JP5368440B2 - 試験システム - Google Patents

試験システム Download PDF

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Publication number
JP5368440B2
JP5368440B2 JP2010515689A JP2010515689A JP5368440B2 JP 5368440 B2 JP5368440 B2 JP 5368440B2 JP 2010515689 A JP2010515689 A JP 2010515689A JP 2010515689 A JP2010515689 A JP 2010515689A JP 5368440 B2 JP5368440 B2 JP 5368440B2
Authority
JP
Japan
Prior art keywords
wafer
semiconductor wafer
semiconductor
wafer stage
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010515689A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2009147719A1 (ja
Inventor
芳雄 甲元
芳春 梅村
康男 徳永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of JPWO2009147719A1 publication Critical patent/JPWO2009147719A1/ja
Application granted granted Critical
Publication of JP5368440B2 publication Critical patent/JP5368440B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2010515689A 2008-06-02 2008-06-02 試験システム Expired - Fee Related JP5368440B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/060171 WO2009147719A1 (ja) 2008-06-02 2008-06-02 試験システム

Publications (2)

Publication Number Publication Date
JPWO2009147719A1 JPWO2009147719A1 (ja) 2011-10-20
JP5368440B2 true JP5368440B2 (ja) 2013-12-18

Family

ID=41397810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010515689A Expired - Fee Related JP5368440B2 (ja) 2008-06-02 2008-06-02 試験システム

Country Status (3)

Country Link
JP (1) JP5368440B2 (2)
TW (1) TW200952106A (2)
WO (1) WO2009147719A1 (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102958243B1 (ko) 2024-03-12 2026-04-27 주식회사 아도반테스토 반도체 디바이스 핸들링 장치 및 반도체 디바이스 시험 장치

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6308639B1 (ja) * 2017-08-07 2018-04-11 株式会社テクノホロン プロービングステーション
JP6471401B1 (ja) * 2017-10-31 2019-02-20 合同会社Pleson 半導体ウエハーの試験ユニット
CN114779034A (zh) * 2022-04-13 2022-07-22 苏州晶睿半导体科技有限公司 一种基于半导体晶圆的测试设备和map图偏移检测方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6394653A (ja) * 1986-10-09 1988-04-25 Tatsumo Kk 基板の自動位置合せ方法及び装置
JPH11274252A (ja) * 1998-03-19 1999-10-08 Mitsubishi Electric Corp 半導体装置の検査装置及びその検査方法
JP2000164655A (ja) * 1998-11-24 2000-06-16 Matsushita Electric Ind Co Ltd アライメント装置及びアライメント方法
JP2004271520A (ja) * 2003-02-18 2004-09-30 Jsr Corp 異方導電性コネクターおよびプローブ部材並びにウエハ検査装置およびウエハ検査方法
JP2007027302A (ja) * 2005-07-14 2007-02-01 Denso Corp 検査装置及び検査装置の位置決め方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6394653A (ja) * 1986-10-09 1988-04-25 Tatsumo Kk 基板の自動位置合せ方法及び装置
JPH11274252A (ja) * 1998-03-19 1999-10-08 Mitsubishi Electric Corp 半導体装置の検査装置及びその検査方法
JP2000164655A (ja) * 1998-11-24 2000-06-16 Matsushita Electric Ind Co Ltd アライメント装置及びアライメント方法
JP2004271520A (ja) * 2003-02-18 2004-09-30 Jsr Corp 異方導電性コネクターおよびプローブ部材並びにウエハ検査装置およびウエハ検査方法
JP2007027302A (ja) * 2005-07-14 2007-02-01 Denso Corp 検査装置及び検査装置の位置決め方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102958243B1 (ko) 2024-03-12 2026-04-27 주식회사 아도반테스토 반도체 디바이스 핸들링 장치 및 반도체 디바이스 시험 장치

Also Published As

Publication number Publication date
TW200952106A (en) 2009-12-16
TWI379369B (2) 2012-12-11
WO2009147719A1 (ja) 2009-12-10
JPWO2009147719A1 (ja) 2011-10-20

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