JP4502964B2 - Method for dividing bonded substrates - Google Patents

Description

The present invention relates to a method for dividing a bonded substrate.

  Compared with displays using liquid crystal display elements (LCD), organic EL displays using organic electroluminescence (EL) elements are self-luminous and therefore do not require a backlight. Since it has many advantages such as low power consumption and high response speed, in recent years, it has been rapidly developed as a next-generation flat panel display (FPD) replacing the LCD display.

  An organic EL device is formed by laminating a transparent anode layer, an organic hole injection layer, an organic light emitting layer, and a metal electrode layer (cathode) in this order on a glass substrate. Electrons are injected from the hole and the cathode into the organic hole injection layer, and the electrons and holes recombine in the organic light emitting layer to form an excited state. Light emission occurs during the transition from the excited state to the ground state. It is what is said. The organic EL elements having such a configuration are formed through a process in which a large number of organic EL elements are formed in a matrix on a brittle substrate, and the substrate is cut and separated into individual elements, like a semiconductor chip such as a large-scale integrated circuit (LSI). Manufactured.

  By the way, as a method used for cutting and separating brittle substrates such as glass, silicon, and ceramics, dicing is performed by cutting the substrate with a diamond blade having a thickness of about 50 to 200 μm that rotates at high speed to form a cutting groove on the substrate. Two typical examples are scribing, in which the surface of the substrate is damaged by a diamond cutter wheel having a thickness of about 0.6 to 2 mm to generate vertical cracks in the thickness direction of the substrate.

  As described above, dicing uses a blade that is extremely thin compared to a scribing cutter wheel. Therefore, when cutting a substrate having a thin film or a convex portion formed on the surface thereof, such as the organic EL element, It can be said that it is a suitable method because it is difficult to damage the convex portion.

  However, in dicing, frictional heat is generated in the region where the blade is cutting, and the cutting is performed while supplying cooling water to this region, so there are metal parts such as metal electrode layers and metal terminals. This is not a desirable method for an organic EL device. In other words, in the case of dicing, it is actually difficult to completely remove the cooling water after dicing. If the cooling water is not completely removed and there is residual moisture, the metal portion of the organic EL element is corroded. There is a fear. In addition, dicing has a problem that the cutting time is longer than that of scribing and the productivity is not good.

  On the other hand, scribing has the advantage that the product yield is better than that obtained by dicing because no cooling water is required, and the productivity is high because the cutting time is shorter than that of dicing.

  However, in scribing, there is a completely different problem from dicing. In other words, unlike dicing, scribing is difficult when there is a thin film on the substrate, so when cutting and separating are performed by scribing, the cutter wheel is inserted into the convex part and thin film including the light emitting part. It is formed on the substrate surface with an interval that can be measured. Then, the substrate surface exposed between the protrusions and the thin film is scribed with a cutter wheel. As shown in FIG. 28, the conventional cutter wheel H has a cutting edge ridge line C at the center between both side surfaces of the wheel. For this reason, the scribe position S must be a location sufficiently away from the convex portion and the thin film X so that the cutter wheel H does not interfere with the convex portion and the thin film X. However, when the scribe position S is at a position away from the convex portion or the thin film X, there is a problem that the size of the substrate per element becomes larger than necessary.

  30 (a) to 30 (d) show a first method for cutting a liquid crystal mother substrate as an example of a conventional procedure for cutting a laminated glass substrate such as a liquid crystal mother substrate at a desired cutting position. It is sectional drawing demonstrated for every. In the following description, for convenience, a glass substrate on one side of a bonded glass substrate 71 formed by bonding a pair of glass substrates that are liquid crystal mother substrates facing each other is a glass substrate 7A, and a glass substrate on the other side. Is a glass substrate 7B.

  (1) First, as shown in FIG. 30A, the laminated glass substrate 71 is placed on the first scribing device with the glass substrate 7A of the laminated glass substrate 71 facing upward, and the glass substrate 7A is placed on the glass substrate 7A. On the other hand, a scribe line Sa is formed by scribing using the glass cutter wheel 72.

  (2) Next, the front and back of the laminated glass substrate 71 on which the scribe line Sa is formed on the glass substrate 7A are reversed and conveyed to the second scribe device. Then, with this second scribing device, as shown in FIG. 30 (b), the glass substrate 7B of the bonded glass substrate 71 is scribed using the glass cutter wheel 72, and the scribe line Sb is scribed. It is formed parallel to the line Sa. In the liquid crystal mother substrate, a plurality of liquid crystal panels are formed, and it is necessary to form terminals on the side edge of one glass substrate on which each liquid crystal panel is formed. Therefore, the liquid crystal mother substrate is formed on the glass substrate 7B. The scribe line Sb is often formed so that the scribe positions in the horizontal direction are shifted from the scribe line Sa formed on the glass substrate 7A.

  (3) Next, the laminated glass substrate 71 in which the scribe lines Sa and Sb are formed on the glass substrate 7A and the glass substrate 7B, respectively, without turning the glass substrate 7A and the glass substrate 7B upside down. Is transferred to the first breaking device with the upper side facing up. In the first breaking device, as shown in FIG. 30C, the laminated glass substrate 71 is placed on a mat 74, and the break bar 73 is provided to the glass substrate 7 </ b> B of the laminated glass substrate 71. It is pressed along the scribe line Sa formed on the glass substrate 7A. As a result, the lower glass substrate 7B has a vertical crack extending upward from the scribe line Sa, and the glass substrate 7A is broken along the scribe line Sa.

  (4) Next, the laminated glass substrate 71 on which the glass substrate 7A has been broken is transferred to the second breaker with the glass substrate 7A and the glass substrate 7B turned upside down, with the glass substrate 7A facing up. . In this second breaking device, as shown in FIG. 30 (d), the laminated glass substrate 71 is placed on a mat 74, and the break bar 73 is placed against the glass substrate 7 A of the laminated glass substrate 71. It is pressed along the scribe line Sb formed on the glass substrate 7B. Thereby, the lower glass substrate 7B is broken along the scribe line Sb.

  By performing each process of said (1)-(4), the bonded glass substrate 71 is divided | segmented into two in a desired position.

  As shown in the above steps (3) and (4), the lower glass substrate is broken by pressing the break bar 73 against the upper glass plate. For example, as shown in FIG. 30C, when the prec bar 73 is pressed against the upper glass substrate 7B, the glass substrate 7A and the glass substrate 7B are in a state where the pressed portion of the breaker 73 is bent downward. Thus, a force is applied in the direction of spreading the vertical crack (vertical crack) of the scribe line Sa generated in the glass substrate 7A to both sides. Thereby, the vertical crack extends upward and reaches the upper part of the glass substrate 7A, so that the glass substrate 7A is divided. On the other hand, on the scribe line Sb formed on the upper glass substrate 7B, the force to suppress cracks (vertical cracks) from both sides acts on the scribe line Sb, as opposed to the lower glass substrate. Not.

  In the breaking step performed in the steps (3) and (4), for example, as shown in FIG. 30 (c), if the depth of the vertical crack in the scribe line Sa of the glass substrate 7A on the lower surface side is shallow, In order to break the glass substrate 7A, it is necessary to apply a relatively large pressing force. However, if the pressing force by the break bar 73 is too strong, the upper glass substrate 7B may be broken at the same time. In this case, in the lower glass substrate 7A, the vertical crack extends in the substantially vertical direction and the break proceeds, so that no problem occurs. However, in the upper glass substrate 7B, the position where the force pressed by the break bar 73 is applied, and the glass Since the position of the scribe line Sb formed on the substrate 7B is different and no force is applied in such a direction as to break the upper glass substrate 7B, there is a possibility that a cross section in an oblique direction may be formed. In addition, cracks may collide with each other, and there may be a chip (horizontal crack) at that point. The laminated glass substrate in which such a cross section in the oblique direction, chipping, etc. are generated loses its commercial value as a liquid crystal panel.

  In view of this, the applicant of the present application has proposed a method for cutting a brittle substrate that can solve such a problem in “Cut method for bonded glass substrate” in Patent Document 1.

  FIGS. 31A to 31D are cross-sectional views illustrating the second dividing method for dividing the brittle material described in Patent Document 1 for each step. Hereinafter, based on FIG. 31 (a)-(d), the method described in this patent document 1 is demonstrated.

  In the following description, as in FIGS. 30A to 30D, for convenience, one side of a bonded glass substrate 71 formed by bonding a pair of glass substrates that are liquid crystal mother substrates facing each other. The glass substrate is referred to as a glass substrate 7A, and the other glass substrate is referred to as a glass substrate 7B.

  (1) First, as shown in FIG. 31 (a), the glass substrate 7A of the bonded glass substrate 71 is placed on the first scribing device with the glass substrate 7A facing upward, and the glass cutter wheel is placed on the glass substrate 7A. The scribe line Sa is formed using 72.

  (2) Next, the front and back of the laminated glass substrate 71 on which the scribe line Sa is formed on the glass substrate 7A are reversed and conveyed to the first breaking device. In this first breaking device, as shown in FIG. 31B, a laminated glass substrate 71 is placed on a mat 74, and a break bar 73 is provided with respect to the glass substrate 7B of the laminated glass substrate 71. It is pressed along the scribe line Sa formed on the glass substrate 7A. Thereby, in the lower glass substrate 7A, a vertical crack extends upward from the scribe line Sa, and the glass substrate 7A is broken along the scribe line Sa.

  (3) Next, the bonded glass substrate 71 on which the glass substrate 7A has been broken is conveyed to the second scribing device without inverting the front and back of the glass substrate 7A and the glass substrate 7B. And with this 2nd scribing apparatus, as shown in FIG.31 (c), it scribed with respect to the glass substrate 7B of the bonding glass substrate 71 using the glass cutter wheel 72, and scribed the scribe line Sb. It is formed parallel to the line Sa. In the liquid crystal mother substrate, a plurality of liquid crystal panels are formed, and it is necessary to form terminals on the side edge of one glass substrate on which each liquid crystal panel is formed. Therefore, the liquid crystal mother substrate is formed on the glass substrate 7B. The scribe line Sb is often formed so that the scribe positions in the horizontal direction are shifted from the scribe line Sa formed on the glass substrate 7A.

  (4) Next, the front and back surfaces of the bonded glass substrate 71 are reversed, and the glass substrate 7A is turned up, and the glass substrate 71 is conveyed to the second breaking device. In the second breaking device, as shown in FIG. 31 (d), the laminated glass substrate 71 is placed on a mat 74, and the glass substrate 7 B is opposed to the glass substrate 7 A of the laminated glass substrate 71. The break bar 73 is pressed along the scribe line Sb against the opposing portion of the formed scribe line Sb. Thereby, the lower glass substrate 7B is broken along the scribe line Sb. By performing each process of said (1)-(4), the bonded glass substrate 71 is parted in a desired position.

  In this second method for cutting a brittle material, as shown in steps (2) and (4), a scribe line is formed on the lower glass substrate to be broken at the time of the breaking step. Since there is no scribe line in the glass substrate, the upper glass substrate is not broken simultaneously with the lower glass substrate. For this reason, the possibility of the occurrence of the oblique section, chipping, etc., which is a problem in the first cutting method shown in FIGS. 30 (a) to 30 (d), is solved.

  In FIG. 7, the front view seen from the direction orthogonal to the rotating shaft of the glass cutter wheel 72 used for this 1st and 2nd parting method is shown. The glass cutter wheel 72 has a disk shape with a wheel diameter φ and a wheel thickness W, and an edge with an obtuse edge angle α is formed around the wheel.

  The applicant of the present application discloses a glass cutter wheel that can improve the glass cutter wheel 72 shown in FIG. 7 and can form deep vertical cracks in the “glass cutter wheel” of Patent Document 2. Yes.

  29 (a) and 29 (b) show a front view of a glass cutter wheel described in Patent Document 2 and a side view seen from the direction along the rotation axis, respectively.

  The glass cutter wheel 25 has irregularities formed on the ridge line portion of the cutting edge formed around the wheel. That is, a U-shaped or V-shaped groove 25b is formed in the ridge line portion 25a of the blade edge. The grooves 25b are formed by notching each pitch P from the ridge line portion 25a of the blade edge to a depth h. By forming such a groove 25b, a projection j having a height h is formed at intervals of the pitch P.

  In FIGS. 29 (a) and 29 (b), the groove formed in the ridge line portion of the glass cutter wheel is drawn to make it easier to understand, but in actuality, this groove is not visible to the naked eye. It is a micron-order size that cannot be seen with.

  Table 1 below shows specific numerical values such as wheel diameter φ, wheel thickness W, etc., and two types of type 1 and type 2 are shown as an example.

このような稜線部に凹凸が形成されたガラスカッターホイール２５は、スクライブ性能、即ち、垂直クラックを形成する能力を飛躍的に向上させることができ、このガラスカッターホイール２５を用いてスクライブを行えば、スクライブ時にガラス下面付近にまで到達するような深い垂直クラックを得ることができる。
特開平６−４８７５５号公報 特開平９−１８８５３４号公報

The glass cutter wheel 25 having such irregularities formed on the ridge portion can dramatically improve the scribing performance, that is, the ability to form vertical cracks. If the glass cutter wheel 25 is used for scribing, Deep vertical cracks that reach the vicinity of the lower surface of the glass during scribing can be obtained.
Japanese Patent Laid-Open No. 6-48755 JP-A-9-188534

  However, the glass cutter wheel with irregularities formed on the ridgeline described above can greatly improve the scribing performance compared with the conventional glass cutter wheel, but it has precise irregularities over the entire circumference of the ridgeline part. Since it is formed, it takes a long time to process the concavo-convex portions in the ridge line portion, and there is a problem in workability. Moreover, when the 2nd parting method shown in FIG. 31 was performed using the glass cutter wheel 25 by which the unevenness | corrugation was formed in the above ridgeline parts, the upper glass substrate 7B was scribed in the process (3). At this point, a scribe line Sb having a deep vertical crack is formed on the glass substrate 7B, and the bonded glass substrate 71 may be substantially divided. Therefore, in order to shift from the step (3) to the step (4), the laminated glass substrate 71 is separated when the laminated glass substrate 71 is sucked with a suction pad or the like and conveyed to the second breaking device. May be left in the second scribing device, and further, a part of the divided laminated glass substrate 71 may fall during the transfer of the laminated glass substrate 71, and the laminated glass substrate There is a possibility that the line device that divides 71 may not operate normally.

  Furthermore, in such a series of cutting steps, a scribing device is used, and the surface of each substrate is scribed by a diamond cutter wheel having a thickness of about 0.6 to 2 mm as described above in the thickness direction of the substrate. The vertical cracks are generated in the cracks, and the breaks are made as appropriate to extend the vertical cracks. In this scribing process, chips (cullet) are inevitably generated regardless of the amount. In the bonded substrate, when such cullet remains, the bonded substrate is scratched, and the quality of the bonded substrate is deteriorated. For this reason, it is necessary to appropriately perform cullet removal work.

  However, the work of removing the cullet generated at the time of scribing takes time and may be difficult to remove completely. Further, there is a problem that the glass substrate surface is scratched by the removal of the cullet. Although this scratch is not preferable even in a liquid crystal display glass substrate, even in the case of a projector substrate, even if the scratch is minute, the scratch is enlarged when projected, the quality as a projector substrate is lowered, and reliability Cannot be secured, and the yield decreases.

  The present invention has been made in order to solve the above-described conventional problems, and can prevent the surface from being scratched by a cullet generated in the cutting process of a bonded substrate, particularly a projector substrate. In addition to providing a good bonded substrate, there is provided a method for dividing a bonded substrate capable of obtaining a vertical crack sufficient to divide the bonded substrate and performing accurate dividing along a scribe line.

The method for dividing a bonded substrate of the invention corresponding to claim 1 of the present invention (Invention 1) is a method of dividing a bonded substrate in which a pair of glass substrates are bonded to each other. In a state where a thin film is attached to both surfaces, a step of scribing a glass substrate using a cutter wheel from above the thin film, and after the scribing step, on the thin film on the scribed glass substrate, It is characterized by having a step of attaching a protective film having a thickness larger than that of the thin film and having a strong adhesive force, and then peeling the protective film from the glass substrate scribed together with the thin film. .

  With the above configuration, the cullet generated in the scribe process does not adhere to the glass substrate.

  In this configuration, the cullet generated during the scribing process adheres to the protective film, and is removed together with the thin film when the protective film is peeled off.

Moreover, in the said structure, after sticking a thin film on both surfaces of the said bonding board | substrate, the thickness is larger than this film on the said thin film of the lower glass substrate side, and a 1st protective film with weak adhesive force in a state of paste, by scribing a thin film surface side of the upper layer of the glass substrate side, to the upper layer of the glass substrate, forming a vertical crack, then a thin have on the film on the glass substrate of the upper layer A second protective film having a thickness larger than that of the thin film and having a strong adhesive force is attached to the upper glass substrate to which the second protective film is attached on the lower layer side. After the first protective film is peeled off by inverting the bonded substrate so that the lower glass substrate to which the protective film is attached is on the upper layer side, By scribing the glass substrate positioned in the layer from the thin film surface side, a vertical crack is formed in the glass substrate positioned in the upper layer, and then on the thin film on the glass substrate positioned in the upper layer. After the second protective film having a thickness larger than that of the thin film and having a strong adhesive force is further attached, the second protective film attached to the upper layer and the lower glass substrate, together with the thin film, You may comprise so that it may peel from a lower glass substrate.

  In this configuration, as in the above configuration, even if cullet is generated during the scribing process, it does not adhere to the glass substrate and the glass substrate is not damaged. In addition, the first and second protective films attached to the lower glass substrate effectively protect the bonded substrate from direct contact with the scribe table during scribing. By finally peeling off the second protective film, both thin films are peeled off from the glass substrate, so that the cullet remaining on the glass substrate is removed together with the second protective film, and a clean glass substrate surface can be secured.

A method for dividing a bonded substrate according to a third aspect of the present invention (Invention 2) is a method for dividing a bonded substrate in which a glass substrate and a silicon substrate are bonded to each other, the glass substrate In a state where a thin film is attached to the glass substrate, a step of scribing the glass substrate from above the thin film using a cutter wheel, and after the scribing step, on the thin film on the glass substrate, from the thin film It is characterized by having a step of attaching a protective film having a large thickness and strong adhesive force, and then peeling the protective film together with the thin film from the glass substrate .

With the above configuration, the invention 2 is the same as the invention 1 , and the cullet generated in the scribe process does not adhere to the glass substrate.

  In this configuration, the cullet generated during the scribing process adheres to the protective film and is removed together with the thin film when the protective film is peeled off.

In the above configuration, after attaching a thin film on the glass substrate, in a state of being positioned with the silicon substrate in the lower layer, by scribing a thin film surface side of the upper layer of the glass substrate, the upper glass substrate of the vertical crack formed leading to the lower surface, then the thin film on the glass substrate of the upper layer, large thickness than the thin film, and, together with the paste strong protective film of adhesive strength, the lower layer The bonded substrate is inverted so that the silicon substrate is on the upper layer side, and after scribing the silicon substrate positioned on the upper layer, the bonded substrate is inverted so that the silicon substrate is on the lower layer side. A vertical crack may be formed in the silicon substrate by pressurizing the glass substrate side positioned in the silicon substrate.

In this configuration, since one substrate constituting the bonded substrate is a silicon substrate, it is not affected by the occurrence of cullet due to scribing. Since a thin film is attached only to the other glass substrate and scribed in this state, even if cullet is generated during the scribing process, it does not adhere to the glass substrate and the glass substrate is not scratched. Further, when a protective film is attached to remove the cullet and the protective film is peeled off, the cullet can be protected because it peels off from the glass substrate together with the thin film .

  Further, in the above configuration, a cutter wheel is used as the means for performing the scribing, and the cutter wheel is formed with a first cutter wheel having a groove formed on the entire edge of the blade edge line or a groove. The second cutter wheel in which the region and the region where no groove is formed is formed at a predetermined ratio may be selectively used.

  By using these cutter wheels, the substrate of the brittle material can be divided. Furthermore, when the 1st cutter wheel is used, the vertical crack which reaches the glass substrate lower surface is obtained. On the other hand, when the second cutter wheel is used, a vertical crack whose depth periodically changes is obtained.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a front view of a cutter wheel applied to the present embodiment, and FIG. 15 is a front view showing a scribing state by the cutter wheel shown in FIG.

  The cutter wheel 1 has a cutting edge ridge line 2 that is offset closer to one of the side surfaces (left side surface 3 in the illustrated example) than the center 5 between both side surfaces 3 and 4 of the wheel, and an insertion hole in the center of the wheel. 6 is formed. FIG. 15 shows the greater the degree of deviation of the cutting edge ridge line 2, that is, the longer the distance from the center 5 to the cutting edge ridge line 2, in other words, the shorter the distance between the left side surface 3 and the cutting edge ridge line 2 in the illustrated example. Thus, it is preferable because scribing can be performed closer to the convex portion of the element or the thin film X during scribing. As the size of the cutter wheel 1 thus configured, for example, the thickness w of the wheel is 0.65 mm, the diameter φ at the blade edge 2 is 2 to 3 mm, and the distance k from the left side surface 3 of the wheel to the blade edge 2 is 30. Although the inner diameter d of the insertion hole 6 is 0.8 mm, it is not limited to this size. In FIG. 15, symbol G indicates a brittle substrate.

  In order to perform scribing of the brittle material substrate G with the cutter wheel 1 as described above, as shown in FIG. 15, the side of the cutter wheel 1 on which the cutting edge ridgeline 2 approaches is the convex portion of the element or the thin film X Is applied to the brittle material substrate G. Here, since the elements X are arranged in a matrix on the brittle material substrate G, a scribe line E is formed by scribing the convex portions and the thin film X along the elements in one row. Then, the cutter wheel 1 is inverted 180 degrees, and the scribe line F is formed by scribing the nearest part of the convex portions and the thin film X along the elements in the row adjacent to the previous row.

  At the time of scribing, in addition to reversing the cutter wheel 1 by 180 degrees every time the formation of one scribe line is completed, the two cutter wheels 1 and 1 have a relationship as shown in FIG. That is, a chip holder (not shown) may be used in which two cutter wheels 1 and 1 are arranged in parallel and the edge edges 2 and 2 of the cutter blades are positioned farthest from each other. When two cutter wheels 1 and 1 are used in this way, the scribe head is run only once between the elements, and the adjacent parts E and the thin films X and X are adjacent to the portions E and X, respectively. F can be simultaneously scribed, and it is not necessary to reverse the cutter wheel 1 180 degrees each time one scribe line is formed as described above, so that workability is improved. The two cutter wheels 1 and 1 can be selectively scribed simultaneously or individually by an operation program.

  Next, Fig.2 (a) is a front view of the cutter wheel which formed the processus | protrusion in the blade edge ridgeline. Moreover, FIG.2 (b) is a side view with the elements on larger scale of the wheel. Here, as shown in the enlarged view A in the cutting edge ridge line 21 of the cutter wheel 11, the U-shaped grooves 71 are cut out to obtain the protrusions 81 having a height h at intervals of the pitch P.

  The wheel 11 exemplified here has a wheel diameter (φ) of 2.5 mm, a wheel thickness (w) of 0.65 mm, a blade edge angle (α) of 125 °, a number of protrusions of 125, and a protrusion height (h). Is a glass section when a 1.1 mm thick glass plate is scribed using this glass cutter wheel 11 with a cutting edge load of 2.6 kgf and a scribing speed of 300 mm / sec. 16 shows.

  In FIG. 16, a recess L on the upper surface of the glass plate G is a glass groove formed during scribing, and this is called a scribe line (this line extends in a direction perpendicular to the paper surface). Simultaneously with the engraving of the scribe line L, a crack (vertical crack) K is generated extending downward from the scribe line L. In this case, a long crack (actually measured through the glass plate G in the thickness direction) is generated. 962 μm).

  As described above, the cutter wheel 11 provided with the protrusion 81 does not generate a horizontal crack even when the blade load is increased, and a long vertical crack K is obtained at a depth proportional to the magnitude of the load. If this vertical crack K is long, precise breaks along the scribe line can be performed in the break process of the next process, and the yield is improved. In addition, since the break work is easy, the content of the break process can be relaxed or simplified, and in some cases, the break process can be omitted.

  FIG. 3 shows an example of the protrusion 82 having a shape different from the above, and the protrusion 82 is formed by cutting out the V-shaped groove 72 in the cutting edge ridge line 22.

  FIG. 4 further shows an example of the protrusion 83 having a shape different from the above, and the protrusion 83 is formed by cutting out a saw-shaped groove 73 in the blade edge line 23.

  FIG. 5 shows an example of the protrusion 84 having a shape different from the above, and the protrusion 84 is formed by cutting out a rectangular groove 74 in the edge edge line 24.

  The cutter wheel 1 described above has an insertion hole 6, and a shaft (not shown) is inserted into the insertion hole 6 and attached to a tip holder of a scribe head (not shown). A shaft 9 may be provided integrally with the wheel on both side surfaces 3 and 4 of the wheel.

  In this case, axis management becomes easy. That is, when the cutter wheel 1 is used, the shaft is inserted into the insertion hole 6 provided in the center of the cutter wheel 1, but the wheel diameter is as small as several millimeters, and therefore the shaft diameter is 1 millimeter or less. There is also. As described above, the management of the minute shaft is complicated, but if the shaft 9 is integrated with the wheel, the shaft management becomes easy.

FIG. 8 is a side view showing the cutter wheel 16 applied to the present embodiment.
As shown in FIG. 8, the cutter wheel 16 has a cutting edge ridge line portion having a region A in which grooves are formed and a region B in which grooves are not formed. The ratio of the ridge line portion of the region A in which such a groove is formed to the entire circumference (A region plus B region) (hereinafter referred to as the ratio of the region A to the entire circumference) forms the groove in the ridge line of the cutter wheel 16. In consideration of workability, it is preferably 3/4 or less. With such a ratio, the processing for forming the grooves does not require a long time and can be made excellent in workability.

  Further, when the ratio of the area A to the entire circumference is 3/4 or less and is in a range larger than 1/4, a vertical crack whose depth periodically changes as shown in FIG. 23 described later is obtained. However, when the ratio of the area A to the entire circumference is in such a range, it is necessary to set a limited condition in order to obtain the above-described periodic cracks.

  On the other hand, when the ratio of the area A to the entire circumference is set to a range of ¼ or less, a vertical crack whose depth is stably and periodically changed under a wide condition can be obtained. When the ratio of the area A to the entire circumference is set within this range, when a brittle substrate having a scribe line formed is conveyed, there arises a problem that a portion of the brittle material substrate is divided and dropped during the conveyance. Suitable to prevent that.

  The groove 6b formed in the A region of the ridge line portion is intentionally periodically machined in the micron order, and is inevitably formed in the submicron order in the grinding process for forming the edge edge line. Differentiated from polishing streaks.

  FIG. 9 shows an example of a glass cutter wheel according to another embodiment, and FIG. 9A divides the entire periphery of the cutting edge into six regions, and regions A and regions B are alternately formed. It is set as follows. FIG. 9B is a diagram in which the entire periphery of the cutting edge is divided into eight regions, and regions A and regions B are alternately formed.

In FIG. 9B, a region A in which a groove is formed is formed over a plurality of regions A1 to A4, and a region B in which no groove is formed is formed over a plurality of regions B1 to B4. The length of each region A1 to A4 and B1 to B4 is, for example,
A1 = A2 = A3 = A4 A1 + A2 + A3 + A4 = A
B1 = B2 = B3 = B4 B1 + B2 + B3 + B4 = B
A / B = 1
Is set to be In this case, all the areas A1 to A4 are all equal, and B1 to B4 are all equal. Since A / B = 1, the ratio of the area A to the entire circumference is 2/4.

In another example,
A1 = A2 ≠ A3 ≠ A4 A1 + A2 + A3 + A4 = A
B1 = B2 ≠ B3 ≠ B4 B1 + B2 + B3 + B4 = B
A / B = 1
Is set to be In this case, in each of the regions A1 to A4 and B1 to B4, A3 and A4 are different from A1 and A2, and B3 and B4 are different from B1 and B2. Moreover, since A / B = 1 as a whole, the ratio of the area A to the entire circumference is 2/4.

In yet another example,
A1 = A2 ≠ A3 ≠ A4 A1 + A2 + A3 + A4 = A
B1 = B2 ≠ B3 ≠ B4 B1 + B2 + B3 + B4 = B
A / B = 3/1
Is set to be In this case, in each of the regions A1 to A4 and B1 to B4, A3 and A4 are different from A1 and A2, and B3 and B4 are different from B1 and B2. Further, since A / B = 3/1 as a whole, the ratio of the area A to the entire circumference is 3/4.

  The cutter wheel 16 may be formed integrally with a shaft inserted through the wheel 16. As a method of integrally forming, a method of grinding a wheel and a shaft integrally from a material, a method of bonding and / or brazing a blade edge and a shaft, and the like are used.

  FIG. 23 is a schematic diagram schematically showing a vertical crack generated in the glass substrate when a scribe line is formed on the glass substrate using the cutter wheel 16 described above.

Scribe scribe line caused by scribing using a cutter wheel 16, which in the ridge portion of cutter wheel, a groove scribing formed by the A region formed line S _A, which is formed by the region B in which no grooves are formed in the line S _B, the depth of the vertical crack is provided shade was confirmed differently. That is, the scribe line S _A, is a deep vertical crack D _A is formed by irregularities formed on the ridge portion, the scribe line S _B, because they are not irregularities formed on the ridge portion, is formed a shallow vertical crack D _B It was confirmed that

  Thus, in the scribe using the cutter wheel 16 of the present embodiment, the depth of vertical cracks changes periodically, so in this embodiment, the scribe performance is the same as that of the conventional cutter of FIG. It can be seen that the scribing performance in the wheel 72 is intermediate between the scribing performance in the cutter wheel 11 in FIG. Furthermore, desired scribe characteristics are obtained by appropriately changing the ratio of the region A in which grooves are formed and the region B in which grooves are not formed with respect to the entire circumference of the cutter wheel. A desired vertical crack line (scribe line) for dividing is obtained.

Hereinafter, specific examples I to V of the cutter wheel applied to the present embodiment will be described.

( Specific example I )
In FIG. 10, the form of the cutter wheel of the specific example I is shown, and Table 2 below shows dimensions such as the wheel diameter of the cutter wheel of the specific example I.

本具体例Ｉのカッターホイール１６は、稜線部の全周長さの１／１０（８分割／８０分
割）の部分に一箇所、同じ深さの溝（７μｍ）が連続して形成されるように設定している。

In the cutter wheel 16 of the specific example I , a groove (7 μm) having the same depth is continuously formed at a portion of 1/10 (8 divisions / 80 divisions) of the entire circumference of the ridge line portion. Is set.

Using this cutter wheel 16, scribing was performed on a non-alkali glass having a thickness of 0.7 mm with a blade edge load of 0.16 to 0.40 MPa and a scribe speed of 400 mm / sec. In the scribe using the cutter wheel 16 of the specific example I , as shown in FIG. 23, a scribe line in which the depth of the vertical crack periodically changes is formed, and when a load of 0.18 MPa is used, FIG. The deep vertical crack D _A was about 400 μm, and the shallow vertical crack D _B was about 100 μm.

( Specific example II )
FIG. 11 shows the configuration of the cutter wheel 16 of the specific example II , and Table 3 below shows this specific example II.
The wheel diameter of the cutter wheel is shown.

本具体例IIのカッターホイール１６は、稜線部の全周長さの１／１０（８分割／８０分
割）の長さに、二箇所にわたって、同じ深さの溝（７μｍ）が連続して形成された領域Ａ１及びＡ２を設けている。各溝が形成された領域、Ａ１及びＡ２は、カッターホイール１６の中心軸を挟んで反対側になるように設定されている。

In the cutter wheel 16 of this specific example II , a groove (7 μm) having the same depth is continuously formed over two locations at a length of 1/10 (8 divisions / 80 divisions) of the entire circumference of the ridge line portion. Regions A1 and A2 are provided. The regions where the grooves are formed, A1 and A2, are set to be opposite to each other with the central axis of the cutter wheel 16 in between.

Using this cutter wheel 16, scribing was performed on a non-alkali glass having a thickness of 0.7 mm with a blade edge load of 0.16 to 0.40 MPa and a scribe speed of 400 mm / sec. In the scribe using the cutter wheel 16 of this specific example II , as shown in FIG. 23, a scribe line in which the depth of the vertical crack periodically changes is formed, and when a load of 0.20 MPa is used, FIG. The deep vertical crack D _A was about 400 μm, and the shallow vertical crack D _B was about 100 μm.

( Specific example III )
FIG. 12 shows a configuration of the cutter wheel 16 of the specific example III , and Table 4 below shows dimensions such as a wheel diameter of the cutter wheel 16 of the specific example III .

本具体例III のカッターホイール１６は、稜線部の全周長さの１／１０( ８分割／８０分割）の長さに、三箇所にわたって、同じ深さの溝（７μｍ）が連続して形成された領域Ａ１、Ａ２及びＡ３を設けている。領域Ａ１、Ａ２及びＡ３は、それぞれ均等な間隔となるように設定されている。

In the cutter wheel 16 of this specific example III , a groove (7 μm) having the same depth is continuously formed at three places in the length of 1/10 (8 divisions / 80 divisions) of the entire circumference of the ridge line portion. Regions A1, A2 and A3 are provided. The areas A1, A2, and A3 are set so as to be equally spaced.

Using this cutter wheel 16, scribing was performed on a non-alkali glass having a thickness of 0.7 mm with a blade edge load of 0.16 to 0.40 MPa and a scribe speed of 400 mm / sec. In the scribe using the cutter wheel 16 of this specific example III , as shown in FIG. 23, a scribe line in which the depth of the vertical crack periodically changes is formed, and when a load of 0.20 MPa is used, FIG. The deep vertical crack D _A was about 400 μm, and the shallow vertical crack D _B was about 100 μm.

( Specific example IV )
FIG. 13 shows the configuration of the cutter wheel 16 of Example IV , and Table 5 below shows dimensions such as the wheel diameter of the cutter wheel 16 of Example IV .

本具体例IVのカッターホイール１６は、稜線部の全周長さの１／１０（８分割／８０分割）の長さに、一箇所にわたって、連続して溝が形成された領域Ａ１を設けている。この領域Ａ１には、７つの溝が形成されており、各溝の深さはそれぞれ異なっており、順に、３，５，７，７，７，５，３μｍになるように設定されている。

The cutter wheel 16 of this specific example IV is provided with a region A1 in which grooves are continuously formed over one place at a length of 1/10 (8 divisions / 80 divisions) of the entire circumference of the ridge line portion. Yes. In this area A1, seven grooves are formed, and the depths of the grooves are different from each other, and are set to be 3, 5, 7, 7, 7, 5, 3 μm in order.

Using this cutter wheel 16, scribing was performed on a non-alkali glass having a thickness of 0.7 mm with a blade edge load of 0.16 to 0.40 MPa and a scribing speed of 400 mm / sec. In the scribe using the glass cutter wheel 16 of this specific example IV , as shown in FIG. 23, a scribe line in which the depth of the vertical crack is periodically changed is formed, and when a load of 0.22 MPa is used, The 23 deep vertical cracks D _A were about 400 μm, and the shallow vertical cracks D _B were about 100 μm.

( Specific example V )
Figure 14 shows the form of the cutter wheel 16 of the embodiment V, Table 6 below, the specific example V
The dimensions of the cutter wheel 16 such as the wheel diameter are shown.

本具体例Ｖのカッターホイール１６は、稜線部の全周を１０６分割して、全周にわたっ
て、３，５，７，７，７，５，３μｍの深さの溝が、この順に形成されるように設定されている。

In the cutter wheel 16 of this specific example V , the entire circumference of the ridge line portion is divided into 106, and grooves having depths of 3, 5, 7, 7, 7, 5, 3 μm are formed in this order over the entire circumference. Is set to

Using this cutter wheel 16, scribing was performed on a non-alkali glass having a thickness of 0.7 mm with a blade edge load of 0.16 to 0.40 MPa and a scribe speed of 400 mm / sec. In the scribe using the cutter wheel of the specific example V , as shown in FIG. 23, a scribe line in which the depth of the vertical crack is periodically changed is formed, and when a load of 0.29 MPa is used, The deep vertical crack D _A was about 400 μm, and the shallow vertical crack D _B was about 100 μm.

Further, according to the results of the above specific examples I to V , the pitch of each groove formed over a plurality is preferably 20 to 200 μm according to the wheel diameter of 1 to 20 mm. It has been found that the depth is preferably 2 to 200 μm, depending on the wheel diameter of 1 to 20 mm.

In the drawing used to describe the cutter wheel, the groove formed on the ridge line of the cutter wheel is drawn large in order to make it easy to understand, but in actuality, this groove can be seen with the naked eye. The micron order size is not possible.
-Scribe device-
FIG. 17 is a schematic front view showing an embodiment of a scribing device equipped with the cutter wheel described above.

  FIG. 18 is a side view of the scribing apparatus of FIG.

  This scribing apparatus includes a horizontally rotatable table 51 for fixing a placed brittle material substrate G by a vacuum suction means, and a pair of parallel supports for movably supporting the table 51 in the Y direction (direction perpendicular to the paper surface). Guide rails 52, 52, a ball screw 53 that moves the table 51 along the guide rails 52, 52, and a guide bar 54 that is installed above the table 51 along the X direction (left-right direction in this figure). A scribe head 55 provided on the guide bar 54 so as to be slidable in the X direction, a motor 56 for sliding the scribe head 55, and a lower part of the scribe head 55 can be moved up and down and swingable. A tip holder 57, the cutter wheel 1 that is rotatably attached to the lower end of the tip holder 57, and a guide bar 54; It is obtained by a pair of CCD cameras 58 recognizes the alignment mark displayed on the brittle material substrate G on the installed table 51 upward. The scribe head 55 includes a cutter wheel reversing means for reversing the tip holder 57 by 180 degrees so that the cutter wheel 1 is reversed by 180 degrees every time the formation of one scribe line is completed. Yes.

  Further, the scribing device does not include the cutter wheel reversing means as described above, and the two cutter wheels 1 and 1 are arranged in parallel on the two chip holders 57 and 57, and the cutting edge ridge lines 2 and 2 are provided. You may attach so that it may become the most distant position. When two cutter wheels 1 and 1 are used in this way, the scribe head is run only once between the elements, and the adjacent parts E and the thin films X and X are adjacent to the portions E and X, respectively. It becomes possible to simultaneously scribe F (see FIG. 15), and it is not necessary to reverse the cutter wheel 1 180 degrees each time one scribe line is formed as described above, thereby improving workability.

Further, the two cutter wheels 1 and 1 can be selectively scribed simultaneously or individually by an operation program, and the two tip holders 57 and 57 are individually attached to the scribe head 55. that has a built-in lifting means that can be raised and lowered to.
Next, a method for cutting a laminated glass substrate using a cutting apparatus equipped with a cutter wheel applied to an embodiment of the present invention will be described.

Figure 24 (a) ~ (c), respectively, a method of dividing the glass substrate 10 laminated with a cutting device having a cutter wheel according to the present exemplary embodiment, a sectional view for explaining each step is there. In the following description, for convenience, a glass substrate on one side of a laminated glass substrate formed by bonding a pair of glass substrates that are liquid crystal mother substrates facing each other is a glass substrate 10A, and a glass substrate on the other side. Let it be a glass substrate 10B.

  (1) First, as shown in FIG. 24 (a), the laminated glass substrate 10 is placed on the first scribe device with the glass substrate 10A of the laminated glass substrate 10 facing upward, and the glass substrate 10A is placed on the glass substrate 10A. On the other hand, the cutter wheel 11 in which the groove shown in FIG. 2 is formed on the ridge line of the cutter wheel in FIG. 1 is scribed to form a scribe line Sa ′. As shown in FIG. 24B, the scribe line Sa ′ formed using the glass cutter wheel 11 is formed with a deep vertical crack Va that reaches the vicinity of the lower surface of the glass substrate 10A.

(2) Next, the front and back of the laminated glass substrate 10 on which the scribe line Sa ′ is formed on the glass substrate 10A is reversed and conveyed to the second scribe device. And in this 2nd scribe apparatus, as shown in FIG.24 (b), the groove | channel shown in FIG. 8 is formed in the ridgeline of the cutter wheel 1 of FIG. 1 with respect to the glass substrate 10B of the bonding glass substrate 10. FIG. The scribe line Sb ′ is formed in parallel with the scribe line Sa ′ by scribing using the cutter wheel 16. This second scribe device uses the cutter wheel described in any of the specific examples I to V , and the scribe line Sb ′ formed by using this cutter wheel 16 has a shallow portion and Vertical cracks Vb in which deeply formed portions alternately and periodically change are formed. In the liquid crystal mother substrate, a plurality of liquid crystal panels are formed, and it is necessary to form terminals on the side edge of one glass substrate on which each liquid crystal panel is formed. Therefore, the liquid crystal mother substrate is formed on the glass substrate 10B. The scribe line Sb ′ is often formed so that the scribe positions in the horizontal direction are shifted from the scribe line Sa ′ formed on the glass substrate 10A.

  (3) Next, the laminated glass substrate 10 in which the scribe lines Sa ′ and Sb ′ are formed on the glass substrate 10A and the glass substrate 10B, respectively, is turned upside down on the glass substrate 10A and the glass substrate 10B. 10A is faced up and transported to the breaker. In this breaking apparatus, as shown in FIG. 24C, the laminated glass substrate 10 is placed on a mat 44, and the break bar 39 is placed on the glass substrate 10B of the laminated glass substrate 10 with respect to the glass substrate 10B. Press along the scribe line Sb ′ formed in As a result, the lower glass substrate 10B has a vertical crack extending upward from the scribe line Sb ', and the glass substrate 10B is broken along the scribe line Sb'.

  The laminated glass substrate 10 is divided by sequentially performing the steps (1) to (3).

  As described above, the scribing by the cutter wheel 16 forms the vertical crack Vb in which the shallowly formed portion and the deeply formed portion alternately and periodically change, and the vertical crack Vb is completely in the thickness direction of the glass substrate. It does not go through. For this reason, in said process (2), even if glass substrate 10A is in the state which was completely divided in the middle of conveying pasted glass substrate 10 from the 2nd scribing device to a breaking device, it is a glass substrate. Since 10A is in a state of being bonded to the glass substrate 10B with a sealant, there is no possibility that the bonded glass substrate 10 is separated.

Each of FIGS. 25A to 25D describes a second method for dividing the laminated glass substrate 10 for each step by using a cutting apparatus including the cutter wheel 1 applied to the present embodiment. It is sectional drawing. In the following description, for convenience, a glass substrate on one side of a laminated glass substrate formed by bonding a pair of glass substrates that are liquid crystal mother substrates facing each other is a glass substrate 10A, and a glass substrate on the other side. Let it be a glass substrate 10B.

  (1) First, as shown in FIG. 25A, the laminated glass substrate 10 is placed on the first scribing device with the glass substrate 10A of the laminated glass substrate 10 facing upward, and the glass substrate 10A is placed on the glass substrate 10A. On the other hand, the scribe line Sc is formed by scribing using the cutter wheel 1 (or 15, 16).

  (2) Next, the front and back of the bonded glass substrate 10 on which the scribe line Sc is formed on the glass substrate 10A are reversed and conveyed to the first breaking device. In this first breaking device, as shown in FIG. 25 (b), the laminated glass substrate 10 is placed on the mat 44, and the break bar 39 is placed on the glass substrate 10 B of the laminated glass substrate 10. Press along the scribe line Sc formed on the glass substrate 10A. Thereby, the vertical cracks of the lower glass substrate 10A extend upward from the scribe line Sc, and the glass substrate 10A is broken along the scribe line Sc.

  (3) Next, the bonded glass substrate 10 from which the glass substrate 10A has been divided is conveyed to the second scribing device without inverting the front and back of the glass substrate 10A and the glass substrate 10B. Then, with this second scribing device, as shown in FIG. 25C, scribing is performed on the glass substrate 10B of the bonded glass substrate using the cutter wheel 16, and the scribe line Sd is scribed to the scribe line Sc. Are formed parallel to each other. In the liquid crystal mother substrate, a plurality of liquid crystal panels are formed, and it is necessary to form terminals on the side edge of one glass substrate on which each liquid crystal panel is formed. Therefore, the liquid crystal mother substrate is formed on the glass substrate 10B. The scribe line Sd is often formed such that the scribe positions are shifted from each other in the horizontal direction from the scribe line Sc formed on the glass substrate 10A.

  (4) Next, the front and back sides of the bonded glass substrate 10 are reversed, and the glass substrate 10A is placed on the upper side and conveyed to the second breaker. In this second break device, as shown in FIG. 25 (d), the bonded glass substrate is placed on a mat 44, and the break bar 39 is placed on the glass substrate 10 A of the bonded glass substrate 10. Press along the scribe line Sd formed on 10B. Thereby, a vertical crack extends upward from the scribe line Sd in the lower glass substrate 10B, and the glass substrate 10B is broken along the scribe line Sd. A vertical crack caused by the formation of the scribe line Sd on the glass substrate 10B in the step (3) is indicated by Vd in FIG.

As described above, the scribing by the glass cutter wheel 16 forms the vertical crack Vd in which the shallowly formed portion and the deeply formed portion alternately and periodically change, and the vertical crack Vd is completely in the thickness direction of the glass substrate. It does not enter the state. For this reason, in said process (4), even if 10 A of glass substrates are in the state parted completely in the middle of conveying the laminated glass substrate 10 from a 2nd scribe apparatus to a 2nd break apparatus. The glass substrate 10B is not divided and the bonded glass substrate 10 is not divided . In the above SL has described scribing method of a bonded glass substrate, as a special case, the other of the brittle material substrate can be scribed, in this case, is a shallow formed on the other of the brittle material substrate portion Vertical cracks can be formed so that the deeply formed portions periodically change. Then, by forming such vertical cracks having periodically different depths, the brittle material substrate can be sent to the next step without being completely divided during the conveyance.
-Method for cutting a bonded substrate of the present invention-
Example 1
FIGS. 26A to 26I are process diagrams for explaining the first embodiment of the present invention. FIG. 27 is a schematic diagram showing the arrangement of apparatuses used corresponding to the process. FIG. 27A shows an example in which the devices corresponding to the process order are arranged in a line. FIG. 27B shows an example in which the corresponding device is arranged around the transfer robot.
Example 1 is a method for dividing a flat display panel mother glass substrate 80 formed by bonding glass substrates, which are one type of brittle material substrate, facing each other.
One side of the flat display panel mother glass substrate 80 is a glass substrate 80A, the other side is a glass substrate 80B, and the glass substrate 80A and the glass substrate 80B are made of, for example, non-alkali glass. Moreover, the cutter wheel 16 of FIG. 8 from which the vertical crack from which a depth changes periodically is obtained with respect to a glass substrate was used for the cutter wheel.

  (1) First, the first film processing apparatus 201 is equipped with a mechanism similar to the pasting mechanism used in the polarizing plate pasting apparatus in the manufacturing process of the liquid crystal mother glass substrate, as shown in FIG. As shown, thin films 85 are attached to both surfaces of the flat display panel mother glass substrate 80. The thin film 85 is preferably attached prior to the division of the substrate, and has a thickness of about 10 μm. Further, a first protective film 86 having a thickness larger than that of the film 85 and having a weak adhesive force is pasted on the thin film 85 on the lower glass substrate 80B side. In addition, this 1st protective film 86 is 40-80 micrometers in thickness.

  (2) Next, the flat display panel mother glass substrate 80 is transferred to the first scribing device 202 by the transfer robot R1, and as shown in FIG. 26B, the thin film 85 side on the upper glass substrate side is transferred. Are scribed with a cutter wheel 16 to form shallow vertical cracks Ve whose depth changes periodically in the upper glass substrate 80A. By forming this vertical crack Ve, it is possible to prevent a part of the glass substrate from dropping off from the mother glass substrate when the flat display panel mother glass substrate is transported to the subsequent apparatus. Simplification of the dividing operation in the process can be achieved.

  (3) Thereafter, the flat display panel mother glass substrate 80 to which the first protective film 86 is attached is transported to the second film processing apparatus 203 by the transport robot R2. This second film processing apparatus 203 is equipped with a mechanism similar to the pasting mechanism used in the polarizing plate pasting apparatus in the manufacturing process of the liquid crystal mother glass substrate, as shown in FIG. In addition, a second protective film 87 having a larger thickness than that of the thin film 85 and having a strong adhesive force is attached to the upper glass substrate 80A. Like the first protective film 86, the second protective film 87 has a thickness of 40 to 80 μm.

  (4) Further, the flat display panel mother glass substrate 80 is inverted so that the glass substrate 80A is on the lower layer side, and is transferred to the first breaker 204 by the transfer robot R3, as shown in FIG. 26 (d). Further, by pressing the glass substrate 80B side with the break bar 39, the vertical crack Ve formed in the glass substrate 80A and whose depth is periodically changed is extended to the vertical crack VE.

   (5) The flat display panel mother glass substrate 80 is transported to the third film processing device 205 by the transport robot R4, and the first protective film 86 of the first protective film 86 is sucked by the robot having at least one suction pad. One corner is sucked and held, and the suction pad is moved in the diagonal direction of the flat display panel mother glass substrate 80 and raised to peel off the first protective film 86.

  (6) Next, the flat display panel mother glass substrate 80 is transferred to the second scribe device 206 by the transfer robot R5, and the first protective film 86 is peeled off as shown in FIG. By scribing the glass substrate 80B of the display panel mother glass substrate 80 from the thin film 85 side with the cutter wheel 16, a shallow vertical crack Vf whose depth is periodically changed is formed in the glass substrate 80B positioned in the upper layer. . By forming the vertical crack Vf, it is possible to prevent a part of the glass substrate from dropping from the mother glass substrate when the flat display panel mother glass substrate is transported to the subsequent apparatus.

  (7) Thereafter, the flat display panel mother glass substrate 80 is transported to the fourth film processing apparatus 207 by the transport robot R6. This fourth film processing apparatus 207 is provided with a mechanism similar to the pasting mechanism used in the polarizing plate pasting apparatus in the manufacturing process of the liquid crystal mother glass substrate, as shown in FIG. In addition, a second protective film 87 is further stuck on the thin film 85 on the glass substrate 80B positioned in the upper layer.

  (8) Further, the flat display panel mother glass substrate 80 is inverted so that the glass substrate 80B is on the lower layer side, and is transferred to the second breaking device 208 by the transfer robot R7, as shown in FIG. In this way, by pressing the glass substrate 80A side positioned in the upper layer with the break bar 39, the shallow periodically changing vertical crack Vf formed in the glass substrate 80B is extended to the vertical crack VF.

  (9) Next, the flat display panel mother glass substrate 80 is transferred to the fifth film processing apparatus 209 by the transfer robot R8, and as shown in FIG. The protective film 87 is sucked and held at one corner of the second protective film 87 with a suction pad by a robot having at least one suction pad, and this suction pad is moved in the diagonal direction of the flat display panel mother glass substrate. The glass substrate 80A is peeled off from the glass substrate 80A which is raised together with the thin film 85 and positioned in the upper layer.

  (10) Next, the flat display panel mother glass substrate 80 is transferred to the separation device 210 by the transfer robot R9. The separation device 210 includes a spherical table, a suction means for sucking and fixing the substrate placed on the table to the table, a push-up pin for pushing the substrate above the table, and a robot r for picking up the product. As shown in i), the flat display panel mother glass substrate 80 is placed on a spherical table (in FIG. 26, a flat table is shown for easy understanding of the state where the substrates are separated), and suction is performed. After fixing, the products 110 are separated along the vertical cracks VE and VF. Although not shown, the adhesive strength of the second protective film 87 and the thin film 85 applied to the glass substrate 80B by UV irradiation is weakened, and the pin is attached to the product 110 from the lower side of the spherical table. And the product 110 is held and taken out by the robot r.

In the process of Example 1 described above, the thin film 85 is attached to both surfaces of the flat display panel mother glass substrate 80 in the process (1), and the scribing in the process (2) is performed on the thin film 85. At this time, even if cullet is generated, it is only scattered on the thin film 85 and does not adhere to the glass substrate 80A, so that it is possible to avoid scratching the glass substrate 80A. Further, a first protective film 86 is attached to the lower glass substrate, and at the time of scribing, the glass substrate 80B is formed by the first protective film 86 located on the lower surface of the flat display panel mother glass substrate 80. Since there is no direct contact with the table holding the mother substrate for the flat display panel, the substrate surface is protected from scratches. In the step (3), a second protective film is pasted on the glass substrate 80A, and in the step (4), the mother substrate for a flat display panel is inverted so that the glass substrate 80A is on the lower layer side. The glass substrate 80A is cut by the break bar 39 and placed on the table of the break device. Even if the protective film 86 is peeled off in the step (5), since the adhesive force of the first protective film 86 is smaller than that of the thin film 85 immediately below, the thin film 85 is not peeled off from the glass substrate 80B. In the step (7), the second protective film 87 is attached to the glass substrate 80B, and in this state, the flat display panel mother glass substrate 80 is turned upside down so that the second protective film 87 becomes the flat display panel mother. Located on the lower surface of the glass substrate 80, the second protective film 87 protects the substrate surface from being scratched because the glass substrate 80A does not directly contact the table holding the flat display panel mother substrate. . In the step (9), after the second protective film 87 is attached to the glass substrate 80A and then peeled off, the adhesive force of the second protective film 87 is larger than the thin film 85 immediately below the second protective film 87. The thin film 85 is peeled off from the glass substrate 80A. Through this step, the cullet remaining on the glass substrate 80A is removed together with the second protective film 87.
(Example 2)
The second embodiment is a method for dividing a reflective projector substrate that is formed by bonding a glass substrate and a silicon substrate, which are a kind of brittle material substrate, facing each other. The glass substrate 80A is the glass substrate on one side of the reflective projector substrate, the silicon substrate 80C is the silicon substrate on the other side, and the glass material of the glass substrate 80A is, for example, non-alkali glass. Moreover, the cutter wheel 16 of FIG. 8 from which the vertical crack from which the depth of a vertical crack changes periodically within a glass substrate is obtained was used for the cutter wheel.

  The vertical cracks obtained when the silicon substrate 80C is scribed with the cutter wheel 16 of FIG. 8 are continuous and shallow.

Therefore, the cutting process under the above conditions is the same as the cutting process shown in FIG. 26 showing the first embodiment, except that the glass substrate 80B of FIG. 26 is replaced with the silicon substrate 80C. For this reason, description of a parting process is abbreviate | omitted here.
(Example 3)
The third embodiment is a method for dividing a transmissive projector substrate formed by bonding a glass substrate, which is a kind of brittle material substrate, and a glass substrate to face each other.
The glass substrate on one side of the transmissive projector substrate is a glass substrate 80A, the glass substrate on the other side is 80B, and the glass material of the glass substrate 80A and the glass substrate 80B is, for example, quartz glass. Moreover, the cutter wheel 11 of FIG. 2 or the cutter wheel 16 of FIG. 8 was used for the cutter wheel.

Since the material of the glass substrate 80A and the glass substrate 80B in FIG. 26 is a hard brittle material such as quartz, the vertical cracks formed at the time of scribing are the ones in which the depth periodically changes shallowly in Example 1. Unlike, it becomes a continuous shallow thing.
The dividing process under the above conditions is the same as the dividing process shown in FIG. For this reason, description of a parting process is abbreviate | omitted here.
Example 4
The fourth embodiment is a method for dividing a reflective projector substrate formed by bonding a glass substrate and a silicon substrate, which are a kind of brittle material substrate, to face each other. The glass substrate 80A is the glass substrate on one side of the reflective projector substrate, the silicon substrate 80C is the silicon substrate on the other side, and the glass material of the glass substrate 80A is, for example, quartz glass. Moreover, the cutter wheel 11 of FIG. 2 or the cutter wheel 16 of FIG. 8 was used for the cutter wheel.

  Since the material of the glass substrate 80A in FIG. 26 is a hard and brittle material such as quartz, the vertical cracks formed when the glass substrate 80A is scribed are shallow and periodically changed in depth in Example 1. On the other hand, it becomes a continuous shallow one, and the vertical crack formed in the silicon substrate 80C also becomes a continuous shallow one.

Therefore, the dividing step under the above conditions is the same as the dividing step shown in FIG. 26 showing the first embodiment. For this reason, description of a parting process is abbreviate | omitted here.
(Example 5)
The fifth embodiment is a method for dividing the flat display panel mother glass substrate 1 formed by bonding glass substrates, which are one type of brittle material substrate, facing each other.
One side of the flat display panel mother glass substrate 80 is a glass substrate 80A, the other side is a glass substrate 80B, and the glass substrate 80A and the glass substrate 80B are made of, for example, non-alkali glass. Moreover, the cutter wheel 11 of FIG. 2 from which the long vertical crack which substantially penetrates a glass substrate in a plate | board thickness direction was obtained was used for the cutter wheel.

In the dividing step under the above conditions, the steps (d) and (g) are unnecessary from FIG. 26 showing the dividing step of Example 1, and the upper and lower sides of the glass substrates 80A and 80B in the steps (h) and (i). Are replaced, and the glass substrate 80B becomes the upper substrate and the glass substrate 80A becomes the lower substrate. In the steps (b) and (e) (scribe step), long vertical cracks that substantially penetrate the glass substrate in the thickness direction are obtained in the glass substrate 80A and the glass substrate 80B.
(Example 6)
The sixth embodiment is a method for dividing a reflective projector substrate that is formed by bonding a glass substrate and a silicon substrate, which are one of brittle material substrates, to face each other. The substrate on one side of the reflective projector substrate is a glass substrate 80A, the substrate on the other side is a silicon substrate 80C, and the glass material of the glass substrate 80A is, for example, non-alkali glass. Moreover, the cutter wheel 11 of FIG. 2 from which the long vertical crack which substantially penetrates a glass substrate in a plate | board thickness direction was obtained was used for the cutter wheel.

  When the glass substrate 80A is scribed under the above-described conditions, a long vertical crack that substantially penetrates the glass substrate in the thickness direction is obtained. On the other hand, when the silicon substrate 80C is scribed, a continuous shallow vertical crack is obtained.

  In the dividing step of the above condition, the glass substrate 80B is replaced with the silicon substrate 80C in FIG. 26 showing the dividing step of the first embodiment, and in the step (a), the first film 85 and the thin film 85 attached to the silicon substrate 80C are used. The protective film 86 is omitted. Then, the steps (d), (f), and (h) are unnecessary, and the projector substrate is reversed from the step (g) and placed on the table of the separation device.

  Further, in the sixth embodiment, the example is shown in which the silicon substrate 80C is scribed and then broken after the glass substrate 80A is scribed, but first, the silicon substrate 80C is scribed and broken, and then the glass substrate 80A is scribed. Good.

  Further, in order to minimize the influence of cullet generated during scribing, it is preferable that a thin film or a protective film is attached to the surface of the silicon substrate 80C as appropriate according to the process.

  In the present invention, polyethylene is used as the material for the thin film 85, the first protective film 86, and the second protective film 87, but any film material that is stretchable can be used without being limited to polyethylene.

  FIG. 27A shows a cutting apparatus for bonded brittle material substrates in which the devices included in the cutting process are arranged in a straight line following the cutting process of the flat display panel mother glass substrate shown in the first embodiment. It is a figure. Since the operation of this cutting apparatus has already been described in the description of the steps of the first embodiment, a description thereof will be omitted.

  In addition, when there is an unnecessary process as in the fifth and sixth embodiments, the processing apparatus corresponding to the unnecessary process and the transfer robot that transports to the processing apparatus are automatically divided as shown in FIG. Removed from line equipment.

  FIG. 27B is a cluster type arrangement of the individual processing devices of the cutting device of FIG. 27A, and the eight processing devices of the first scribe device 202 to the fifth film processing device 209 are circular. It is the structure arranged in the shape. The above eight processing apparatuses are transported by one transport robot R, and transport from the first film processing apparatus 201 to the first scribe apparatus 202 is performed by the transport robot R1, and the fifth film processing apparatus 209 is performed. Is transferred by the transfer robot R9.

  In FIG. 27B, the eight processing devices of the scribing device 202 to the fifth film processing device 209 are arranged in order counterclockwise, but the processing tact time of the automatic cutting device line is improved and the line device is configured. In order to limit the installation space for each component device, the eight processing devices need not be arranged in order.

  In addition, when there is an unnecessary process as in the fifth and sixth embodiments, the automatic cutting apparatus line shown in FIG. 27B shows the processing apparatus of the unnecessary process and the transfer robot that transports to the processing apparatus. It is not necessary to include it in the component device.

In the dividing method of the embodiment of the present invention, special processing is performed in a process of dividing a large-sized mother substrate into a plurality of small-sized flat display panels having a structure in which two substrates are bonded as a bonded substrate. The case of scribing from the outer substrate surface that has not been described has been described. However, there are cases in which scribing is performed from the inner substrate surface on which special processing is performed. Examples of such special processing include, for example, an aluminum film and a resist film used when forming an electronic control circuit formed on the opposite surface side of the bonded substrate, and for supplying power and signals to the bonded substrate panel. In the terminal portion as the current-carrying means, there are an ITO film and a chromium plating film formed inside the substrate. As other examples, an aluminum thin film is formed in advance on the facing surface side of the bonded substrate, or a thin film-like polyimide film is attached in order to exhibit a necessary display function. It is necessary to scribe from the side on which the film is formed in order to divide the filmed portion at a predetermined position with high accuracy while avoiding peeling of the film at the dividing position. The cutting edge disclosed in the present application can also respond to such a request effectively.
-Cutter wheel manufacturing equipment-
Next, the cutter wheel manufacturing apparatus for manufacturing the cutter wheels 11 and 16 in which unevenness | corrugation was formed in the blade edge ridgeline part as shown in FIG.2 and FIG.8 is demonstrated.

  FIG. 19 is a plan view showing a schematic configuration of an embodiment of a cutter wheel manufacturing apparatus.

  The cutter wheel manufacturing apparatus 400 includes a configuration for forming irregularities on the blade edge by grinding the ridge line portion of the blade edge with respect to the cutter wheel having the blade edge formed on the ridge line portion.

  The cutter wheel manufacturing apparatus 400 includes a housing 93 in which a grindstone 92 that is rotatably supported and fixed by a spindle motor 111 is disposed. On the front surface of the housing 93, a cutter wheel to be ground is carried out. A door 94 is provided that can be opened for entry. The door portion 94 is a safety door, and is provided with a safety control device (not shown) that interrupts the grinding process when it is opened during grinding of the cutter wheel.

  A grinding mechanism 102 is provided inside the housing 93 so as to be able to approach or separate from the grindstone 92. The approach and separation of the grinding mechanism 102 with respect to the grindstone 92 is operated by a feed motor 98. The feed motor 98 can adjust the feed and return of the grinding mechanism 102 to a predetermined position by rotating a ball screw (not shown).

  The grinding mechanism 102 has a wheel support portion 99 that supports the cutter wheel during grinding. A blade tip rotation motor 120 that rotates the cutter wheel at a fixed angle is provided at the rear portion of the wheel support portion 99. Further, the grinding mechanism 102 is provided with a horizontal alignment handle 101 and a vertical alignment handle 103, whereby the horizontal and vertical alignment are automatically adjusted manually or by a control mechanism (not shown). .

  A control device 95 for controlling the position and operation of the grinding mechanism 102 is provided outside the housing 93. Further, the control device 95 is provided with an operation unit 97 for designating the grinding conditions of the cutter wheel by the grinding mechanism 102.

  For example, the operation unit 97 includes a touch panel as shown in FIG. The touch panel shown as an example in FIG. 20 is provided with a touch panel operation unit 31 on which a specified condition list such as various operation modes, setting conditions, and alarms of the entire apparatus is displayed. There are provided a power switch 32 to be operated, an illuminated push button switch 33 for designating to enter operation preparation, an alarm buzzer 34 for issuing alarm information, and an emergency stop push button switch 35 for instructing to stop operation in an emergency. Yes.

  In addition, a signal tower 100 is provided on the upper portion of the housing 93. The signal tower 100 is an indicator lamp that indicates a state in the housing, such as an abnormality occurring, automatic operation, and no problem even if the door is opened or closed. ing. FIG. 21 shows an example of the signal tower 100. In this example, the “red” indicator lamp 41 for indicating that the inside of the housing 93 is abnormal and the inside of the housing 93 are in automatic operation. A “green” indicator lamp 42 is displayed, and a “yellow” indicator lamp 43 is displayed to indicate that there is no problem even if the door is opened and closed.

  Next, the operation of the cutter wheel manufacturing apparatus 400 having the above configuration will be described. First, the operation unit 97 is operated to perform initial setting for the grinding conditions of the cutter wheel to be ground.

  For example, the following conditions are input as the initial setting.

The first region rotation angle F ₁ ; groove depth, D ₁₁ ,..., D _1n
And rotation angle F ₂ of the second region; groove depth, D _21, ..., D _2n
The rotation angle F _m of the m-th region; the depth of the groove, D _m1 ,..., D _mn
-Number of divisions per area: N
・ Number of areas: R
When the input of the initial settings is completed, the cutter wheel grinding process is started.

  FIG. 22 is a flowchart for explaining the grinding process of the cutter wheel. Hereinafter, the grinding process of the cutter wheel will be described based on this flowchart.

  First, the division number n = 0 is set (S1), and then the area number m = 1 is set (S2).

  Next, the cutter wheel to be ground is attached to the wheel support 99 (S3).

Next, the operation unit 97 is operated to start the automatic operation of the grinding mechanism 102 (S4). Further, after moving to the station standby position (S5), the calculation of n = n + 1 is executed (S6). Next, it is determined whether D _mn = 0 (S7). If it is determined that D _mn ≠ 0, the process proceeds to the following step 8 (S8). If it is determined that D _mn = 0, the machining at that blade edge position is not necessary, so step 12 (S12 described later) is performed. ) In step 8, the position where the tip of the grindstone 92 contacts the cutting edge of the cutter wheel is detected. Optical means, mechanical means, and electrical means are used for detecting the contact position. The detection of the contact of the blade edge of the cutter wheel with the grindstone 92 is detected every time the blade edge contacts the grindstone in order to increase the processing accuracy of the grindstone 92.

  After the position where the tip of the grindstone 92 contacts the cutting edge is detected, the grinding mechanism 102 is moved to the cutting edge processing position by the feed motor 98 (S9).

  Next, the grinding mechanism 102 is moved in the direction of the grindstone 92 so that the cutting edge comes into strong contact with the grindstone 92, and the mth and nth grooves are processed to a depth of Dmn (S10).

  In this step 10, each groove is formed so that the depth of the n-th groove in the m-th region becomes the groove depth Dmn of the input value set in the initial setting in advance. . Similarly, the rotation angle of the mth area is also set in advance by the rotation angle Fm of the input value set in the initial setting.

  Next, the grinding mechanism 102 is moved to the standby position (S11).

  Next, the division number n and the division number N are compared to determine whether or not n <N (S12). If n <N, the process proceeds to step 13, and if n <N, the process proceeds to step 14.

  In step 13, the blade edge rotation motor 120 is rotated by a minute angle Fm. Subsequently, the process returns to Step 9 via Step 6, Step 7 and Step 8, and grinding is performed at the position of the blade edge rotated by a minute angle.

  If it is determined in step 12 that n <N, this means that the division number n has reached the preset division number N, and the process proceeds to step 14, where m < It is determined whether it is R (S14).

  Here, when it is determined that m <R, the blade edge is rotated by the set angle by the blade rotation motor 120 (S15). Subsequently, 1 is added to the set area number m to update it to the area number (m + 1). Further, initial setting of n = 0 is performed (S16). Thereafter, the process returns to Step 9 via Step 6, Step 7 and Step 8, and the grinding process is continued.

  If it is determined in step 14 that m <R is not satisfied, it indicates that the area number m has reached the initially set area number R, and the process proceeds to step 17 where the grinding mechanism 102 is returned to the origin position. (S17).

  Next, the glass cutter whose blade edge is ground is taken out (S18), and the grinding process is completed.

  If the cutter wheel manufacturing apparatus 400 described above is used, it is possible to form a groove having a desired depth at a desired position on the entire circumference of the cutting edge with good accuracy.

  In the cutter wheel manufacturing apparatus shown in FIG. 19, one grinding mechanism 102 is provided for the grindstone 92, but a plurality of grindstones are arranged near the center of the housing so as to surround the periphery of the grindstone. You may make it the structure which provides a grinding mechanism. In this way, the processing efficiency of the cutter wheel can be greatly improved in proportion to the number of installed grinding mechanisms.

  Further, a plurality of grindstones may be vertically stacked and installed, and the cutting edges of a plurality of cutter wheels to be processed may be disposed on each grindstone so as to face each grindstone.

  Further, a plurality of cutter wheels may be attached to one cutter wheel support portion in the grinding mechanism, and a plurality of cutter wheels may be ground simultaneously in a single grinding step. If it does in this way, the processing efficiency of a cutter wheel can be improved further.

Furthermore, as a configuration of the manufacturing apparatus, the above embodiment has been described with respect to a device configuration in which the mounting portion 112 that rotatably supports and fixes the rotating grindstone is fixed and the grinding mechanism 102 is movable. On the contrary, even if an equipment configuration in which the grinding mechanism 102 is fixed and the grindstone mounting portion 112 is movable is used, the vicinity of the ridgeline of the cutter wheel can be processed in the same manner to produce a cutting edge having an uneven shape. Is possible.

As described above, in the cutting method of the present invention , the scribe process is performed in a state where a thin film is bonded to the glass substrate surface of the bonded substrate, so that the cullet generated in the scribe process is attached to the glass substrate. Do not wear and scratch the glass substrate.
Further, in this configuration, after the scribing step, a protective film is attached on the thin film on the upper glass substrate, and then the protective film is separated from the upper glass substrate together with the thin film. In this case, the cullet generated during the scribing step is in close contact with the protective film, and is removed together with the thin film when the protective film is peeled off.

In addition, the cutting method of the present invention can supply a product with high quality and high reliability, which is useful.

It is a front view which shows typically the external appearance shape of the cutter wheel applied to embodiment of this invention . (A) is a front view of the cutter wheel which formed the processus | protrusion in the blade edge ridgeline, (b) is the side view and partial enlarged view of the wheel. It is the elements on larger scale which show another embodiment of the cutter wheel of FIG.2 (b) which formed the processus | protrusion in the blade edge ridgeline. It is the elements on larger scale which show another embodiment of the cutter wheel of FIG.2 (b) which formed the processus | protrusion in the blade edge ridgeline. It is the elements on larger scale which show another embodiment of the cutter wheel of FIG.2 (b) which formed the processus | protrusion in the blade edge ridgeline. It is a front view showing an embodiment of a cutter wheel formed by projecting shafts integrally with the wheel on both side surfaces of the wheel. It is a front view of the conventional glass cutter wheel. It is a side view of the cutter wheel applied to the embodiment of the present invention . It is a side view of the cutter wheel applied to another embodiment of the present invention . It is a side view which shows a cutter wheel (specific example I) . It is a side view which shows a cutter wheel (specific example II) . It is a side view showing a cutter wheel (example III). It is a side view which shows a cutter wheel (specific example IV) . It is a side view showing a cutter wheel (example V). It is a figure explaining the state of scribing by the cutter wheel applied to the embodiment of the present invention . It is sectional drawing which shows the crack which arises when a glass plate is scribed with the cutter wheel which formed the processus | protrusion in the blade edge ridgeline. It is a schematic front view which shows embodiment of the scribing apparatus applied to embodiment of this invention . It is a side view of the scribing apparatus of FIG. It is a top view which shows schematic structure of the manufacturing apparatus of the cutter wheel applied to embodiment of this invention . It is a figure which shows an example of the touchscreen with which the operation part of the manufacturing apparatus of the cutter wheel applied to embodiment of this invention is equipped. It is a figure which shows an example of the signal tower with which the cutter wheel manufacturing apparatus applied to embodiment of this invention is equipped. It is a flowchart for demonstrating the grinding process of the cutter wheel applied to embodiment of this invention . It is the figure which showed the mode of the vertical crack when scribing with the cutting method of this invention . Cutting device provided with a cutter wheel applied to an embodiment of the present invention It is sectional drawing explaining the method of parting a bonding glass substrate using a for every process. Cutting device provided with a cutter wheel applied to an embodiment of the present invention It is sectional drawing explaining the 2nd method of dividing | segmenting a bonding glass substrate using each process. It is process drawing for demonstrating embodiment of the parting process of this invention. It is a parting line layout for explaining an embodiment of a parting line process of the present invention. It is a figure explaining the condition of scribing by the conventional cutter wheel. (A) is a front view of the glass cutter wheel by which the groove | channel was formed in the blade edge ridgeline part, (b) is a side view of the wheel. It is process drawing which showed the conventional general parting procedure with respect to bonded glass. It is the figure which showed another conventional parting procedure with respect to the laminated glass.

Claims (4)

A method of dividing a bonded substrate in which a pair of glass substrates are bonded to each other, wherein a thin film is bonded to both surfaces of the bonded substrate, and a glass is used from above the thin film using a cutter wheel. A process of scribing the substrate;
After the scribing step, a protective film having a thickness larger than that of the thin film and having a strong adhesive force is pasted on the thin film on the scribed glass substrate, and then the protective film is attached together with the thin film. A method for dividing a bonded substrate, comprising a step of peeling from a scribed glass substrate . The method for dividing a laminated substrate according to claim 1, wherein after a thin film is attached to both surfaces of the bonded substrate, the thickness is larger than the film on the thin film on the lower glass substrate side, and the adhesive is adhered. A vertical crack is formed in the upper glass substrate by scribing from the thin film surface side on the upper glass substrate side with the first protective film having a weak force attached, and then the upper glass A second protective film that is thicker than the thin film and has a strong adhesive force is pasted on the thin film on the substrate, and the upper glass substrate on which the second protective film is pasted is the lower layer side. Then, the bonded substrate is inverted so that the lower glass substrate to which the first protective film is bonded is on the upper layer side, and the first protective film is inverted. After the film is peeled off, the glass substrate positioned in the upper layer is scribed from the thin film surface side, thereby forming a vertical crack in the glass substrate positioned in the upper layer, and then the glass substrate positioned in the upper layer. After the second protective film having a larger thickness than the thin film and having a strong adhesive force is further pasted on the thin film above, the second protective film adhered to the upper and lower glass substrates, respectively. A method for dividing a bonded substrate, wherein the substrate is separated from the upper and lower glass substrates together with a thin film . A method of dividing a bonded substrate in which a glass substrate and a silicon substrate are bonded to each other, wherein the glass substrate is cut using a cutter wheel from above the thin film in a state where a thin film is bonded to the glass substrate. A process of scribing to
After the scribing step, a protective film having a thickness larger than that of the thin film and having a strong adhesive force is pasted on the thin film on the glass substrate, and then the protective film is removed from the glass substrate together with the thin film. A method for dividing a bonded substrate, comprising a step of peeling . 4. The method for dividing a laminated substrate according to claim 3, wherein a thin film is attached on the glass substrate, and then the silicon substrate is positioned in a lower layer, from the thin film surface side on the upper glass substrate side. By scribing, a vertical crack reaching the lower surface of the upper glass substrate is formed, and then on the thin film on the upper glass substrate, the thickness is larger than that of the thin film and the adhesive strength is strong. Affix the protective film, invert the bonded substrate so that the lower layer silicon substrate is on the upper layer side, and scribe the silicon substrate positioned on the upper layer, so that the silicon substrate is on the lower layer side By flipping the bonded substrate and pressurizing the glass substrate located in the upper layer, vertical cracks are generated in the silicon substrate. Bonding cutting method of the substrate, characterized in that formed.

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