JP3877870B2 - 基板成形金型、及び基板成形金型における成形基板の板厚調整方法 - Google Patents

基板成形金型、及び基板成形金型における成形基板の板厚調整方法 Download PDF

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Publication number
JP3877870B2
JP3877870B2 JP14022698A JP14022698A JP3877870B2 JP 3877870 B2 JP3877870 B2 JP 3877870B2 JP 14022698 A JP14022698 A JP 14022698A JP 14022698 A JP14022698 A JP 14022698A JP 3877870 B2 JP3877870 B2 JP 3877870B2
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Japan
Prior art keywords
substrate
shim
base
molding die
substrate molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP14022698A
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English (en)
Japanese (ja)
Other versions
JPH1142648A (ja
JPH1142648A5 (2
Inventor
和夫 井上
吉弘 川▲さき▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP14022698A priority Critical patent/JP3877870B2/ja
Publication of JPH1142648A publication Critical patent/JPH1142648A/ja
Publication of JPH1142648A5 publication Critical patent/JPH1142648A5/ja
Application granted granted Critical
Publication of JP3877870B2 publication Critical patent/JP3877870B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C2045/2646—Means for adjusting the axial dimension of the mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)
JP14022698A 1997-05-30 1998-05-21 基板成形金型、及び基板成形金型における成形基板の板厚調整方法 Expired - Fee Related JP3877870B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14022698A JP3877870B2 (ja) 1997-05-30 1998-05-21 基板成形金型、及び基板成形金型における成形基板の板厚調整方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP14265397 1997-05-30
JP9-142653 1997-05-30
JP14022698A JP3877870B2 (ja) 1997-05-30 1998-05-21 基板成形金型、及び基板成形金型における成形基板の板厚調整方法

Publications (3)

Publication Number Publication Date
JPH1142648A JPH1142648A (ja) 1999-02-16
JPH1142648A5 JPH1142648A5 (2) 2005-09-08
JP3877870B2 true JP3877870B2 (ja) 2007-02-07

Family

ID=26472823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14022698A Expired - Fee Related JP3877870B2 (ja) 1997-05-30 1998-05-21 基板成形金型、及び基板成形金型における成形基板の板厚調整方法

Country Status (1)

Country Link
JP (1) JP3877870B2 (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HK1027253A2 (en) * 2000-07-31 2000-12-08 谢宁乐 Mould for injection moulding

Also Published As

Publication number Publication date
JPH1142648A (ja) 1999-02-16

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