JP5065155B2 - 電子部品ユニット - Google Patents
電子部品ユニット Download PDFInfo
- Publication number
- JP5065155B2 JP5065155B2 JP2008135737A JP2008135737A JP5065155B2 JP 5065155 B2 JP5065155 B2 JP 5065155B2 JP 2008135737 A JP2008135737 A JP 2008135737A JP 2008135737 A JP2008135737 A JP 2008135737A JP 5065155 B2 JP5065155 B2 JP 5065155B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic component
- thermal fuse
- temperature
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000020169 heat generation Effects 0.000 claims description 18
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 230000002159 abnormal effect Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 14
- 238000001816 cooling Methods 0.000 description 7
- 239000000155 melt Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Fuses (AREA)
Description
3 パワートランジスタ(電子部品)
4 温度ヒューズ
10 板バネ(固定部材)
A 受熱部
B 放熱部
Claims (1)
- 通電により発熱する電子部品と、該電子部品に異常発熱が生じたときに溶断して前記通電を遮断する温度ヒューズと、前記電子部品の近傍に前記温度ヒューズを固定すると共に前記電子部品からの熱を前記温度ヒューズに伝達する固定部材とを備えた電子部品ユニットであって、
前記固定部材は、前記電子部品から受ける受熱量が自身から発散する放熱量を上回る受熱部と、前記放熱量が前記受熱量を上回る放熱部とを有し、
前記温度ヒューズから前記電子部品の発熱中心部に向かって延在されると共に、先端部が左右に延び、且つ、前記温度ヒューズと前記発熱中心部との間が一点止めされ、
前記発熱中心部に対向したエッジ部が、該発熱中心部を中心とした円弧状に湾曲している
ことを特徴とする電子部品ユニット。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008135737A JP5065155B2 (ja) | 2008-05-23 | 2008-05-23 | 電子部品ユニット |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008135737A JP5065155B2 (ja) | 2008-05-23 | 2008-05-23 | 電子部品ユニット |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009283360A JP2009283360A (ja) | 2009-12-03 |
| JP2009283360A5 JP2009283360A5 (ja) | 2011-01-06 |
| JP5065155B2 true JP5065155B2 (ja) | 2012-10-31 |
Family
ID=41453596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008135737A Expired - Fee Related JP5065155B2 (ja) | 2008-05-23 | 2008-05-23 | 電子部品ユニット |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5065155B2 (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102444600A (zh) * | 2010-10-11 | 2012-05-09 | 上海克拉电子有限公司 | 一种风机调速模块 |
| JP7133723B2 (ja) * | 2019-03-12 | 2022-09-08 | シグニファイ ホールディング ビー ヴィ | 電子部品に温度ヒューズをスナップフィットするためのホルダ |
| CN110788609B (zh) * | 2019-11-29 | 2025-04-04 | 孝感华工高理电子有限公司 | 一种调速模块打mosfet上螺丝的机构、系统及方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0134264Y2 (ja) * | 1986-09-05 | 1989-10-18 | ||
| JPH02265141A (ja) * | 1989-03-31 | 1990-10-29 | Toshiba Lighting & Technol Corp | 回路部品の連結構造 |
| JP3272417B2 (ja) * | 1992-10-14 | 2002-04-08 | 内橋エステック株式会社 | 温度ヒュ−ズの取付構造 |
-
2008
- 2008-05-23 JP JP2008135737A patent/JP5065155B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009283360A (ja) | 2009-12-03 |
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