JP6445947B2 - 光結合装置 - Google Patents
光結合装置 Download PDFInfo
- Publication number
- JP6445947B2 JP6445947B2 JP2015174611A JP2015174611A JP6445947B2 JP 6445947 B2 JP6445947 B2 JP 6445947B2 JP 2015174611 A JP2015174611 A JP 2015174611A JP 2015174611 A JP2015174611 A JP 2015174611A JP 6445947 B2 JP6445947 B2 JP 6445947B2
- Authority
- JP
- Japan
- Prior art keywords
- covering member
- emitting element
- light
- light emitting
- optical coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
- H10F55/255—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices formed in, or on, a common substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F55/205—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive semiconductor devices have no potential barriers, e.g. photoresistors
- H10F55/207—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive semiconductor devices have no potential barriers, e.g. photoresistors wherein the electric light source comprises semiconductor devices having potential barriers, e.g. light emitting diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
Description
前記発光素子に対向する受光素子と、
前記発光素子が設置された第1の面と、前記第1の面に対向する第2の面と、を有するリードフレームと、
前記発光素子を覆う第1の被覆部材と、
前記第1の被覆部材と、前記受光素子と、前記第1の面と、前記第2の面と、を覆う第2の被覆部材と、
前記第2の被覆部材を覆う第3の被覆部材であって、前記第2の被覆部材と前記第3の被覆部材の第1の接着強度と、前記第2の被覆部材と前記第2の面の第2の接着強度とのうちの少なくとも一方の接着強度が、前記第1の被覆部材と前記第2の被覆部材の第3の接着強度よりも低い第3の被覆部材と、
を備える光結合装置が提供される。
図1は、第1の実施形態に係る光結合装置の概略的な構成を示す平面図である。また、図2は、図1に示す切断線A−Aに沿った断面図である。さらに、図3は、図2に示す領域Rの拡大図である。
第2の実施形態について、第1の実施形態と異なる点を中心に説明する。図5(a)は、第2の実施形態に係る光結合装置の一部を拡大した断面図であり、図5(b)は、図5(a)に示す光結合装置において、リードフレーム12と第2の被覆部材15とが剥離した状態を示す断面図である。
以下、第2の実施形態の変形例について説明する。図6(a)は第2の実施形態の変形例に係る光結合装置の一部を拡大した断面図であり、図6(b)は図6(a)に示す光結合装置において、リードフレーム12と第2の被覆部材15が剥離した状態を示す断面図である。
Claims (2)
- 発光素子と、
前記発光素子に対向する受光素子と、
前記発光素子が設置された第1の面と、前記第1の面に対向する第2の面と、を有するリードフレームと、
前記発光素子を覆う第1の被覆部材と、
前記第1の被覆部材と、前記受光素子と、前記リードフレームと、を覆う第2の被覆部材と、
前記第2の被覆部材を覆う第3の被覆部材であって、前記第2の被覆部材と前記第3の被覆部材の第1の接着強度と、前記第2の被覆部材と前記第2の面の第2の接着強度とのうちの少なくとも一方の接着強度が、前記第1の被覆部材と前記第2の被覆部材の第3の接着強度よりも低い第3の被覆部材と、
を備え、
前記第2の接着強度が、前記第2の被覆部材と前記第1の面の接着強度よりも低い、光結合装置。 - 前記第2の面の表面粗さが、前記第1の面の表面粗さよりも大きい、請求項1に記載の光結合装置。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015174611A JP6445947B2 (ja) | 2015-09-04 | 2015-09-04 | 光結合装置 |
| TW105105546A TWI604629B (zh) | 2015-09-04 | 2016-02-24 | Optical coupling device |
| CN201610115546.0A CN106501905B (zh) | 2015-09-04 | 2016-03-01 | 光耦合装置 |
| US15/061,999 US10008626B2 (en) | 2015-09-04 | 2016-03-04 | Optical coupling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015174611A JP6445947B2 (ja) | 2015-09-04 | 2015-09-04 | 光結合装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017050487A JP2017050487A (ja) | 2017-03-09 |
| JP6445947B2 true JP6445947B2 (ja) | 2018-12-26 |
Family
ID=58189648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015174611A Active JP6445947B2 (ja) | 2015-09-04 | 2015-09-04 | 光結合装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10008626B2 (ja) |
| JP (1) | JP6445947B2 (ja) |
| CN (1) | CN106501905B (ja) |
| TW (1) | TWI604629B (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12593722B2 (en) | 2021-09-16 | 2026-03-31 | Kabushiki Kaisha Toshiba | Optical coupling device |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5148243A (en) * | 1985-06-25 | 1992-09-15 | Hewlett-Packard Company | Optical isolator with encapsulation |
| US5329131A (en) * | 1991-05-17 | 1994-07-12 | U.S. Philips Corporation | Opto-electronic coupler having improved moisture protective housing |
| US5647034A (en) * | 1994-10-03 | 1997-07-08 | Matsushita Electric Works, Ltd. | Operation displaying semiconductor switch |
| US5614131A (en) * | 1995-05-01 | 1997-03-25 | Motorola, Inc. | Method of making an optoelectronic device |
| JP3539710B2 (ja) * | 1998-02-17 | 2004-07-07 | シャープ株式会社 | 光結合装置の製造方法 |
| JP4117868B2 (ja) * | 1999-11-22 | 2008-07-16 | シャープ株式会社 | 光結合素子 |
| JP3781180B2 (ja) * | 2001-05-15 | 2006-05-31 | シャープ株式会社 | 光結合素子を製造する製造装置、およびその製造方法 |
| US6885016B2 (en) * | 2001-09-04 | 2005-04-26 | Eugene Robert Worley | Switching power supply circuit using a silicon based LED for feedback |
| JP4040858B2 (ja) * | 2001-10-19 | 2008-01-30 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| JP4034062B2 (ja) * | 2001-10-25 | 2008-01-16 | シャープ株式会社 | 光結合装置のリードフレーム及び光結合装置の製造方法 |
| JP2004296906A (ja) | 2003-03-27 | 2004-10-21 | Denso Corp | 樹脂封止型半導体装置 |
| JP2005294494A (ja) * | 2004-03-31 | 2005-10-20 | Toshiba Corp | 光半導体装置及びその製造方法 |
| US7065274B2 (en) | 2004-05-27 | 2006-06-20 | Energy Conversion Devices, Inc. | Optical coupling device |
| US7424867B2 (en) | 2004-07-15 | 2008-09-16 | Lawrence Kates | Camera system for canines, felines, or other animals |
| JP4219954B2 (ja) * | 2006-12-28 | 2009-02-04 | シャープ株式会社 | 多チャンネル型光結合装置、電子機器及びリードフレーム部材並びに多チャンネル型光結合装置の製造方法 |
| JP4924113B2 (ja) | 2007-03-08 | 2012-04-25 | 豊田合成株式会社 | 発光装置及び発光装置の製造方法 |
| JP2009064907A (ja) * | 2007-09-05 | 2009-03-26 | Sharp Corp | 光結合半導体装置 |
| JP2009188167A (ja) | 2008-02-06 | 2009-08-20 | Toyoda Gosei Co Ltd | 発光装置の製造方法 |
| EP2554601A4 (en) | 2010-03-31 | 2013-10-09 | Sekisui Chemical Co Ltd | SEALANT FOR OPTICAL SEMICONDUCTORS AND OPTICAL SEMICONDUCTOR ELEMENT |
| JP5640476B2 (ja) | 2010-06-08 | 2014-12-17 | 信越化学工業株式会社 | 光半導体素子封止用樹脂組成物及び発光装置 |
| JP5649547B2 (ja) * | 2011-10-11 | 2015-01-07 | 株式会社東芝 | 半導体装置の製造方法 |
| JP2013093504A (ja) * | 2011-10-27 | 2013-05-16 | Toshiba Corp | 半導体装置の製造方法および冶具 |
| JP2013120940A (ja) * | 2011-12-07 | 2013-06-17 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | オプトカプラ |
| US8907362B2 (en) * | 2012-01-24 | 2014-12-09 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
| KR20130098048A (ko) | 2012-02-27 | 2013-09-04 | 엘지이노텍 주식회사 | 발광소자 패키지 |
| JP2014041865A (ja) * | 2012-08-21 | 2014-03-06 | Toshiba Corp | 半導体装置 |
| JP5779155B2 (ja) * | 2012-08-28 | 2015-09-16 | 株式会社東芝 | 半導体装置 |
| US9082685B2 (en) * | 2013-06-25 | 2015-07-14 | Panasonic Intellectual Property Management Co., Ltd. | Optical-coupling semiconductor device |
| JP2015050281A (ja) | 2013-08-30 | 2015-03-16 | 株式会社東芝 | 光結合装置 |
| JP2015054965A (ja) * | 2013-09-13 | 2015-03-23 | 株式会社東芝 | 封止用樹脂、半導体装置、および光結合装置 |
| CN104465640A (zh) * | 2013-09-24 | 2015-03-25 | 兆龙国际股份有限公司 | 光耦合器 |
-
2015
- 2015-09-04 JP JP2015174611A patent/JP6445947B2/ja active Active
-
2016
- 2016-02-24 TW TW105105546A patent/TWI604629B/zh active
- 2016-03-01 CN CN201610115546.0A patent/CN106501905B/zh active Active
- 2016-03-04 US US15/061,999 patent/US10008626B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12593722B2 (en) | 2021-09-16 | 2026-03-31 | Kabushiki Kaisha Toshiba | Optical coupling device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106501905A (zh) | 2017-03-15 |
| TWI604629B (zh) | 2017-11-01 |
| JP2017050487A (ja) | 2017-03-09 |
| TW201711218A (zh) | 2017-03-16 |
| US20170069781A1 (en) | 2017-03-09 |
| US10008626B2 (en) | 2018-06-26 |
| CN106501905B (zh) | 2018-11-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10833055B2 (en) | Semiconductor device and optical coupling device | |
| TWI587537B (zh) | Optocoupler | |
| JP6065135B2 (ja) | 発光装置 | |
| US8723215B2 (en) | LED module | |
| US20160190352A1 (en) | Optical sensor device | |
| CN101414585A (zh) | 光学设备及其制造方法 | |
| WO2011125346A1 (ja) | 発光装置およびその製造方法 | |
| JP2011505071A5 (ja) | ||
| JP6620231B2 (ja) | 発光装置及び発光装置の製造方法 | |
| US20190264894A1 (en) | Color conversion element and lighting device | |
| JP2014241341A (ja) | 半導体発光装置 | |
| US8610166B2 (en) | Light emitting device | |
| JP6445947B2 (ja) | 光結合装置 | |
| JP2005136101A (ja) | 半導体発光装置 | |
| US20160079500A1 (en) | Light emitting device and manufacturing method thereof | |
| US9887311B2 (en) | Semiconductor module having a light-transmissive insulating body | |
| JP6416800B2 (ja) | 半導体装置 | |
| JP6626537B2 (ja) | 半導体装置および光結合装置 | |
| JP2015056629A (ja) | 光デバイス、光モジュール、光デバイスの製造方法及び光モジュールの製造方法 | |
| US20160322531A1 (en) | Semiconductor device and optical coupling device | |
| JP7096649B2 (ja) | 半導体装置 | |
| US20070252133A1 (en) | Light emitting apparatus | |
| US20140191143A1 (en) | Optocoupler | |
| KR20190124043A (ko) | 발광 디바이스 | |
| US20120112221A1 (en) | Led package structure and manufacturing method for the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170913 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20171113 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20171114 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180625 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180803 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180927 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20181102 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20181130 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6445947 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |