JP4673612B2 - Ｃｏ２存在下での電気めっき - Google Patents

Ｃｏ２存在下での電気めっき Download PDF

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Publication number
JP4673612B2
JP4673612B2 JP2004349651A JP2004349651A JP4673612B2 JP 4673612 B2 JP4673612 B2 JP 4673612B2 JP 2004349651 A JP2004349651 A JP 2004349651A JP 2004349651 A JP2004349651 A JP 2004349651A JP 4673612 B2 JP4673612 B2 JP 4673612B2
Authority
JP
Japan
Prior art keywords
ocf
plating
group
nonionic compound
aqueous solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004349651A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005256162A (ja
Inventor
隆文 永井
和久 藤井
英明 浅井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Priority to JP2004349651A priority Critical patent/JP4673612B2/ja
Priority to KR1020067018505A priority patent/KR20070001174A/ko
Priority to EP05710181A priority patent/EP1722013A4/fr
Priority to PCT/JP2005/002179 priority patent/WO2005078161A1/fr
Priority to US10/589,263 priority patent/US20070175763A1/en
Publication of JP2005256162A publication Critical patent/JP2005256162A/ja
Application granted granted Critical
Publication of JP4673612B2 publication Critical patent/JP4673612B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2004349651A 2004-02-12 2004-12-02 Ｃｏ２存在下での電気めっき Expired - Fee Related JP4673612B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004349651A JP4673612B2 (ja) 2004-02-12 2004-12-02 Ｃｏ２存在下での電気めっき
KR1020067018505A KR20070001174A (ko) 2004-02-12 2005-02-14 Ｃｏ2 존재하에서의 전기 도금
EP05710181A EP1722013A4 (fr) 2004-02-12 2005-02-14 Galvanoplastie en presence de co2
PCT/JP2005/002179 WO2005078161A1 (fr) 2004-02-12 2005-02-14 Galvanoplastie en présence de co2
US10/589,263 US20070175763A1 (en) 2004-02-12 2005-02-14 Electroplating in presence of co2

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004035281 2004-02-12
JP2004349651A JP4673612B2 (ja) 2004-02-12 2004-12-02 Ｃｏ２存在下での電気めっき

Publications (2)

Publication Number Publication Date
JP2005256162A JP2005256162A (ja) 2005-09-22
JP4673612B2 true JP4673612B2 (ja) 2011-04-20

Family

ID=34863449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004349651A Expired - Fee Related JP4673612B2 (ja) 2004-02-12 2004-12-02 Ｃｏ２存在下での電気めっき

Country Status (5)

Country Link
US (1) US20070175763A1 (fr)
EP (1) EP1722013A4 (fr)
JP (1) JP4673612B2 (fr)
KR (1) KR20070001174A (fr)
WO (1) WO2005078161A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007063598A (ja) * 2005-08-30 2007-03-15 Tokyo Univ Of Agriculture & Technology 多孔性金属薄膜およびその製造方法
JP4919262B2 (ja) * 2006-06-02 2012-04-18 日立マクセル株式会社 貯蔵容器、樹脂の成形方法及びメッキ膜の形成方法
JP5324191B2 (ja) * 2008-11-07 2013-10-23 ルネサスエレクトロニクス株式会社 半導体装置
US20120245019A1 (en) * 2011-03-23 2012-09-27 Brookhaven Science Associates, Llc Method and Electrochemical Cell for Synthesis of Electrocatalysts by Growing Metal Monolayers, or Bilayers and Treatment of Metal, Carbon, Oxide and Core-Shell Nanoparticles
CN106222729B (zh) * 2014-08-20 2018-02-06 江苏理工学院 基于移动阳极的超临界复合电镀加工钻头方法
US10011918B2 (en) * 2014-12-23 2018-07-03 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and process of electro-chemical plating

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1314799B1 (fr) * 2000-08-24 2013-10-16 Hideo Yoshida PROCéDé DE TRAITEMENT éLECTROCHIMIQUE, TEL QUE le placage électrochimique ET DISPOSITIF DE REACTION de placage électrochimique

Also Published As

Publication number Publication date
WO2005078161A1 (fr) 2005-08-25
KR20070001174A (ko) 2007-01-03
EP1722013A1 (fr) 2006-11-15
EP1722013A4 (fr) 2007-08-08
US20070175763A1 (en) 2007-08-02
JP2005256162A (ja) 2005-09-22

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