JP4171246B2 - メモリカードおよびその製造方法 - Google Patents

メモリカードおよびその製造方法 Download PDF

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Publication number
JP4171246B2
JP4171246B2 JP2002169144A JP2002169144A JP4171246B2 JP 4171246 B2 JP4171246 B2 JP 4171246B2 JP 2002169144 A JP2002169144 A JP 2002169144A JP 2002169144 A JP2002169144 A JP 2002169144A JP 4171246 B2 JP4171246 B2 JP 4171246B2
Authority
JP
Japan
Prior art keywords
lead frame
memory card
connection terminal
chip
flash memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002169144A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004013738A (ja
JP2004013738A5 (2
Inventor
光一 金本
正親 増田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2002169144A priority Critical patent/JP4171246B2/ja
Priority to US10/443,956 priority patent/US6924547B2/en
Priority to KR1020030035493A priority patent/KR101000625B1/ko
Publication of JP2004013738A publication Critical patent/JP2004013738A/ja
Publication of JP2004013738A5 publication Critical patent/JP2004013738A5/ja
Application granted granted Critical
Publication of JP4171246B2 publication Critical patent/JP4171246B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/24—Configurations of stacked chips at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2002169144A 2002-06-10 2002-06-10 メモリカードおよびその製造方法 Expired - Fee Related JP4171246B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002169144A JP4171246B2 (ja) 2002-06-10 2002-06-10 メモリカードおよびその製造方法
US10/443,956 US6924547B2 (en) 2002-06-10 2003-05-23 Memory card
KR1020030035493A KR101000625B1 (ko) 2002-06-10 2003-06-03 메모리 카드 및 그 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002169144A JP4171246B2 (ja) 2002-06-10 2002-06-10 メモリカードおよびその製造方法

Publications (3)

Publication Number Publication Date
JP2004013738A JP2004013738A (ja) 2004-01-15
JP2004013738A5 JP2004013738A5 (2) 2005-10-13
JP4171246B2 true JP4171246B2 (ja) 2008-10-22

Family

ID=29706817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002169144A Expired - Fee Related JP4171246B2 (ja) 2002-06-10 2002-06-10 メモリカードおよびその製造方法

Country Status (3)

Country Link
US (1) US6924547B2 (2)
JP (1) JP4171246B2 (2)
KR (1) KR101000625B1 (2)

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US7830666B2 (en) * 2000-01-06 2010-11-09 Super Talent Electronics, Inc. Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board
US8141240B2 (en) 1999-08-04 2012-03-27 Super Talent Electronics, Inc. Manufacturing method for micro-SD flash memory card
US7264992B2 (en) * 2004-08-06 2007-09-04 Paul Hsueh Removable flash integrated memory module card and method of manufacture
US20080286990A1 (en) * 2003-12-02 2008-11-20 Super Talent Electronics, Inc. Direct Package Mold Process For Single Chip SD Flash Cards
US6900527B1 (en) * 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US8102657B2 (en) 2003-12-02 2012-01-24 Super Talent Electronics, Inc. Single shot molding method for COB USB/EUSB devices with contact pad ribs
US8998620B2 (en) * 2003-12-02 2015-04-07 Super Talent Technology, Corp. Molding method for COB-EUSB devices and metal housing package
US20080195817A1 (en) * 2004-07-08 2008-08-14 Super Talent Electronics, Inc. SD Flash Memory Card Manufacturing Using Rigid-Flex PCB
KR100858756B1 (ko) 2004-07-12 2008-09-16 가부시끼가이샤 도시바 저장 디바이스 및 호스트 장치
US20060027906A1 (en) * 2004-08-03 2006-02-09 Sheng-Chih Hsu Exclusive memory structure applicable for multi media card and secure digital card
KR100574996B1 (ko) * 2004-11-25 2006-05-02 삼성전자주식회사 반도체 패키지 및 이를 이용한 메모리 카드, 및 이의제조에 이용되는 몰드
KR100585163B1 (ko) 2004-11-27 2006-06-01 삼성전자주식회사 메모리 카드 및 그 제조방법
JP2007081232A (ja) * 2005-09-15 2007-03-29 Renesas Technology Corp 半導体装置の製造方法
ATE440346T1 (de) * 2005-11-14 2009-09-15 Tyco Electronics France Sas Smartcard-kírper, smartcard und herstellungsverfahren
JP4843311B2 (ja) * 2005-12-27 2011-12-21 富士通コンポーネント株式会社 メモリカード及びその製造方法
JP2007205908A (ja) 2006-02-02 2007-08-16 Matsushita Electric Ind Co Ltd 重量センサ
JP4766053B2 (ja) 2006-02-02 2011-09-07 パナソニック株式会社 Ｓｄメモリカードおよびｓｄメモリカードの製造方法
US8599571B2 (en) 2006-04-21 2013-12-03 Panasonic Corporation Memory card
KR100849182B1 (ko) * 2007-01-22 2008-07-30 삼성전자주식회사 반도체 카드 패키지 및 그 제조방법
US8254134B2 (en) * 2007-05-03 2012-08-28 Super Talent Electronics, Inc. Molded memory card with write protection switch assembly
JP5187305B2 (ja) * 2007-06-15 2013-04-24 パナソニック株式会社 メモリカードおよびその製造方法
US8102658B2 (en) * 2007-07-05 2012-01-24 Super Talent Electronics, Inc. Micro-SD to secure digital adaptor card and manufacturing method
JP2009032013A (ja) * 2007-07-26 2009-02-12 Toshiba Corp 半導体装置及びその製造方法
USD794644S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD795261S1 (en) * 2009-01-07 2017-08-22 Samsung Electronics Co., Ltd. Memory device
USD794641S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794643S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794642S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794034S1 (en) * 2009-01-07 2017-08-08 Samsung Electronics Co., Ltd. Memory device
USD795262S1 (en) * 2009-01-07 2017-08-22 Samsung Electronics Co., Ltd. Memory device
KR101035209B1 (ko) * 2010-01-26 2011-05-17 주식회사 영일프레시젼 방열판을 포함하는 아이씨 카드의 충진제 플래쉬 방지방법
JP5242644B2 (ja) * 2010-08-31 2013-07-24 株式会社東芝 半導体記憶装置
JP2012212417A (ja) 2011-03-24 2012-11-01 Toshiba Corp 半導体メモリカード
US20130286603A1 (en) * 2012-04-30 2013-10-31 Takashi Okada Memory card and sd card
JP5740372B2 (ja) 2012-09-12 2015-06-24 株式会社東芝 半導体メモリカード
US9195929B2 (en) * 2013-08-05 2015-11-24 A-Men Technology Corporation Chip card assembling structure and method thereof
US20200325821A1 (en) 2019-04-09 2020-10-15 Rolls-Royce North American Technologies Inc. Starter/generator

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19710514C2 (de) * 1997-03-13 2001-06-28 Itt Mfg Enterprises Inc Steckkarte für elektronische Geräte
JP3815936B2 (ja) * 2000-01-25 2006-08-30 株式会社ルネサステクノロジ Ｉｃカード
JP3768761B2 (ja) 2000-01-31 2006-04-19 株式会社日立製作所 半導体装置およびその製造方法
US6444501B1 (en) * 2001-06-12 2002-09-03 Micron Technology, Inc. Two stage transfer molding method to encapsulate MMC module
US6843421B2 (en) * 2001-08-13 2005-01-18 Matrix Semiconductor, Inc. Molded memory module and method of making the module absent a substrate support

Also Published As

Publication number Publication date
JP2004013738A (ja) 2004-01-15
KR20040014185A (ko) 2004-02-14
KR101000625B1 (ko) 2010-12-10
US20030227075A1 (en) 2003-12-11
US6924547B2 (en) 2005-08-02

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