JP4266326B2 - 電気接続構造および電気接続システム - Google Patents

電気接続構造および電気接続システム Download PDF

Info

Publication number: JP4266326B2
Authority: JP; Japan
Prior art keywords: chamber; connector; substrate; electrical connection; conductive
Prior art date: 2003-05-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

JP2003143698A

Other languages

English (en)

Japanese (ja)

Other versions

JP2004349073A (ja

Inventor

徹馬坂本

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Tyco Electronics Japan GK

Original Assignee

Tyco Electronics AMP KK

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-05-21

Filing date

2003-05-21

Publication date

2009-05-20

2003-05-21 Application filed by Tyco Electronics AMP KK filed Critical Tyco Electronics AMP KK

2003-05-21 Priority to JP2003143698A priority Critical patent/JP4266326B2/ja

2004-04-21 Priority to TW093111100A priority patent/TW200511669A/zh

2004-05-19 Priority to KR1020040035476A priority patent/KR20040100976A/ko

2004-05-21 Priority to CNB2004100475223A priority patent/CN100420096C/zh

2004-12-09 Publication of JP2004349073A publication Critical patent/JP2004349073A/ja

2009-05-20 Application granted granted Critical

2009-05-20 Publication of JP4266326B2 publication Critical patent/JP4266326B2/ja

2023-05-21 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

239000000758 substrate Substances 0.000 claims description 96
238000005192 partition Methods 0.000 claims description 53
239000004020 conductor Substances 0.000 claims description 29
239000000919 ceramic Substances 0.000 description 56
229910052802 copper Inorganic materials 0.000 description 8
239000010949 copper Substances 0.000 description 8
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 7
238000010586 diagram Methods 0.000 description 5
238000005219 brazing Methods 0.000 description 4
230000000149 penetrating effect Effects 0.000 description 4
238000003780 insertion Methods 0.000 description 3
230000037431 insertion Effects 0.000 description 3
238000000034 method Methods 0.000 description 2
229910000679 solder Inorganic materials 0.000 description 2
229910001128 Sn alloy Inorganic materials 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
239000002131 composite material Substances 0.000 description 1
150000001879 copper Chemical class 0.000 description 1
238000005336 cracking Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000009429 electrical wiring Methods 0.000 description 1
239000011521 glass Substances 0.000 description 1
JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
230000012447 hatching Effects 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
239000002184 metal Substances 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
231100000989 no adverse effect Toxicity 0.000 description 1
238000007747 plating Methods 0.000 description 1
238000003825 pressing Methods 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
238000005476 soldering Methods 0.000 description 1
238000003466 welding Methods 0.000 description 1

Images

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/707—Soldering or welding

Landscapes

Coupling Device And Connection With Printed Circuit (AREA)
Multi-Conductor Connections (AREA)

JP2003143698A 2003-05-21 2003-05-21 電気接続構造および電気接続システム Expired - Fee Related JP4266326B2 (ja)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
JP2003143698A JP4266326B2 (ja)	2003-05-21	2003-05-21	電気接続構造および電気接続システム
TW093111100A TW200511669A (en)	2003-05-21	2004-04-21	Electrical connecting structure, connector & electrical connecting system
KR1020040035476A KR20040100976A (ko)	2003-05-21	2004-05-19	전기접속 구조체, 커넥터 및 전기접속 시스템
CNB2004100475223A CN100420096C (zh)	2003-05-21	2004-05-21	电连接结构、连接器及电连接系统

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2003143698A JP4266326B2 (ja)	2003-05-21	2003-05-21	電気接続構造および電気接続システム

Publications (2)

Publication Number	Publication Date
JP2004349073A JP2004349073A (ja)	2004-12-09
JP4266326B2 true JP4266326B2 (ja)	2009-05-20

Family

ID=33531402

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2003143698A Expired - Fee Related JP4266326B2 (ja)	2003-05-21	2003-05-21	電気接続構造および電気接続システム

Country Status (4)

Country	Link
JP (1)	JP4266326B2 (zh)
KR (1)	KR20040100976A (zh)
CN (1)	CN100420096C (zh)
TW (1)	TW200511669A (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102009001663A1 (de) *	2009-03-19	2010-09-23	BSH Bosch und Siemens Hausgeräte GmbH	Staubsauger mit elektrischem Verbindungselement
CN103477501A (zh) *	2011-04-20	2013-12-25	泰科电子日本合同会社	连接器以及连接器的制造方法
JP5845006B2 (ja) *	2011-06-29	2016-01-20	タイコエレクトロニクスジャパン合同会社	電気接続構造
JP5705062B2 (ja) *	2011-08-08	2015-04-22	タイコエレクトロニクスジャパン合同会社	コネクタ
CN104471794B (zh) *	2012-07-19	2017-02-08	泰科电子日本合同会社	平板状连接器
KR102000293B1 (ko) *	2012-09-28	2019-07-15	타이코에이엠피 주식회사	압력센서
JP2014082094A (ja) *	2012-10-16	2014-05-08	Tyco Electronics Japan Kk	コネクタ
JP6208935B2 (ja) *	2012-10-31	2017-10-04	タイコエレクトロニクスジャパン合同会社	コネクタ
WO2016044042A1 (en)	2014-09-16	2016-03-24	Fci Asia Pte. Ltd	Hermetically sealed electrical connector assembly
CN105322317B (zh) *	2014-11-18	2017-08-25	中国计量科学研究院	一种真空系统、多级真空系统及它们的馈通电气连接方法
CN108649360B (zh) *	2018-06-08	2023-09-15	无锡华测电子系统有限公司	一种低频接口互连结构及其制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR2785450B1 (fr) *	1998-10-30	2003-07-04	Thomson Csf	Module de composants superposes dans un meme boitier
CN2364582Y (zh) *	1998-12-29	2000-02-16	富士康(昆山)电脑接插件有限公司	电子卡装置
JP2000299149A (ja) *	1999-04-13	2000-10-24	Tosei Electro Beam Kk	接続端子及びその製造方法
DE19932849C2 (de) *	1999-07-14	2003-07-03	Herbert Amrhein	Kontaktiereinrichtung zum Herstellen einer elektrisch leitfähigen Verbindung
TW512653B (en) *	1999-11-26	2002-12-01	Ibiden Co Ltd	Multilayer circuit board and semiconductor device

2003
- 2003-05-21 JP JP2003143698A patent/JP4266326B2/ja not_active Expired - Fee Related
2004
- 2004-04-21 TW TW093111100A patent/TW200511669A/zh unknown
- 2004-05-19 KR KR1020040035476A patent/KR20040100976A/ko not_active Withdrawn
- 2004-05-21 CN CNB2004100475223A patent/CN100420096C/zh not_active Expired - Fee Related

Also Published As

Publication number	Publication date
KR20040100976A (ko)	2004-12-02
TW200511669A (en)	2005-03-16
CN1574466A (zh)	2005-02-02
JP2004349073A (ja)	2004-12-09
CN100420096C (zh)	2008-09-17

Legal Events

Date	Code	Title	Description
2006-04-22	A621	Written request for application examination	Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060421
2008-05-22	A977	Report on retrieval	Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080522
2008-06-11	A131	Notification of reasons for refusal	Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080610
2008-08-12	A521	Written amendment	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080811
2008-10-15	A131	Notification of reasons for refusal	Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081014
2008-12-13	A521	Written amendment	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20081212
2009-02-02	TRDD	Decision of grant or rejection written
2009-02-12	A01	Written decision to grant a patent or to grant a registration (utility model)	Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090210
2009-02-19	A01	Written decision to grant a patent or to grant a registration (utility model)	Free format text: JAPANESE INTERMEDIATE CODE: A01
2009-02-26	A61	First payment of annual fees (during grant procedure)	Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090216
2009-02-27	R150	Certificate of patent or registration of utility model	Free format text: JAPANESE INTERMEDIATE CODE: R150
2009-03-02	FPAY	Renewal fee payment (event date is renewal date of database)	Free format text: PAYMENT UNTIL: 20120227 Year of fee payment: 3
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2015-02-17	R250	Receipt of annual fees	Free format text: JAPANESE INTERMEDIATE CODE: R250
2016-02-16	R250	Receipt of annual fees	Free format text: JAPANESE INTERMEDIATE CODE: R250
2017-02-27	LAPS	Cancellation because of no payment of annual fees

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