JP5250949B2 - 発光素子モジュール - Google Patents

発光素子モジュール Download PDF

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Publication number
JP5250949B2
JP5250949B2 JP2006215120A JP2006215120A JP5250949B2 JP 5250949 B2 JP5250949 B2 JP 5250949B2 JP 2006215120 A JP2006215120 A JP 2006215120A JP 2006215120 A JP2006215120 A JP 2006215120A JP 5250949 B2 JP5250949 B2 JP 5250949B2
Authority
JP
Japan
Prior art keywords
sealing
resin material
sealing resin
emitting element
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006215120A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008041968A (ja
Inventor
弘毅 初田
博司 寒川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2006215120A priority Critical patent/JP5250949B2/ja
Priority to PCT/JP2007/065050 priority patent/WO2008018336A1/fr
Publication of JP2008041968A publication Critical patent/JP2008041968A/ja
Application granted granted Critical
Publication of JP5250949B2 publication Critical patent/JP5250949B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
JP2006215120A 2006-08-07 2006-08-07 発光素子モジュール Expired - Fee Related JP5250949B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006215120A JP5250949B2 (ja) 2006-08-07 2006-08-07 発光素子モジュール
PCT/JP2007/065050 WO2008018336A1 (fr) 2006-08-07 2007-08-01 Module d'élément luminescent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006215120A JP5250949B2 (ja) 2006-08-07 2006-08-07 発光素子モジュール

Publications (2)

Publication Number Publication Date
JP2008041968A JP2008041968A (ja) 2008-02-21
JP5250949B2 true JP5250949B2 (ja) 2013-07-31

Family

ID=39032869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006215120A Expired - Fee Related JP5250949B2 (ja) 2006-08-07 2006-08-07 発光素子モジュール

Country Status (2)

Country Link
JP (1) JP5250949B2 (fr)
WO (1) WO2008018336A1 (fr)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008026841A1 (de) * 2008-02-22 2009-08-27 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
DE102008016487A1 (de) * 2008-03-31 2009-10-01 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
JP5224890B2 (ja) * 2008-04-21 2013-07-03 シャープ株式会社 発光デバイスおよび発光デバイスの製造方法
KR100992778B1 (ko) 2008-05-23 2010-11-05 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
WO2010021346A1 (fr) * 2008-08-20 2010-02-25 三菱化学株式会社 Dispositif émettant de la lumière à semi-conducteurs et son procédé de fabrication
JP2010114406A (ja) * 2008-10-08 2010-05-20 Sony Corp 照明装置、液晶表示装置、及び照明装置の製造方法
JP5173743B2 (ja) * 2008-10-30 2013-04-03 京セラ株式会社 発光装置
JP2011077168A (ja) * 2009-09-29 2011-04-14 Sanken Electric Co Ltd 半導体発光装置、半導体発光モジュール及び照明装置
EP2323186B1 (fr) * 2009-11-13 2017-07-26 Tridonic Jennersdorf GmbH Module de diode électroluminescente et son procédé de fabrication
JP5328698B2 (ja) * 2010-03-02 2013-10-30 シャープ株式会社 表示装置
KR101647512B1 (ko) * 2010-03-25 2016-08-11 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
KR101096786B1 (ko) * 2010-03-26 2011-12-21 일진반도체 주식회사 발광 다이오드 패키지
JP5431259B2 (ja) * 2010-06-30 2014-03-05 シャープ株式会社 発光素子パッケージおよびその製造方法、発光素子アレイ、および表示装置
JP2012023184A (ja) * 2010-07-14 2012-02-02 Sharp Corp 発光装置
DE102010031945A1 (de) * 2010-07-22 2012-01-26 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
DE102010046122A1 (de) 2010-09-21 2012-03-22 Osram Opto Semiconductors Gmbh Elektronisches Bauelement
KR101087065B1 (ko) 2010-10-13 2011-11-25 (주) 아모엘이디 엘이디 패키지 제조방법
JP5968674B2 (ja) * 2011-05-13 2016-08-10 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及びこれを備える紫外線ランプ
CN103688377B (zh) * 2011-05-16 2018-06-08 日亚化学工业株式会社 发光装置及其制造方法
US9397274B2 (en) * 2011-08-24 2016-07-19 Lg Innotek Co., Ltd. Light emitting device package
JP2013140848A (ja) * 2011-12-28 2013-07-18 Nitto Denko Corp 封止用シートおよび光半導体素子装置
KR101301991B1 (ko) * 2012-08-28 2013-08-30 공명국 액정고분자 수지저장벽을 가진 고신뢰성고출력발광다이오드패키지 및 그 제조방법
JP6197288B2 (ja) * 2012-12-27 2017-09-20 日亜化学工業株式会社 発光装置およびその製造方法
JP2014145946A (ja) * 2013-01-30 2014-08-14 Panasonic Corp 光電変換サブマウント基板
JP6182916B2 (ja) 2013-03-15 2017-08-23 日亜化学工業株式会社 発光装置の封止部材の取り外し方法
JP2014206572A (ja) * 2013-04-11 2014-10-30 パナソニック株式会社 光電変換サブマウント基板
JP2014206573A (ja) * 2013-04-11 2014-10-30 パナソニック株式会社 光電変換サブマウント基板
JP2017045807A (ja) * 2015-08-25 2017-03-02 デクセリアルズ株式会社 発光装置、及び発光装置の製造方法
JP6597135B2 (ja) * 2015-09-30 2019-10-30 日亜化学工業株式会社 発光装置
EP3572396A4 (fr) * 2017-01-17 2020-11-18 Nikon Corporation Composé (méth)acrylate, additif pour résine optique, élément optique et dispositif optique
JP7053252B2 (ja) 2017-12-26 2022-04-12 日機装株式会社 半導体発光装置
US11032976B1 (en) 2020-03-16 2021-06-15 Hgci, Inc. Light fixture for indoor grow application and components thereof
JP2023528128A (ja) * 2020-03-16 2023-07-04 エイチジーシーアイ・インコーポレイテッド 室内栽培用照明器具及びその構成部品
CN113451486A (zh) 2020-03-27 2021-09-28 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
JP7498319B1 (ja) 2023-01-27 2024-06-11 日機装株式会社 発光装置の製造方法
CN119008817A (zh) * 2023-05-19 2024-11-22 京东方科技集团股份有限公司 发光基板及其制备方法、显示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3685018B2 (ja) * 2000-05-09 2005-08-17 日亜化学工業株式会社 発光素子とその製造方法
JP2004087812A (ja) * 2002-08-27 2004-03-18 Sanyo Electric Co Ltd 発光体
JP4599857B2 (ja) * 2003-04-24 2010-12-15 日亜化学工業株式会社 半導体装置及びその製造方法
JP4634810B2 (ja) * 2005-01-20 2011-02-16 信越化学工業株式会社 シリコーン封止型ｌｅｄ

Also Published As

Publication number Publication date
WO2008018336A1 (fr) 2008-02-14
JP2008041968A (ja) 2008-02-21

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