JP4326609B2 - 半導体素子を製造する方法 - Google Patents

半導体素子を製造する方法 Download PDF

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Publication number
JP4326609B2
JP4326609B2 JP23009598A JP23009598A JP4326609B2 JP 4326609 B2 JP4326609 B2 JP 4326609B2 JP 23009598 A JP23009598 A JP 23009598A JP 23009598 A JP23009598 A JP 23009598A JP 4326609 B2 JP4326609 B2 JP 4326609B2
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JP
Japan
Prior art keywords
flag
substrate
hole
lead
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP23009598A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11126865A5 (2
JPH11126865A (ja
Inventor
ブライアン・エイ・ウェブ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
NXP USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP USA Inc filed Critical NXP USA Inc
Publication of JPH11126865A publication Critical patent/JPH11126865A/ja
Publication of JPH11126865A5 publication Critical patent/JPH11126865A5/ja
Application granted granted Critical
Publication of JP4326609B2 publication Critical patent/JP4326609B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/415—Leadframe inner leads serving as die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
JP23009598A 1997-08-01 1998-07-30 半導体素子を製造する方法 Expired - Lifetime JP4326609B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US904989 1986-09-08
US08/904,989 US5963782A (en) 1997-08-01 1997-08-01 Semiconductor component and method of manufacture

Publications (3)

Publication Number Publication Date
JPH11126865A JPH11126865A (ja) 1999-05-11
JPH11126865A5 JPH11126865A5 (2) 2005-10-27
JP4326609B2 true JP4326609B2 (ja) 2009-09-09

Family

ID=25420114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23009598A Expired - Lifetime JP4326609B2 (ja) 1997-08-01 1998-07-30 半導体素子を製造する方法

Country Status (3)

Country Link
US (1) US5963782A (2)
JP (1) JP4326609B2 (2)
DE (1) DE19834160A1 (2)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5798556A (en) * 1996-03-25 1998-08-25 Motorola, Inc. Sensor and method of fabrication
TW330337B (en) * 1997-05-23 1998-04-21 Siliconware Precision Industries Co Ltd Semiconductor package with detached die pad
DE19728281C1 (de) * 1997-07-02 1998-10-29 Siemens Ag Zwei-Chip-Leistungs-IC mit verbessertem Kurzschlußverhalten
DE19839123C1 (de) * 1998-08-27 1999-11-04 Siemens Ag Mikromechanische Struktur
SG111092A1 (en) 2002-11-15 2005-05-30 St Microelectronics Pte Ltd Semiconductor device package and method of manufacture
US7571647B2 (en) * 2005-08-30 2009-08-11 Oki Semiconductor Co., Ltd. Package structure for an acceleration sensor
EP2015046A1 (en) * 2007-06-06 2009-01-14 Infineon Technologies SensoNor AS Vacuum Sensor
US20130192338A1 (en) * 2012-01-26 2013-08-01 Felix Mayer Portable electronic device
US9772317B2 (en) 2012-07-26 2017-09-26 Sensirion Ag Method for operating a portable electronic device
US9899290B2 (en) * 2016-03-23 2018-02-20 Nxp Usa, Inc. Methods for manufacturing a packaged device with an extended structure for forming an opening in the encapsulant

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6297418A (ja) * 1985-10-23 1987-05-06 Clarion Co Ltd 弾性表面波装置のパツケ−ジ方法
US4942454A (en) * 1987-08-05 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Resin sealed semiconductor device
US5570454A (en) * 1994-06-09 1996-10-29 Hughes Electronics Method for processing speech signals as block floating point numbers in a CELP-based coder using a fixed point processor
US5553014A (en) * 1994-10-31 1996-09-03 Lucent Technologies Inc. Adaptive finite impulse response filtering method and apparatus
US6323550B1 (en) * 1995-06-06 2001-11-27 Analog Devices, Inc. Package for sealing an integrated circuit die
US5907497A (en) * 1995-12-28 1999-05-25 Lucent Technologies Inc. Update block for an adaptive equalizer filter configuration

Also Published As

Publication number Publication date
DE19834160A1 (de) 1999-02-04
JPH11126865A (ja) 1999-05-11
US5963782A (en) 1999-10-05

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