to claim 3 , wherein:

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