JP4358915B2 - 半導体製造システム - Google Patents

半導体製造システム Download PDF

Info

Publication number: JP4358915B2
Authority: JP; Japan
Prior art keywords: temperature; heater; thermocouple; measured; power supply
Prior art date: 1997-03-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP06822597A

Other languages

English (en)

Japanese (ja)

Other versions

JPH10270454A5 (2

JPH10270454A (ja

Inventor

和夫田中

稔中野

正昭上野

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kokusai Denki Electric Inc

Original Assignee

Hitachi Kokusai Electric Inc

Kokusai Denki Electric Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1997-03-21

Filing date

1997-03-21

Publication date

2009-11-04

1997-03-21 Application filed by Hitachi Kokusai Electric Inc, Kokusai Denki Electric Inc filed Critical Hitachi Kokusai Electric Inc

1997-03-21 Priority to JP06822597A priority Critical patent/JP4358915B2/ja

1998-10-09 Publication of JPH10270454A publication Critical patent/JPH10270454A/ja

2005-02-17 Publication of JPH10270454A5 publication Critical patent/JPH10270454A5/ja

2009-11-04 Application granted granted Critical

2009-11-04 Publication of JP4358915B2 publication Critical patent/JP4358915B2/ja

2017-03-21 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

Images

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Control Of Resistance Heating (AREA)

JP06822597A 1997-03-21 1997-03-21 半導体製造システム Expired - Lifetime JP4358915B2 (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP06822597A JP4358915B2 (ja)	1997-03-21	1997-03-21	半導体製造システム

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP06822597A JP4358915B2 (ja)	1997-03-21	1997-03-21	半導体製造システム

Related Child Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2009163640A Division JP5184455B2 (ja)	2009-07-10	2009-07-10	半導体製造システム、半導体製造方法、温度制御方法及び半導体製造装置のコントローラ

Publications (3)

Publication Number	Publication Date
JPH10270454A JPH10270454A (ja)	1998-10-09
JPH10270454A5 JPH10270454A5 (2)	2005-02-17
JP4358915B2 true JP4358915B2 (ja)	2009-11-04

Family

ID=13367665

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP06822597A Expired - Lifetime JP4358915B2 (ja)	1997-03-21	1997-03-21	半導体製造システム

Country Status (1)

Country	Link
JP (1)	JP4358915B2 (2)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4878801B2 (ja) *	2005-09-26	2012-02-15	株式会社日立国際電気	基板処理装置、半導体装置の製造方法
JP5510991B2 (ja) *	2007-09-06	2014-06-04	株式会社日立国際電気	半導体製造装置及び基板処理方法
JP2012231145A (ja) *	2012-05-22	2012-11-22	Hitachi Kokusai Electric Inc	半導体製造システム、半導体製造方法、温度制御方法、温度制御装置及び半導体製造装置のコントローラ
CN113272940B (zh)	2019-01-07	2024-03-26	株式会社国际电气	基板处理装置、半导体装置的制造方法以及加热器单元
US11056372B2 (en) *	2019-04-30	2021-07-06	Applied Materials, Inc.	Low temperature biasable substrate support
JP7811871B2 (ja) *	2022-03-23	2026-02-06	株式会社Ｓｃｒｅｅｎホールディングス	熱処理装置
CN119790487A (zh) *	2022-12-26	2025-04-08	株式会社国际电气	基板处理系统、基板处理装置、半导体器件的制造方法以及程序

1997
- 1997-03-21 JP JP06822597A patent/JP4358915B2/ja not_active Expired - Lifetime

Also Published As

Publication number	Publication date
JPH10270454A (ja)	1998-10-09

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