JP5772338B2 - 軟質希薄銅合金線、軟質希薄銅合金板及び軟質希薄銅合金撚線 - Google Patents

軟質希薄銅合金線、軟質希薄銅合金板及び軟質希薄銅合金撚線 Download PDF

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JP5772338B2
JP5772338B2 JP2011160356A JP2011160356A JP5772338B2 JP 5772338 B2 JP5772338 B2 JP 5772338B2 JP 2011160356 A JP2011160356 A JP 2011160356A JP 2011160356 A JP2011160356 A JP 2011160356A JP 5772338 B2 JP5772338 B2 JP 5772338B2
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Japan
Prior art keywords
copper alloy
wire
copper
soft
soft dilute
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JP2011160356A
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English (en)
Japanese (ja)
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JP2013023736A5 (2
JP2013023736A (ja
Inventor
英之 佐川
英之 佐川
青山　正義
正義 青山
黒田　洋光
洋光 黒田
亨 鷲見
亨 鷲見
啓輔 藤戸
啓輔 藤戸
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Proterial Ltd
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Hitachi Metals Ltd
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Priority to JP2011160356A priority Critical patent/JP5772338B2/ja
Priority to US13/553,762 priority patent/US20130022831A1/en
Priority to CN201210252581.9A priority patent/CN102890976B/zh
Publication of JP2013023736A publication Critical patent/JP2013023736A/ja
Publication of JP2013023736A5 publication Critical patent/JP2013023736A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils

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  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
JP2011160356A 2011-07-21 2011-07-21 軟質希薄銅合金線、軟質希薄銅合金板及び軟質希薄銅合金撚線 Active JP5772338B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011160356A JP5772338B2 (ja) 2011-07-21 2011-07-21 軟質希薄銅合金線、軟質希薄銅合金板及び軟質希薄銅合金撚線
US13/553,762 US20130022831A1 (en) 2011-07-21 2012-07-19 Soft dilute copper alloy wire, soft dilute copper alloy plate and soft dilute copper alloy stranded wire
CN201210252581.9A CN102890976B (zh) 2011-07-21 2012-07-20 软质低浓度铜合金线、软质低浓度铜合金板及软质低浓度铜合金捻线

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011160356A JP5772338B2 (ja) 2011-07-21 2011-07-21 軟質希薄銅合金線、軟質希薄銅合金板及び軟質希薄銅合金撚線

Publications (3)

Publication Number Publication Date
JP2013023736A JP2013023736A (ja) 2013-02-04
JP2013023736A5 JP2013023736A5 (2) 2013-04-18
JP5772338B2 true JP5772338B2 (ja) 2015-09-02

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JP2011160356A Active JP5772338B2 (ja) 2011-07-21 2011-07-21 軟質希薄銅合金線、軟質希薄銅合金板及び軟質希薄銅合金撚線

Country Status (3)

Country Link
US (1) US20130022831A1 (2)
JP (1) JP5772338B2 (2)
CN (1) CN102890976B (2)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4709296B2 (ja) * 2009-04-17 2011-06-22 日立電線株式会社 希薄銅合金材料の製造方法
JP5077416B2 (ja) * 2010-02-08 2012-11-21 日立電線株式会社 軟質希薄銅合金材料、軟質希薄銅合金線、軟質希薄銅合金板、軟質希薄銅合金撚線およびこれらを用いたケーブル、同軸ケーブルおよび複合ケーブル
JP5589753B2 (ja) * 2010-10-20 2014-09-17 日立金属株式会社 溶接部材、及びその製造方法
JP5589754B2 (ja) 2010-10-20 2014-09-17 日立金属株式会社 希薄銅合金材料、及び耐水素脆化特性に優れた希薄銅合金材料の製造方法
JP5589756B2 (ja) * 2010-10-20 2014-09-17 日立金属株式会社 フレキシブルフラットケーブル及びその製造方法
US20130042949A1 (en) * 2011-08-17 2013-02-21 Hitachi Cable, Ltd. Method of manufacturing soft-dilute-copper-alloy-material
CN104810111A (zh) * 2015-04-23 2015-07-29 德州学院 信号传输用电缆线芯
CN107887053B (zh) * 2016-09-29 2019-12-31 日立金属株式会社 镀敷铜线、镀敷绞线和绝缘电线以及镀敷铜线的制造方法
JP6424925B2 (ja) * 2016-09-29 2018-11-21 日立金属株式会社 めっき銅線、めっき撚線及び絶縁電線並びにめっき銅線の製造方法
JP6828444B2 (ja) * 2017-01-10 2021-02-10 日立金属株式会社 導電線の製造方法、並びにケーブルの製造方法
WO2023106241A1 (ja) * 2021-12-07 2023-06-15 古河電気工業株式会社 銅系線材および半導体デバイス

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0784631B2 (ja) * 1986-10-23 1995-09-13 古河電気工業株式会社 電子機器用銅合金
JPH0819499B2 (ja) * 1987-06-10 1996-02-28 古河電気工業株式会社 フレキシブルプリント用銅合金
JPH08940B2 (ja) * 1987-07-03 1996-01-10 古河電気工業株式会社 フレキシブルプリント用銅合金
JPH01198457A (ja) * 1988-02-02 1989-08-10 Furukawa Electric Co Ltd:The コイル巻線用軟銅線
JP2726939B2 (ja) * 1989-03-06 1998-03-11 日鉱金属 株式会社 加工性，耐熱性の優れた高導電性銅合金
JPH06192768A (ja) * 1992-12-25 1994-07-12 Nikko Kinzoku Kk 高導電性銅合金
JP3324228B2 (ja) * 1993-09-14 2002-09-17 日立電線株式会社 極細線用銅線，及びその製造方法
JP3633302B2 (ja) * 1998-08-27 2005-03-30 日立電線株式会社 フラットケーブル用導体
US20020157741A1 (en) * 2001-02-20 2002-10-31 Nippon Mining & Metals Co., Ltd. High strength titanium copper alloy, manufacturing method therefor, and terminal connector using the same
JP4674483B2 (ja) * 2005-03-30 2011-04-20 日立電線株式会社 銅材の製造方法及び銅材
US7946022B2 (en) * 2005-07-05 2011-05-24 The Furukawa Electric Co., Ltd. Copper alloy for electronic machinery and tools and method of producing the same
JP2008182171A (ja) * 2006-12-28 2008-08-07 Hitachi Cable Ltd 太陽電池用はんだめっき線及びその製造方法並びに太陽電池
JP2008255417A (ja) * 2007-04-05 2008-10-23 Hitachi Cable Ltd 銅材の製造方法及び銅材
JP4709296B2 (ja) * 2009-04-17 2011-06-22 日立電線株式会社 希薄銅合金材料の製造方法
JP5652741B2 (ja) * 2009-11-24 2015-01-14 住友電気工業株式会社 銅線材及びその製造方法
JP5077416B2 (ja) * 2010-02-08 2012-11-21 日立電線株式会社 軟質希薄銅合金材料、軟質希薄銅合金線、軟質希薄銅合金板、軟質希薄銅合金撚線およびこれらを用いたケーブル、同軸ケーブルおよび複合ケーブル
JP5569330B2 (ja) * 2010-10-20 2014-08-13 日立金属株式会社 音楽・映像用ケーブル
JP5589753B2 (ja) * 2010-10-20 2014-09-17 日立金属株式会社 溶接部材、及びその製造方法
JP5589756B2 (ja) * 2010-10-20 2014-09-17 日立金属株式会社 フレキシブルフラットケーブル及びその製造方法
JP5760544B2 (ja) * 2011-03-17 2015-08-12 日立金属株式会社 軟質希薄銅合金線、軟質希薄銅合金撚線およびこれらを用いた絶縁電線、同軸ケーブルおよび複合ケーブル

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CN102890976A (zh) 2013-01-23
JP2013023736A (ja) 2013-02-04
US20130022831A1 (en) 2013-01-24
CN102890976B (zh) 2016-09-07

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