JP6155121B2 - 高温熱アニーリング方法 - Google Patents
高温熱アニーリング方法 Download PDFInfo
- Publication number
- JP6155121B2 JP6155121B2 JP2013143231A JP2013143231A JP6155121B2 JP 6155121 B2 JP6155121 B2 JP 6155121B2 JP 2013143231 A JP2013143231 A JP 2013143231A JP 2013143231 A JP2013143231 A JP 2013143231A JP 6155121 B2 JP6155121 B2 JP 6155121B2
- Authority
- JP
- Japan
- Prior art keywords
- poly
- siloxane
- styrene
- antioxidant
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/90—Thermal treatments, e.g. annealing or sintering
- H10P95/906—Thermal treatments, e.g. annealing or sintering for altering the shape of semiconductors, e.g. smoothing the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/04—Pretreatment of the material to be coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/22—Removing surface-material, e.g. by engraving, by etching
- B44C1/227—Removing surface-material, e.g. by engraving, by etching by etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00523—Etching material
- B81C1/00531—Dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/10—Block or graft copolymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1212—Zeolites, glasses
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/122—Inorganic polymers, e.g. silanes, polysilazanes, polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1241—Metallic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1245—Inorganic substrates other than metallic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1275—Process of deposition of the inorganic material performed under inert atmosphere
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1283—Control of temperature, e.g. gradual temperature increase, modulation of temperature
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/442—Block-or graft-polymers containing polysiloxane sequences containing vinyl polymer sequences
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/947—Subphotolithographic processing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Silicon Polymers (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
式
式
式
本発明は、マイクロスコピック(microscopic)エッチングまたはマイクロパターン形成された表面を必要とするデバイス(例えば、マイクロエレクトロニクス、マイクロセンサおよびバイオチップ)の構築において、後でのパターン転写処理において使用される、リソグラフィで有用なラインアンドスペースフィーチャを形成するための方法を提供する。本発明の方法は従来のリソグラフィ手段を用いて基体上に作成されたガイドパターンに対して整数倍で割りきれるピッチ寸法を有するパターンの作成を提供する。より小さな寸法、例えば、従来のリソグラフィ技術を使用して製造されうるものの2分の1、または4分の1で、その高解像パターンを形成する能力は、例えば、半導体チップの設計および製造において全く新たな技術を可能にする。
式
式
式
2リットルのガラス反応器内に、窒素雰囲気下で、シクロヘキサン(1,500g)が入れられた。次いで、カニューレを介して、この反応器にスチレン(50.34g)が入れられた。次いで、この反応器の内容物は40℃に加熱された。次いで、この反応器に、シクロヘキサン中で0.32Mの濃度に希釈されたsec−ブチルリチウム(19.18g)がカニューレを介して、素早く添加され、反応器内容物が黄色に変わった。この反応器の内容物は30分間攪拌された。次いで、この反応器の内容物は30℃に冷却された。次いで、エチレンオキシド(0.73g)がこの反応器に移された。この反応器の内容物は15分間攪拌された。次いで、メタノール中の1.4M HCl溶液20mLがこの反応器に入れられた。ついで、この反応器中のポリマーが、イソプロパノール中で、500mLのポリマー溶液対1,250mLのイソプロパノールの比率で、沈殿させられることによって、分離された。次いで、得られた沈殿はろ過され、真空オーブン内で60℃で一晩乾燥させられて、生成物であるヒドロキシル末端化ポリスチレンブラシ42gを生じさせた。この生成物であるヒドロキシル末端化ポリスチレンブラシは数平均分子量MN7.4kg/mol、および多分散度PD 1.07を示した。
500mLの丸底反応器に、アルゴン雰囲気下で、シクロヘキサン(90mL)およびスチレン(17.1g)が入れられた。次いで、シクロヘキサン中のsec−ブチルリチウムの1.4M溶液の0.7mLショットがこの反応器に、カニューレを介して素早く添加され、反応器の内容物が黄橙色に変化した。この反応器内容物は30分間攪拌された。次いで、形成されたポリスチレンブロックのゲル浸透クロマトグラフィ分析のために、この反応器内容物の少量がこの反応器から取り出されて、無水メタノールを収容している小さな丸底フラスコに入れられた。次いで、2,2,5,5−テトラメチルジシラフラン(472mg)がこの反応器に入れられた。橙色がゆっくりと薄くなり、そして1時間後に、反応器の内容物は薄黄色であった。次いで、10.5gの新たに昇華させられたヘキサメチルシクロトリシロキサンがこの反応器に移された。この反応器内容物が無色になるまで、この反応器内容物は1.5時間にわたって反応させられた。次いで、乾燥テトラヒドロフラン(90mL)がこの反応器に添加され、そしてこの反応は3.25時間にわたって進められた。次いで、クロロトリメチルシラン(1mL)がこの反応器に添加されてこの反応をクエンチした。生成物は500mLのメタノール中で沈殿させられ、ろ過することによって分離された。追加のメタノールで洗浄した後で、このポリマーは150mLの塩化メチレンに再溶解させられ、脱イオン水で3回洗浄され、次いで500mLのメタノール中で再沈殿させられた。次いで、このポリマーはろ過され、真空オーブン内で70℃で一晩乾燥させられて、20.5gを得た。このポリ(スチレン)−b−ポリ(ジメチルシロキサン)ブロックコポリマー生成物は、数平均分子量MN 24kg/mol、多分散度PD 1.01、および28重量%のポリ(ジメチルシロキサン)含有量(1H NMRで決定)を示した。
コポリマー組成物の調製
実施例2に従って調製されたPSt−b−PSiブロックコポリマーをプロピレングリコールメチルエーテルアセタート(ザダウケミカルカンパニーから入手可能なダウアノール(Dowanol(登録商標))PMA)に溶解させることにより、比較例S1および実施例3〜5のそれぞれにおける、フィルム堆積のための、1.6重量%の固形分の濃度を有するベーススピニング溶液が調製された。このベーススピニング溶液に表1に示される酸化防止剤が添加されて、最終スピニング溶液中に、示された濃度を生じさせた。
s商品名イルガフォス(IRGAFOS(登録商標))168でBASFから入手可能。
自然酸化物層を有するシリコン基体の表面上に、実施例1に従って製造されたヒドロキシル末端化ポリスチレンブラシのトルエン中の1.5重量%(固形分)溶液を3,000rpmで1分間にわたってスピンコーティングすることによって、自然酸化物層を有するシリコン基体の表面が修飾された。次いで、この基体は150℃にセットされたホットプレート上に1分間配置された。次いで、この基体は250℃にセットされたホットプレート上に窒素雰囲気下で20分間配置されて、堆積されたブラシ層をアニールした。次いで、この基体は、結合していないポリマーを洗い流すためにその基体をまずトルエン中に1分間浸漬することによりトルエンですすがれ、次いで3,000rpmで1分間回転乾燥させた。次いで、この基体は110℃にセットされたホットプレート上で1分間にわたってベークされた。
比較例S1、並びに実施例3〜4に従って調製されたスピニング溶液が、それぞれ、0.2μmのワットマンシリンジフィルタを用いて手作業でろ過された。比較例F1および実施例7〜8においては、次いで、それぞれ、比較例S1および実施例3〜4からの濾過された溶液が、実施例6に従って準備された別々のポリ(スチレン)ブラシ処理された基体上に、2,500rpmでスピンコートされた。次いで、これら基体は150℃にセットされたホットプレート上に1分間配置された。次いで、これら基体は、堆積フィルムをアニールするために、10ppm未満の酸素を含む窒素雰囲気下で1時間にわたって340℃にセットされたホットプレート上に置かれた。
Claims (9)
- 表面を有する基体を提供し;
ポリ(スチレン)−b−ポリ(シロキサン)ブロックコポリマー成分および酸化防止剤を含むコポリマー組成物を提供し、前記ポリ(スチレン)−b−ポリ(シロキサン)ブロックコポリマー成分の数平均分子量が5〜1,000kg/molであり;
前記基体の前記表面に前記コポリマー組成物のフィルムを適用し;
場合によっては、前記フィルムをベークし;
前記フィルムを275〜350℃で、気体雰囲気下で、1秒〜4時間の期間にわたって加熱することにより前記フィルムをアニールし;並びに、
前記アニールされたフィルムからポリ(スチレン)ブロックを除去し、かつ前記アニールされたフィルム中のポリ(シロキサン)ブロックをSiOxに変換するように前記アニールされたフィルムを処理する;
ことを含む、基体を処理する方法。 - 提供される前記ポリ(スチレン)−b−ポリ(シロキサン)ブロックコポリマー成分が、25〜1,000kg/molの数平均分子量MN、1〜3の多分散度PD、および0.19〜0.33のポリ(シロキサン)重量分率WfPSiを有する単一種のポリ(スチレン)−b−ポリ(シロキサン)ジブロックコポリマーである、請求項2の方法。
- 提供される前記コポリマー組成物がさらに溶媒を含み、前記溶媒がプロピレングリコールモノメチルエーテルアセタート(PGMEA)、エトキシエチルプロピオナート、アニソール、乳酸エチル、2−ヘプタノン、シクロヘキサノン、酢酸アミル、γ−ブチロラクトン(GBL)、n−メチルピロリドン(NMP)およびトルエンからなる群から選択される請求項4の方法。
- 前記ポリ(スチレン)−b−ポリ(シロキサン)ブロックコポリマー成分が少なくとも2種の異なるポリ(スチレン)−b−ポリ(シロキサン)ブロックコポリマーのブレンドであり、
前記少なくとも2種の異なるポリ(スチレン)−b−ポリ(シロキサン)ブロックコポリマーが1〜1,000kg/molの数平均分子量MN、および1〜3の多分散度PDを有するポリ(スチレン)−b−ポリ(シロキサン)ブロックコポリマーの群から選択され、並びに
前記ブレンドが25〜1,000kg/molのブレンド数平均分子量MN−ブレンドを示す、請求項2の方法。 - 前記ブレンドが0.19〜0.33のブレンドポリ(シロキサン)重量分率WfPSi−ブレンドを示す請求項6の方法。
- 提供される前記コポリマー組成物がさらに溶媒を含み、前記溶媒がプロピレングリコールモノメチルエーテルアセタート(PGMEA)、エトキシエチルプロピオナート、アニソール、乳酸エチル、2−ヘプタノン、シクロヘキサノン、酢酸アミル、γ−ブチロラクトン(GBL)、n−メチルピロリドン(NMP)およびトルエンからなる群から選択される請求項7の方法。
- 前記気体雰囲気が100ppm以下の酸素を有する窒素雰囲気である請求項1の方法。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/547,246 | 2012-07-12 | ||
| US13/547,246 US8821739B2 (en) | 2012-07-12 | 2012-07-12 | High temperature thermal annealing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014019871A JP2014019871A (ja) | 2014-02-03 |
| JP6155121B2 true JP6155121B2 (ja) | 2017-06-28 |
Family
ID=49912829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013143231A Active JP6155121B2 (ja) | 2012-07-12 | 2013-07-09 | 高温熱アニーリング方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8821739B2 (ja) |
| JP (1) | JP6155121B2 (ja) |
| KR (1) | KR102123255B1 (ja) |
| CN (1) | CN103571253B (ja) |
| TW (1) | TWI487756B (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9012545B2 (en) * | 2012-08-31 | 2015-04-21 | Rohm And Haas Electronic Materials Llc | Composition and method for preparing pattern on a substrate |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4127682B2 (ja) | 1999-06-07 | 2008-07-30 | 株式会社東芝 | パターン形成方法 |
| JP3940546B2 (ja) | 1999-06-07 | 2007-07-04 | 株式会社東芝 | パターン形成方法およびパターン形成材料 |
| JP3913638B2 (ja) * | 2001-09-03 | 2007-05-09 | 東京エレクトロン株式会社 | 熱処理方法及び熱処理装置 |
| JP2005041931A (ja) * | 2003-07-23 | 2005-02-17 | Jsr Corp | 重合体組成物及びナノオーダーパターン形成方法 |
| JP5377857B2 (ja) * | 2004-11-22 | 2013-12-25 | ウィスコンシン・アラムナイ・リサーチ・ファウンデーション | 非周期的パターン共重合体フィルムのための方法及び組成 |
| US7964107B2 (en) | 2007-02-08 | 2011-06-21 | Micron Technology, Inc. | Methods using block copolymer self-assembly for sub-lithographic patterning |
| EP1967554B1 (de) * | 2007-02-23 | 2012-04-11 | Triflex Beschichtungssysteme GmbH & Co. Kommanditgesellschaft | Grundierungs- und Markierungszusammensetzungen |
| US8147914B2 (en) | 2007-06-12 | 2012-04-03 | Massachusetts Institute Of Technology | Orientation-controlled self-assembled nanolithography using a block copolymer |
| WO2009058180A2 (en) | 2007-09-27 | 2009-05-07 | Massachusetts Institute Of Technology | Self-assembly technique applicable to large areas and nanofabrication |
| US8425982B2 (en) * | 2008-03-21 | 2013-04-23 | Micron Technology, Inc. | Methods of improving long range order in self-assembly of block copolymer films with ionic liquids |
| US8426313B2 (en) | 2008-03-21 | 2013-04-23 | Micron Technology, Inc. | Thermal anneal of block copolymer films with top interface constrained to wet both blocks with equal preference |
| US8114301B2 (en) * | 2008-05-02 | 2012-02-14 | Micron Technology, Inc. | Graphoepitaxial self-assembly of arrays of downward facing half-cylinders |
| CN101800167B (zh) * | 2009-02-09 | 2011-10-05 | 中国科学院微电子研究所 | 一种在锗衬底上制备金属-氧化物-半导体电容的方法 |
| US8834956B2 (en) | 2009-06-22 | 2014-09-16 | Micron Technology, Inc. | Methods of utilizing block copolymer to form patterns |
| US8268732B2 (en) * | 2009-11-19 | 2012-09-18 | Micron Technology, Inc. | Methods of utilizing block copolymers to form patterns |
| US20110206905A1 (en) | 2010-02-05 | 2011-08-25 | The Governors Of The University Of Alberta | Method for forming a block copolymer pattern |
| US8696918B2 (en) | 2010-05-05 | 2014-04-15 | Micron Technology, Inc. | Methods of utilizing block copolymer to form patterns |
| US8304493B2 (en) | 2010-08-20 | 2012-11-06 | Micron Technology, Inc. | Methods of forming block copolymers |
| JP5753749B2 (ja) * | 2010-09-27 | 2015-07-22 | 富士フイルム株式会社 | インプリント用硬化性組成物の製造方法 |
| JP6218241B2 (ja) * | 2011-07-29 | 2017-10-25 | ウィスコンシン・アルムナイ・リサーチ・ファウンデーションWisconsin Alumni Research Foundation | 薄膜の誘導組織化用ブロック共重合体物質を調製する方法並びにブロック共重合体を有する組成物および構造物 |
| US8961918B2 (en) * | 2012-02-10 | 2015-02-24 | Rohm And Haas Electronic Materials Llc | Thermal annealing process |
| JP5814868B2 (ja) * | 2012-06-29 | 2015-11-17 | 株式会社東芝 | 磁気記録媒体の製造方法 |
-
2012
- 2012-07-12 US US13/547,246 patent/US8821739B2/en active Active
-
2013
- 2013-07-09 JP JP2013143231A patent/JP6155121B2/ja active Active
- 2013-07-11 TW TW102124867A patent/TWI487756B/zh active
- 2013-07-12 CN CN201310435005.2A patent/CN103571253B/zh active Active
- 2013-07-12 KR KR1020130082045A patent/KR102123255B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140009065A (ko) | 2014-01-22 |
| KR102123255B1 (ko) | 2020-06-16 |
| CN103571253B (zh) | 2015-06-03 |
| US8821739B2 (en) | 2014-09-02 |
| US20140014002A1 (en) | 2014-01-16 |
| TWI487756B (zh) | 2015-06-11 |
| JP2014019871A (ja) | 2014-02-03 |
| CN103571253A (zh) | 2014-02-12 |
| TW201406880A (zh) | 2014-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6166906B2 (ja) | 熱アニーリング方法 | |
| JP6120591B2 (ja) | ブロックコポリマーおよびそれに関連する方法 | |
| JP2013163810A (ja) | ブロックコポリマーおよびそれに関連する方法 | |
| JP6166971B2 (ja) | 熱アニーリング方法 | |
| JP2014055291A (ja) | 基体上にパターンを調製するための組成物および方法 | |
| JP6328946B2 (ja) | 誘導自己組織化共重合組成物および関連方法 | |
| TWI519591B (zh) | 嵌段共聚物配方及其相關方法 | |
| JP6155121B2 (ja) | 高温熱アニーリング方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160615 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170127 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170203 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170428 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170529 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170605 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6155121 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
