JP5124077B2 - ポリマー、およびそれを含むフォトレジスト - Google Patents
ポリマー、およびそれを含むフォトレジスト Download PDFInfo
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
- H04M1/724—User interfaces specially adapted for cordless or mobile telephones
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
- H04M1/0235—Slidable or telescopic telephones, i.e. with a relative translation movement of the body parts; Telephones using a combination of translation and other relative motions of the body parts
- H04M1/0237—Sliding mechanism with one degree of freedom
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/108—Polyolefin or halogen containing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/115—Cationic or anionic
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- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
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- Signal Processing (AREA)
- Human Computer Interaction (AREA)
- Computer Networks & Wireless Communication (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Silicon Polymers (AREA)
Description
式中、Rは、水素、または好ましくは非水素置換基、たとえば任意に置換されたアルキル、特にC1〜20アルキル;任意に置換された脂環式基、とくにC3〜20脂環式基、たとえばノルボルニル、アダマンチル、シクロヘキシル、イソボルニル、フェンキルなど;任意に置換されたアリール、たとえば任意に置換された炭素環式アリール、たとえば任意に置換されたフェニル、ナフチルなど、または任意に置換されたヘテロアリールであり;mおよびnはそれぞれ0より大きい。R基は、光画像形成を促進する基、たとえばフォト酸レイビル基、たとえばエステルまたはアセタール、あるいはコントラスト強化基、たとえばフッ素化アルコールを含んでもよい。値mは、ポリマー単位の総数を基準にして、好ましくは20〜90%である。この場合も、少なくとも一部の繰り返し単位が炭素を含有する(有機ポリマーを得るため)、たとえば任意に置換されたアルキル、任意に置換された脂環式基、任意に置換された炭素環式アリールなどを含有するポリマーが好ましい。
式中、R1およびR2は異なる種類であり、水素または非水素置換基であってよく、好ましくはR1およびR2の両方が上記式IのRで議論された非水素置換基であり、x、y、およびzはそれぞれ0より大きい。好ましくは、R1およびR2の少なくとも1つは、光画像形成を促進する基、たとえばフォト酸レイビル基、またはコントラスト強化基、たとえばフッ素化アルコールを含む。この場合も、少なくとも一部の繰り返し単位が炭素を含有する(有機ポリマーを得るため)、たとえば任意に置換されたアルキル、任意に置換された脂環式基、任意に置換された炭素環式アリールなどを含有するポリマーが好ましい。
式中、各Mは独立に、Si、Ti、Zr、Ge、またはSnであり、好ましくはSi、Ti、Zr、またはSnであり、より好ましくはMはSiまたはTiであり、各Yは同種または異種であり、少なくとも2つのY基は、加水分解または縮合反応に対して反応性である基(たとえば脱離基)であり、好ましくは3または4個のY基がそのような反応性基である。
式中、各Yは、同種または異種の、ハロゲン、C1〜8アルコキシ、ヒドロキシ、ハロゲン、またはSi原子への結合(化学結合)であり、少なくとも2つのY基はハロゲンまたはアルコキシであり、好ましくはC1〜4アルコキシまたはC1〜3アルコキシ、たとえばメトキシまたはエトキシである。
式中、R、R1、およびR2は、水素、または前述のような非水素置換であり、m、n、x、y、およびzはそれぞれ0より大きい。好適には、R、R1、およびR2のすべてが水素以外である。好ましいR、R1、およびR2基としては、次の構造:
これらの構造において、構造の左側の開放された結合(−)はポリマーとの化学結合であり、R”は、化学結合または結合基、たとえばヘテロ原子、たとえばSまたはO、あるいは任意に置換されたアルキレン、たとえばC1〜8アルキレンであり、BGは、ブロック基、たとえばフォト酸レイビル基、たとえばエステル(たとえばt−ブチルエステル)またはヒドロキシ基とエチルビニルエーテル基との反応によって生成するようなアセタール基であるか、あるいはBGは、リソグラフィー加工に対して一般的に不活性である基、たとえばC1〜8アルキル、アルキルスルホネート、たとえばメシルなどであってもよく、Xは、水素、あるいは直前のBGに関して規定したようなブロック基であってよく、R3は、フォト酸レイビル部位を提供する基であり、たとえばR3は、エステル酸素、たとえばt−ブチルに結合する第四級炭素を提供する。
式中、R11およびR12は独立に、H、(C1〜C6)アルキル、およびフェニルから選択される。R11およびR12の好ましいアルキル基は、メチルおよびプロピルである。
(実施例1:1,1,1−トリフルオロ−2−トリフルロメチル−ペンタ−4−エン−2−オール(BTHB)−トリエトキシシランの合成)
HFIPNB−トリエトキシシランモノマーは、HFIPNBとトリエトキシシランのヒドロシリル化反応による直接合成も行った。
(パート1:1,1,1−トリフルオロ−2−トリフルロメチル−ペンタ−4−エン−2−オール(BTHB)−エトキシメチルエーテル(EOM)の合成)
凝縮器と滴下漏斗とを取り付けた500mlの三口フラスコに、9.69g(403.79mmol)の水素化ナトリウム(鉱油中の60%分散液であり、無水ヘキサンで洗浄したもの)と150mlの乾燥THFとを加えた。70.00g(336.49mmol)のBTHBと50mlの乾燥THFとの混合物を、滴下漏斗で反応容器にゆっくりと加えた。次に、溶液全体を80℃で16時間還流した。反応混合物に38.17g(493.79mmol)のクロロメチルエチルエーテルと20mlのTHFとを加え、反応混合物を還流しながら終夜撹拌した。反応混合物を室温まで冷却し、200mlの水酸化カリウム水溶液を加えて、塩を溶解させた。その水相を200mlのジクロロメタンで2回抽出し、有機底部層を合わせたものを硫酸マグネシウムで乾燥させた。過剰の溶媒および残留する出発物質は、ロータリーエバポレーターを使用して除去した。67.80gの無色液体が、138〜143℃における単純な蒸留によって単離された(収率78%、GCによる純度99.24%)。
500mlの三口フラスコに、60.00g(225.50mmol)のBTHB−エトキシメチルエーテルと、220mlの無水トルエンと、40.70g(248.06mmol)のトリエトキシシランと、触媒量のヘキサクロロ白金(IV)酸水和物(H2PtCl6xH2O)とを加えた。反応混合物を125℃で3日間還流した。過剰の溶媒および残留する揮発性出発物質を予備蒸留によって除去し、ヒドロシリル化生成物を、88〜99℃(0.4〜1.3mmHg)で減圧蒸留することによって単離した。無色粘稠液体が得られ、NMRおよびGCによって特性決定した。
(実施例6:30部の実施例1のモノマーと、20部の実施例5のモノマーと、50部のテトラエトキシシラン(TEOS)とを含むポリマーの合成)
実施例6の手順によって、適切な別の反応混合物を使用して、157nm吸光度がより低い以下のポリマーを調製した。
実施例8の手順によって、適切な別の反応混合物を使用して、以下のポリマーを調製した。
イオン交換ステップは使用せずに実施例8の一般手順を使用して、実施例1のモノマー1部と実施例2のモノマー1部を縮合させて、Mwが3,152ダルトンの樹脂を生成した。次にこの樹脂を160℃で5時間熱処理しても分子量の有意な変化はなかった(Mw=3098、Mn=2816)。この材料の特性は、A157nmが1.19/μmであり、Tgは約20℃であり、水性0.26N水酸化テトラメチルアンモニウム現像液中の溶解速度は1500Å/秒を超え、ケイ素含有率は約9.5%であった。
生成物の熱処理ステップを使用せずに、実施例10の一般手順を使用して、実施例3のモノマー1部と、実施例4のモノマー1部と、1部のTEOSとを縮合させて、Mwが約6,435であり、Mnが5,044であり、A157が1.23/μmであるポリマーを生成した。0.26N現像液中の溶解速度は約1070Å/秒であり、測定によるケイ素含有率は約12%であった。
(実施例14〜16:フォトレジストの調製および157nmにおけるリソグラフィー加工)
実施例14〜16のそれぞれにおいて、以下の成分を以下の量で混合してフォトレジスト組成物を調製した。
実施例14のポリマー:
実施例15のポリマー:
Abs157/μm:1.47
実施例16のポリマー:
Abs157/μm:1.5
以下の成分を以下の量で混合してフォトレジスト組成物を調製する。
実施例18のケイ素含有粒子のゲル浸透クロマトグラフィー(GPC)(図2の上図のクロマトグラム)およびマトリックス支援レーザー脱離イオン化飛行時間型質量分析(MALDITOF−MS)(下図のスペクトル)を測定した。別の実験において、3種類のポリメタクリレート標準物質のSECを使用して、粒子の回転半径Rgが2.7nmと求められた。MALDITOF−MSスペクトルから、粒子はMnが24,500Daの1種類の分子であることが明らかである。GPCは粒子の流体力学的体積の尺度であり、MSは実際の質量を測定するので、これら2つの測定から、高度に架橋された物質に期待される非常に高密度の粒子であることが分かる。この種の単分散性は、トリエチルアミンを塩基触媒として使用した場合にも得られた。この実施例で得られたGPCおよび質量スペクトルを図面の図2に示す。
温度計、凝縮器、窒素入口、マグネチックスターラー、および油浴を取り付けた100mlの三口丸底フラスコに、5.0g(16.9mmol)のBTHB−トリエトキシシラン、3.0g(14.4mmol)のTEOS、3.1gの水、1.6gのエタノール、および3ppmの濃塩酸を投入した。この反応混合物を4時間還流した。次にこの重合混合物を酢酸エチルで希釈して、酸が除去されるまで水で数回洗浄した。酸を塩基で中和した後に水で洗浄しても、ポリマーに影響を与えることなく酸を除去することができる。このポリマー溶液を減圧下(アスピレーター減圧)室温で30分間蒸発させ、続いてさらに24時間減圧(室温で2mmHg)した(収率88%、3.51g)(Mw=6700、Mw/Mn=1.39)。
フォトレジスト組成物を以下のようにして調製した。91部の実施例17で調製したSiポリマーと、4.5部のトリフェニルスルホニウムペルフルオロブタンスルホネートと、0.4部のジアミンオルガノシランと、580部の2−ヘプタノンとを混合することによって均一なレジスト溶液を得た。
Claims (8)
- 光活性成分が1種以上のフォト酸発生剤化合物を含む、請求項1または2記載のフォトイメージャブル組成物。
- ポリマーが炭素原子を含む、請求項1から3のいずれか1項に記載のフォトイメージャブル組成物。
- 請求項1から4のいずれか1項記載のポジ型フォトイメージャブル組成物のコーティング層を含む基体を含む製品。
- コーティングされた基体であって、
a)基体表面上に適用された下層の有機ポリマー組成物コーティング層と、
b)前記下層のポリマー組成物コーティング層上に配置される、請求項1から4のいずれか1項に記載のポジ型フォトイメージャブル組成物のコーティング層と、
を含む、前記コーティングされた基体。 - 電子デバイスの製造方法であって、
(a)請求項1から4のいずれか1項記載のポジ型フォトイメージャブル組成物を基体上に適用するステップと、
(b)前記フォトイメージャブル組成物のコーティング層を活性化放射線に露光して、露光したフォトイメージャブル層を現像するステップと、
を含む、前記製造方法。
Applications Claiming Priority (2)
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|---|---|---|---|
| US45158003P | 2003-03-03 | 2003-03-03 | |
| US60/451580 | 2003-03-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2011034479A Division JP5178858B2 (ja) | 2003-03-03 | 2011-02-21 | ポリマー、およびそれを含むフォトレジスト |
Publications (2)
| Publication Number | Publication Date |
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| JP2004295104A JP2004295104A (ja) | 2004-10-21 |
| JP5124077B2 true JP5124077B2 (ja) | 2013-01-23 |
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| JP2004058830A Expired - Lifetime JP5124077B2 (ja) | 2003-03-03 | 2004-03-03 | ポリマー、およびそれを含むフォトレジスト |
| JP2011034479A Expired - Lifetime JP5178858B2 (ja) | 2003-03-03 | 2011-02-21 | ポリマー、およびそれを含むフォトレジスト |
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| US (2) | US7390609B2 (ja) |
| EP (1) | EP1455230A3 (ja) |
| JP (2) | JP5124077B2 (ja) |
| KR (2) | KR101112482B1 (ja) |
| CN (1) | CN1570762B (ja) |
| TW (1) | TWI317458B (ja) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004076535A1 (ja) * | 2003-02-26 | 2004-09-10 | Tokyo Ohka Kogyo Co., Ltd. | シルセスキオキサン樹脂、ポジ型レジスト組成物、レジスト積層体及びレジストパターン形成方法 |
| US7297616B2 (en) * | 2003-04-09 | 2007-11-20 | Rohm And Haas Electronic Materials Llc | Methods, photoresists and substrates for ion-implant lithography |
| JP2004354417A (ja) | 2003-05-27 | 2004-12-16 | Shin Etsu Chem Co Ltd | ポジ型レジスト材料並びにこれを用いたパターン形成方法 |
| US20050196699A1 (en) * | 2004-03-03 | 2005-09-08 | Rohm And Haas Electronic Materials Llc | Polymers and photoresists comprising same |
| JP4551701B2 (ja) * | 2004-06-14 | 2010-09-29 | 富士フイルム株式会社 | 液浸露光用保護膜形成組成物及びそれを用いたパターン形成方法 |
| KR101097522B1 (ko) | 2004-08-24 | 2011-12-22 | 도아고세이가부시키가이샤 | 유기 규소 화합물의 제조 방법 |
| US7320855B2 (en) * | 2004-11-03 | 2008-01-22 | International Business Machines Corporation | Silicon containing TARC/barrier layer |
| EP1720072B1 (en) * | 2005-05-01 | 2019-06-05 | Rohm and Haas Electronic Materials, L.L.C. | Compositons and processes for immersion lithography |
| EP1762895B1 (en) | 2005-08-29 | 2016-02-24 | Rohm and Haas Electronic Materials, L.L.C. | Antireflective Hard Mask Compositions |
| US7348447B2 (en) * | 2005-10-11 | 2008-03-25 | Xerox Corporation | Aromatic disiloxane compositions |
| KR101186689B1 (ko) * | 2006-10-30 | 2012-09-27 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. | 침지 리소그래피 처리용 조성물 및 방법 |
| FR2908558B1 (fr) * | 2006-11-13 | 2008-12-19 | Commissariat Energie Atomique | Materiau d'electrolyte silicie pour pile a combustible, procede pour sa realisation et pile a combustible mettant en oeuvre un tel materiau. |
| EP2056162B1 (en) * | 2007-11-05 | 2016-05-04 | Rohm and Haas Electronic Materials LLC | Process for immersion lithography |
| JP5775701B2 (ja) * | 2010-02-26 | 2015-09-09 | 富士フイルム株式会社 | パターン形成方法及びレジスト組成物 |
| US9233840B2 (en) * | 2010-10-28 | 2016-01-12 | International Business Machines Corporation | Method for improving self-assembled polymer features |
| JP5650086B2 (ja) * | 2011-06-28 | 2015-01-07 | 信越化学工業株式会社 | レジスト下層膜形成用組成物、及びパターン形成方法 |
| US9281212B1 (en) | 2014-10-17 | 2016-03-08 | International Business Machines Corporation | Dielectric tone inversion materials |
| JP6455160B2 (ja) * | 2015-01-14 | 2019-01-23 | Jsr株式会社 | 硬化膜形成用感放射線性組成物、硬化膜、表示素子及び硬化膜の形成方法 |
| JP6268111B2 (ja) | 2015-02-06 | 2018-01-24 | 信越化学工業株式会社 | フッ素含有ケイ素化合物、その製造方法、及びフッ素含有ケイ素樹脂の製造方法 |
| KR102177417B1 (ko) * | 2017-12-31 | 2020-11-11 | 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 | 포토레지스트 조성물 및 방법 |
| JP7024744B2 (ja) * | 2018-02-22 | 2022-02-24 | 信越化学工業株式会社 | レジスト材料及びこれを用いたパターン形成方法 |
| CN111819183A (zh) * | 2018-02-28 | 2020-10-23 | 中央硝子株式会社 | 包含六氟异丙醇基的硅化合物及其制造方法 |
| JP7269503B2 (ja) | 2018-02-28 | 2023-05-09 | セントラル硝子株式会社 | 珪素含有層形成組成物およびそれを用いたパターン付き基板の製造方法 |
| KR102307977B1 (ko) | 2018-07-31 | 2021-09-30 | 삼성에스디아이 주식회사 | 반도체 레지스트용 조성물 및 이를 이용한 패턴 형성 방법 |
| US11092890B2 (en) | 2018-07-31 | 2021-08-17 | Samsung Sdi Co., Ltd. | Semiconductor resist composition, and method of forming patterns using the composition |
| US11092889B2 (en) | 2018-07-31 | 2021-08-17 | Samsung Sdi Co., Ltd. | Semiconductor resist composition, and method of forming patterns using the composition |
| JP6865794B2 (ja) * | 2018-07-31 | 2021-04-28 | 三星エスディアイ株式会社Samsung SDI Co., Ltd. | 半導体レジスト用組成物およびこれを用いたパターン形成方法 |
| US11609494B2 (en) | 2019-04-30 | 2023-03-21 | Samsung Sdi Co., Ltd. | Semiconductor photoresist composition and method of forming patterns using the composition |
| KR102446362B1 (ko) | 2019-10-15 | 2022-09-21 | 삼성에스디아이 주식회사 | 반도체 포토 레지스트용 조성물 및 이를 이용한 패턴 형성 방법 |
| KR102573327B1 (ko) | 2020-04-02 | 2023-08-30 | 삼성에스디아이 주식회사 | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 |
| KR102619719B1 (ko) | 2020-05-12 | 2023-12-28 | 삼성에스디아이 주식회사 | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 |
| KR102586112B1 (ko) | 2020-09-14 | 2023-10-05 | 삼성에스디아이 주식회사 | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 |
| KR102598259B1 (ko) | 2020-12-18 | 2023-11-02 | 삼성에스디아이 주식회사 | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 |
| KR102690557B1 (ko) | 2020-12-18 | 2024-07-30 | 삼성에스디아이 주식회사 | 반도체 포토레지스트용 조성물, 이의 제조 방법 및 이를 이용한 패턴 형성 방법 |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA586038A (en) | 1956-03-26 | 1959-10-27 | General Electric Company | Organopolysiloxane resins |
| GB1115051A (en) | 1964-05-27 | 1968-05-22 | Owens Illinois Inc | Siloxane resins |
| GB1451623A (en) | 1973-10-01 | 1976-10-06 | Mullard Ltd | Method of prov8ding a patterned layer of silicon-containing oxide on a substrate |
| US4223121A (en) | 1978-12-04 | 1980-09-16 | Owens-Illinois, Inc. | Organopolysiloxane resins of increased hardness |
| US4349609A (en) | 1979-06-21 | 1982-09-14 | Fujitsu Limited | Electronic device having multilayer wiring structure |
| DE3173441D1 (en) | 1980-08-26 | 1986-02-20 | Japan Synthetic Rubber Co Ltd | Ladder-like lower alkylpolysilsesquioxanes and process for their preparation |
| US4745169A (en) | 1985-05-10 | 1988-05-17 | Hitachi, Ltd. | Alkali-soluble siloxane polymer, silmethylene polymer, and polyorganosilsesquioxane polymer |
| EP0432905B1 (en) | 1989-11-15 | 1998-02-04 | Fujitsu Limited | Polysilphenylenesiloxane, production process thereof, and resist material and semiconductor device formed thereof |
| EP0464614B1 (en) | 1990-06-25 | 1999-09-29 | Matsushita Electronics Corporation | A composition having sensitivity to light or radiation |
| US5100503A (en) | 1990-09-14 | 1992-03-31 | Ncr Corporation | Silica-based anti-reflective planarizing layer |
| TW397936B (en) | 1994-12-09 | 2000-07-11 | Shinetsu Chemical Co | Positive resist comosition based on a silicone polymer containing a photo acid generator |
| TW434458B (en) | 1995-04-04 | 2001-05-16 | Shinetsu Chemical Co | Chemically amplified positive resist compositions |
| JP3324360B2 (ja) | 1995-09-25 | 2002-09-17 | 信越化学工業株式会社 | ポリシロキサン化合物及びポジ型レジスト材料 |
| JP3518158B2 (ja) | 1996-04-02 | 2004-04-12 | 信越化学工業株式会社 | 化学増幅ポジ型レジスト材料 |
| JPH1010741A (ja) * | 1996-06-27 | 1998-01-16 | Dow Corning Asia Kk | 紫外線硬化性ポリシロキサン組成物およびこれを用いた硬化物パターンの製造方法 |
| TW432257B (en) | 1997-01-31 | 2001-05-01 | Shinetsu Chemical Co | High molecular weight silicone compound, chemically amplified positive resist composition and patterning method |
| KR100452670B1 (ko) | 1997-08-06 | 2005-10-11 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 고분자실리콘화합물,레지스트재료및패턴형성방법 |
| US20010006757A1 (en) * | 1998-03-09 | 2001-07-05 | Kiyotaka Fukino | Radiant ray-sensitive lithographic printing plate precursor |
| US6087064A (en) | 1998-09-03 | 2000-07-11 | International Business Machines Corporation | Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method |
| US6849377B2 (en) * | 1998-09-23 | 2005-02-01 | E. I. Du Pont De Nemours And Company | Photoresists, polymers and processes for microlithography |
| US6210856B1 (en) | 1999-01-27 | 2001-04-03 | International Business Machines Corporation | Resist composition and process of forming a patterned resist layer on a substrate |
| JP4270708B2 (ja) | 1999-04-23 | 2009-06-03 | 富士通株式会社 | ケイ素含有ポリマ、その製造方法、それを用いたレジスト組成物、パターン形成方法および電子デバイスの製造方法 |
| US6790587B1 (en) * | 1999-05-04 | 2004-09-14 | E. I. Du Pont De Nemours And Company | Fluorinated polymers, photoresists and processes for microlithography |
| JP2001040283A (ja) | 1999-07-29 | 2001-02-13 | Jsr Corp | 膜形成用組成物の製造方法、膜形成用組成物および絶縁膜形成用材料 |
| JP2001040092A (ja) | 1999-07-29 | 2001-02-13 | Jsr Corp | 膜形成用組成物および絶縁膜形成用材料 |
| JP2001215707A (ja) * | 2000-02-04 | 2001-08-10 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
| US6406828B1 (en) | 2000-02-24 | 2002-06-18 | Shipley Company, L.L.C. | Polymer and photoresist compositions |
| US6444408B1 (en) * | 2000-02-28 | 2002-09-03 | International Business Machines Corporation | High silicon content monomers and polymers suitable for 193 nm bilayer resists |
| US6531260B2 (en) * | 2000-04-07 | 2003-03-11 | Jsr Corporation | Polysiloxane, method of manufacturing same, silicon-containing alicyclic compound, and radiation-sensitive resin composition |
| US6420084B1 (en) | 2000-06-23 | 2002-07-16 | International Business Machines Corporation | Mask-making using resist having SIO bond-containing polymer |
| US6420088B1 (en) | 2000-06-23 | 2002-07-16 | International Business Machines Corporation | Antireflective silicon-containing compositions as hardmask layer |
| JP2002062654A (ja) * | 2000-08-16 | 2002-02-28 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
| JP2002082437A (ja) * | 2000-09-06 | 2002-03-22 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
| JP4295937B2 (ja) | 2000-12-05 | 2009-07-15 | 株式会社Kri | 活性成分及びそれを用いた感光性樹脂組成物 |
| US7261992B2 (en) | 2000-12-21 | 2007-08-28 | International Business Machines Corporation | Fluorinated silsesquioxane polymers and use thereof in lithographic photoresist compositions |
| TW594416B (en) | 2001-05-08 | 2004-06-21 | Shipley Co Llc | Photoimageable composition |
| TWI300516B (ja) * | 2001-07-24 | 2008-09-01 | Jsr Corp | |
| JP4373082B2 (ja) * | 2001-12-28 | 2009-11-25 | 富士通株式会社 | アルカリ可溶性シロキサン重合体、ポジ型レジスト組成物、レジストパターン及びその製造方法、並びに、電子回路装置及びその製造方法 |
| US7018678B2 (en) * | 2002-06-03 | 2006-03-28 | Shipley Company, L.L.C. | Electronic device manufacture |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2011103014A (ja) | 2011-05-26 |
| US20090136867A1 (en) | 2009-05-28 |
| KR20040078584A (ko) | 2004-09-10 |
| TW200500794A (en) | 2005-01-01 |
| JP2004295104A (ja) | 2004-10-21 |
| TWI317458B (en) | 2009-11-21 |
| EP1455230A2 (en) | 2004-09-08 |
| EP1455230A3 (en) | 2004-12-01 |
| US20040248032A1 (en) | 2004-12-09 |
| KR20110106829A (ko) | 2011-09-29 |
| KR101112482B1 (ko) | 2012-02-24 |
| KR101334031B1 (ko) | 2013-11-28 |
| CN1570762B (zh) | 2010-10-13 |
| JP5178858B2 (ja) | 2013-04-10 |
| US7390609B2 (en) | 2008-06-24 |
| US8026037B2 (en) | 2011-09-27 |
| CN1570762A (zh) | 2005-01-26 |
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