JP4903987B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP4903987B2
JP4903987B2 JP2004079597A JP2004079597A JP4903987B2 JP 4903987 B2 JP4903987 B2 JP 4903987B2 JP 2004079597 A JP2004079597 A JP 2004079597A JP 2004079597 A JP2004079597 A JP 2004079597A JP 4903987 B2 JP4903987 B2 JP 4903987B2
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JP
Japan
Prior art keywords
semiconductor device
mold
curable liquid
liquid silicone
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004079597A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005268565A (ja
JP2005268565A5 (2
Inventor
好次 森田
淳二 中西
勝利 峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to JP2004079597A priority Critical patent/JP4903987B2/ja
Priority to TW094106803A priority patent/TWI383429B/zh
Priority to US10/599,041 priority patent/US8262970B2/en
Priority to KR1020067019279A priority patent/KR101168861B1/ko
Priority to PCT/JP2005/004410 priority patent/WO2005091361A1/en
Priority to EP05720681A priority patent/EP1730775B1/en
Priority to CNB200580008837XA priority patent/CN100539092C/zh
Priority to MYPI20051177A priority patent/MY146873A/en
Publication of JP2005268565A publication Critical patent/JP2005268565A/ja
Publication of JP2005268565A5 publication Critical patent/JP2005268565A5/ja
Application granted granted Critical
Publication of JP4903987B2 publication Critical patent/JP4903987B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2004079597A 2004-03-19 2004-03-19 半導体装置の製造方法 Expired - Lifetime JP4903987B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2004079597A JP4903987B2 (ja) 2004-03-19 2004-03-19 半導体装置の製造方法
TW094106803A TWI383429B (zh) 2004-03-19 2005-03-07 半導體裝置及其製法
KR1020067019279A KR101168861B1 (ko) 2004-03-19 2005-03-08 반도체 장치 및 이의 제조방법
PCT/JP2005/004410 WO2005091361A1 (en) 2004-03-19 2005-03-08 Semiconductor device and method of manufacturing thereof
US10/599,041 US8262970B2 (en) 2004-03-19 2005-03-08 Semiconductor device and method of manufacturing thereof
EP05720681A EP1730775B1 (en) 2004-03-19 2005-03-08 Semiconductor device and method of manufacturing thereof
CNB200580008837XA CN100539092C (zh) 2004-03-19 2005-03-08 半导体器件及其制造方法
MYPI20051177A MY146873A (en) 2004-03-19 2005-03-18 Semiconductor device and method of manufacturing therof.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004079597A JP4903987B2 (ja) 2004-03-19 2004-03-19 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2005268565A JP2005268565A (ja) 2005-09-29
JP2005268565A5 JP2005268565A5 (2) 2007-03-29
JP4903987B2 true JP4903987B2 (ja) 2012-03-28

Family

ID=34961509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004079597A Expired - Lifetime JP4903987B2 (ja) 2004-03-19 2004-03-19 半導体装置の製造方法

Country Status (8)

Country Link
US (1) US8262970B2 (2)
EP (1) EP1730775B1 (2)
JP (1) JP4903987B2 (2)
KR (1) KR101168861B1 (2)
CN (1) CN100539092C (2)
MY (1) MY146873A (2)
TW (1) TWI383429B (2)
WO (1) WO2005091361A1 (2)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4931366B2 (ja) 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5207591B2 (ja) 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP5285846B2 (ja) 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
CN102290170A (zh) * 2010-06-17 2011-12-21 台湾双羽电机股份有限公司 薄型电阻及其制造方法
KR20150022990A (ko) * 2012-06-08 2015-03-04 히타치가세이가부시끼가이샤 반도체 장치의 제조 방법
JP2014082284A (ja) * 2012-10-15 2014-05-08 Dow Corning Toray Co Ltd 凸状硬化物及び基材を備える一体化物の製造方法
US8997342B2 (en) * 2012-10-15 2015-04-07 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Method of fabrication, a multilayer electronic structure and structures in accordance with the method
US9470395B2 (en) 2013-03-15 2016-10-18 Abl Ip Holding Llc Optic for a light source
CA2911523C (en) 2013-05-10 2018-10-02 Abl Ip Holding Llc Silicone optics
KR101741010B1 (ko) * 2014-09-01 2017-05-29 한국생산기술연구원 레독스 플로우 전지용 바이폴라 플레이트의 제조방법
BR112017014323B1 (pt) * 2015-03-05 2022-11-01 Sumitomo Bakelite Co., Ltd Composição de resina para vedação, método para produzir unidade de controle eletrônico montada em veículo e unidade de controle eletrônico montada em veículo
KR102695706B1 (ko) * 2022-05-24 2024-08-16 레이저쎌 주식회사 진공챔버를 구비한 가압 방식의 레이저 리플로우 장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0214244A (ja) 1988-06-30 1990-01-18 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
JP3516764B2 (ja) 1995-03-08 2004-04-05 アピックヤマダ株式会社 リリースフィルムを用いる樹脂モールド装置及び樹脂モールド方法
JPH1177733A (ja) 1997-09-01 1999-03-23 Apic Yamada Kk 樹脂モールド方法及び樹脂モールド装置
US6080605A (en) * 1998-10-06 2000-06-27 Tessera, Inc. Methods of encapsulating a semiconductor chip using a settable encapsulant
US6040366A (en) * 1998-02-27 2000-03-21 General Electric Company Liquid injection molding silicone elastomers having primerless adhesion
US6124407A (en) * 1998-10-28 2000-09-26 Dow Corning Corporation Silicone composition, method for the preparation thereof, and silicone elastomer
JP3494586B2 (ja) * 1999-03-26 2004-02-09 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP4646363B2 (ja) * 2000-06-29 2011-03-09 東レ・ダウコーニング株式会社 シリコーンゴム組成物
JP4947858B2 (ja) * 2001-08-21 2012-06-06 東レ・ダウコーニング株式会社 導電性液状シリコーンゴム組成物、導電性シリコーンゴム成形物およびその製造方法
JP4061361B2 (ja) * 2001-12-28 2008-03-19 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加反応型ポリオルガノシロキサン組成物
US7375158B2 (en) * 2002-05-31 2008-05-20 Dow Corning Toray Silicone Company, Ltd. Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition

Also Published As

Publication number Publication date
JP2005268565A (ja) 2005-09-29
CN1934699A (zh) 2007-03-21
CN100539092C (zh) 2009-09-09
US20070273050A1 (en) 2007-11-29
KR20060123643A (ko) 2006-12-01
EP1730775A1 (en) 2006-12-13
TWI383429B (zh) 2013-01-21
EP1730775B1 (en) 2013-02-13
TW200535957A (en) 2005-11-01
MY146873A (en) 2012-10-15
US8262970B2 (en) 2012-09-11
WO2005091361A1 (en) 2005-09-29
KR101168861B1 (ko) 2012-07-30

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