JP5386831B2 - 塗膜研磨方法 - Google Patents
塗膜研磨方法 Download PDFInfo
- Publication number
- JP5386831B2 JP5386831B2 JP2008040159A JP2008040159A JP5386831B2 JP 5386831 B2 JP5386831 B2 JP 5386831B2 JP 2008040159 A JP2008040159 A JP 2008040159A JP 2008040159 A JP2008040159 A JP 2008040159A JP 5386831 B2 JP5386831 B2 JP 5386831B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- coating film
- film
- coating
- roughness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
電着塗膜23は、カチオン型電着塗料又はアニオン型電着塗料に被塗物を浸漬し、所定の電圧を被塗物22と電着塗料との間に印加することで、電気泳動作用により未硬化塗膜が被塗物1の表面に形成され、これをたとえば160℃〜180℃で15分〜30分焼き付けることで硬化塗膜が形成される。被塗物1の種類や目的によっても相違するが、電着塗膜22の膜厚はたとえば10〜40μmである。
上塗り工程後に、上記研磨装置1を用いて研磨を行う。
2 ヘッド部、
3 ボディー部、
4 パッド(研磨パッド)、
5 研磨フィルム、
6 駆動源、
7 回転軸、
8 支持部、
9 操作部、
11 研磨フィルム上の粗い領域、
12 研磨フィルム上の細かい領域、
21 塗装欠陥、
22 被塗物、
23 電着塗膜、
24 中塗り塗膜、
25 ベース塗膜、
26 クリヤー塗膜。
Claims (2)
- 全面に研磨材が設けられ、前記研磨材の粗さが異なる同心円状の2つの領域を有し、内方側に粗さが粗い領域を配置し、外方側に粗さが細かい領域を配置している研磨フィルムが研磨パッドの凸状の曲面に前記凸状の曲面の頂部に前記研磨フィルムの前記粗さが粗い領域が位置するように装着された状態で、前記研磨フィルムの前記粗さが粗い領域で塗膜を研磨するときに比べて、前記研磨フィルムの前記粗さが細かい領域で塗膜を研磨するときに前記研磨パッドを傾ける、塗膜の研磨方法。
- 前記研磨フィルムの研磨材の粗さが粗い領域で研磨を行った後、前記フィルムの研磨材の粗さが細かい領域で研磨を行う、請求項1に記載の塗膜の研磨方法。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008040159A JP5386831B2 (ja) | 2008-02-21 | 2008-02-21 | 塗膜研磨方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008040159A JP5386831B2 (ja) | 2008-02-21 | 2008-02-21 | 塗膜研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009196033A JP2009196033A (ja) | 2009-09-03 |
| JP5386831B2 true JP5386831B2 (ja) | 2014-01-15 |
Family
ID=41140142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008040159A Expired - Fee Related JP5386831B2 (ja) | 2008-02-21 | 2008-02-21 | 塗膜研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5386831B2 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106272011A (zh) * | 2015-06-01 | 2017-01-04 | 惠州Tcl移动通信有限公司 | 一种触摸屏修复工具及触摸屏修复方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59112552U (ja) * | 1983-01-21 | 1984-07-30 | 日立工機株式会社 | 研摩工具 |
| JPH0828204B2 (ja) * | 1987-12-28 | 1996-03-21 | 東ソー株式会社 | 局所表面分析装置 |
| JPH0263965U (ja) * | 1988-10-31 | 1990-05-14 | ||
| JP2004009189A (ja) * | 2002-06-05 | 2004-01-15 | Makoto Ueno | 研磨具および研磨部材 |
| JP4026707B2 (ja) * | 2002-08-08 | 2007-12-26 | コンパクト・ツール株式会社 | オービタルサンダー |
| US7618306B2 (en) * | 2005-09-22 | 2009-11-17 | 3M Innovative Properties Company | Conformable abrasive articles and methods of making and using the same |
| JP3121170U (ja) * | 2006-02-14 | 2006-04-27 | 株式会社豊稔企販 | ディスク状ダイヤモンド砥石 |
-
2008
- 2008-02-21 JP JP2008040159A patent/JP5386831B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009196033A (ja) | 2009-09-03 |
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