JP5767971B2 - 硬化性樹脂組成物 - Google Patents

硬化性樹脂組成物 Download PDF

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Publication number
JP5767971B2
JP5767971B2 JP2011534250A JP2011534250A JP5767971B2 JP 5767971 B2 JP5767971 B2 JP 5767971B2 JP 2011534250 A JP2011534250 A JP 2011534250A JP 2011534250 A JP2011534250 A JP 2011534250A JP 5767971 B2 JP5767971 B2 JP 5767971B2
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Prior art keywords
meth
component
resin composition
acrylate
curable resin
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Japanese (ja)
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JPWO2011040407A1 (ja
Inventor
佑基 比舎
佑基 比舎
渡辺　淳
淳 渡辺
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Denka Co Ltd
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Denki Kagaku Kogyo KK
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/02—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonates or saturated polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
JP2011534250A 2009-09-29 2010-09-28 硬化性樹脂組成物 Active JP5767971B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011534250A JP5767971B2 (ja) 2009-09-29 2010-09-28 硬化性樹脂組成物

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009225646 2009-09-29
JP2009225646 2009-09-29
PCT/JP2010/066839 WO2011040407A1 (fr) 2009-09-29 2010-09-28 Composition de résine durcissable
JP2011534250A JP5767971B2 (ja) 2009-09-29 2010-09-28 硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2011040407A1 JPWO2011040407A1 (ja) 2013-02-28
JP5767971B2 true JP5767971B2 (ja) 2015-08-26

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ID=43826223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011534250A Active JP5767971B2 (ja) 2009-09-29 2010-09-28 硬化性樹脂組成物

Country Status (5)

Country Link
JP (1) JP5767971B2 (fr)
KR (1) KR101632374B1 (fr)
CN (1) CN102574962B (fr)
TW (1) TWI518127B (fr)
WO (1) WO2011040407A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8921490B2 (en) * 2009-06-30 2014-12-30 Henkel US IP LLC Ultrafast heat/room temperature adhesive composition for bonding applications
CN103113538B (zh) * 2013-01-24 2015-02-25 常州大学 一种含氟大分子偶联剂及其制备方法和应用
JPWO2014157624A1 (ja) * 2013-03-29 2017-02-16 株式会社クラレ 重合体及びその製造方法、並びに該重合体を含有する樹脂組成物
CN104497944B (zh) * 2014-11-18 2016-06-29 惠晶显示科技（苏州）有限公司 一种可显影uv固化耐氢氟酸保护胶
CN107428891B (zh) * 2015-03-24 2021-04-20 施敏打硬株式会社 固化性组合物
JP2017037923A (ja) * 2015-08-07 2017-02-16 大日本印刷株式会社 太陽電池モジュール用の衝撃吸収型ガラス基板及び、それを用いてなる太陽電池モジュール
KR20190027855A (ko) * 2016-07-07 2019-03-15 쓰리엠 이노베이티브 프로퍼티즈 컴파니 광 방향전환 필름용 접착제
US11466183B2 (en) * 2018-07-18 2022-10-11 Threebond Co., Lid. Adhesive composition, cured product, and bonded body
JP7319766B2 (ja) * 2018-08-10 2023-08-02 日東電工株式会社 粘着シート
JP7355559B2 (ja) * 2019-08-28 2023-10-03 住友理工株式会社 燃料電池用ラジカル硬化性シール部材

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5716067A (en) * 1980-05-20 1982-01-27 Minnesota Mining & Mfg Adhesive coating composition
JPS62146278A (ja) * 1985-12-19 1987-06-30 Sumitomo Bakelite Co Ltd 紫外線硬化型メツキ下地剤
JPS63189411A (ja) * 1987-01-30 1988-08-05 Asahi Glass Co Ltd ポリエステル樹脂組成物
JPH07106328A (ja) * 1993-10-07 1995-04-21 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP2002164360A (ja) * 2000-11-27 2002-06-07 Sumitomo Bakelite Co Ltd ダイアタッチペースト及び半導体装置
JP2002184793A (ja) * 2000-04-10 2002-06-28 Sumitomo Bakelite Co Ltd ダイアタッチペースト及び半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6189264A (ja) * 1984-10-08 1986-05-07 Dainippon Toryo Co Ltd 塗料用樹脂組成物
TWI282811B (en) * 2000-04-10 2007-06-21 Sumitomo Bakelite Co Die-attaching paste and semiconductor device
JP2007266382A (ja) 2006-03-29 2007-10-11 Toppan Printing Co Ltd 太陽電池モジュール用のバックシート及び該バックシートを用いた太陽電池モジュール。
JP5237565B2 (ja) * 2007-02-09 2013-07-17 株式会社ブリヂストン 光硬化性液状ゴム組成物
CN101431107A (zh) * 2007-11-07 2009-05-13 E.I.内穆尔杜邦公司 叠层膜和使用该叠层膜的太阳能电池板
US20100247058A1 (en) * 2007-11-15 2010-09-30 Toshihiko Takasaki Resin composition for optical waveguide and optical waveguide
JP2009235205A (ja) * 2008-03-26 2009-10-15 Tomoegawa Paper Co Ltd 粘着剤組成物及びそれを用いた粘着シート
CN101290950B (zh) * 2008-05-23 2011-02-02 浙江工业大学 一种太阳能电池板背膜及其生产工艺

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5716067A (en) * 1980-05-20 1982-01-27 Minnesota Mining & Mfg Adhesive coating composition
JPS62146278A (ja) * 1985-12-19 1987-06-30 Sumitomo Bakelite Co Ltd 紫外線硬化型メツキ下地剤
JPS63189411A (ja) * 1987-01-30 1988-08-05 Asahi Glass Co Ltd ポリエステル樹脂組成物
JPH07106328A (ja) * 1993-10-07 1995-04-21 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP2002184793A (ja) * 2000-04-10 2002-06-28 Sumitomo Bakelite Co Ltd ダイアタッチペースト及び半導体装置
JP2002164360A (ja) * 2000-11-27 2002-06-07 Sumitomo Bakelite Co Ltd ダイアタッチペースト及び半導体装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JPN6014041693; 非晶性ポリエステル樹脂（有機溶剤可溶型）バイロン , 20140925 *

Also Published As

Publication number Publication date
JPWO2011040407A1 (ja) 2013-02-28
KR20120106725A (ko) 2012-09-26
TWI518127B (zh) 2016-01-21
CN102574962A (zh) 2012-07-11
WO2011040407A1 (fr) 2011-04-07
TW201120126A (en) 2011-06-16
CN102574962B (zh) 2016-05-04
KR101632374B1 (ko) 2016-06-21

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