JP3865928B2 - 結合バッキングブロック及び複合変換器アレー - Google Patents
結合バッキングブロック及び複合変換器アレー Download PDFInfo
- Publication number
- JP3865928B2 JP3865928B2 JP12165898A JP12165898A JP3865928B2 JP 3865928 B2 JP3865928 B2 JP 3865928B2 JP 12165898 A JP12165898 A JP 12165898A JP 12165898 A JP12165898 A JP 12165898A JP 3865928 B2 JP3865928 B2 JP 3865928B2
- Authority
- JP
- Japan
- Prior art keywords
- array
- composite
- backing block
- transducer
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
- B06B1/0677—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a high impedance backing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/840,470 | 1997-04-18 | ||
| US08/840,470 US6043590A (en) | 1997-04-18 | 1997-04-18 | Composite transducer with connective backing block |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH10304495A JPH10304495A (ja) | 1998-11-13 |
| JPH10304495A5 JPH10304495A5 (2) | 2005-11-17 |
| JP3865928B2 true JP3865928B2 (ja) | 2007-01-10 |
Family
ID=25282461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12165898A Expired - Fee Related JP3865928B2 (ja) | 1997-04-18 | 1998-04-16 | 結合バッキングブロック及び複合変換器アレー |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6043590A (2) |
| EP (1) | EP0872285B1 (2) |
| JP (1) | JP3865928B2 (2) |
| KR (1) | KR19980081523A (2) |
| CN (1) | CN1149395C (2) |
| AT (1) | ATE357979T1 (2) |
| DE (1) | DE69837416T2 (2) |
Families Citing this family (71)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6685645B1 (en) | 2001-10-20 | 2004-02-03 | Zonare Medical Systems, Inc. | Broad-beam imaging |
| US6936008B2 (en) * | 1999-08-20 | 2005-08-30 | Zonare Medical Systems, Inc. | Ultrasound system with cableless coupling assembly |
| US6255761B1 (en) * | 1999-10-04 | 2001-07-03 | The United States Of America As Represented By The Secretary Of The Navy | Shaped piezoelectric composite transducer |
| US6225804B1 (en) * | 1999-10-25 | 2001-05-01 | Analogic Corporation | Correction of DC offset in magnetic resonance imaging signals |
| FI108204B (fi) * | 1999-11-25 | 2001-11-30 | Kari Johannes Kirjavainen | Kalvo energioiden muuntamiseksi |
| US6288477B1 (en) | 1999-12-03 | 2001-09-11 | Atl Ultrasound | Composite ultrasonic transducer array operating in the K31 mode |
| US6384516B1 (en) * | 2000-01-21 | 2002-05-07 | Atl Ultrasound, Inc. | Hex packed two dimensional ultrasonic transducer arrays |
| US7288069B2 (en) * | 2000-02-07 | 2007-10-30 | Kabushiki Kaisha Toshiba | Ultrasonic probe and method of manufacturing the same |
| US6467138B1 (en) * | 2000-05-24 | 2002-10-22 | Vermon | Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same |
| JP3449345B2 (ja) * | 2000-08-11 | 2003-09-22 | 株式会社村田製作所 | センサアレイおよび送受信装置 |
| US6504288B2 (en) * | 2000-12-05 | 2003-01-07 | The Regents Of The University Of California | Compensated individually addressable array technology for human breast imaging |
| US6490228B2 (en) | 2001-02-16 | 2002-12-03 | Koninklijke Philips Electronics N.V. | Apparatus and method of forming electrical connections to an acoustic transducer |
| US7135809B2 (en) * | 2001-06-27 | 2006-11-14 | Koninklijke Philips Electronics, N.V. | Ultrasound transducer |
| US6806623B2 (en) * | 2002-06-27 | 2004-10-19 | Siemens Medical Solutions Usa, Inc. | Transmit and receive isolation for ultrasound scanning and methods of use |
| US6875178B2 (en) | 2002-06-27 | 2005-04-05 | Siemens Medical Solutions Usa, Inc. | Receive circuit for ultrasound imaging |
| US6994674B2 (en) * | 2002-06-27 | 2006-02-07 | Siemens Medical Solutions Usa, Inc. | Multi-dimensional transducer arrays and method of manufacture |
| US6891311B2 (en) * | 2002-06-27 | 2005-05-10 | Siemens Medical Solutions Usa, Inc | Ultrasound transmit pulser with receive interconnection and method of use |
| US7053530B2 (en) * | 2002-11-22 | 2006-05-30 | General Electric Company | Method for making electrical connection to ultrasonic transducer through acoustic backing material |
| US6831394B2 (en) * | 2002-12-11 | 2004-12-14 | General Electric Company | Backing material for micromachined ultrasonic transducer devices |
| US20050225210A1 (en) * | 2004-04-01 | 2005-10-13 | Siemens Medical Solutions Usa, Inc. | Z-axis electrical connection and methods for ultrasound transducers |
| EP1795132B1 (en) * | 2004-09-21 | 2011-07-06 | Olympus Corporation | Ultrasonic transducer |
| US7302744B1 (en) * | 2005-02-18 | 2007-12-04 | The United States Of America Represented By The Secretary Of The Navy | Method of fabricating an acoustic transducer array |
| JP4504255B2 (ja) * | 2005-05-31 | 2010-07-14 | アロカ株式会社 | 超音波探触子及びその製造方法 |
| US7927280B2 (en) | 2005-08-05 | 2011-04-19 | Koninklijke Philips Electronics N.V. | Curved 2-D array ultrasound transducer and method for volumetric imaging |
| US7449640B2 (en) * | 2005-10-14 | 2008-11-11 | Sonosite, Inc. | Alignment features for dicing multi element acoustic arrays |
| US7804970B2 (en) * | 2005-10-24 | 2010-09-28 | Sonosite, Inc. | Array interconnect for improved directivity |
| US20080130415A1 (en) * | 2006-11-07 | 2008-06-05 | General Electric Company | Compound flexible circuit and method for electrically connecting a transducer array |
| US7557489B2 (en) * | 2007-07-10 | 2009-07-07 | Siemens Medical Solutions Usa, Inc. | Embedded circuits on an ultrasound transducer and method of manufacture |
| US7834522B2 (en) | 2007-08-03 | 2010-11-16 | Mr Holdings (Hk) Limited | Diagnostic ultrasound transducer |
| US7841069B2 (en) * | 2007-08-30 | 2010-11-30 | International Business Machines Corporation | Method for manufacturing a thin closure magnetic head |
| CN101396276B (zh) * | 2007-09-25 | 2010-08-11 | 深圳市蓝韵实业有限公司 | 一种超声诊断仪探头控制模块通道连通性诊断装置 |
| WO2009055767A2 (en) * | 2007-10-26 | 2009-04-30 | Trs Technologies, Inc. | Micromachined piezoelectric ultrasound transducer arrays |
| US20090108710A1 (en) | 2007-10-29 | 2009-04-30 | Visualsonics Inc. | High Frequency Piezocomposite And Methods For Manufacturing Same |
| US7804228B2 (en) * | 2007-12-18 | 2010-09-28 | Boston Scientific Scimed, Inc. | Composite passive materials for ultrasound transducers |
| WO2010044382A1 (ja) * | 2008-10-14 | 2010-04-22 | オリンパスメディカルシステムズ株式会社 | 超音波プローブ |
| US20100171395A1 (en) * | 2008-10-24 | 2010-07-08 | University Of Southern California | Curved ultrasonic array transducers |
| KR101133462B1 (ko) * | 2008-11-19 | 2012-04-09 | 삼성메디슨 주식회사 | 초음파 진단장치용 프로브 및 그 제조방법 |
| KR101112658B1 (ko) * | 2008-11-19 | 2012-02-15 | 삼성메디슨 주식회사 | 초음파 진단장치용 프로브 및 그 제조방법 |
| KR101137261B1 (ko) * | 2009-03-18 | 2012-04-20 | 삼성메디슨 주식회사 | 초음파 진단장치용 프로브 및 그 제조방법 |
| KR101137262B1 (ko) * | 2009-03-18 | 2012-04-20 | 삼성메디슨 주식회사 | 초음파 진단장치용 프로브 및 그 제조방법 |
| KR101068918B1 (ko) * | 2009-06-23 | 2011-09-30 | 삼성메디슨 주식회사 | 초음파 진단기의 트랜스듀서 및 그 트랜스듀서의 제조 방법 |
| US8245580B2 (en) * | 2009-10-02 | 2012-08-21 | Rosemount Inc. | Compliant coil form |
| US8792307B2 (en) * | 2010-02-22 | 2014-07-29 | Baker Hughes Incorporated | Acoustic transducer with a backing containing unidirectional fibers and methods of making and using same |
| JP5039167B2 (ja) * | 2010-03-24 | 2012-10-03 | 株式会社東芝 | 二次元アレイ超音波プローブ及びプローブ診断装置 |
| KR101397100B1 (ko) * | 2010-06-28 | 2014-05-20 | 삼성전자주식회사 | 초음파 프로브 및 그 제조방법 |
| US8299687B2 (en) | 2010-07-21 | 2012-10-30 | Transducerworks, Llc | Ultrasonic array transducer, associated circuit and method of making the same |
| KR101196214B1 (ko) * | 2010-09-06 | 2012-11-05 | 삼성메디슨 주식회사 | 초음파 진단장치용 프로브 |
| EP2759003B1 (en) * | 2011-09-20 | 2020-08-26 | Sunnybrook Research Institute | Ultrasound transducer |
| KR101296244B1 (ko) | 2012-01-31 | 2013-08-13 | 삼성메디슨 주식회사 | 초음파 프로브의 흡음 소자, 초음파 프로브의 흡음층 및 그 제작 방법 |
| KR101378012B1 (ko) * | 2012-03-14 | 2014-03-24 | 삼성전자주식회사 | 멀티 어레이형 초음파 프로브 장치 및 멀티 어레이형 초음파 프로브 장치의 제조 방법 |
| KR101336246B1 (ko) | 2012-04-23 | 2013-12-03 | 삼성전자주식회사 | 초음파 트랜스듀서, 초음파 프로브, 및 초음파 진단장치 |
| EP2883429B1 (en) * | 2012-08-09 | 2019-05-15 | Dalhousie University | Ultrasound endoscope and methods of manufacture thereof |
| DE102013101097A1 (de) | 2013-02-04 | 2014-08-21 | Ge Sensing & Inspection Technologies Gmbh | Verfahren zur Kontaktierung eines Ultraschallwandlers; Ultraschallwandlerkomponente mit kontaktiertem Ultraschallwandler zur Verwendung in einem Ultraschallprüfkopf; Ultraschallprüfkopf und Vorrichtung zur zerstörungsfreien Prüfung eines Prüflings mittels Ultraschall |
| US10271134B2 (en) | 2013-11-22 | 2019-04-23 | Covarx Corporation | 2D matrix array backing interconnect assembly, 2D ultrasonic transducer array, and method of manufacture |
| KR101467933B1 (ko) * | 2013-12-02 | 2014-12-02 | 한국세라믹기술원 | 피에조 파이버 컴포지트 구조체 및 이를 이용한 소자 |
| KR101467934B1 (ko) * | 2013-12-02 | 2014-12-02 | 한국세라믹기술원 | 피에조 파이버 컴포지트 구조체 및 이를 이용한 소자 |
| US9833219B2 (en) * | 2014-03-26 | 2017-12-05 | Siemens Medical Solutions Usa, Inc. | Angle oriented array for medical ultrasound |
| US9664783B2 (en) | 2014-07-15 | 2017-05-30 | Garmin Switzerland Gmbh | Marine sonar display device with operating mode determination |
| US9812118B2 (en) | 2014-07-15 | 2017-11-07 | Garmin Switzerland Gmbh | Marine multibeam sonar device |
| US9766328B2 (en) * | 2014-07-15 | 2017-09-19 | Garmin Switzerland Gmbh | Sonar transducer array assembly and methods of manufacture thereof |
| US9784826B2 (en) | 2014-07-15 | 2017-10-10 | Garmin Switzerland Gmbh | Marine multibeam sonar device |
| US10514451B2 (en) | 2014-07-15 | 2019-12-24 | Garmin Switzerland Gmbh | Marine sonar display device with three-dimensional views |
| US9784825B2 (en) | 2014-07-15 | 2017-10-10 | Garmin Switzerland Gmbh | Marine sonar display device with cursor plane |
| US10001459B2 (en) * | 2015-02-27 | 2018-06-19 | General Electric Company | System and method for phased array edge card |
| CN106256989B (zh) * | 2015-06-18 | 2020-09-18 | 中国石油化工股份有限公司 | 一种井下随钻噪声采集系统 |
| US10605913B2 (en) | 2015-10-29 | 2020-03-31 | Garmin Switzerland Gmbh | Sonar noise interference rejection |
| KR102444289B1 (ko) | 2017-07-18 | 2022-09-16 | 삼성전자주식회사 | 인터포저, 이를 채용한 초음파 프로브, 및 인터포저를 제조하는 방법 |
| WO2022067438A1 (en) * | 2020-09-30 | 2022-04-07 | E2Sense Inc. | Ultrasonic transducer assembly and related methods |
| TWI870972B (zh) | 2022-09-26 | 2025-01-21 | 德商卡爾蔡司多重掃描電子顯微鏡有限公司 | 帶電粒子束裝置的擾動補償 |
| WO2024186572A1 (en) | 2023-03-09 | 2024-09-12 | Fujifilm Sonosite, Inc. | Multi-layer flexible array interconnect for an ultrasound transducer, and methods of manufacture |
| WO2025149160A1 (en) | 2024-01-11 | 2025-07-17 | Carl Zeiss Smt Gmbh | Disturbance compensation for charged particle beam devices |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2881336A (en) * | 1956-05-04 | 1959-04-07 | Sperry Prod Inc | Damping means for piezo-electric crystals |
| JPS56120291A (en) * | 1980-02-27 | 1981-09-21 | Furuno Electric Co Ltd | Transceiver for ultrasonic wave |
| FR2485858B1 (fr) * | 1980-06-25 | 1986-04-11 | Commissariat Energie Atomique | Procede de fabrication de transducteurs ultrasonores de formes complexes et application a l'obtention de transducteurs annulaires |
| US4404489A (en) * | 1980-11-03 | 1983-09-13 | Hewlett-Packard Company | Acoustic transducer with flexible circuit board terminals |
| JPS60100950A (ja) * | 1983-11-09 | 1985-06-04 | 松下電器産業株式会社 | 超音波探触子 |
| JPS60140153A (ja) * | 1983-12-28 | 1985-07-25 | Toshiba Corp | 超音波探触子の製造方法 |
| JPH0660896B2 (ja) * | 1984-11-02 | 1994-08-10 | 株式会社日立製作所 | 超音波探触子 |
| DE3540610A1 (de) * | 1985-11-15 | 1987-05-21 | Fraunhofer Ges Forschung | Ultraschallpruefkopf |
| JPS63207300A (ja) * | 1987-02-24 | 1988-08-26 | Toshiba Corp | 超音波プロ−ブ |
| JP2545861B2 (ja) * | 1987-06-12 | 1996-10-23 | 富士通株式会社 | 超音波探触子の製造方法 |
| US5065068A (en) * | 1989-06-07 | 1991-11-12 | Oakley Clyde G | Ferroelectric ceramic transducer |
| JPH03141936A (ja) * | 1989-10-30 | 1991-06-17 | Fujitsu Ltd | 超音波探触子 |
| ATE120670T1 (de) * | 1990-06-21 | 1995-04-15 | Siemens Ag | Verbund-ultraschallwandler und verfahren zur herstellung eines strukturierten bauelementes aus piezoelektrischer keramik. |
| US5267221A (en) * | 1992-02-13 | 1993-11-30 | Hewlett-Packard Company | Backing for acoustic transducer array |
| US5423220A (en) * | 1993-01-29 | 1995-06-13 | Parallel Design | Ultrasonic transducer array and manufacturing method thereof |
| US5329498A (en) * | 1993-05-17 | 1994-07-12 | Hewlett-Packard Company | Signal conditioning and interconnection for an acoustic transducer |
| US5434827A (en) * | 1993-06-15 | 1995-07-18 | Hewlett-Packard Company | Matching layer for front acoustic impedance matching of clinical ultrasonic tranducers |
| US5539965A (en) * | 1994-06-22 | 1996-07-30 | Rutgers, The University Of New Jersey | Method for making piezoelectric composites |
| US5625149A (en) * | 1994-07-27 | 1997-04-29 | Hewlett-Packard Company | Ultrasonic transductor |
| US5810009A (en) * | 1994-09-27 | 1998-09-22 | Kabushiki Kaisha Toshiba | Ultrasonic probe, ultrasonic probe device having the ultrasonic probe, and method of manufacturing the ultrasonic probe |
| US5706820A (en) * | 1995-06-07 | 1998-01-13 | Acuson Corporation | Ultrasonic transducer with reduced elevation sidelobes and method for the manufacture thereof |
| US5796207A (en) * | 1997-04-28 | 1998-08-18 | Rutgers, The State University Of New Jersey | Oriented piezo electric ceramics and ceramic/polymer composites |
-
1997
- 1997-04-18 US US08/840,470 patent/US6043590A/en not_active Expired - Lifetime
-
1998
- 1998-04-16 JP JP12165898A patent/JP3865928B2/ja not_active Expired - Fee Related
- 1998-04-17 AT AT98302976T patent/ATE357979T1/de not_active IP Right Cessation
- 1998-04-17 EP EP98302976A patent/EP0872285B1/en not_active Expired - Lifetime
- 1998-04-17 DE DE69837416T patent/DE69837416T2/de not_active Expired - Lifetime
- 1998-04-18 CN CNB981092489A patent/CN1149395C/zh not_active Expired - Lifetime
- 1998-04-18 KR KR1019980013893A patent/KR19980081523A/ko not_active Ceased
-
1999
- 1999-09-08 US US09/391,549 patent/US6104126A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| ATE357979T1 (de) | 2007-04-15 |
| US6043590A (en) | 2000-03-28 |
| EP0872285A2 (en) | 1998-10-21 |
| EP0872285A3 (en) | 2001-12-19 |
| CN1209545A (zh) | 1999-03-03 |
| CN1149395C (zh) | 2004-05-12 |
| JPH10304495A (ja) | 1998-11-13 |
| US6104126A (en) | 2000-08-15 |
| KR19980081523A (ko) | 1998-11-25 |
| DE69837416T2 (de) | 2008-01-24 |
| EP0872285B1 (en) | 2007-03-28 |
| DE69837416D1 (de) | 2007-05-10 |
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